TW200812749A - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus Download PDF

Info

Publication number
TW200812749A
TW200812749A TW096116567A TW96116567A TW200812749A TW 200812749 A TW200812749 A TW 200812749A TW 096116567 A TW096116567 A TW 096116567A TW 96116567 A TW96116567 A TW 96116567A TW 200812749 A TW200812749 A TW 200812749A
Authority
TW
Taiwan
Prior art keywords
polishing
slurry
polishing pad
pad
grinding
Prior art date
Application number
TW096116567A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Fujita
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200812749A publication Critical patent/TW200812749A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW096116567A 2006-09-15 2007-05-10 Polishing method and polishing apparatus TW200812749A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006251785A JP5080769B2 (ja) 2006-09-15 2006-09-15 研磨方法及び研磨装置

Publications (1)

Publication Number Publication Date
TW200812749A true TW200812749A (en) 2008-03-16

Family

ID=39105213

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096116567A TW200812749A (en) 2006-09-15 2007-05-10 Polishing method and polishing apparatus

Country Status (5)

Country Link
US (2) US7632169B2 (enExample)
JP (1) JP5080769B2 (enExample)
KR (1) KR20080025290A (enExample)
DE (1) DE102007020342A1 (enExample)
TW (1) TW200812749A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419070B (zh) * 2011-01-11 2013-12-11 Nat Univ Tsing Hua 相關性變數篩選系統及其篩選方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
KR101493087B1 (ko) * 2008-05-27 2015-02-24 엘지디스플레이 주식회사 플렉서블 표시장치의 제조 방법
US8893519B2 (en) * 2008-12-08 2014-11-25 The Hong Kong University Of Science And Technology Providing cooling in a machining process using a plurality of activated coolant streams
KR101249856B1 (ko) * 2011-07-15 2013-04-03 주식회사 엘지실트론 웨이퍼 에지 연마 장치
JP5723740B2 (ja) * 2011-10-11 2015-05-27 株式会社東京精密 ダイシング装置のブレード潤滑機構及びブレード潤滑方法
US9570311B2 (en) * 2012-02-10 2017-02-14 Taiwan Semiconductor Manufacturing Company, Ltd. Modular grinding apparatuses and methods for wafer thinning
US10293462B2 (en) * 2013-07-23 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad conditioner and method of reconditioning planarization pad
JP2015150635A (ja) * 2014-02-13 2015-08-24 株式会社東芝 研磨布および研磨布の製造方法
JP6304118B2 (ja) * 2015-05-01 2018-04-04 信越半導体株式会社 ワイヤソー装置
KR102401388B1 (ko) 2016-06-24 2022-05-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
JP6923342B2 (ja) * 2017-04-11 2021-08-18 株式会社荏原製作所 研磨装置、及び、研磨方法
JP7108450B2 (ja) * 2018-04-13 2022-07-28 株式会社ディスコ 研磨装置
CN110103119A (zh) * 2018-09-20 2019-08-09 杭州众硅电子科技有限公司 一种抛光装卸部件模块
CN114473856B (zh) * 2020-11-11 2023-09-22 中国科学院微电子研究所 一种cmp研磨垫及cmp研磨装置
US20250108477A1 (en) * 2023-09-28 2025-04-03 Applied Materials, Inc. Chemical mechanical polishing edge control with pad recesses

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2628915B2 (ja) * 1989-06-05 1997-07-09 三菱マテリアル株式会社 研磨布のドレッシング装置
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5709593A (en) * 1995-10-27 1998-01-20 Applied Materials, Inc. Apparatus and method for distribution of slurry in a chemical mechanical polishing system
US5928062A (en) * 1997-04-30 1999-07-27 International Business Machines Corporation Vertical polishing device and method
US6139406A (en) * 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
JPH1148129A (ja) * 1997-08-07 1999-02-23 Asahi Glass Co Ltd 研磨パッド及び板状材の研磨方法
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JPH11277411A (ja) * 1998-03-25 1999-10-12 Ebara Corp 基板の研磨装置
US6429131B2 (en) * 1999-03-18 2002-08-06 Infineon Technologies Ag CMP uniformity
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6712678B1 (en) * 1999-12-07 2004-03-30 Ebara Corporation Polishing-product discharging device and polishing device
US6375791B1 (en) * 1999-12-20 2002-04-23 Lsi Logic Corporation Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
KR100443770B1 (ko) * 2001-03-26 2004-08-09 삼성전자주식회사 기판의 연마 방법 및 연마 장치
US6887132B2 (en) * 2001-09-10 2005-05-03 Multi Planar Technologies Incorporated Slurry distributor for chemical mechanical polishing apparatus and method of using the same
JP2003188125A (ja) * 2001-12-18 2003-07-04 Ebara Corp ポリッシング装置
JP2004063888A (ja) 2002-07-30 2004-02-26 Applied Materials Inc 化学機械研磨装置用のスラリ供給装置
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
JP4625252B2 (ja) 2003-12-19 2011-02-02 東洋ゴム工業株式会社 Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
JP2006147773A (ja) * 2004-11-18 2006-06-08 Ebara Corp 研磨装置および研磨方法
US20070087672A1 (en) * 2005-10-19 2007-04-19 Tbw Industries, Inc. Apertured conditioning brush for chemical mechanical planarization systems

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419070B (zh) * 2011-01-11 2013-12-11 Nat Univ Tsing Hua 相關性變數篩選系統及其篩選方法

Also Published As

Publication number Publication date
US7632169B2 (en) 2009-12-15
US20080070488A1 (en) 2008-03-20
US20100120336A1 (en) 2010-05-13
DE102007020342A1 (de) 2008-03-27
JP2008068389A (ja) 2008-03-27
KR20080025290A (ko) 2008-03-20
JP5080769B2 (ja) 2012-11-21

Similar Documents

Publication Publication Date Title
TW200812749A (en) Polishing method and polishing apparatus
CN100369210C (zh) 抛光方法
CN105390417B (zh) 抛光组件及基板处理装置
TWI691367B (zh) 用於研磨墊清洗的方法及系統
US10737366B2 (en) Dressing apparatus and wafer polishing apparatus comprising same
US9475170B2 (en) Device for cleaning fixed abrasives polishing pad
KR100687115B1 (ko) 연마 장치 및 연마 방법
KR102661661B1 (ko) 기판 세정 장치
TWI894314B (zh) 修整裝置和研磨裝置
JP2008068389A5 (enExample)
US20200027760A1 (en) Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method
TW201926449A (zh) 用以將基板平坦化之裝置及方法
US20190039203A1 (en) Substrate processing apparatus
TWI790282B (zh) 基板處理裝置、基板處理方法及記錄媒體
JP2016111265A (ja) バフ処理装置、および、基板処理装置
JP2016043442A (ja) 研磨装置
US6468134B1 (en) Method and apparatus for slurry distribution
US20160303703A1 (en) Scanning Chemical Mechanical Polishing
JP2005103696A (ja) 研磨装置
JP2015044250A (ja) ポリッシング方法
JP2015044251A (ja) ポリッシング方法
JP2016119333A (ja) バフ処理装置、および、基板処理装置
JP2021130148A (ja) 研削システム、及び研削方法
JP6346541B2 (ja) バフ処理装置、および、基板処理装置
JP2016119368A (ja) コンディショニング装置、バフ処理装置、基板処理装置、ドレッサ、および、コンディショニング方法