KR20080025290A - 연마 방법 및 연마 장치 - Google Patents

연마 방법 및 연마 장치 Download PDF

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Publication number
KR20080025290A
KR20080025290A KR1020070080185A KR20070080185A KR20080025290A KR 20080025290 A KR20080025290 A KR 20080025290A KR 1020070080185 A KR1020070080185 A KR 1020070080185A KR 20070080185 A KR20070080185 A KR 20070080185A KR 20080025290 A KR20080025290 A KR 20080025290A
Authority
KR
South Korea
Prior art keywords
polishing
pad
slurry
grooves
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020070080185A
Other languages
English (en)
Korean (ko)
Inventor
타카시 후지타
Original Assignee
가부시키가이샤 토쿄 세이미쯔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 토쿄 세이미쯔 filed Critical 가부시키가이샤 토쿄 세이미쯔
Publication of KR20080025290A publication Critical patent/KR20080025290A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020070080185A 2006-09-15 2007-08-09 연마 방법 및 연마 장치 Withdrawn KR20080025290A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006251785A JP5080769B2 (ja) 2006-09-15 2006-09-15 研磨方法及び研磨装置
JPJP-P-2006-00251785 2006-09-15

Publications (1)

Publication Number Publication Date
KR20080025290A true KR20080025290A (ko) 2008-03-20

Family

ID=39105213

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070080185A Withdrawn KR20080025290A (ko) 2006-09-15 2007-08-09 연마 방법 및 연마 장치

Country Status (5)

Country Link
US (2) US7632169B2 (enExample)
JP (1) JP5080769B2 (enExample)
KR (1) KR20080025290A (enExample)
DE (1) DE102007020342A1 (enExample)
TW (1) TW200812749A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101249856B1 (ko) * 2011-07-15 2013-04-03 주식회사 엘지실트론 웨이퍼 에지 연마 장치
KR101493087B1 (ko) * 2008-05-27 2015-02-24 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
KR20190120075A (ko) * 2018-04-13 2019-10-23 가부시기가이샤 디스코 연마 장치

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
US8893519B2 (en) * 2008-12-08 2014-11-25 The Hong Kong University Of Science And Technology Providing cooling in a machining process using a plurality of activated coolant streams
TWI419070B (zh) * 2011-01-11 2013-12-11 Nat Univ Tsing Hua 相關性變數篩選系統及其篩選方法
JP5723740B2 (ja) * 2011-10-11 2015-05-27 株式会社東京精密 ダイシング装置のブレード潤滑機構及びブレード潤滑方法
US9570311B2 (en) * 2012-02-10 2017-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Modular grinding apparatuses and methods for wafer thinning
US10293462B2 (en) * 2013-07-23 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad conditioner and method of reconditioning planarization pad
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法
JP6304118B2 (ja) * 2015-05-01 2018-04-04 信越半導体株式会社 ワイヤソー装置
KR102401388B1 (ko) 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块
CN114473856B (zh) * 2020-11-11 2023-09-22 中国科学院微电子研究所 一种cmp研磨垫及cmp研磨装置
US20250108477A1 (en) * 2023-09-28 2025-04-03 Applied Materials, Inc. Chemical mechanical polishing edge control with pad recesses

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628915B2 (ja) * 1989-06-05 1997-07-09 三菱マテリアル株式会社 研磨布のドレッシング装置
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5928062A (en) * 1997-04-30 1999-07-27 International Business Machines Corporation Vertical polishing device and method
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
JPH1148129A (ja) * 1997-08-07 1999-02-23 Asahi Glass Co Ltd 研磨パッド及び板状材の研磨方法
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11277411A (ja) * 1998-03-25 1999-10-12 Ebara Corp 基板の研磨装置
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6712678B1 (en) * 1999-12-07 2004-03-30 Ebara Corporation Polishing-product discharging device and polishing device
US6375791B1 (en) * 1999-12-20 2002-04-23 Lsi Logic Corporation Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
KR100443770B1 (ko) * 2001-03-26 2004-08-09 삼성전자주식회사 기판의 연마 방법 및 연마 장치
US6887132B2 (en) * 2001-09-10 2005-05-03 Multi Planar Technologies Incorporated Slurry distributor for chemical mechanical polishing apparatus and method of using the same
JP2003188125A (ja) * 2001-12-18 2003-07-04 Ebara Corp ポリッシング装置
JP2004063888A (ja) 2002-07-30 2004-02-26 Applied Materials Inc 化学機械研磨装置用のスラリ供給装置
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
JP4625252B2 (ja) 2003-12-19 2011-02-02 東洋ゴム工業株式会社 Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101493087B1 (ko) * 2008-05-27 2015-02-24 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
KR101249856B1 (ko) * 2011-07-15 2013-04-03 주식회사 엘지실트론 웨이퍼 에지 연마 장치
KR20190120075A (ko) * 2018-04-13 2019-10-23 가부시기가이샤 디스코 연마 장치

Also Published As

Publication number Publication date
US7632169B2 (en) 2009-12-15
US20080070488A1 (en) 2008-03-20
US20100120336A1 (en) 2010-05-13
DE102007020342A1 (de) 2008-03-27
TW200812749A (en) 2008-03-16
JP2008068389A (ja) 2008-03-27
JP5080769B2 (ja) 2012-11-21

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20070809

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid