KR20070097058A - Substrate inspecting apparatus and substrate inspecting method - Google Patents

Abstract

In a substrate inspecting apparatus, a CPU (811) for a control section is provided with a reference resistance measuring section (811a) for measuring a reference resistance value, which is a resistance value within a measuring point set, with respect to a previously selected reference substrate; a threshold value setting section (811c) for setting a threshold value for each measuring set; an inspection resistance measuring section (811d) for measuring, as an inspection resistance value, the resistance value within the measuring point set of the substrate to be inspected; and a judging section (811e) for judging conformity of the inspection resistance value, based on the threshold value, for each measuring point set. Thus, continuity inspection of the substrate to be inspected can be accurately inspected.

Description

Substrate inspection device and substrate inspection method {SUBSTRATE INSPECTING APPARATUS AND SUBSTRATE INSPECTING METHOD}

The present invention provides a substrate inspection apparatus, a substrate inspection program, and a substrate inspection apparatus for conducting inspection between two measurement points (hereinafter, referred to as measurement point sets), which are set in advance on the wiring pattern with respect to a test target substrate on which a plurality of wiring patterns are formed. It relates to a substrate inspection method. In particular, it relates to a board | substrate test | inspection apparatus and board | substrate test | inspection method which perform the conduction test between the said measuring point sets in the buildup board | substrate which has a via.

Since wiring patterns on a circuit board need to accurately transmit electrical signals to electrical components such as semiconductors and resistors, such as ICs mounted on the circuit board, printed wiring boards, liquid crystal panels, and plasmas before mounting semiconductors or electrical components. The resistance value between the measurement points provided in the wiring pattern to be inspected is measured with respect to the wiring pattern formed on the board | substrate, such as a circuit wiring board in which a wiring pattern was formed in the display panel, or a semiconductor wafer, and the quality is inspected.

As described above, in order to determine the quality of the substrate according to the resistance value between the measurement points, it is necessary to accurately measure the resistance value between the measurement points, and a measurement method capable of a much more accurate measurement using a known four-terminal measurement method has been proposed ( See Patent Document 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 10-123189

On the other hand, with the progress of miniaturization of circuit boards in recent years, the width of wiring patterns has narrowed, and the influence of nonuniformity of the width (or thickness) of wiring patterns on the resistance value between measurement points has increased. Therefore, even if the resistance value between measurement points is large, and even if the resistance value between measurement points is measured with high precision as mentioned above, setting of the threshold used as the reference | standard of the acceptance judgment becomes difficult, As a result, conduction test of a board | substrate is performed correctly. It may be difficult to do it.

In particular, in the case where the substrate is a build-up substrate having vias, the increase in the resistance value between the measurement points due to the bonding failure generated in the vias such as the laser via is small, and the resistance value between the measurement points due to the nonuniformity such as the width of the wiring pattern is small. It becomes about the same (or less) as the nonuniformity of, and it becomes very difficult to set the threshold which becomes a reference | standard of the acceptance judgment.

This invention is made | formed in view of the said subject, and an object of this invention is to provide the board | substrate test | inspection apparatus and board | substrate test | inspection method which carry out the conduction test of the to-be-tested board | substrate correctly.

In order to solve the said problem, the board | substrate test | inspection apparatus which concerns on the board | substrate with which the some wiring pattern was formed is previously set on the said wiring pattern, and performs the conduction test between the measurement point sets which are a combination of two measurement points. A substrate inspection apparatus, comprising: inspection resistance measurement means for measuring a resistance value between the measurement point sets of a substrate to be inspected as an inspection resistance value, threshold setting means for setting a threshold value corresponding to the measurement point set, and for each of the measurement point sets It is characterized by including determination means for determining whether or not the inspection resistance value in accordance with a threshold value.

By setting it as the above-mentioned structure, the resistance value between the set of measurement points which is set previously on the wiring pattern of a test | inspection board | substrate by a test | inspection resistance measuring means, and is a combination of two measuring points, is measured as test resistance value. The threshold value is set by the threshold value setting means in correspondence with the set of measurement points, and the determination means determines whether or not the value of the test resistance value is set by the threshold value setting means for each set of measurement points. Therefore, since the quantity of the inspection resistance value which is the resistance value between the measuring point sets is determined according to the threshold value set corresponding to the measuring point set, the quantity of the inspection resistance value is accurately determined by setting the threshold value to an appropriate value corresponding to the measuring point set. The conduction test of a test | inspection board | substrate is performed correctly.

1 is a side cross-sectional view showing an embodiment of a substrate inspection device according to the present invention.

FIG. 2 is a plan view of the substrate inspection device shown in FIG. 1. FIG.

3 is a configuration diagram showing an example of an electrical configuration of a substrate inspection device.

4 is a conceptual diagram for explaining an example of the configuration of the measurement execution unit.

5 is a configuration diagram showing an example of a hardware configuration of the controller.

6 is a conceptual diagram showing an example of the configuration of a substrate.

7 is a configuration diagram showing an example of a functional configuration of a control unit according to the first embodiment.

FIG. 8 is a graph for explaining a method of determining whether the test resistance value is determined by the determining unit according to the first embodiment. FIG.

9 is an explanatory diagram of a test resistance difference.

10 is a chart for explaining an example of a method for calculating a threshold.

11 is a flowchart showing an example of the operation up to the threshold value setting of the control unit according to the first embodiment.

12 is a flowchart showing an example of the operation performed when the control unit according to the first embodiment executes inspection.

It is a block diagram which shows an example of the functional structure of the control part which concerns on 2nd Embodiment.

It is a graph explaining the method of determining the quality of inspection resistance value by the determination part which concerns on 2nd Embodiment.

15 is a flowchart showing an example of the operation up to the threshold value setting of the control unit according to the second embodiment.

FIG. 16 is a flowchart showing an example of the operation when the control unit executes the inspection according to the second embodiment. FIG.

17 is a configuration diagram showing an example of a functional configuration of a control unit according to the third embodiment.

18 is a graph for explaining how to judge whether or not the inspection resistance value is determined by the determination unit according to the third embodiment.

19 is a flowchart showing an example of the operation up to the threshold value setting of the control unit according to the third embodiment.

20 is a flowchart showing an example of the operation when the control unit executes the inspection according to the third embodiment.

1 is a side cross-sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, Figure 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the direction relationship with each figure mentioned later, the XYZ rectangular coordinate axis was described.

As shown in these figures, this board | substrate test | inspection apparatus is provided with the opening-closing door 11 arrange | positioned freely with respect to the apparatus main body 1 in the apparatus front side (-Y side), and this opening-closing door 11 In the state where the wiring pattern is formed in a plurality of layers, the substrate 2 (corresponding to the inspected substrate; see FIG. 6) is opened from the carrying-out portion 3 provided in the central portion of the front side of the apparatus. It is possible to bring in. In addition, the rear side (+ Y side) of the carry-out / out part 3 is provided with the contact 44 of several (for example, 500) which transmits a test signal, and lands of the wiring pattern of the board | substrate 2 (measurement point) The inspection part 4 which moves the inspection jig 41 mentioned later in order to contact the contact 44 is provided.

In addition, the inspection signal 4 outputs an instruction signal for moving the contactor 44 to contact the measurement point, an inspection signal outputted to the measurement point through the contactor 44, and the inspection unit 4. A signal or the like is input, and a measurement execution unit 74 which transmits a test signal to a control unit 8 (not shown) which will be described later is arranged and arranged in a suitable place (in this case, the upper part of the apparatus main body 1). And the board | substrate 2 in which the test | inspection (i.e. quality determination) by the test | inspection part 4, the measurement execution part 74, etc. is complete | finished is returned to the carrying-in / out part 3, the open / close door 11 is opened, and an operator It can be carried out by.

In this board | substrate inspection apparatus, in order to convey the board | substrate 2 between the carrying-in / out part 3 and the test | inspection part 4, the conveyance table 5 is installed freely in a Y direction, and the conveyance table 5 is a conveyance table. It is comprised so that it may move in the Y direction and position by the drive mechanism 6. That is, in the conveying table drive mechanism 6, the two guide rails 61 extending in the Y direction are spaced apart in the X direction by a predetermined interval, and the conveying table 5 slides freely along these guide rails 61. It is.

Moreover, the ball screw 62 is arrange | positioned and installed in parallel with these guide rail 61, The one side (-Y side) end of this ball screw 62 is hold | maintained by the apparatus main body 1, and the other side (+ Y Side) is connected to the rotating shaft 64 of the conveyance table driving motor 63. In addition, the ball screw 62 is screwed with a bracket 65 fixing the conveying table 5, and the motor 63 rotates in response to a command from the controller 8 (see FIGS. 3 and 5) described later. When driven, the conveyance table 5 moves in the Y direction corresponding to the rotational amount to reciprocate between the carry-in and out portions 3 and the inspection unit 4.

2, the conveyance table 5 is provided with the board | substrate seating part 51 for mounting the board | substrate 2. As shown in FIG. The substrate mounting portion 51 is an elastic biasing means for elastically biasing the substrate 2 from the direction in which the raised substrate 2 is coupled with the three coupling pins 53 and facing the coupling pins 53. The substrate 2 is elastically biased toward the coupling pin 53 to hold the substrate 2 on the substrate mounting portion 51 (not shown). In addition, a through opening (not shown) is formed in the substrate seating portion 51 in order to bring the contact 44 of the lower inspection unit 4D described later into contact with the wiring pattern formed on the lower surface of the substrate 2 thus held. It is.

The inspection unit 4 is an upper inspection unit 4U for inspecting a wiring pattern formed on the upper surface side of the substrate 2 on the upper side (+ Z side) with the moving path of the conveying table 5 interposed therebetween, and the lower side. (-Z side) is provided with the lower test | inspection unit 4D for inspecting the wiring pattern formed in the lower surface side of the board | substrate 2. As shown in FIG. The inspection units 4U and 4D have substantially the same configuration and are arranged substantially symmetrically with the moving path of the conveying table 5 interposed therebetween. The inspection units 4U and 4D are provided with the inspection jig 41 and the inspection jig drive mechanism 43.

3 is a configuration diagram showing an example of an electrical configuration of a substrate inspection device. The board inspection apparatus includes a CPU, a ROM, a RAM, a motor driver, and the like, which controls the entire apparatus in accordance with a program stored in the ROM in advance (see Fig. 5), the tester controller 75, and the measurement execution. The part 74 is provided.

The tester controller 75 receives the inspection start command from the control unit 8 and is located at both ends of the wiring pattern to be inspected among the plurality of contacts 44 contacting the lands of the wiring pattern of the substrate 2 along the program stored in advance. In order to select two contactors 44 in contact with each of two lands (hereinafter, referred to as measurement point sets). In addition, the tester controller 75 outputs a scan command to the measurement execution unit 74 to perform a test between the two selected contacts 44. Further, the tester controller 75 receives the resistance value measured from the measurement execution unit 74 (the inspection processing unit 741 described later in FIG. 4) and transmits it to the control unit 8.

On the other hand, as shown in FIG. 3, the inspection jig drive mechanism 43 includes an X jig driver 43X for moving the inspection jig 41 in the X direction with respect to the apparatus main body 1, and an X jig driver 43X. Is connected to the Y jig driver 43Y to move the inspection jig 41 in the Y direction, and the θ jig driver 43θ is connected to the Y jig driver 43Y to rotate the inspection jig 41 in the Z-axis direction. ) And a Z jig driver 43Z which is connected to the θ jig driver 43 43 and moves the test jig 41 in the Z direction, and the test jig 41 is moved by the control unit 8 to the transfer table 5. The contact 44 is brought into contact with or separated from the wiring pattern formed on the board | substrate 2 by positioning relatively, or raising and lowering the test jig 41 in a vertical direction (Z direction) with respect to .

4 is a conceptual diagram for explaining an example of the configuration of the measurement execution unit 74. The measurement execution unit 74 includes a current generation unit 742 consisting of a direct current source for outputting a direct current for measurement of a predetermined value (value set by the control unit 8) I0, and within the wiring pattern by the direct current for measurement. The contactor 44 selected by the tester controller 75 (see FIG. 3) among the plurality of contacts 44 included in the test jig 41 and the voltage measuring unit 743 for measuring the generated voltage drop amount (potential difference). The scanner 744 which consists of a switch array etc. which connect the current generating part 742 and the voltage measuring part 743 is provided.

The inspection processor 741 connects the current generator 742 between the two contacts 44 to be supplied current in response to a scan command from the tester controller 75, and between the two contacts 44 to be detected by the potential difference. The control signal is output to the scanner 744 in order to connect the voltage measuring units 743, respectively. In addition, the inspection processing unit 741 divides the voltage value (potential difference) measured by the voltage measuring unit 743 into the DC current value for measurement I0 to measure the resistance value between the two contacts 44 (that is, between the measurement point sets). It obtains and transmits to the test controller 75.

5 is a configuration diagram showing an example of a hardware configuration of the controller 8. The control unit 8 is made of, for example, a personal computer. The control unit 8 includes a main control unit 81 for controlling the overall operation of the control unit 8 and a keyboard, a mouse, and the like, which accept an operation from the outside. 82, a speaker 83 for outputting audio to the outside, a monitor 84 for outputting images to the outside, a communication control unit 85 for communicating with the tester controller 75, and various kinds of information The printer 86 that prints to the printer is connected via a bus BA8 which is a data transmission path.

The main control unit 81 controls the overall operation of the control unit 8, an information processing unit (CPU) 811, a RAM 812 for temporarily storing information during processing, and an operating system (OS). And a ROM 813 in which predetermined image information and the like are stored in advance.

Among the various data stored in the RAM 812 or the ROM 813, data that can be stored in a removable recording medium is, for example, a hard disk drive, an optical disk drive, a flexible disk drive, a silicon disk drive, a cassette media reader, or the like. In this case, the recording medium is, for example, a hard disk, an optical disk, a flexible disk, a CD, a DVD, a semiconductor memory, or the like.

The interface units 821 and 861 are for exchanging data between the operation unit 82, the printer 86, and the main control unit 81, respectively. The audio reproducing unit 831 outputs a predetermined voice (for example, an alarm, a voice for operation guidance, etc.) to the speaker 83 according to an instruction from the main controller 81. The drawing processing unit 841 displays required images on the monitor 84 according to the image display instruction from the main control unit 81, and includes a video RAM and the like.

6 is a conceptual diagram illustrating an example of the configuration of the substrate 2. (a) is a perspective view which transparentized other than a wiring pattern, (b) is sectional drawing. The substrate 2 may include a first substrate 21 having a wiring pattern 211 a formed on an upper surface 211 of an insulating substrate 212, and a wiring pattern 221 a formed on an upper surface 221 of an insulating substrate 222. Together, this is a build-up multilayer (in this case, three-layer) printed wiring board (corresponding to the build-up substrate) composed of the second substrate 22 having the wiring pattern 223a formed on the lower surface 223.

The wiring pattern 211a is electrically connected to the wiring pattern 221a through the via TH1 formed on the insulating substrate 212, and the wiring pattern 221a is connected to the via TH2 formed on the insulating substrate 222. It is connected to the wiring pattern 223a so that electricity can be supplied through it. The vias TH1 and TH2 are micro vias formed here by a laser, and defects are likely to occur in the joint surface between the copper plating layer formed on the cylindrical side of the via and the wiring patterns 221a and 223a. In the case where the defect is minor, the increase in the resistance value between the measurement point sets (for example, between the measurement point MP1 and the measurement point MP2 on the wiring pattern 211a) due to the defect may be difficult to detect.

<First Embodiment>

Next, the board | substrate inspection apparatus which concerns on 1st Embodiment of this invention is demonstrated using FIGS. 7 is a configuration diagram showing an example of a functional configuration of the control unit 8 according to the first embodiment. The CPU 811 of the controller 8 includes a reference resistance measuring unit 811a (corresponding to the reference resistance measuring unit) for measuring a reference resistance value, which is a resistance value between sets of measurement points, with respect to a preselected reference substrate, and a reference resistance for each measurement point set. A statistical calculation unit 811b (corresponding to statistical calculation means) for obtaining an average value and a standard deviation of the values, a threshold value setting unit 811c (corresponding to a threshold value setting means) for setting a threshold value for each set of measurement points, and a test subject. An inspection resistance measuring unit 811d (corresponding to the inspection resistance measuring unit) for measuring the resistance value between the set of measurement points of the substrate as the inspection resistance value, and a determination unit 811e for determining the quality of the inspection resistance value according to the threshold value for each measurement point set. ) (Corresponds to the determination means).

In addition, the RAM 812 of the control unit 8 stores the reference resistance storage unit 812a for storing the reference resistance value in association with the identification information of the measurement point set, and stores the threshold value in association with the identification information of the measurement point set. Threshold storage unit 812b and inspection resistance storage unit 812c for storing the value of the inspection resistance in association with the identification information of the measurement point set.

The reference resistance measuring unit 811a refers to a resistance value between sets of measurement points with respect to a reference substrate which is a predetermined number (in this case, 30) to be inspected among a plurality of inspected substrates of the same type (for example, 10,000). While measuring as the resistance value, the obtained reference resistance value is stored in the reference resistance storage unit 812a in association with the identification information of the measurement point set.

Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value. In addition, a reference board | substrate selects as a reference board | substrate what conducts a conductive test beforehand among 10000 test pieces of the same kind, and is favorable.

The statistical calculation unit 811b reads from the reference resistance storage unit 812a the reference resistance value measured by the reference resistance measurement unit 811a for each set of measurement points for a predetermined number (here, 30 sheets) of reference substrates. And the standard deviation is obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812a in association with the identification information of the measurement point set.

The threshold value setting unit 811c assigns a sequence number to each set of measurement points by arranging the set of measurement points in ascending order according to the average value of the reference resistance values, and the difference of the average value of the reference resistance values of two sets of measurement points adjacent to the sequence numbers. The threshold is set in accordance with the above, and the set threshold is stored in the threshold storage unit 812b in association with the sequence number information and the identification information of the set of two measurement points. A detailed method of setting the threshold will be described later with reference to FIG. 10.

The test resistance measuring unit 811d measures the resistance value between the set of measurement points of the test target substrate as the test resistance value, and matches the obtained test resistance value with the identification information of the test point set to the test resistance storage unit 812c. To save. Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value.

The determination unit 811e reads the inspection resistance values of two sets of measurement points adjacent to the sequence number from the inspection resistance storage unit 812c, calculates their difference (hereinafter referred to as inspection resistance difference? R), and sets the threshold value. The determination is made based on the magnitude relationship with the corresponding threshold set by the unit 811c. Specifically, when the test resistance difference ΔR of two sets of measurement points adjacent to the sequence number is less than the lower limit SHLA set by the threshold setting unit 811c or more than the upper limit SHUA, the defect is judged to be defective. (See Figure 8). More detailed processing will be described later using the flowchart shown in FIG.

The reference resistance storage unit 812a associates the average value and the standard deviation of the reference resistance value obtained by the reference resistance measurement unit 811a with the reference resistance value obtained by the statistical calculation unit 811b with the identification information of two sets of measurement points. To save.

The threshold storage unit 812b stores the threshold value set by the threshold value setting unit 811c in association with sequence number information and identification information of two sets of measurement points.

The test resistance storage unit 812c stores the test resistance value obtained by the test resistance measuring unit 811d in association with the identification information of the measurement point set.

Further, the board inspection program of the present invention which functions the control unit 8 as the reference resistance measuring unit 811a, the statistical calculation unit 811b, and the like is stored in the ROM 813, for example, by the CPU 811. By executing, the control part 8 functions as each function part, such as the reference resistance measuring part 811a and the statistical calculation part 811b.

8 is a graph for explaining a method of determining whether the test resistance value is determined by the determining unit 811e. (a) is a graph G1 showing an example of the test resistance value R, where the horizontal axis is the sequence number SN and the vertical axis is the test resistance value R. FIG. The sequence number SN is given by sorting in ascending order according to the average value of the reference resistance values for each set of measurement points, and the magnitude relationship between the reference resistance value and the test resistance value between the measurement point sets is approximately equal, (G1) is a curve in which the test resistance value R increases as the sequence number SN increases.

However, in this case, there is a defective part in the wiring pattern between the measuring point sets with the sequence number SN of "455", and due to this defective part, the graph G1 shows the sequence number corresponding to the inspection resistance value R between the measuring point sets. There is a defective portion EP in which the test resistance value R is rapidly increased at the position where SN is "455". In addition, the resistance value of the defective part EP is equal to or greater than the resistance value R1 between the measuring point sets having the sequence number SN of 1, and the resistance between the measuring point sets having the maximum sequence number SN (here, "925"). Since it is below the value R2, it cannot be detected when a constant threshold is used for all the set of measurement points in a test | inspection board | substrate.

(b) is the graph G2 of the set of two sets of measurement points with which the sequence number adjoins corresponding to the test | inspection resistance value R shown to (a). The horizontal axis in the figure is the sequence number SN, and the vertical axis is the inspection resistance difference ΔR. Here, inspection resistance difference (DELTA) R is demonstrated using FIG. 9 is an explanatory diagram of inspection resistance difference ΔR. The horizontal axis in the figure is the sequence number SN and the vertical axis is the test resistance value R. FIG. The test resistance difference ΔRi is the test resistance value R of two sets of measurement points, in which the sequence numbers SN defined by the following formula (1) are adjacent (here, the sequence numbers SN are i, (i + 1)): ) Is the difference.

However, Ri is the test resistance value R of the measuring point set whose sequence number SN is i. In addition, i = 1-925.

Returning to Fig. 8B again, since the test resistance value R is substantially increased as the sequence number SN is increased as described above, the test resistance difference ΔR is shown in the graph G2. Usually, it is a small amount of value (for example, about 1 mΩ). However, since there exists the defective part EP which the test resistance value R rapidly increases in the position where sequence number SN is "455", the test resistance whose i of the test resistance difference (DELTA Ri) is "454". The difference ΔRi is significantly larger than the test resistance difference ΔRi at another point (for example, about 10 mΩ), and the test resistance difference ΔRi at a point where i is "455" is different from the test resistance difference ΔRi. ) And a significantly smaller value (eg -10mΩ). Therefore, by accurately setting the threshold value (the upper limit value shown by the graph G3 of FIG. 8 and the lower limit value shown by the graph G4) to an appropriate value (for example, 3 mΩ and -2 mΩ), it is possible to accurately detect the defective part EP. It becomes possible.

10 is a chart for explaining an example of a method for calculating a threshold. (a) is a chart showing the average value AV and the standard deviation σ calculated by the statistical calculation unit 811b, and (b) the threshold value (the upper limit value SHUA) calculated by the threshold setting unit 811c. ) And the lower limit (SHLA). (a) includes reference numbers measured by the reference resistance measuring unit 811a for the number of measurement point sets (hereinafter referred to as point number PN) and the measurement point set corresponding to the point number PN in the order from the upper column. The average value AV and the standard deviation σ of the value, and the sequence number SN given to each set of measurement points by the threshold value setting unit 811c are displayed.

Here, the average value AVi of the set of measurement points whose point number PN is i is the smallest, and the sequence number SN corresponding to this point number PN (= i) is one. Further, the average value AVj of the set of measurement points whose point number PN is j is the second smallest, and the sequence number SN corresponding to this point number PN (= j) is two.

(b) shows a sequence number (SN), an average value (AV), and a standard deviation (σ) in order from the upper column, and shows the result of sorting (sorting) the data shown in (a) by the sequence number (SN). have. As described above, the point numbers PN of the set of measurement points having the sequence numbers SN 1 and 2 are i and j, respectively. Here, the point number PN of the measurement point set whose sequence number SN is n and (n + 1) was called p and q, respectively. The upper limit SHUA and the lower limit SHLA set by the threshold setting unit 811c are displayed on the lower side of the column of the fourth point number PN from the top of (b). As shown outside, the upper limit value SHUAn and the lower limit value SHLAn, which are set from the set of measurement points having the sequence numbers SN and n and (n + 1), are obtained by the following expressions (2) and (3), respectively. .

11 is a flowchart showing an example of the operation up to the threshold setting of the controller 8. This operation is performed as a preparation operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in FIG.

First, by the reference resistance measuring unit 811a, the reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: number of measurement point sets), which are resistance values between sets of measurement points, for 30 reference substrates ( Here, N = 925), M: number of reference substrates (here, M = 30)) are measured, and reference resistance storage unit 812a is associated with identification information (here, point number PN) of the measurement point set. Is stored in step S101. Next, the statistical calculation unit 811b calculates the average value AVi and the standard deviation σi of the reference resistance value SRi, j for each measurement point set, and identifies the measurement point set (in this case, the point number PN). Are stored in the reference resistance storage unit 812a (step S103).

Then, the threshold value setting unit 811c sorts in ascending order (that is, in order of decreasing average value AVi) according to the magnitude of the average value AVi of the reference resistance values SRi, j, so that the sequence number (for each set of measurement points) SN) is granted (step S105). Next, by the threshold value setting unit 811c, the reference resistance value SRi of two sets of measurement point sets adjacent to the sequence number SN (here, the measurement point set in which the sequence numbers SN are n and (n + 1)) Using the average value AVi and the standard deviation σi of j) (by the equations (2) and (3) described above), the upper limit value SHUAn and the lower limit value SHLAn for the test resistance difference ΔRn are set. (See FIG. 10), the upper limit value SHUAn and the lower limit value SHLAn are stored in the threshold storage unit 812b in association with sequence number SN information and identification information (point number PN) of two sets of measurement points. (Step S107), the processing ends.

12 is a flowchart showing an example of the operation when the control unit 8 executes an inspection. This operation is executed when the operation shown in Fig. 11 is completed and the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in Fig. 2. Incidentally, the following processing is performed by the determination unit 811e unless otherwise specified.

First, the value of the counter k of the sequence number SK is initialized to 1 (step S201). Then, with reference to the threshold storage unit 812b, the point number of the measuring point set in which the value of the sequence number SK is the value of the counter k (that is, the k-th from the smaller average value AV of the reference resistance value). (PNk) is obtained (step S203). Next, the resistance value Rk of the measuring point set of the point number PNk is measured by the test resistance measuring unit 811d and stored in the test resistance storage unit 812c in association with the point number PNk (step S205). . Next, a determination is made as to whether the value of the counter k is 1 (step S207).

If the value of the counter k is 1 (YES in step S207), the value of the counter k is incremented by 1 (step S209), and the process returns to step S203 to repeat the processing after step S203. If the value of the counter k is not 1 (that is, 2 or more) (NO in step S207), the sequence numbers SK are adjacent (here, the sequence numbers SK are k and (k-1)). ) The test resistance values Rk and R (k-1) of two sets of measurement points are read from the test resistance storage unit 812c, and the test resistance difference ΔRk is obtained using the following equation (4) (step). S211).

Then, a determination is made as to whether or not the inspection resistance difference ΔRk is equal to or greater than the lower limit SHUA (k-1) and less than or equal to the upper limit SHLA (k-1) obtained in step S107 of the flowchart shown in FIG. S213). If the test resistance difference ΔRk is greater than or equal to the lower limit SHLA (k-1) and not less than or equal to the upper limit SHUA (k-1) (that is, less than or equal to the lower limit SHLA (k-1)) or the upper limit SHUA (k- 1)) exceeding) (NO in step S213), it is determined that the wiring pattern (or empty) between the measurement point sets corresponding to the point number PN (k-1) is defective (step S221). The process ends.

On the other hand, when it is determined that the test resistance difference ΔRk is equal to or greater than the lower limit SHLA (k-1) and equal to or less than the upper limit SHUA (k-1) (YES in step S213), the value of the counter k is measured point. A determination is made as to whether or not the number N of sets is set (step S215). If it is determined that the value of the counter k is not more than the number N of the measuring point sets (that is, less than the number N of the measuring point sets) (NO in step S215), the value of the counter k is set by one. Incremented (step S217), the process returns to step S203 and the process after step S203 is repeatedly executed. On the other hand, when it is determined that the value of the counter k is equal to or greater than the number N of the measurement point sets (YES in step S215), the conduction state of the substrate 2 is determined to be good (step S219), and the processing ends. .

In this way, since both parts of the test resistance value Rk which is the resistance value between the measuring point sets are determined according to the upper limit value SHUA (k-1) and the lower limit value SHLA (k-1) set for each measuring point set, the upper limit value SHUA By setting (k-1)) and the lower limit value SHLA (k-1) to an appropriate value for each set of measurement points, the quality of the test resistance value Rk is accurately determined.

In addition, the difference ΔRk between the test resistance values Rk and R (k-1) of two sets of measurement points is determined according to the corresponding upper limit value SHUA (k-1) and lower limit value SHLA (k-1). Therefore, compared with the case where the inspection resistance value Rk is determined for each measurement point set, the difference between the manufacturing conditions for each inspection target substrate 2 and the measurement conditions for the inspection resistance value Rk for each inspection substrate 2 is canceled out. The quality of the test resistance value Rk is determined more accurately.

For example, when the board | substrate 2 has the nonuniformity of the width | variety and the narrowness of the wiring pattern according to manufacturing conditions, and even if there is no defective site, the test | inspection resistance value Rk is large in the board | substrate 2 as a whole (wiring pattern). Is small) and the test resistance value Rk is generally small in the substrate 2 (when the wiring pattern is wide), and there is a difference between the test resistance values Rk and R (k-1). Since (DELTA) Rk is determined, the influence of the fluctuation | variation of the absolute value of test | inspection resistance value Rk is suppressed.

Similarly, the substrate 2 is inspected when the inspection resistance value Rk is entirely high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high) even when there are no defective parts depending on the measurement conditions. There is a case where the resistance value Rk is generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), and the difference ΔRk between the inspection resistance values Rk and R (k-1). Is determined, the influence of the fluctuation of the absolute value of the test resistance value Rk is suppressed.

In addition, the difference ΔRk of the test resistance values Rk and R (k-1) of two sets of measurement points to which the sequence numbers SK are adjacent (that is, the magnitude of the reference resistance value SR is adjacent) corresponds. Since it is determined according to the upper limit value SHUA (k-1) and the lower limit value SHLA (k-1), the manufacturing conditions for each inspected substrate 2 and the inspection resistance value Rk for each inspected substrate 2 are determined. By canceling out the difference in the measurement conditions of, the quality of the test resistance value Rk is more accurately determined.

In other words, two measurement points in which the sequence number SK, which is a sequence of the average value AV of the reference resistance value SR of the reference substrate, which is a substrate of the same kind as the test target substrate 2, is in a good conduction state, are adjacent to each other. The set is more accurately determined because the absolute value of the difference [Delta] Rk between the corresponding test resistance values Rk and R (k-1) becomes small since the set is originally a set of measuring points of the same magnitude.

In addition, the upper limit value according to the average value AV and the standard deviation σ of the reference resistance value SR of two sets of measuring points adjacent to the sequence number SK (see equations (2) and (3) described above). Since (SHUAn) and the lower limit value SHLAn are set, the appropriate upper limit value SHUAn and the lower limit value SHLAn are easily set.

In addition, each time the test resistance value Rk is measured, it is determined whether or not the difference ΔRk between the test resistance values Rk and R (k-1) is determined and the measurement of the test resistance value Rk is stopped at the time when a defect occurs. Therefore, the inspection of the substrate 2 is performed efficiently, especially when the frequency of defects is high.

In addition, this invention can take the following forms.

(A) In the first embodiment, the threshold value setting unit 811c sets the sequence number SN for each set of measurement points according to the magnitude of the average value AV of the reference resistance values of the reference substrate of a predetermined number (here, 30 sheets). Although the case of assigning has been described, the sequence number SN may be assigned according to other rules. For example, it may be a form which gives the order of the measurement point set which the measurement of the test | inspection resistance value R of the board | substrate 2 is performed as sequence number SN. In this case, the processing for obtaining the average value AV of the reference resistance value and the like is unnecessary, and the processing is simplified.

(B) In the first embodiment, the case where the threshold value setting unit 811c assigns the sequence number SN to each measurement point set in the order of the average value AV of the reference resistance values of the 30 reference substrates is small. If the number of reference boards is limited to 30 sheets, the number of reference boards may be any number (when the number of reference boards is one, the process of calculating the average value is unnecessary), and the order in which the average value AV of the reference resistance values is small (ascending) Rather, the sequence numbers SN may be assigned in ascending order (descending order).

(C) In the first embodiment, the case where the threshold value setting section 811c sets the lower limit value SHLA and the upper limit value SHUA has been described. However, at least one of the lower limit value SHLA and the upper limit value SHUA is set. It may also be in the form. In this case, the processing is simplified.

(D) In the first embodiment, when the threshold value setting section 811c sets the lower limit value SHLA and the upper limit value SHUA in accordance with the average value AV and the standard deviation σ of the reference resistance value of the reference substrate. Although it demonstrated, it may be set in accordance with at least one of the average value AV and the standard deviation (sigma). In this case, the processing is simplified.

(E) In 1st Embodiment, the threshold value setting part 811c uses the above-mentioned Formula (2) and Formula (3) regarding average value AV and standard deviation (σ) of the reference resistance value of a reference | standard board | substrate. Although the case of setting the lower limit value SHLA and the upper limit value SHUA has been described, it may be set using other formulas or may be set through other division tables or the like.

For example, the average values AVp and AVq, which are the average values AV of the two sets of measurement points, are divided into intervals of a predetermined size (for example, 2 mΩ), and the lower limit value SHLA and the upper limit value SHUA are divided for each division. The stored table (look-up table) may be set in advance, and the lower limit value SHLA and the upper limit value SHUA may be set in accordance with the average values AVp and AVq and the table.

<2nd embodiment>

Next, the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention is demonstrated using FIG. In addition, since the structure demonstrated using FIG. 1 thru | or 6 is the same as that of 1st Embodiment, the description is abbreviate | omitted. 13 is a configuration diagram showing an example of a functional configuration of the controller 8 according to the second embodiment. The CPU 811 of the control unit 8 includes a reference resistance measuring unit 811f (corresponding to the reference resistance measuring unit) for measuring a reference resistance value, which is a resistance value between sets of measurement points, with respect to a preselected reference substrate, per reference substrate. A reference total calculation unit 811g (corresponding to the reference total calculation means) for calculating the sum of the reference resistance values, and a statistical calculation unit 811h (corresponding to statistical calculation means) for calculating the average value and standard deviation of the reference resistance values for each set of measurement points. And a threshold resistance setting section 811i (corresponding to a threshold value setting means) for setting a threshold value for each set of measurement points, and an inspection resistance measurement section 811j for measuring the resistance value between the set of measurement points of the substrate under test as a test resistance value. (Corresponds to the inspection resistance measuring means), an inspection total calculating unit 811k (corresponding to the inspection total calculating means) for obtaining the total sum of the inspection resistance values for each inspected substrate, and the amount of inspection resistance value according to a threshold value for each set of measurement points. Judging (811m) for determining and a (corresponding to the determining means).

In addition, the RAM 812 of the control unit 8 stores the reference resistance storage unit 812f for storing the reference resistance value in association with the identification information of the measurement point set, and stores the threshold value in association with the identification information of the measurement point set. Threshold storage unit 812g and inspection resistance storage unit 812h for storing the value of the inspection resistance in association with identification information of the measurement point set.

The reference resistance measuring unit 811f is a reference that is a resistance value between sets of measurement points with respect to a reference substrate that is a predetermined number (in this case, 30) to be inspected among a plurality of inspected substrates of the same type (for example, 10,000). In addition to measuring the resistance value, the obtained reference resistance value is stored in the reference resistance storage unit 812f in association with the identification information of the measurement point set.

Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value. In addition, a reference board | substrate selects as a reference board | substrate what conducts a conductive test beforehand among 10000 test pieces of the same kind, and is favorable.

The reference total calculation unit 811g obtains the sum of the reference resistance values per sheet of the reference substrate with respect to the reference resistance value measured by the reference resistance measurement unit 811f, and stores the sum in the reference resistance storage unit 812f. Specifically, the total of the reference resistance values of all the reference substrates is obtained for 30 reference substrates, and the total of the reference resistance values per sheet is obtained by dividing by the number of reference substrates.

The statistical calculation unit 811h reads from the reference resistance storage unit 812f the reference resistance value measured by the reference resistance measurement unit 811f for each set of measurement points with respect to a predetermined number (here, 30 sheets) of reference substrates. The standard deviation is obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812f in association with the identification information of the measurement point set.

The threshold setting unit 811i sets the threshold value according to the average value and the standard deviation of the reference resistance value of the measurement point set, and associates the set threshold value with the identification information of the measurement point set to the threshold storage unit 812g. To save. Specifically, using the average value AVi and the standard deviation σi of the reference resistance value SRi (i = 1 to N, N: number of measurement point sets) of the measurement point set, the following equations (5) and (6) The upper limit SHUBi and the lower limit SHLBi are respectively calculated using (see FIG. 15).

The test resistance measuring unit 811j measures the resistance value between the set of measurement points of the test target substrate as the test resistance value, and stores the obtained test resistance value in the test resistance storage unit 812h in association with the identification information of the measurement point set. will be. Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value.

The inspection total calculation section 811k obtains the total sum of the inspection resistance values per sheet to be inspected from the inspection resistance values measured by the inspection resistance measurement section 811j and stores them in the inspection resistance storage section 812h.

The determination unit 811m reads the inspection resistance value Rk (k = 1 to N) of the measurement point set from the inspection resistance storage unit 812h, and reads the inspection resistance value Rk by the inspection total calculation unit 811k. The correction resistance value RNk is obtained by correcting by the following equation (7) using the sum of the obtained test resistance values (TM) and the reference resistance values (SM) obtained by the reference total calculation unit (811g). The determination is made based on the magnitude relationship between the corresponding upper limit value SHUBk and lower limit value SHLBk set by the correction resistance value RNk and the threshold value setting section 811i. Specifically, it is determined that the correction resistance value RNk of the measuring point set is defective when it is less than the lower limit SHLBk set by the threshold setting unit 811i or exceeds the upper limit SHUBk (see FIG. 14). More detailed processing will be described later using the flowchart shown in FIG.

The reference resistance storage unit 812f stores the average value and the standard deviation of the reference resistance value obtained by the reference resistance measurement unit 811f and the reference resistance value obtained by the statistical calculation unit 811h in association with the identification information of the measurement point set. In addition, the total of the reference resistance values obtained by the reference total calculation unit 811g is stored.

The threshold storage unit 812g stores the threshold set by the threshold setting unit 811i in association with the identification information of the measurement point set.

The test resistance storage unit 812h stores the test resistance value obtained by the test resistance measuring unit 811j in correspondence with the identification information of the set of measurement points, and stores the sum of the test resistance values obtained by the test total calculation unit 811k. To save.

In addition, the board inspection program of the present invention which functions the control unit 8 as the reference resistance measuring unit 811f, the statistical calculation unit 811h, and the like is stored in the ROM 813, for example. The control unit 8 functions as each functional unit such as the reference resistance measuring unit 811f, the statistical calculation unit 811h, and the like by executing the control unit.

14 is a graph for explaining a method for determining whether the test resistance value is determined by the determining unit 811m. This figure is a graph G1N showing an example of the correction resistance value RN obtained by correcting the inspection resistance value R, where the horizontal axis is the sequence number SN and the vertical axis is the correction resistance value RN. Here, the sequence number (SN) is given by sorting in ascending order according to the magnitude of the average value of the reference resistance values for each set of measurement points, and the magnitude relationship between the reference resistance value and the test resistance value between the measurement point sets is approximately the same. (G1N) is a curve in which the test resistance value R increases as the sequence number SN increases.

In this case, however, there is a defective portion in the wiring pattern between the measurement point sets having the sequence number SN "455", and due to this defective portion, the graph G1N has a sequence number corresponding to the inspection resistance value R between these measurement point sets. At the position where SN is "455", there is a defective portion EP in which the correction resistance value RN is rapidly increased. Further, the resistance value of the defective portion EP is equal to or greater than the correction resistance value R1N between the measurement point sets having the sequence number SN of 1, and is corrected between the measurement point sets with the maximum sequence number SN (here, "925"). Since it is less than the resistance value R2N, it cannot be detected when a constant threshold value is used for all the set of measurement points in a test | inspection board | substrate.

As described above, as the sequence number SN increases, the correction resistance value RN increases substantially, and the upper limit value SHUBi and the lower limit value SHLBi are respectively (5) and (6) by the threshold value setting section 811i. Since the upper limit value SHUBi and the lower limit value SHLBi are each obtained by the formula, the graphs are moved in parallel in the vertical direction along the graph G1N as shown in the graphs G5 and G6, respectively. Therefore, by appropriately setting the graphs G5 and G6 corresponding to the upper limit SHUBi and the lower limit SHLBi (by appropriately setting the interval between the graphs G5 and G6 and G1N). It is possible to accurately detect the defective area EP.

15 is a flowchart showing an example of the operation up to the threshold value setting of the controller 8. This operation is performed as a preparation operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in FIG.

First, by the reference resistance measuring unit 811f, the reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: the number of measurement point sets) Here, N = 925), M: number of reference substrates (here, M = 30)) are measured, and the reference resistance storage unit 812f is associated with identification information of the measurement point set (hereinafter referred to as point number PN). Is stored in step S301. Next, the statistical calculation unit 811h obtains the average value AVi and the standard deviation σi of the reference resistance value SRi, j for each measurement point set, and identifies the measurement point set identification information (here, the point number PN). Correspondingly, it is stored in the reference resistance storage unit 812f (step S303).

The total sum SM of the average value AVi (corresponding to the total sum of the reference resistance values per sheet of reference substrate) is obtained by the reference total calculation unit 811g (step S305). Subsequently, the threshold value setting unit 811i uses the average value AVi and the standard deviation σi of the reference resistance value SRi, j of the measurement point set (by the formulas (5) and (6) described above). ) The upper limit SHUBi and the lower limit SHLBi are set, and the upper limit SHUBi and the lower limit SHLBi are stored in the threshold storage unit 812g in association with the identification information (point number PN) of the measurement point set ( Step S307), the process ends.

16 is a flowchart showing an example of the operation when the control unit 8 executes the inspection. This operation is executed in a state where the operation shown in Fig. 15 is completed and the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in Fig. 2. Incidentally, the following processing is performed by the determining unit 811m unless otherwise specified.

First, the test resistance values Rk (k = 1 to N) of all the measurement point sets are measured by the test resistance measuring unit 811j and stored in the test resistance storage unit 812h (step S401). The total sum TM of the test resistance values Rk is determined by the test total calculation unit 811k and stored in the test resistance storage unit 812h (step S403). Subsequently, the test resistance value Rk is corrected by the above-described equation (7) using the sum of the test resistance values TM and the sum of the reference resistance values SM to obtain a correction resistance value RNk (step). S405).

Then, a determination is made as to whether or not the correction resistance value RNk is greater than or equal to the lower limit SHLBk and less than or equal to the upper limit SHUBk obtained in step S307 of the flowchart shown in FIG. 15 (step S407). When it is determined that the at least one correction resistance value RNk is greater than or equal to the lower limit SHLBk and not less than or equal to the upper limit SHUBk (that is, less than the lower limit SHLBk or greater than the upper limit SHUBk) (N0 in step S407), It is determined that the conduction state of the substrate 2 is defective (step S411), and the processing ends.

On the other hand, when it is determined that all the correction resistance values RNk are equal to or greater than the lower limit value SHLBk and less than or equal to the upper limit value SHUBk (YES in step S407), it is determined that the conduction state of the substrate 2 is good (step S409). Is terminated.

In this way, since both parts of the test resistance value Rk, which is the resistance value between the measurement point sets, are determined according to the upper limit value SHUBk and the lower limit value SHLBk set for each measurement point set, the upper limit value SHUBk and the lower limit value SHLBk are appropriate for each measurement point set. By setting the value, the quality of the test resistance value Rk is accurately determined.

In addition, since the test resistance value Rk is determined as the correction resistance value RNk corrected by the ratio with respect to the total SM of the reference resistance value RS of the total TM of the test resistance value Rk, it is a test | inspection By correcting the difference between the manufacturing conditions for each substrate and the measurement conditions of the inspection resistance values for each substrate to be inspected, the quality of the inspection resistance value Rk is more accurately determined.

For example, when the board | substrate 2 has the nonuniformity of the width | variety and the narrowness of the wiring pattern according to manufacturing conditions, and even if there is no defective site, the test | inspection resistance value Rk is large in the board | substrate 2 as a whole (wiring pattern). Is small and the test resistance value Rk is generally small in the substrate 2 (when the wiring pattern is wide), and the test resistance value Rk is the sum of the test resistance values Rk. Since it is determined as the correction resistance value RNk corrected by the ratio with respect to the sum SM of the reference resistance values RS of TM, the influence of the fluctuation of the absolute value of the test resistance value Rk is suppressed.

Similarly, the substrate 2 is inspected when the inspection resistance value Rk is entirely high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high) even when there are no defective portions depending on the measurement conditions. There is a case where the resistance value Rk is generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), and the test resistance value Rk is the sum of the test resistance values Rk (TM). Since it is determined as the correction resistance value RNk corrected by the ratio of the reference resistance value RS to the total SM of the reference resistance RS, the influence of the fluctuation of the absolute value of the test resistance value Rk is suppressed.

Furthermore, the upper limit value SHLBi and the lower limit value SHUBi are set according to the average value AVi and the standard deviation σi of the reference resistance value SR of the measurement point set (see equations (5) and (6) above). Therefore, the appropriate upper limit value SHLAi and the lower limit value SHUAi are easily set.

Moreover, this invention can take the following forms.

(F) In 2nd Embodiment, the determination part 811m correct | amends test | inspection resistance value Rk using the total of test resistance value TM and the total of reference resistance value SM, and correct | amends resistance value RNk. In the following description, a case of determining the correction resistance value RNk is described. However, the upper limit value SHUBk and the lower limit value SHLBk are corrected using the sum of the test resistance values TM and the sum of the reference resistance values SM. It may be. In this case, for example, the threshold value setting unit 811i may correct the upper limit value SHUBk and the lower limit value SHLBk by the following expressions (8) and (9), respectively.

(G) In the second embodiment, the case where the threshold value setting unit 811i calculates the sum SM using the average value AV of the reference resistance values of the 30 reference substrates has been described. Is not limited to 30 sheets, and may be any number. For example, when the number of reference substrates is one, the processing for obtaining the average value AV is unnecessary.

(H) In the second embodiment, the case where the threshold value setting section 811i sets the lower limit value SHLB and the upper limit value SHUB has been described. However, at least one of the lower limit value SHLB and the upper limit value SHUB is set. It may also be in the form. In this case, the processing is simplified.

(I) In the second embodiment, when the threshold value setting section 811i sets the lower limit value SHLB and the upper limit value SHUB according to the average value AV and the standard deviation σ of the reference resistance value of the reference substrate. Although it demonstrated, it may be set in accordance with at least one of the average value AV and the standard deviation (sigma). For example, the lower limit SHLB and the upper limit SHUB may be obtained by subtracting and adding a predetermined number (for example, 5 mΩ) previously set as the average value AV. In this case, the processing is simplified.

(J) In the second embodiment, the threshold value setting unit 811 i uses the above-described equations (5) and (6) regarding the average value AV and the standard deviation σ of the reference resistance value of the reference substrate. Although the case of setting the lower limit value SHLB and the upper limit value SHUB has been described, it may be set using other formulas or may be set through other division tables or the like.

For example, the average value AV of the reference resistance value is divided into intervals of a predetermined size (for example, 2 mΩ), and the table (lookup table) in which the lower limit value SHLB and the upper limit value SHUB are stored in advance is set in advance. The lower limit SHLB and the upper limit SHUB may be set in accordance with (AV) and this table.

Third Embodiment

Next, the board | substrate inspection apparatus which concerns on 3rd Embodiment of this invention is demonstrated using FIGS. 17-20. In addition, since the structure demonstrated using FIG. 1 thru | or 6 is the same as that of 1st Embodiment, the description is abbreviate | omitted. 17 is a configuration diagram showing an example of a functional configuration of the control unit 8 according to the third embodiment. The CPU 811 of the control unit 8 includes a reference resistance measuring unit 811p (corresponding to the reference resistance measuring unit) for measuring a reference resistance value, which is a resistance value between sets of measurement points, with respect to a preselected reference substrate, and a sequence number for each set of measurement points. A statistical calculation unit 811q (corresponding to a part of the threshold value setting means) for obtaining an average value and a standard deviation of the threshold, and a threshold setting unit 811r (corresponding to a part of the threshold value setting means) for setting a threshold value for each set of measurement points. And an inspection resistance measuring unit 811s (corresponding to the inspection resistance measuring unit) for measuring the resistance value between the set of measurement points of the test target substrate as the inspection resistance value, and determining the quality of the inspection resistance value according to the threshold value for each measurement point set. A judging section 811t (corresponding to judging means) is provided.

In addition, the RAM 812 of the control unit 8 stores a reference resistance storage unit 812p for storing the reference resistance value in association with the identification information of the measurement point set, and stores the threshold value in association with the identification information of the measurement point set. Threshold storage unit 812q and inspection resistance storage unit 812r for storing the value of the inspection resistance in association with identification information of the measurement point set.

The reference resistance measuring unit 811p is a reference that is a resistance value between sets of measurement points with respect to a reference substrate which is a predetermined number (in this case, 30) to be inspected among a plurality of inspected substrates of the same type (for example, 10,000). While measuring the resistance value, the obtained reference resistance value is stored in the reference resistance storage unit 812p in association with the identification information of the measurement point set.

Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value. In addition, a reference board | substrate selects as a reference board | substrate what conducts a conductive test beforehand among 10000 test pieces of the same kind, and is favorable.

The statistical calculation unit 811q reads the reference resistance value measured by the reference resistance measurement unit 811p for each reference substrate from the reference resistance storage unit 812p, and assigns a sequence number to each set of measurement points of the reference resistance value. The average value and standard deviation are obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812p in association with the identification information of the measurement point set.

The threshold setting unit 811r sets the threshold value according to the average value and the standard deviation of the sequence number obtained by the statistical calculation unit 811q for each measurement point set, and associates the set threshold value with the identification information of the measurement point set. It is stored in the threshold memory | storage part 812q. Specifically, the sequence number of the measurement point set on each reference substrate (SN i, j (i = 1 to N, j = 1 to M, N: number of measurement point sets (here 925)), M: number of reference substrates (here Using the average value (NAVi) and the standard deviation (Nσi), the upper limit value SHUCi and the lower limit value SHLCi are obtained by the following equations (10) and (11), respectively (see FIG. 19).

The test resistance measuring unit 811s measures the resistance value between the set of measurement points of the test target substrate as the test resistance value, and stores the obtained test resistance value in the test resistance storage unit 812r in association with the identification information of the measurement point set. will be. Specifically, dividing the voltage value measured by the voltage measuring unit 743 shown in FIG. 4 by the current value I0 applied to the current generating unit 742 is obtained as the resistance value.

The determination unit 811t reads the test resistance value Ri (i = 1 to N) of the measurement point set from the test resistance storage unit 812r, and sorts the test resistance value Ri in ascending order to correspond to each measurement point set. The sequence number TNi is obtained, and success or failure is determined according to the magnitude relationship between the corresponding upper limit value SHUCi and the lower limit value SHLCi set by the sequence number TNi and the threshold value setting unit 811r. Specifically, it is determined that the sequence number TNi of the measurement point set is defective when it is less than the lower limit SHLCi set by the threshold setting unit 811r or exceeds the upper limit SHUCi (see FIG. 18). More detailed processing will be described later using the flowchart shown in FIG.

The reference resistance storage unit 812p corresponds to the average value and standard deviation of the sequence number of the reference resistance value obtained by the reference resistance measurement unit 811p and the reference resistance value obtained by the statistical calculation unit 811q and the identification information of the measurement point set. To save.

The threshold storage unit 812q stores the threshold value set by the threshold value setting unit 811r in association with the identification information of the measurement point set.

The test resistance storage unit 812r stores the test resistance value obtained by the test resistance measuring unit 811s in association with the identification information of the measurement point set.

In addition, the board inspection program of the present invention which functions the control unit 8 as the reference resistance measuring unit 811p, the statistical calculation unit 811q, and the like is stored in the ROM 813, for example, by the CPU 811. By executing, the control unit 8 functions as each functional unit such as the reference resistance measuring unit 811p and the statistical calculation unit 811q.

18 is a graph for explaining a method of determining whether the test resistance value is determined by the determining unit 811t. (a) is a graph G7 in which the average values of the reference resistance values SR of each set of measurement points are arranged in ascending order, where the horizontal axis is the sequence number SN and the vertical axis is the reference resistance value SR. In addition, the average value NAVi, the upper limit SHUCi, and the lower limit SHLCi of the sequence number of a predetermined measurement point set (hereinafter, referred to as a measurement point set of interest) are shown in the figure.

(b) is a graph G8 in which the test resistance values R of each set of measurement points of one test target substrate 2 are arranged in ascending order, where the horizontal axis is the sequence number SN and the vertical axis is the test resistance value R. FIG. . In the figure, the sequence number TNi of the inspection resistance value Ri of the set of measurement points of interest on this inspection substrate is indicated. In this test | inspection board | substrate 2, since sequence number TNi is more than the lower limit SHLCi and less than an upper limit SHUCi, it is determined that it is favorable.

(c) is a graph (G9) in which the test resistance value R of each set of measurement points of the test target substrate 2 different from (b) is arranged in ascending order, where the horizontal axis is the sequence number SN and the vertical axis is the test resistance value ( R). In the figure, the sequence number TNi of the inspection resistance value Ri of the set of measurement points of interest on this inspection substrate is indicated. Also in this test | inspection board | substrate 2, since sequence number TNi is more than the lower limit SHLCi and less than an upper limit SHUCi, it is determined that it is favorable.

(d) is a graph (G10) in which the test resistance values R of each set of measurement points of the test target board 2 different from (b) and (c) are arranged in ascending order, and the horizontal axis is a sequence number SN and the vertical axis is It is an inspection resistance value (R). In the figure, the sequence number TNi of the inspection resistance value Ri of the set of measurement points of interest on this inspection substrate is indicated. In this test | inspection board | substrate 2, since sequence number TNi exceeds the upper limit SHUCi, it is determined that it is bad.

19 is a flowchart showing an example of the operation up to the threshold setting of the controller 8. This operation is performed as a preparation operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in FIG.

First, by the reference resistance measuring unit 811p, the reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: number of measurement point sets), which are resistance values between sets of measurement points, for 30 reference substrates ( Here, N = 925), M: the number of reference substrates (here, M = 30)) are measured, and the reference resistance storage unit 812p is associated with identification information (hereinafter referred to as point number PN) of the measurement point set. Is stored in step S501. Next, the statistical resistance unit 811q sorts (sorts) the reference resistance values SRi, j of the set of measurement points for each reference substrate in ascending order and is assigned a sequence number SNi, j (step S503). Subsequently, the statistical calculation unit 811q obtains the average value NAVi and the standard deviation Nσi of the sequence number SNi, j for each set of measurement points, and associates them with the identification information of the measurement point set (here, the point number PN). The reference resistance storage unit 812p is stored (step S505).

Then, the threshold value setting section 811r uses the average value NAVi and the standard deviation Nσi of the sequence number SNi, j of the measurement point set (by the above-described formulas (10) and (11)). The value SHUCi and the lower limit SHLCi are set, and the upper limit SHUBi and the lower limit SHLBi are stored in the threshold storage unit 812q in association with the identification information (point number PN) of the measuring point set (step). S507) The process ends.

20 is a flowchart showing an example of the operation when the control unit 8 executes the inspection. This operation is executed in a state where the operation shown in Fig. 19 is completed and the substrate 2 to be inspected is placed on the substrate mounting portion 51 shown in Fig. 2. In addition, the following processing is performed by the determination part 811t, unless it states specially.

First, the test resistance values Rk (k = 1 to N) of all the measurement point sets are measured by the test resistance measuring unit 811s and stored in the test resistance storage unit 812r (step S601). Then, the test resistance value Ri is sorted in ascending order so that a corresponding sequence number TNi is obtained for each set of measurement points (step S603). Next, a determination is made as to whether or not the sequence number TNi is equal to or greater than the lower limit SHLCi and less than or equal to the upper limit SHUCi obtained in step S507 of the flowchart shown in FIG. 19 (step S605).

If it is determined that the at least one sequence number TNi is greater than or equal to the lower limit SHLCi and not less than or equal to the upper limit SHUCi (that is, less than the lower limit SHLCi or greater than the upper limit SHUCi) (NO in step S605), the substrate It is determined that the conduction state of (2) is defective (step S609), and the processing ends.

On the other hand, when it is determined that all the sequence numbers TNi are equal to or higher than the lower limit SHLCi and equal to or lower than the upper limit SHUCi (YES in step S605), the conduction state of the substrate 2 is determined to be good (step S607). do.

In this way, since both parts of the test resistance value Ri, which is the resistance value between the measuring point sets, are determined according to the upper limit value SHUCi and the lower limit value SHLCi set for each measuring point set, the upper limit value SHUCi and the lower limit value SHLCi are determined for each measuring point set. By setting it to an appropriate value, the quality of the test resistance value Ri is accurately determined.

In addition, the measuring point sets are arranged in ascending order according to the magnitude of the test resistance value Ri, and a sequence number TNi is assigned to each measuring point set, which is compared with the upper limit value SHUCi and the lower limit value SHLCi. Since the quality of the test resistance value Ri is determined, the difference between the manufacturing conditions for each test substrate and the measurement condition of the test resistance value for each test substrate is canceled, so that the quality of the test resistance value is more accurately determined.

For example, when the board | substrate 2 has the nonuniformity of the width | variety and the narrowness of the wiring pattern according to manufacturing conditions, and the test resistance value Ri is large in the board | substrate 2 even if there is no defective site (wiring pattern) The test resistance value Ri has a small width) and the test resistance value Ri is generally small within the substrate 2 (when the wiring pattern is wide), and the test resistance value Ri is the test resistance value Ri in the test substrate. Since it is determined as the sequence number TNi in the ascending order according to the magnitude of), the influence of the variation of the absolute value of the test resistance value Rk is canceled out.

Similarly, the substrate 2 is inspected when the inspection resistance value Ri is entirely high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high) even when there are no defective parts according to the measurement conditions. There is a case where the resistance value Ri is generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), and the inspection resistance value Ri is determined by the inspection resistance value Ri in the inspection substrate. Since it is determined as the sequence number TNi in the ascending order according to the size, the influence of the fluctuation of the absolute value of the test resistance value Ri is canceled out.

Also, for each reference board, the set of measuring points is arranged in ascending order according to the size of the reference resistance value SR, and a sequence number SN is assigned to each measuring point set, and the upper limit value SHUCi and the lower limit value are assigned according to the assigned sequence number SN. Since SHLCi) is obtained, an appropriate threshold value is set.

In addition, an average value (NAVi) and a standard deviation (Nσi) of the sequence number (SN) assigned to each measurement point set are obtained, and an upper limit value (i) is obtained according to the average value (NAVi) and standard deviation (Nσi) of the obtained sequence number (SN). Since SHUCi) and the lower limit SHLCi are obtained (see equations (10) and (11) described above), a more appropriate upper limit SHUCi and a lower limit SHLCi are easily set.

Moreover, this invention can take the following forms.

(K) In the third embodiment, the case where the threshold value setting unit 811r sets the threshold value according to the reference resistance value of the reference substrate has been described. However, the threshold value may be set by other methods. . For example, the threshold value may be set according to the test resistance value of the past measurement by the test resistance measuring unit 811s. In this case, the processing is simplified.

More specifically, it may be a form in which a predetermined number (for example, 10) is subtracted and added to the lower limit and the upper limit, respectively, based on the sequence number of the test resistance value determined to be good in the past measurement.

(L) In the third embodiment, the case where the threshold value setting section 811r sets the threshold value using the average value (NAV) of the sequence number of the reference resistance values of the 30 reference substrates has been described. The number of is not limited to 30 sheets, and may be any number. For example, when the number of reference substrates is one, the processing for obtaining the average value NAV is unnecessary.

(M) In the third embodiment, the case where the threshold value setting section 811r sets the lower limit value SHLC and the upper limit value SHUC has been described. However, at least one of the lower limit value SHLC and the upper limit value SHUC is set. It may also be in the form. In this case, the processing is simplified.

(N) In the third embodiment, the threshold setting unit 811r sets the lower limit value SHLC and the upper limit value SHUC according to the average value NAV and the standard deviation Nσ of the sequence number of the reference resistance value of the reference substrate. Although the case has been described, it may be set in accordance with at least one of the average value NAV and the standard deviation Nσ. For example, it may be in the form of subtracting and adding a predetermined number (for example, 10) set as the average value NAV to obtain the lower limit value SHLC and the upper limit value SHUC, respectively. In this case, the processing is simplified.

(O) In the third embodiment, the threshold value setting unit 811r uses a lower limit value using the above-described formulas (10) and (11) regarding the average value AV and the standard deviation σ of the reference resistance value of the reference substrate. Although the case where the (SHLC) and the upper limit value (SHUC) are set has been described, the setting may be performed using other formulas or may be set through other division tables or the like.

For example, the average value (NAV) of the sequence number of the reference resistance value is divided into intervals of a predetermined size (for example, 5), and the table (lookup table) in which the lower limit value SHLC and the upper limit value SHUC are stored in advance is divided in advance. The lower limit value SHLC and the upper limit value SHUC may be set according to the average value NAV and this table.

Moreover, this invention can take the following forms.

(P) Although the board | substrate inspection apparatus was demonstrated in the 1st thru | or 3rd embodiment with the upper inspection unit 4U and the lower inspection unit 4D, the board | substrate inspection apparatus has the upper inspection unit 4U and the lower part. It may also be a form provided with at least one of the inspection unit 4D.

(Q) In the first to third embodiments, a plurality of contacts 44 are supported and moved in the Z-axis direction so that the inspection jig presses the tip of the contactor 44 to each measurement point of the substrate 2 (so-called). Although the present invention is applied to a substrate inspection apparatus having a multiple needle inspection jig), a pair of contacts 44 (or probes) can be moved independently of each other in the X, Y, and Z directions. The present invention is applied to a substrate inspection apparatus having an inspection jig (a so-called mobile probe type inspection jig) that supports and press-contacts the tip of the contactor 44 to the measurement point of the substrate 2 in order according to a preset program. It may be.

(R) Although the case where the board | substrate 2 which is a test | inspection object is a buildup board | substrate which has a via was demonstrated in 1st-3rd embodiment, other types of board | substrates (for example, to one side on one insulating board) Or a printed wiring board having a wiring pattern formed thereon).

(S) In the first to third embodiments, the case where the reference substrate is selected from a plurality of inspected substrates of the same type as the reference substrate has been described, but the substrate of the same type as the inspected substrate may be used. For example, in the case of inspecting an inspected substrate different from the inspected substrate that has been inspected in the past and the manufacturing lot, the reference substrate (substrate selected from the inspected substrate) used in the past inspection may be used as it is, in particular. It may be a form in which manufacturing management is carried out perfectly, a substrate free of defects is produced, and a reference substrate is used.

As mentioned above, the board | substrate inspection apparatus which concerns on this invention is a board | substrate inspection apparatus which performs the conduction test between the set of measurement points which are previously set on the said wiring pattern, and the combination of two measurement points with respect to the to-be-tested board | substrate with which the some wiring pattern was formed. And a resistance test means for measuring a resistance value between the set of measurement points of the test target substrate as a test resistance value, threshold setting means for setting a threshold value corresponding to the set of measurement points, and the threshold value for each set of measurement points. And determining means for determining whether or not the inspection resistance value is in accordance with the above, wherein the threshold value setting means assigns a sequence number which is a number indicating an order according to a predetermined rule for each of the measurement point sets. Set a threshold value of a difference between resistance values corresponding to two sets of measurement points adjacent to the sequence number. And it is preferably determined according to the threshold value at which the determining means corresponding the difference in the test resistance value of the measurement point set of the two sets of which the sequence number close.

According to this configuration, the resistance value between the set of measurement points, which is a combination of two measurement points, is set in advance on the wiring pattern of the inspection target by the inspection resistance measuring means, and is measured as the inspection resistance value. The threshold value is set by the threshold value setting means in correspondence with the set of measurement points, and the determination means determines whether or not the value of the test resistance value is set by the threshold value setting means for each set of measurement points. Therefore, since the quantity of the inspection resistance value which is the resistance value between the measuring point sets is determined according to the threshold value set corresponding to the measuring point set, the quantity of the inspection resistance value is accurately determined by setting the threshold value to an appropriate value corresponding to the measuring point set. The conduction test of a test | inspection board | substrate is performed correctly.

In addition, the threshold value setting means is provided with a sequence number which is a number indicating an order according to a predetermined rule for each set of measurement points, and the threshold value of the difference between the resistance values corresponding to two sets of measurement points adjacent to the sequence number is set. . And the determination means judges the difference of the test | inspection resistance value of two sets of measurement point in which sequence numbers adjoin, according to the corresponding threshold value. Therefore, since the difference of the inspection resistance value of two sets of measurement points is determined according to the corresponding threshold value, compared with the case where the inspection resistance value is determined for every measurement point set, the manufacturing conditions for every board | substrate to be tested and the inspection resistance for each board | substrate to be tested are compared. By canceling out the difference of the measurement conditions of a value, the quality of an inspection resistance value is determined more correctly.

And reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as a test target substrate, wherein the threshold value setting means sets the measurement point set according to the magnitude of the reference resistance value. It is preferable to assign the sequence number to each set of measurement points by sorting in ascending or descending order, and to set the threshold value according to the difference between the reference resistance values of two sets of measurement point adjacent to the sequence number.

According to the above configuration, the resistance value between the set of measurement points is measured as the reference resistance value by the reference resistance measuring means with respect to the test substrate and the same type of reference substrate. The set of measurement points is arranged in ascending or descending order according to the magnitude of the reference resistance by the threshold setting means, and a sequence number is assigned to each set of measurement points, and the sequence number is applied to the difference between the reference resistance values of two sets of adjacent measurement points. The threshold is set accordingly. In addition, according to this threshold value, the determination means determines the difference between the inspection resistance values of two sets of measurement points in which sequence numbers are adjacent. Therefore, since the difference of the test resistance value of two sets of measuring point sets with which sequence numbers adjoin (that is, the magnitude | size of a reference resistance value is adjacent) is judged according to the corresponding threshold value, the manufacturing conditions for every test board and a test board to be tested As the difference in the measurement conditions of the test resistance values for each offset is further canceled, the quality of the test resistance values is more accurately determined.

And a statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each of the set of measurement points, wherein the reference number of the substrates is a predetermined number of two or more, and the threshold value setting means includes: It is preferable to set the threshold value according to at least one of the average value and the standard deviation of the reference resistance values of two sets of measurement points adjacent to the sequence number.

According to the above configuration, at least one of the average value and the standard deviation of the reference resistance values of the predetermined number of reference substrates is determined for each set of measurement points by the statistical calculation means as the number of reference substrates being two or more. The threshold value setting means sets the threshold value according to at least one of the average value and the standard deviation of the reference resistance values of the set of two sets of measurement points adjacent to the sequence number. Therefore, an appropriate threshold value is easily set because the threshold value is set in accordance with at least one of the average value and the standard deviation of the reference resistance values of two sets of measurement points having adjacent sequence numbers.

A reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as a test target substrate, and a reference total calculation means for obtaining a sum of the reference resistance values per one reference substrate; Inspection total calculation means for obtaining a total of the inspection resistance values for each of the inspected substrates, wherein the determination means corrects the inspection resistance value as a ratio of the total of the reference resistance values of the total of the inspection resistance values to determine the result. It is preferable.

According to the above configuration, the resistance value between the set of measurement points is measured as the reference resistance value by the reference resistance measuring means with respect to the test substrate and the same type of reference substrate. Moreover, the sum total of the reference resistance value per sheet of reference board | substrate is calculated | required by a reference total calculation means, and the sum total of an inspection resistance value is calculated | required for every board | substrate tested by a test | inspection total calculation means. The inspection resistance value is then corrected and judged by the determination means as a ratio with respect to the sum of the reference resistance values of the sum of the inspection resistance values. Therefore, since the inspection resistance value is determined by being corrected as a ratio with respect to the sum of the reference resistance values of the total of the inspection resistance values, the difference between the manufacturing conditions for each inspection target board and the measurement conditions of the inspection resistance values for each inspection board is corrected. The quality of the test resistance value is more accurately determined.

A reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as a test target substrate, and a reference total calculation means for obtaining a sum of the reference resistance values per one reference substrate; Inspection total calculation means for obtaining a total of the inspection resistance values for each inspected substrate, wherein the threshold value setting means corrects the reference resistance value as a ratio of the total of the reference resistance values of the total of the inspection resistance values; It is desirable to set the threshold.

According to the above configuration, the resistance value between the set of measurement points is measured as the reference resistance value by the reference resistance measuring means with respect to the test substrate and the same type of reference substrate. Moreover, the sum total of the reference resistance value per sheet of reference board | substrate is calculated | required by a reference total calculation means, and the sum total of an inspection resistance value is calculated | required for every board | substrate tested by a test | inspection total calculation means. Then, the threshold value setting means corrects the reference resistance value as a ratio of the total of the reference resistance values of the total of the test resistance values to set the threshold value. Therefore, since the reference resistance value is corrected as a ratio of the total of the reference resistance values of the total of the test resistance values, and the threshold value is set, the measurement conditions of the manufacturing conditions for each test substrate and the test resistance value for each test substrate are determined. An appropriate threshold with a difference corrected is set.

And a statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each of the set of measurement points, wherein the reference number of the substrates is a predetermined number of two or more, and the threshold value setting means includes: It is preferable to set the threshold value according to at least one of the average value and the standard deviation.

According to the above configuration, at least one of the average value and the standard deviation of the reference resistance values of the predetermined number of reference substrates is determined for each set of measurement points by the statistical calculation means as the number of reference substrates being two or more. And the threshold value is set by the threshold value setting means according to at least one of an average value and a standard deviation. Therefore, since the threshold value is set according to at least one of the average value and the standard deviation of the reference resistance values of two or more predetermined numbers of reference substrates, an appropriate threshold value is easily set.

Further, the threshold value setting means sets the threshold value for the sequence number according to the magnitude of the test resistance value of the set of measurement points, and the determination means arranges the set of measurement points in ascending or descending order according to the size of the test resistance value. It is preferable to assign a sequence number to each set of measurement points, and compare the sequence number with the threshold value to determine whether the test resistance value is good or bad.

According to the above arrangement, the threshold value setting means sets a threshold value for the sequence number according to the magnitude of the test resistance value of the set of measurement points, and the determination point set is determined by the determining means in ascending or descending order according to the magnitude of the test resistance value. A sequence number is assigned to each set of measurement points in alignment, and this sequence number is compared with a threshold value to determine whether or not the test resistance value is correct. Thus, the set of measuring points is arranged in ascending or descending order according to the magnitude of the test resistance value, and a sequence number is assigned to each measuring point set, and the sequence number is compared with the threshold value for the sequence number set by the threshold value setting means to test resistance. Since the value of the value is determined, the difference between the manufacturing conditions for each test substrate and the measurement condition of the test resistance value for each test substrate is canceled so that the quality of the test resistance value is more accurately determined.

And reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as the test target substrate, wherein the threshold value setting means sets the measurement point set for each reference substrate. It is preferable to arrange in ascending or descending order according to the size of, to assign a sequence number to each set of measurement points, and to set the threshold value according to the assigned sequence number.

According to the above configuration, the resistance value between the set of measurement points is measured as the reference resistance value by the reference resistance measuring means with respect to the test substrate and the same type of reference substrate. Then, by the threshold value setting means, the measurement point sets are arranged for each reference substrate in ascending or descending order according to the magnitude of the reference resistance value, and sequence numbers are assigned to each measurement point set, and threshold values are set according to the assigned sequence numbers. Therefore, the set of measurement points for each reference substrate is arranged in ascending or descending order according to the magnitude of the reference resistance value, and the sequence number is assigned to each measurement point set, and the threshold value is set according to the assigned sequence number, so that an appropriate threshold value is set.

The number of the reference substrates is a predetermined number of two or more, and the threshold value setting means obtains at least one of the average value and the standard deviation of the sequence number assigned to each set of measurement points, and at least one of the obtained average value and the standard deviation of the sequence number. It is preferable to set the threshold according to.

According to the above configuration, at least one of the average value and the standard deviation of the sequence number assigned to each measurement point set by the threshold value setting means is determined as the number of the reference substrates is two or more, and the average value and the standard deviation of the obtained sequence number are obtained. The threshold is set in accordance with at least one of. Therefore, at least one of the average value and the standard deviation of the sequence number assigned to each measurement point set is obtained, and a more appropriate threshold value is easily set because the threshold value is set according to at least one of the average value and the standard deviation of the obtained sequence number. .

Moreover, it is preferable that the said test target board | substrate is a buildup board | substrate which has a via.

According to the above-described configuration, since the inspected substrate is a build-up substrate having a via, even if a bonding failure or the like occurs in the via, the quality of the inspection resistance value is accurately determined.

Further, the substrate inspection method of the present invention is a substrate inspection method of a substrate inspection apparatus which conducts a conduction inspection between a set of measurement points which is a combination of two measurement points, which is set in advance on the wiring pattern with respect to the inspection target board on which a plurality of wiring patterns are formed, The resistance value between the set of measurement points of the test target substrate is measured as an inspection resistance value, a threshold value is set corresponding to the set of measurement points, and the quality of the inspection resistance value is determined according to the threshold value for each of the measurement point sets. I am doing it.

According to the above-described substrate inspection method, the resistance value between the set of measurement points which is set in advance on the wiring pattern of the inspection target board and is a combination of two measurement points is measured as the inspection resistance value. Then, a threshold value is set corresponding to the set of measurement points, and both parts of the test resistance value are determined according to the threshold value set for each set of measurement points. Therefore, since the quantity of the inspection resistance value which is the resistance value between the measuring point sets is determined according to the threshold value set corresponding to the measuring point set, the quantity of the inspection resistance value is accurately determined by setting the threshold value to an appropriate value corresponding to the measuring point set. The conduction test of a test | inspection board | substrate is performed correctly.

The substrate inspection program of the present invention is a substrate inspection program of a substrate inspection apparatus which conducts a conduction inspection between a set of measurement points which is set on the wiring pattern in advance and is a combination of two measurement points with respect to the inspection target board on which a plurality of wiring patterns are formed. Inspection resistance measuring means for measuring the resistance value between the set of measurement points of the substrate under test as a test resistance value, threshold setting means for setting a threshold value corresponding to the set of measurement points, and for each of the measurement point sets. It is characterized by making it function as a determination means for determining the pass / fail of the test resistance value in accordance with the threshold value.

According to the above-described substrate inspection program, the resistance value between the set of measurement points, which is a combination of two measurement points, is set in advance on the wiring pattern of the inspection target by the inspection resistance measuring means, and is measured as the inspection resistance value. The threshold value is set by the threshold value setting means in correspondence with the set of measurement points, and the determination means determines whether or not the value of the test resistance value is set by the threshold value setting means for each set of measurement points. Therefore, since the quantity of the inspection resistance value which is the resistance value between the measuring point sets is determined according to the threshold value set corresponding to the measuring point set, the quantity of the inspection resistance value is accurately determined by setting the threshold value to an appropriate value corresponding to the measuring point set. The conduction test of a test | inspection board | substrate is performed correctly.

In addition, what is described as a means to achieve any function in this specification is not limited to the structure of the specification description which achieves those functions, and also includes the structure of the unit, part, etc. which achieve those functions.

According to the substrate inspection apparatus of the present invention, the resistance value between the measurement point sets, which are set on the wiring pattern in advance, is measured as the inspection resistance value, the threshold value is set in correspondence with the measurement point set, and each measurement point set. Since the quality of the inspection resistance value is determined according to the threshold value, by setting the threshold value to an appropriate value for each set of measurement points, the quality of the inspection resistance value can be accurately determined, and the conduction inspection of the inspected substrate can be performed accurately. .

Claims (12)

In the board | substrate test | inspection apparatus which carries out the conduction test between the set of measurement points which are previously set on the said wiring pattern, and a combination of two measurement points, with respect to the test | inspection board | substrate with which the some wiring pattern was formed, Inspection resistance measurement means for measuring a resistance value between the set of measurement points of the inspection target as an inspection resistance value; Threshold setting means for setting a threshold corresponding to the set of measurement points; And judging means for judging whether or not the inspection resistance value is in accordance with the threshold value for each of the measurement point sets. The method according to claim 1, wherein the threshold value setting means assigns a sequence number which is a number indicating an order according to a predetermined rule for each of the measurement point sets, and the difference in resistance values corresponding to two sets of measurement point sets adjacent to the sequence number. Set the threshold of, And said determining means determines the difference between the inspection resistance values of two sets of measurement points adjacent to said sequence number in accordance with a corresponding threshold value. The reference resistance measuring means according to claim 2, further comprising reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as a test target substrate, The threshold value setting means assigns the sequence number to each set of measurement points by arranging the set of measurement points in ascending or descending order according to the magnitude of the reference resistance value, and the difference between the reference resistance values of two sets of measurement point sets adjacent to the sequence number. The threshold value is set according to the substrate inspection apparatus. The method of claim 3, wherein the number of the reference substrate is a predetermined number of two or more, Statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each set of measurement points, And said threshold value setting means sets a threshold value according to at least one of an average value and a standard deviation of reference resistance values of two sets of measurement points adjacent to said sequence number. The reference resistance measuring means according to claim 1, further comprising: reference resistance measuring means for measuring a resistance value between the set of measurement points for a reference substrate of the same type as a test target substrate as a reference resistance value Reference total calculating means for obtaining a total of the reference resistance values per sheet of reference, It is provided with the inspection total calculation means which calculates the sum total of the said inspection resistance values for every test board | substrate, And the judging means corrects the inspection resistance value by a ratio of the total of the inspection resistance values to the total of the reference resistance values. The reference resistance measuring means according to claim 1, further comprising: reference resistance measuring means for measuring a resistance value between the set of measurement points for a reference substrate of the same type as a test target substrate as a reference resistance value; Reference total calculating means for obtaining a total of the reference resistance values per sheet of reference, It is provided with the inspection total calculation means which calculates the sum total of the said inspection resistance values for every test board | substrate, And the threshold value setting means sets the threshold value by correcting the reference resistance value as a ratio of the total of the reference resistance value to the total of the test resistance values. The method according to claim 5 or 6, wherein the number of the reference substrate is a predetermined number of two or more, Statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each set of measurement points, And said threshold value setting means sets a threshold value according to at least one of said average value and standard deviation. The method according to claim 1, wherein the threshold value setting means sets the threshold value for the sequence number according to the magnitude of the test resistance value of the set of measurement points, The determining means sorts the set of measuring points in ascending or descending order according to the magnitude of the test resistance value, assigns each of the set of measurement points a sequence number, compares the sequence number with the threshold value, and compares the quantity of the test resistance value. The board | substrate inspection apparatus characterized by the above-mentioned. The apparatus according to claim 8, further comprising: reference resistance measuring means for measuring a resistance value between the set of measurement points as a reference resistance value for a reference substrate of the same type as a test target substrate, The threshold value setting means sorts the set of measurement points in ascending or descending order according to the magnitude of the reference resistance value for each of the reference substrates, assigns a sequence number to each set of measurement points, and sets the threshold value according to the assigned sequence number. Board inspection apparatus characterized in that. The method according to claim 9, wherein the number of the reference substrate is a predetermined number of two or more, And said threshold value setting means obtains at least one of an average value and a standard deviation of sequence numbers assigned to each set of measurement points, and sets the threshold value according to at least one of the obtained average value and standard deviation of sequence numbers. Inspection device. The substrate inspection apparatus according to any one of claims 1 to 10, wherein the substrate to be inspected is a build-up substrate having vias. In the board | substrate test | inspection method of the board | substrate test | inspection apparatus which carries out the conduction test between the set of measurement points which are previously set on the said wiring pattern, and a combination of two measurement points with respect to the test | inspection board | substrate with which the some wiring pattern was formed, The resistance value between the set of measurement points of the substrate under test is measured as an inspection resistance value, Set a threshold corresponding to the set of measurement points, And determining whether or not the inspection resistance value is determined according to the threshold value for each of the measurement point sets.

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