KR20080053365A - 반도체 처리 장치 및 방법 - Google Patents

반도체 처리 장치 및 방법 Download PDF

Info

Publication number
KR20080053365A
KR20080053365A KR1020087008352A KR20087008352A KR20080053365A KR 20080053365 A KR20080053365 A KR 20080053365A KR 1020087008352 A KR1020087008352 A KR 1020087008352A KR 20087008352 A KR20087008352 A KR 20087008352A KR 20080053365 A KR20080053365 A KR 20080053365A
Authority
KR
South Korea
Prior art keywords
authority
display
unit
operator
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020087008352A
Other languages
English (en)
Korean (ko)
Inventor
다카히토 마츠자와
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20080053365A publication Critical patent/KR20080053365A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Storage Device Security (AREA)
KR1020087008352A 2005-10-14 2006-10-13 반도체 처리 장치 및 방법 Ceased KR20080053365A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005300637A JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置
JPJP-P-2005-00300637 2005-10-14

Publications (1)

Publication Number Publication Date
KR20080053365A true KR20080053365A (ko) 2008-06-12

Family

ID=37942867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087008352A Ceased KR20080053365A (ko) 2005-10-14 2006-10-13 반도체 처리 장치 및 방법

Country Status (5)

Country Link
US (1) US20090037699A1 (enExample)
JP (1) JP2007109967A (enExample)
KR (1) KR20080053365A (enExample)
CN (1) CN101288153A (enExample)
WO (1) WO2007043646A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190062191A (ko) * 2017-11-27 2019-06-05 가부시기가이샤 디스코 가공 장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5224744B2 (ja) 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
JP5281037B2 (ja) * 2008-03-18 2013-09-04 株式会社日立国際電気 基板処理システム、基板処理システムの表示方法及びそのプログラム
JP5367484B2 (ja) * 2009-07-15 2013-12-11 株式会社日本マイクロニクス 検査システム
JP4737472B2 (ja) * 2009-10-26 2011-08-03 シャープ株式会社 製品の製造方法、および製造システム
US8173451B1 (en) * 2011-02-16 2012-05-08 Tokyo Electron Limited Etch stage measurement system
US9281251B2 (en) 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
KR20220078733A (ko) 2015-08-22 2022-06-10 도쿄엘렉트론가부시키가이샤 기판 배면 텍스처링

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227835A (ja) * 1995-02-20 1996-09-03 Tokyo Electron Ltd 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法
DK0932398T3 (da) * 1996-06-28 2006-09-25 Ortho Mcneil Pharm Inc Anvendelse af topiramat eller derivater deraf til fremstilling af et lægemiddel til behandling af maniodepressive bipolære forstyrrelser
JPH1195878A (ja) * 1997-09-25 1999-04-09 Casio Comput Co Ltd データ処理装置、ネットワークシステム、及び記録媒体
US6198996B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method and apparatus for setting automotive performance tuned preferences set differently by a driver
US6615123B2 (en) * 2000-12-01 2003-09-02 Hewlett-Packard Development Company, L.P. Personality module for configuring a vehicle
US6998956B2 (en) * 2000-12-28 2006-02-14 Cnh America Llc Access control system for a work vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190062191A (ko) * 2017-11-27 2019-06-05 가부시기가이샤 디스코 가공 장치

Also Published As

Publication number Publication date
US20090037699A1 (en) 2009-02-05
WO2007043646A1 (ja) 2007-04-19
CN101288153A (zh) 2008-10-15
JP2007109967A (ja) 2007-04-26

Similar Documents

Publication Publication Date Title
KR100760226B1 (ko) 엘리베이터의 시큐리티 시스템
KR100984332B1 (ko) 원격 보수시스템 및 원격 보수방법
CN105393276B (zh) 作业支援系统、便携终端以及作业支援方法
KR20080053365A (ko) 반도체 처리 장치 및 방법
JP5291911B2 (ja) 計測システム
JP7123513B2 (ja) 検査管理システム
JP2015099548A (ja) 検査管理システム及び方法並びにプログラム
JP2007329284A (ja) 半導体製造装置、半導体製造装置の操作方法及び記憶媒体
EP3049925A2 (en) Systems and methods for session state transfer to a mobile device
JP3207565U (ja) 静電気管理システム
JP4346387B2 (ja) 表示制御システム
JP2020088247A (ja) 検査装置、メンテナンス方法、及びプログラム
CN117236351A (zh) 产线混料校验方法、装置、设备及存储介质
JP3791004B2 (ja) 認証検査装置
JP2023073631A (ja) 現場管理支援装置、現場管理支援方法及び現場管理支援プログラム
KR20070019356A (ko) 로트가변 배치처리가 가능한 반도체 제조설비 및 그로트가변 배치처리방법
JP4546162B2 (ja) 情報提供システムおよびその構成装置
JP2004265221A (ja) 測定機器用プログラム実行制限方法
JP2004028605A (ja) 測定機及び測定機群の操作制限方法
EP4549980A1 (en) Operation terminal, method for operating operation terminal, and magnetic resonance imaging system
JP5655604B2 (ja) アクセス管理システム
EP4549979A1 (en) Operation terminal, method for operating operation terminal, and magnetic resonance imaging system
EP4549981A1 (en) Operation terminal, method for operating operation terminal, and magnetic resonance imaging system
JP2003036312A (ja) 電子カルテ処理装置及び電子カルテ処理用プログラム
JP2025068409A (ja) 情報処理装置、情報処理方法、コンピュータプログラムおよび非一時的コンピュータ可読媒体

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20080407

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100326

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20100901

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20100326

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I