CN101288153A - 半导体处理装置以及方法 - Google Patents

半导体处理装置以及方法 Download PDF

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Publication number
CN101288153A
CN101288153A CNA2006800382029A CN200680038202A CN101288153A CN 101288153 A CN101288153 A CN 101288153A CN A2006800382029 A CNA2006800382029 A CN A2006800382029A CN 200680038202 A CN200680038202 A CN 200680038202A CN 101288153 A CN101288153 A CN 101288153A
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CN
China
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mentioned
authority
information
display
operator
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Pending
Application number
CNA2006800382029A
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English (en)
Chinese (zh)
Inventor
松泽贵仁
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101288153A publication Critical patent/CN101288153A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Storage Device Security (AREA)
CNA2006800382029A 2005-10-14 2006-10-13 半导体处理装置以及方法 Pending CN101288153A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005300637A JP2007109967A (ja) 2005-10-14 2005-10-14 半導体処理装置
JP300637/2005 2005-10-14

Publications (1)

Publication Number Publication Date
CN101288153A true CN101288153A (zh) 2008-10-15

Family

ID=37942867

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800382029A Pending CN101288153A (zh) 2005-10-14 2006-10-13 半导体处理装置以及方法

Country Status (5)

Country Link
US (1) US20090037699A1 (enExample)
JP (1) JP2007109967A (enExample)
KR (1) KR20080053365A (enExample)
CN (1) CN101288153A (enExample)
WO (1) WO2007043646A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5224744B2 (ja) 2006-10-04 2013-07-03 株式会社日立国際電気 基板処理装置
JP5281037B2 (ja) * 2008-03-18 2013-09-04 株式会社日立国際電気 基板処理システム、基板処理システムの表示方法及びそのプログラム
JP5367484B2 (ja) * 2009-07-15 2013-12-11 株式会社日本マイクロニクス 検査システム
JP4737472B2 (ja) * 2009-10-26 2011-08-03 シャープ株式会社 製品の製造方法、および製造システム
US8173451B1 (en) * 2011-02-16 2012-05-08 Tokyo Electron Limited Etch stage measurement system
US9281251B2 (en) 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
KR20220078733A (ko) 2015-08-22 2022-06-10 도쿄엘렉트론가부시키가이샤 기판 배면 텍스처링
JP6934407B2 (ja) * 2017-11-27 2021-09-15 株式会社ディスコ 加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227835A (ja) * 1995-02-20 1996-09-03 Tokyo Electron Ltd 半導体製造装置の操作システム、液晶ディスプレイ基板製造装置の操作システム、制御装置の操作システム及び制御装置の操作方法
DK0932398T3 (da) * 1996-06-28 2006-09-25 Ortho Mcneil Pharm Inc Anvendelse af topiramat eller derivater deraf til fremstilling af et lægemiddel til behandling af maniodepressive bipolære forstyrrelser
JPH1195878A (ja) * 1997-09-25 1999-04-09 Casio Comput Co Ltd データ処理装置、ネットワークシステム、及び記録媒体
US6198996B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method and apparatus for setting automotive performance tuned preferences set differently by a driver
US6615123B2 (en) * 2000-12-01 2003-09-02 Hewlett-Packard Development Company, L.P. Personality module for configuring a vehicle
US6998956B2 (en) * 2000-12-28 2006-02-14 Cnh America Llc Access control system for a work vehicle

Also Published As

Publication number Publication date
US20090037699A1 (en) 2009-02-05
KR20080053365A (ko) 2008-06-12
WO2007043646A1 (ja) 2007-04-19
JP2007109967A (ja) 2007-04-26

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SE01 Entry into force of request for substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Open date: 20081015