KR20090042726A - 기판 접합 장치 및 방법 - Google Patents

기판 접합 장치 및 방법 Download PDF

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Publication number
KR20090042726A
KR20090042726A KR1020080104130A KR20080104130A KR20090042726A KR 20090042726 A KR20090042726 A KR 20090042726A KR 1020080104130 A KR1020080104130 A KR 1020080104130A KR 20080104130 A KR20080104130 A KR 20080104130A KR 20090042726 A KR20090042726 A KR 20090042726A
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KR
South Korea
Prior art keywords
substrate
stage
board
contact area
vacuum chamber
Prior art date
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KR1020080104130A
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English (en)
Korean (ko)
Inventor
아쓰시 기누무라
Original Assignee
시바우라 메카트로닉스 가부시키가이샤
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Application filed by 시바우라 메카트로닉스 가부시키가이샤 filed Critical 시바우라 메카트로닉스 가부시키가이샤
Publication of KR20090042726A publication Critical patent/KR20090042726A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020080104130A 2007-10-26 2008-10-23 기판 접합 장치 및 방법 KR20090042726A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-279232 2007-10-26
JP2007279232 2007-10-26

Publications (1)

Publication Number Publication Date
KR20090042726A true KR20090042726A (ko) 2009-04-30

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ID=40630214

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080104130A KR20090042726A (ko) 2007-10-26 2008-10-23 기판 접합 장치 및 방법

Country Status (4)

Country Link
JP (1) JP2009122666A (ja)
KR (1) KR20090042726A (ja)
CN (1) CN101419356A (ja)
TW (1) TW200922789A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2541587A1 (en) * 2010-02-25 2013-01-02 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
KR101231428B1 (ko) * 2009-09-21 2013-02-07 도쿄엘렉트론가부시키가이샤 배치 기구, 다이싱 프레임을 갖는 웨이퍼의 반송 방법 및 이 반송 방법에 이용되는 웨이퍼 반송용 프로그램을 기록한 컴퓨터 판독가능한 기록 매체
KR101232907B1 (ko) * 2011-03-11 2013-02-13 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101311853B1 (ko) * 2011-01-19 2013-09-27 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101311854B1 (ko) * 2011-01-19 2013-09-27 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101326706B1 (ko) * 2011-01-14 2013-11-08 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101334705B1 (ko) * 2011-03-11 2013-11-29 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
CN115682652A (zh) * 2021-10-09 2023-02-03 广东聚华印刷显示技术有限公司 烘烤设备以及烘烤方法
CN117316837A (zh) * 2023-11-29 2023-12-29 武汉大学 晶圆混合键合工艺的真空互联设备及数字孪生系统

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5487740B2 (ja) * 2009-06-10 2014-05-07 株式会社ニコン 重ね合わせ装置、位置合わせ装置、基板貼り合わせ装置および重ね合わせ方法
JP5481950B2 (ja) * 2009-06-10 2014-04-23 株式会社ニコン 重ね合わせ方法、重ね合わせ装置、位置合わせ装置および貼り合わせ装置
JP5286457B1 (ja) 2011-12-28 2013-09-11 パナソニック株式会社 ロボットアーム
WO2013099091A1 (ja) * 2011-12-28 2013-07-04 パナソニック株式会社 自走式ロボットハンド
CN105189119B (zh) * 2013-04-30 2017-03-29 旭硝子株式会社 层叠体的制造装置及层叠体的制造方法
CN105116626A (zh) * 2015-09-29 2015-12-02 深圳市华星光电技术有限公司 一种配向膜涂布装置及其涂布方法
CN106494054A (zh) * 2016-11-04 2017-03-15 浦江县科创进出口有限公司 一种新型造纸用陶瓷板粘结机构
CN107215070B (zh) * 2016-11-04 2019-03-12 湖南闽新人造板有限责任公司 一种新型热胶合机
CN106515179B (zh) * 2016-11-04 2017-11-21 江苏金友电气有限公司 一种户外箱式变电站的外壳压合装置
CN106494055B (zh) * 2016-11-04 2017-08-25 建峰建设集团股份有限公司 一种建筑装饰板材复合加工机
CN107215073B (zh) * 2016-11-04 2018-12-18 浦江春宏网络科技有限公司 一种热胶合机
CN106842640A (zh) * 2016-12-12 2017-06-13 合肥瑞硕科技有限公司 一种真空贴合治具
CN106985224B (zh) * 2017-04-24 2018-12-25 泉州市巨作贸易有限公司 一种板材的相对平移压合装置
JP6733966B2 (ja) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 基板組立装置及び基板組立方法
CN111223789B (zh) * 2018-11-27 2024-04-26 紫石能源有限公司 腔室用升降机构和半导体处理设备
CN109343248A (zh) * 2018-12-06 2019-02-15 深圳市华星光电半导体显示技术有限公司 真空贴合装置及其脱离显示面板的方法
JP7128534B2 (ja) * 2020-05-26 2022-08-31 Ａｉメカテック株式会社 基板組立装置及び基板組立方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101231428B1 (ko) * 2009-09-21 2013-02-07 도쿄엘렉트론가부시키가이샤 배치 기구, 다이싱 프레임을 갖는 웨이퍼의 반송 방법 및 이 반송 방법에 이용되는 웨이퍼 반송용 프로그램을 기록한 컴퓨터 판독가능한 기록 매체
EP2541587A1 (en) * 2010-02-25 2013-01-02 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
EP2541587A4 (en) * 2010-02-25 2017-04-05 Nikon Corporation Substrate separation device, load lock device, substrate adhesion device and substrate separation method
KR101326706B1 (ko) * 2011-01-14 2013-11-08 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101311853B1 (ko) * 2011-01-19 2013-09-27 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101311854B1 (ko) * 2011-01-19 2013-09-27 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101232907B1 (ko) * 2011-03-11 2013-02-13 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
KR101334705B1 (ko) * 2011-03-11 2013-11-29 엘아이지에이디피 주식회사 유기발광소자 밀봉장치
CN115682652A (zh) * 2021-10-09 2023-02-03 广东聚华印刷显示技术有限公司 烘烤设备以及烘烤方法
CN117316837A (zh) * 2023-11-29 2023-12-29 武汉大学 晶圆混合键合工艺的真空互联设备及数字孪生系统
CN117316837B (zh) * 2023-11-29 2024-03-08 武汉大学 混合键合连续性仿真模型建立方法、系统及设备

Also Published As

Publication number Publication date
JP2009122666A (ja) 2009-06-04
CN101419356A (zh) 2009-04-29
TW200922789A (en) 2009-06-01

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