KR20090071489A - 정전척 및 기판 온도조절-고정장치 - Google Patents

정전척 및 기판 온도조절-고정장치 Download PDF

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Publication number
KR20090071489A
KR20090071489A KR1020080134767A KR20080134767A KR20090071489A KR 20090071489 A KR20090071489 A KR 20090071489A KR 1020080134767 A KR1020080134767 A KR 1020080134767A KR 20080134767 A KR20080134767 A KR 20080134767A KR 20090071489 A KR20090071489 A KR 20090071489A
Authority
KR
South Korea
Prior art keywords
base body
gas path
electrostatic chuck
base plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020080134767A
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English (en)
Korean (ko)
Inventor
나오토 와타나베
다다요시 요시카와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20090071489A publication Critical patent/KR20090071489A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020080134767A 2007-12-27 2008-12-26 정전척 및 기판 온도조절-고정장치 Withdrawn KR20090071489A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-337691 2007-12-27
JP2007337691A JP4929150B2 (ja) 2007-12-27 2007-12-27 静電チャック及び基板温調固定装置

Publications (1)

Publication Number Publication Date
KR20090071489A true KR20090071489A (ko) 2009-07-01

Family

ID=40798015

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080134767A Withdrawn KR20090071489A (ko) 2007-12-27 2008-12-26 정전척 및 기판 온도조절-고정장치

Country Status (4)

Country Link
US (1) US20090168292A1 (https=)
JP (1) JP4929150B2 (https=)
KR (1) KR20090071489A (https=)
CN (1) CN101471279A (https=)

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KR20200042330A (ko) * 2018-10-15 2020-04-23 세메스 주식회사 기판 지지 장치 및 그 제조방법

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CA2704683A1 (en) * 2010-05-28 2010-08-12 Ibm Canada Limited - Ibm Canada Limitee Grounded lid for micro-electronic assemblies
CN108359957A (zh) * 2010-10-29 2018-08-03 应用材料公司 用于物理气相沉积腔室的沉积环及静电夹盘
US9082804B2 (en) * 2011-02-07 2015-07-14 Varian Semiconductor Equipment Associates, Inc. Triboelectric charge controlled electrostatic clamp
JP5505667B2 (ja) * 2011-09-30 2014-05-28 Ｔｏｔｏ株式会社 交流駆動静電チャック
JP5785862B2 (ja) * 2011-11-30 2015-09-30 新光電気工業株式会社 静電チャック及びその製造方法、基板温調固定装置
JP2014049685A (ja) * 2012-09-03 2014-03-17 Ngk Spark Plug Co Ltd 半導体製造用部品
JP2014138164A (ja) * 2013-01-18 2014-07-28 Sumitomo Osaka Cement Co Ltd 静電チャック装置
JP6526575B2 (ja) * 2013-02-07 2019-06-05 エーエスエムエル ホールディング エヌ．ブイ． リソグラフィ装置及び方法
CN103594553B (zh) * 2013-10-23 2015-10-28 中国电子科技集团公司第四十八研究所 一种阵列式硅片装载靶盘
JP5811513B2 (ja) * 2014-03-27 2015-11-11 Toto株式会社 静電チャック
US10410898B2 (en) * 2014-07-22 2019-09-10 Kyocera Corporation Mounting member
US9753463B2 (en) 2014-09-12 2017-09-05 Applied Materials, Inc. Increasing the gas efficiency for an electrostatic chuck
US20170278730A1 (en) * 2016-03-28 2017-09-28 Hitachi High-Technologies Corporation Plasma processing apparatus and plasma processing method
JP6877133B2 (ja) * 2016-03-28 2021-05-26 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
JP6903525B2 (ja) * 2017-04-19 2021-07-14 日本特殊陶業株式会社 セラミックス部材
CN113439330A (zh) * 2019-02-12 2021-09-24 朗姆研究公司 具有陶瓷单体的静电卡盘
US12300473B2 (en) * 2019-03-08 2025-05-13 Applied Materials, Inc. Electrostatic chuck for high bias radio frequency (RF) power application in a plasma processing chamber
CN110246745B (zh) * 2019-05-17 2021-12-21 苏州珂玛材料科技股份有限公司 一种等离子体处理装置及静电卡盘与静电卡盘的制造方法
JP7386624B2 (ja) * 2019-06-14 2023-11-27 日本特殊陶業株式会社 保持装置および保持装置の製造方法
CN110289241B (zh) * 2019-07-04 2022-03-22 北京北方华创微电子装备有限公司 静电卡盘及其制作方法、工艺腔室和半导体处理设备
KR20210057384A (ko) * 2019-11-12 2021-05-21 주식회사 미코세라믹스 정전척
US12189310B2 (en) 2019-12-31 2025-01-07 Asml Holding N.V. Systems and methods for manufacturing a double-sided electrostatic clamp
US11594401B2 (en) * 2020-02-25 2023-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure
US11450546B2 (en) 2020-04-09 2022-09-20 Applied Materials, Inc. Semiconductor substrate support with internal channels
EP3923077A1 (en) * 2020-06-11 2021-12-15 ASML Netherlands B.V. Object holder, electrostatic sheet and method for making an electrostatic sheet
JP7488712B2 (ja) * 2020-07-22 2024-05-22 デンカ株式会社 セラミック板及びその製造方法、セラミック焼結体の体積抵抗率の調整方法
CN114695048A (zh) * 2020-12-30 2022-07-01 中微半导体设备(上海)股份有限公司 下电极组件和包含下电极组件的等离子体处理装置
US12272585B2 (en) * 2021-04-27 2025-04-08 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer chuck structure with holes in upper surface to improve temperature uniformity
JP7707050B2 (ja) * 2021-12-17 2025-07-14 日本特殊陶業株式会社 保持装置
KR20240159576A (ko) * 2022-03-08 2024-11-05 램 리써치 코포레이션 정적 척의 세라믹 플레이트 및 금속 베이스플레이트를 본딩하기 위한 캡슐화된 압축 와셔
JP7759834B2 (ja) * 2022-03-31 2025-10-24 日本碍子株式会社 ウエハ載置台
JP7645838B2 (ja) * 2022-03-31 2025-03-14 日本碍子株式会社 ウエハ載置台
CN119365971A (zh) 2022-06-30 2025-01-24 日本碍子株式会社 半导体制造装置用部件
CN119968700A (zh) * 2022-10-14 2025-05-09 日本碍子株式会社 晶片载放台
CN120981907A (zh) * 2023-04-24 2025-11-18 日本碍子株式会社 晶片载放台
KR102752082B1 (ko) 2023-12-12 2025-01-10 주식회사 미코세라믹스 퍼지 가스 유로를 구비하는 서셉터

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Publication number Priority date Publication date Assignee Title
JP3271352B2 (ja) * 1993-01-13 2002-04-02 ソニー株式会社 静電チャック及びその作製方法並びに基板処理装置及び基板搬送装置
JPH1131736A (ja) * 1997-07-11 1999-02-02 Anelva Corp 半導体製造装置用静電吸着ステージ
JP3980187B2 (ja) * 1998-07-24 2007-09-26 日本碍子株式会社 半導体保持装置、その製造方法およびその使用方法
US6259592B1 (en) * 1998-11-19 2001-07-10 Applied Materials, Inc. Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US7072165B2 (en) * 2003-08-18 2006-07-04 Axcelis Technologies, Inc. MEMS based multi-polar electrostatic chuck
JP4292574B2 (ja) * 2003-09-30 2009-07-08 Ｔｏｔｏ株式会社 静電チャックとその製造方法
JP2005166821A (ja) * 2003-12-01 2005-06-23 Toshiba Ceramics Co Ltd ウェーハ保持用静電チャック及びその製造方法
JP4768333B2 (ja) * 2005-06-29 2011-09-07 日本特殊陶業株式会社 静電チャック
US7672110B2 (en) * 2005-08-29 2010-03-02 Applied Materials, Inc. Electrostatic chuck having textured contact surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200042330A (ko) * 2018-10-15 2020-04-23 세메스 주식회사 기판 지지 장치 및 그 제조방법
US11011405B2 (en) 2018-10-15 2021-05-18 Semes Co., Ltd. Apparatus for supporting substrate having gas supply hole and method of manufacturing same

Also Published As

Publication number Publication date
JP2009158829A (ja) 2009-07-16
JP4929150B2 (ja) 2012-05-09
US20090168292A1 (en) 2009-07-02
CN101471279A (zh) 2009-07-01

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