KR20090039421A - Apparatus for molding substrates - Google Patents
Apparatus for molding substrates Download PDFInfo
- Publication number
- KR20090039421A KR20090039421A KR1020070105059A KR20070105059A KR20090039421A KR 20090039421 A KR20090039421 A KR 20090039421A KR 1020070105059 A KR1020070105059 A KR 1020070105059A KR 20070105059 A KR20070105059 A KR 20070105059A KR 20090039421 A KR20090039421 A KR 20090039421A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- molding
- substrates
- transfer
- loader
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 162
- 238000000465 moulding Methods 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Robotics (AREA)
Abstract
The substrate forming apparatus includes a first loader portion, a second loader portion, a first molding portion, a second molding portion, a first substrate transfer portion, and a second substrate transfer portion. The first and second substrates are separately loaded in the first and second loader portions. The first molding part molding the first substrate. When the second molding part molds the first substrate, the second molding part simultaneously molds the second substrate. The first substrate transfer portion transfers the first substrate from the first loader portion to the first molding portion. The second substrate transfer portion transfers the second substrate from the second loader portion to the second molding portion at the same time when the first transfer portion transfers the first substrate. Therefore, it is possible to mold molding a variety of substrates more efficiently.
Description
The present invention relates to a substrate forming apparatus, and more particularly, to an apparatus for molding a substrate for manufacturing a semiconductor device.
In general, semiconductor devices are manufactured based on wafers made of thin single crystal substrates made of silicon. In detail, the semiconductor device may include a fabrication process for forming a plurality of chips patterned with a circuit pattern on the wafer, and an electrical die sorting process for inspecting electrical characteristics of the chips formed in the fabrication process. Then, the chips are connected to separate circuit boards, and then individually encapsulated with an epoxy resin and manufactured through a package process for electrically protecting them.
The package process is performed through a substrate forming apparatus including a mold manufactured differently according to the shape of a semiconductor device to be manufactured. In detail, the substrate forming apparatus may include a molding unit in which the mold is disposed, a first substrate transfer unit for transferring the substrate from the outside to the molding unit, and a substrate in which molding is performed to substantially mold molding the substrate to which the chips are connected. It includes a second substrate transfer unit for transferring to the outside.
Here, the molding part includes a plurality of the molds for mass production of the semiconductor device of a single variety from the substrate. Accordingly, the first and second transfer parts may also be configured to collectively supply the molds with the substrates corresponding to the semiconductor device of a single variety to the molds.
However, the substrate forming apparatus has a problem in that its efficiency is lowered because some of the plurality of molds are not utilized when attempting to diversify the semiconductor element in small quantities according to a user's request.
Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate forming apparatus capable of efficiently molding molding substrates in order to manufacture a small amount of various kinds of semiconductor devices.
In order to achieve the above object of the present invention, the substrate forming apparatus includes a first loader portion, a second loader portion, a first molding portion, a second molding portion, a first substrate transfer portion, and a second substrate transfer portion. First and second substrates are separately loaded in the first and second loader portions. The first molding part molds the first substrate. The second molding part simultaneously molds the second substrate when molding the first substrate. The first substrate transfer part transfers the first substrate from the first loader part to the first molding part. The second substrate transfer portion transfers the second substrate from the second loader portion to the second molding portion at the same time when the first transfer portion transfers the first substrate.
Thus, the substrate forming apparatus further includes a substrate loading portion into which the first and second substrates are loaded from the outside in order to load the first and second substrates into the first and second loader portions.
The substrate loading part includes first and second stages in which first and second magazines, each of which contains a plurality of the first and second substrates, are loaded and disposed from the outside, and first and second holdings of the first and second magazines, respectively. A first gripper and a second gripper, wherein the first and second magazines are respectively loaded from the first and second stages to enable loading of the first and second substrates simultaneously through the first and second grippers; It includes a first magazine transfer unit for transferring to the second loader unit.
The substrate forming apparatus may further include first and second unloader portions for separately unloading the first and second substrates, each of which is molded in the first and second molding parts, to the outside, and the molding is performed. A second substrate transfer part configured to transfer the first substrate from the first molding part to the first unloader part, and the third substrate transfer part transfer the first substrate on which the molding is performed; Substantially unloading each of the fourth substrate transfer part which simultaneously transfers the substrate from the second forming part to the second unloader part, and the first and second substrates on which the molding is formed from the first and second unloader parts. It further comprises a substrate carrying out portion to be carried out to the outside.
The substrate discharging unit may include third and fourth stages and third and fourth magazines disposed so that third and fourth magazines each containing a plurality of first and second substrates formed with the molding are carried out, respectively. And third and fourth grippers holding the first and second grippers, and simultaneously holding the first and second substrates in which the molding and molding are carried out, through the third and fourth grippers, the first and second substrates being accommodated. And a second magazine transfer unit transferring the second unloader unit to the third and fourth stages.
According to such a substrate forming apparatus, the substrate forming apparatus can separately transfer the first and second substrates for manufacturing semiconductor elements having different shapes, and separately transfer the first and second forming portions to the first and second forming portions. By having a structure, the process of molding the said 1st and 2nd board | substrate can be advanced efficiently. Thereby, productivity of the whole process for manufacturing the said semiconductor element of a small quantity multispecies can be improved.
Hereinafter, a substrate forming apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.
Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.
On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.
1 is a schematic diagram illustrating a substrate forming apparatus according to an embodiment of the present invention, FIG. 2 is a view illustrating a position where a substrate loading part of the substrate forming apparatus illustrated in FIG. 1 is disposed, and FIG. It is a figure which showed the position which the board | substrate carrying out part of the board | substrate shaping | molding apparatus shown in FIG. 1 was arrange | positioned concretely.
1, 2 and 3, the
The
The first
The first and
The first
Specifically, in the lifting structure of the first
The first and
That is, the first and
To this end, the first and second
The first and second
The first and
Herein, the process of molding molding in the first and
Subsequently, the inlets of the first and
Subsequently, the resin material formed on the first and
Here, the first and
In addition, the third and fourth
As such, the
The
The
The second
Meanwhile, the
If the third and
Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.
The present invention described above can be used to improve the overall molding molding productivity by utilizing all of a plurality of molds when molding a substrate to which a semiconductor chip is connected in order to manufacture small quantities of semiconductor devices.
1 is a schematic diagram illustrating a substrate forming apparatus according to an embodiment of the present invention.
FIG. 2 is a view illustrating a position where a substrate loading part of the substrate forming apparatus illustrated in FIG. 1 is disposed.
3 is a view illustrating in detail a position where a substrate carrying part of the substrate forming apparatus illustrated in FIG. 1 is disposed.
<Explanation of symbols for the main parts of the drawings>
100:
300, 350: first and second substrate transfer parts
400 and 450: first and second molding parts
500, 550: first and second substrate transfer portion
600, 650: first and second unloader section 700: substrate carrying section
1000: Substrate Forming Device
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070105059A KR101344496B1 (en) | 2007-10-18 | 2007-10-18 | Apparatus for molding substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070105059A KR101344496B1 (en) | 2007-10-18 | 2007-10-18 | Apparatus for molding substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090039421A true KR20090039421A (en) | 2009-04-22 |
KR101344496B1 KR101344496B1 (en) | 2013-12-24 |
Family
ID=40763307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070105059A KR101344496B1 (en) | 2007-10-18 | 2007-10-18 | Apparatus for molding substrates |
Country Status (1)
Country | Link |
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KR (1) | KR101344496B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101361816B1 (en) * | 2007-10-18 | 2014-02-11 | 세메스 주식회사 | Unit for aligning a substrate and apparatus for molding a substrate having the same |
WO2018150699A1 (en) | 2017-02-15 | 2018-08-23 | 株式会社フジクラ | Optical fiber sensor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100348939B1 (en) | 1999-12-04 | 2002-08-14 | 한국디엔에스 주식회사 | Semiconductor manufacturing apparatus for photolithography process |
JP2003037107A (en) | 2001-07-25 | 2003-02-07 | Tokyo Electron Ltd | Processing apparatus and processing method |
JP4061212B2 (en) * | 2003-03-03 | 2008-03-12 | 第一精工株式会社 | Resin sealing molding equipment |
-
2007
- 2007-10-18 KR KR1020070105059A patent/KR101344496B1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101361816B1 (en) * | 2007-10-18 | 2014-02-11 | 세메스 주식회사 | Unit for aligning a substrate and apparatus for molding a substrate having the same |
WO2018150699A1 (en) | 2017-02-15 | 2018-08-23 | 株式会社フジクラ | Optical fiber sensor |
Also Published As
Publication number | Publication date |
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KR101344496B1 (en) | 2013-12-24 |
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