KR20080049655A - 광전기 기판의 제조 방법 및 광전기 기판 - Google Patents

광전기 기판의 제조 방법 및 광전기 기판 Download PDF

Info

Publication number
KR20080049655A
KR20080049655A KR1020070122574A KR20070122574A KR20080049655A KR 20080049655 A KR20080049655 A KR 20080049655A KR 1020070122574 A KR1020070122574 A KR 1020070122574A KR 20070122574 A KR20070122574 A KR 20070122574A KR 20080049655 A KR20080049655 A KR 20080049655A
Authority
KR
South Korea
Prior art keywords
insulating member
wiring board
mold
forming
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020070122574A
Other languages
English (en)
Korean (ko)
Inventor
겐지 야나기사와
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20080049655A publication Critical patent/KR20080049655A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
KR1020070122574A 2006-11-30 2007-11-29 광전기 기판의 제조 방법 및 광전기 기판 Withdrawn KR20080049655A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006324310A JP4704322B2 (ja) 2006-11-30 2006-11-30 光電気混載基板の製造方法
JPJP-P-2006-00324310 2006-11-30

Publications (1)

Publication Number Publication Date
KR20080049655A true KR20080049655A (ko) 2008-06-04

Family

ID=39475853

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070122574A Withdrawn KR20080049655A (ko) 2006-11-30 2007-11-29 광전기 기판의 제조 방법 및 광전기 기판

Country Status (3)

Country Link
US (1) US7627210B2 (enExample)
JP (1) JP4704322B2 (enExample)
KR (1) KR20080049655A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4974917B2 (ja) * 2008-01-29 2012-07-11 新光電気工業株式会社 光導波路の製造方法
JP5399671B2 (ja) * 2008-09-19 2014-01-29 パナソニック株式会社 光電複合基板及びその製造方法
JPWO2010038871A1 (ja) 2008-10-03 2012-03-01 ソニー株式会社 半導体装置
JP5313849B2 (ja) * 2009-11-30 2013-10-09 新光電気工業株式会社 光導波路装置及びその製造方法
JP5302177B2 (ja) * 2009-12-18 2013-10-02 新光電気工業株式会社 光導波路基板および光電気混載装置
JP2012088634A (ja) * 2010-10-22 2012-05-10 Ngk Spark Plug Co Ltd 光導波路デバイス及びその製造方法
JP5838881B2 (ja) * 2012-03-27 2016-01-06 富士通株式会社 光射出部材の実装方法及び実装装置
JP6137777B2 (ja) * 2012-04-17 2017-05-31 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体上の発光素子または受光素子と光導波路との間の光の接続損失を低減させることに役立つ、スペーサ樹脂パターンの設計
US9099623B2 (en) * 2013-08-30 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacture including substrate and package structure of optical chip
US9721812B2 (en) * 2015-11-20 2017-08-01 International Business Machines Corporation Optical device with precoated underfill
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
JP7118731B2 (ja) 2018-05-18 2022-08-16 新光電気工業株式会社 光導波路搭載基板、光送受信装置
CN108983374B (zh) * 2018-08-08 2020-04-14 华进半导体封装先导技术研发中心有限公司 一种光模块封装结构及制作方法
WO2024029011A1 (ja) * 2022-08-03 2024-02-08 日本電信電話株式会社 光変調器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4306011B2 (ja) 1999-04-20 2009-07-29 凸版印刷株式会社 光配線層及びその製造方法並びに光・電気配線基板及びその製造方法並びに実装基板
JP2004258065A (ja) * 2003-02-24 2004-09-16 Ngk Spark Plug Co Ltd 光導波路基板及びその製造方法、光電気複合実装配線基板及びその製造方法
JP2005300913A (ja) * 2004-04-12 2005-10-27 Sharp Corp 微小ミラーの製造方法
JP4855397B2 (ja) * 2004-07-08 2012-01-18 ダウ・コーニング・コーポレイション 短距離光相互接続装置

Also Published As

Publication number Publication date
JP2008139465A (ja) 2008-06-19
JP4704322B2 (ja) 2011-06-15
US20080131050A1 (en) 2008-06-05
US7627210B2 (en) 2009-12-01

Similar Documents

Publication Publication Date Title
KR20080049655A (ko) 광전기 기판의 제조 방법 및 광전기 기판
US8041159B2 (en) Optical/electrical hybrid substrate and method of manufacturing the same
JP4754613B2 (ja) 光電気混載基板およびその製造方法
JP5064109B2 (ja) 光導波路及びその製造方法、並びに光電気混載基板及びその製造方法
CN101387721B (zh) 安装有光学波导的基板以及制造该基板的方法
US7590315B2 (en) Optical waveguide and optical module using the same
US7731430B2 (en) Sub-mount for mounting optical component, manufacturing method thereof, and light transmission and reception module
JP5313849B2 (ja) 光導波路装置及びその製造方法
KR20080100767A (ko) 광전기 혼재 기판
JPWO2007111236A1 (ja) 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法
JP5395734B2 (ja) 光電気複合基板の製造方法
JP5479310B2 (ja) 光導波路及びその製造方法と光導波路装置
US8351751B2 (en) Optical waveguide and method of manufacturing the same, and optical waveguide mounted board
JP2010152111A (ja) 光導波路、光モジュール、光モジュールの製造方法、および光導波路の製造方法
JPH08264748A (ja) 光導波路集積回路装置及びその製造方法
JP4690870B2 (ja) 光電気集積配線基板及び光電気集積配線システム
KR101664478B1 (ko) 광 모듈, 광 인쇄회로기판 및 그 제조방법
JP2005321588A (ja) 光導波路及びその製造方法、並びに光結合装置
US20230221506A1 (en) Substrate with optical waveguide, and optical communication device
CN119866463A (zh) 光波导
US9122023B2 (en) Optical waveguide device and method of manufacturing the same
JP2007086367A (ja) 光ピン、光ピンコネクタ及び光路変換用モジュール
JP2007178950A (ja) 光配線基板および光配線モジュール
JP2008197380A (ja) 多チャンネル光路変換素子とその作製方法
JP4698728B2 (ja) 光電気集積配線基板および光電気集積配線システム

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20071129

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid