JP2006200946A - Apparatus, program, and method for substrate inspection - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for substrate inspection which performs a continuity test for a substrate to be inspected accurately. <P>SOLUTION: A CPU 811 of a control section comprises a standard resistance measurement section 811a for measuring a standard resistance value, or a resistance value between a set of measurement points, for a standard substrate selected in advance, a threshold setting section 811c for setting a threshold for each set of measurement points, an inspected resistance measurement section 811d for measuring the resistance value between a set of measurement points of the substrate to be inspected as an inspected resistance value, and a decision section 811e for deciding the quality of the inspected resistance value on the basis of the threshold for each set of measurement points. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate inspection apparatus for performing a continuity inspection between two measurement points (hereinafter referred to as a measurement point set) set in advance on the wiring pattern for a substrate to be inspected on which a plurality of wiring patterns are formed. The present invention relates to a substrate inspection program and a substrate inspection method. In particular, the present invention relates to a substrate inspection apparatus, a substrate inspection program, and a substrate inspection method for performing a continuity inspection between the measurement point sets in a build-up substrate having vias.

  The wiring pattern on a circuit board needs to accurately transmit electrical signals to electrical components such as ICs and resistors mounted on the circuit board. Between printed wiring boards, circuit wiring boards on which wiring patterns are formed on liquid crystal panels and plasma display panels, or wiring patterns formed on boards such as semiconductor wafers, between measurement points provided on wiring patterns to be inspected The resistance value is measured and the quality is inspected.

Thus, in order to determine the quality of the substrate based on the resistance value between the measurement points, it is necessary to accurately measure the resistance value between the measurement points, and a higher accuracy can be achieved by using a known four-terminal measurement method. A measurement method capable of measurement has been proposed (see Patent Document 1).
Japanese Patent Laid-Open No. 10-123189

  On the other hand, in recent years, with the progress of miniaturization of circuit boards, the width of the wiring pattern is narrowed, and the influence of the variation in the width (or thickness) of the wiring pattern on the resistance value between the measurement points is increasing. Therefore, the variation in the resistance value between the measurement points is large, and even when the resistance value between the measurement points is measured with high accuracy as described above, it is difficult to set a threshold value that is a criterion for the pass / fail judgment. It may be difficult to accurately perform a continuity test of the substrate.

  In particular, when the substrate is a build-up substrate having vias, for example, the increase in resistance value between measurement points due to a bonding failure occurring in a via such as a laser via is small, and the measurement is accompanied by variations in the width of the wiring pattern, etc. It becomes almost the same as (or less than) the variation in the resistance value between the points, and it becomes extremely difficult to set a threshold value as a criterion for pass / fail judgment.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate inspection apparatus, a substrate inspection program, and a substrate inspection method for accurately performing a continuity inspection of a substrate to be inspected.

  The substrate inspection apparatus according to claim 1, for a substrate to be inspected on which a plurality of wiring patterns are formed, a continuity inspection between measurement point sets that are preset on the wiring pattern and are a combination of two measurement points. An inspection resistance measuring unit that measures a resistance value between the measurement point sets of the substrate to be inspected as an inspection resistance value; and a threshold setting unit that sets a threshold value corresponding to the measurement point set; And determining means for determining pass / fail of the inspection resistance value based on the threshold value for each measurement point set.

  The substrate inspection program according to claim 12 is a continuity inspection between measurement point sets, which is a combination of two measurement points, which is set in advance on the wiring pattern for a substrate to be inspected on which a plurality of wiring patterns are formed. A board inspection program for a board inspection apparatus for performing inspection, the board inspection apparatus corresponding to the measurement point set, and inspection resistance measurement means for measuring a resistance value between the measurement point sets of the board to be inspected as an inspection resistance value And a threshold value setting means for setting a threshold value, and a determination means for determining pass / fail of the inspection resistance value based on the threshold value for each measurement point set.

  According to these inventions, the resistance value between the measurement point sets, which is set in advance on the wiring pattern of the substrate to be inspected and is a combination of two measurement points, is measured as the inspection resistance value by the inspection resistance measuring means. Then, the threshold value setting means sets a threshold value corresponding to the measurement point set, and the determination means determines pass / fail of the inspection resistance value based on the threshold value set by the threshold value setting means for each measurement point set.

  Therefore, the quality of the inspection resistance value, which is the resistance value between the measurement point sets, is determined based on the threshold value set corresponding to the measurement point set. Therefore, the threshold value is set to an appropriate value corresponding to the measurement point set. By setting, the quality of the inspection resistance value is accurately determined, and the continuity inspection of the substrate to be inspected is performed accurately.

  The substrate inspection apparatus according to claim 2, wherein the threshold setting unit assigns a sequential number that is a number representing an order according to a predetermined rule for each measurement point set, and two sets of adjacent sequential numbers. A resistance value difference threshold value corresponding to each of the measurement point sets is set, and the determination means determines the difference between the inspection resistance values of the two measurement point sets adjacent to each other in the order number based on the corresponding threshold values. It is characterized by that.

  According to the above configuration, the threshold value setting unit assigns a sequential number that is a number representing the order in accordance with a predetermined rule for each measurement point set, and the sequential number is assigned to two adjacent measurement point sets. A corresponding resistance value difference threshold is set. Then, the determination means determines the difference between the inspection resistance values of two measurement point sets adjacent to each other based on the corresponding threshold value.

  Accordingly, since the difference between the inspection resistance values of the two sets of measurement points is determined based on the corresponding threshold value, the manufacturing for each substrate to be inspected is compared with the case where the inspection resistance value is determined for each measurement point set. The quality of the inspection resistance value is more accurately determined by canceling out the difference between the conditions and the measurement conditions of the inspection resistance value for each substrate to be inspected.

  The substrate inspection apparatus according to claim 3 includes a reference resistance measurement unit that measures a resistance value between the measurement point sets as a reference resistance value for a reference substrate of the same type as the substrate to be inspected, and the threshold setting unit includes: By reordering the measurement point set in ascending or descending order based on the magnitude of the reference resistance value, the order number is assigned to each measurement point set, and the reference resistances of two sets of measurement point sets adjacent to each other in the order number It is characterized in that a threshold value is set based on a difference in values.

  According to the above configuration, the resistance value between the measurement point sets is measured as the reference resistance value for the reference board of the same type as the board to be inspected by the reference resistance measuring unit. Then, the threshold value setting means rearranges the measurement point set in ascending or descending order based on the magnitude of the reference resistance value, and assigns a sequential number to each measurement point set. A threshold is set based on the difference in the reference resistance values of the point set. In addition, based on this threshold value, the determination means determines the difference between the inspection resistance values of two measurement point sets having adjacent sequential numbers.

  Therefore, since the difference between the inspection resistance values of two measurement point sets that are adjacent to each other in order number (that is, the reference resistance value is adjacent) is determined based on the corresponding threshold value, By further canceling out the difference between the manufacturing condition and the measurement condition of the inspection resistance value for each substrate to be inspected, the quality of the inspection resistance value is more accurately determined.

  5. The substrate inspection apparatus according to claim 4, wherein the number of the reference substrates is a predetermined number of 2 or more, and an average value and a standard deviation of the reference resistance values of the predetermined number of reference substrates for each measurement point set. Statistical calculation means for obtaining at least one of the threshold values, wherein the threshold value setting means sets a threshold value based on at least one of an average value and a standard deviation of reference resistance values of two measurement point sets adjacent to each other in the order number. It is characterized by.

  According to the above configuration, the number of reference boards is a predetermined number of 2 or more, and at least one of the average value and the standard deviation of the reference resistance values of the predetermined number of reference boards is set for each measurement point set by the statistical calculation means. Is required. Then, the threshold value is set by the threshold value setting means based on at least one of the average value and the standard deviation of the reference resistance values of the two measurement point sets having adjacent sequential numbers.

  Therefore, since the threshold value is set based on at least one of the average value and the standard deviation of the reference resistance values of two measurement point sets having adjacent sequential numbers, an appropriate threshold value is easily set.

  According to a fifth aspect of the present invention, there is provided a substrate inspection apparatus comprising: a reference resistance measuring unit that measures a resistance value between the measurement point sets as a reference resistance value for a reference substrate of the same type as the substrate to be inspected; A reference sum calculating means for obtaining a sum of the reference resistance values; and an inspection sum calculating means for obtaining a sum of the inspection resistance values for each substrate to be inspected, wherein the determining means determines the inspection resistance value as the inspection resistance value. It is characterized in that the correction is made by correcting with the ratio of the total sum of the reference resistance values to the sum of the reference resistance values.

  According to the above configuration, the resistance value between the measurement point sets is measured as the reference resistance value for the reference board of the same type as the board to be inspected by the reference resistance measuring unit. Further, the total sum of reference resistance values per reference substrate is obtained by the reference sum calculation means, and the sum of inspection resistance values is obtained for each substrate to be inspected by the inspection sum calculation means. Then, the determination means corrects and determines the inspection resistance value by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values.

  Therefore, since the inspection resistance value is corrected and determined by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values, the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected are determined. By correcting the difference, the quality of the inspection resistance value is more accurately determined.

  According to a sixth aspect of the present invention, there is provided a substrate inspection apparatus comprising: a reference resistance measuring unit that measures a resistance value between the measurement point sets as a reference resistance value for a reference substrate of the same type as the substrate to be inspected; A reference sum calculating means for obtaining a sum of the reference resistance values; and an inspection sum calculating means for obtaining a sum of the inspection resistance values for each substrate to be inspected, wherein the threshold setting means determines the reference resistance value as the inspection resistance. The threshold value is set by correcting with the ratio of the sum of the values to the sum of the reference resistance values.

  According to the above configuration, the resistance value between the measurement point sets is measured as the reference resistance value for the reference board of the same type as the board to be inspected by the reference resistance measuring unit. Further, the total sum of reference resistance values per reference substrate is obtained by the reference sum calculation means, and the sum of inspection resistance values is obtained for each substrate to be inspected by the inspection sum calculation means. Then, the threshold value is set by correcting the reference resistance value by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values by the threshold setting means.

  Therefore, since the threshold value is set by correcting the reference resistance value by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values, the manufacturing conditions for each substrate to be inspected and the inspection resistance values for each substrate to be inspected are set. An appropriate threshold value in which a difference in measurement conditions is corrected is set.

  The substrate inspection apparatus according to claim 7, wherein the number of the reference substrates is a predetermined number of 2 or more, and an average value and a standard deviation of the reference resistance values of the predetermined number of reference substrates for each measurement point set. Statistical calculation means for obtaining at least one of the threshold values, wherein the threshold value setting means sets a threshold value based on at least one of the average value and the standard deviation.

  According to the above configuration, the number of reference substrates is a predetermined number of 2 or more, and at least the average value and the standard deviation of the reference resistance values of the predetermined number of reference substrates are measured for each measurement point set by the statistical calculation means. One is required. Then, the threshold value setting means sets the threshold value based on at least one of the average value and the standard deviation.

  Therefore, the threshold value is set based on at least one of the average value and the standard deviation of the reference resistance values of a predetermined number of reference boards of 2 or more, and therefore an appropriate threshold value is easily set.

  The substrate inspection apparatus according to claim 8, wherein the threshold setting unit sets a threshold for a sequential number based on the magnitude of the inspection resistance value of the measurement point set, and the determination unit includes the measurement point. The set is rearranged in ascending or descending order based on the magnitude of the inspection resistance value, and a sequential number is assigned to each measurement point set, and this sequential number is compared with the threshold value to determine whether the inspection resistance value is good or bad. It is characterized by doing.

  According to the above configuration, the threshold value setting means sets a threshold value for a sequence number based on the magnitude of the test resistance value of the measurement point set, and the determination means sets the measurement point set in ascending order based on the magnitude of the test resistance value. Alternatively, they are rearranged in descending order, and a sequential number is assigned to each measurement point set, and this sequential number is compared with a threshold value to determine whether the inspection resistance value is good or bad.

  Therefore, the measurement point set is rearranged in ascending or descending order based on the magnitude of the inspection resistance value, and a sequential number is assigned to each measurement point set, and this sequential number corresponds to the sequential number set by the threshold setting unit. Since the quality of the inspection resistance value is determined by comparing with the threshold value, the difference between the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected is offset, so that the inspection resistance value Pass / fail is determined more accurately.

  The substrate inspection apparatus according to claim 9 includes a reference resistance measurement unit that measures a resistance value between the measurement point sets as a reference resistance value for a reference substrate of the same type as the substrate to be inspected, and the threshold setting unit includes: For each of the reference substrates, the measurement point set is rearranged in ascending order or descending order based on the magnitude of the reference resistance value, a sequential number is assigned to each measurement point set, and the threshold value is based on the assigned sequential number. It is characterized by setting.

  According to the above configuration, the resistance value between the measurement point sets is measured as the reference resistance value for the reference board of the same type as the board to be inspected by the reference resistance measuring unit. Then, by the threshold setting means, the measurement point set is rearranged in ascending or descending order based on the size of the reference resistance value for each reference substrate, and a sequential number is assigned to each measurement point set, and the assigned sequential number A threshold is set based on

  Therefore, for each reference substrate, the measurement point set is rearranged in ascending or descending order based on the magnitude of the reference resistance value, a sequential number is assigned to each measurement point set, and a threshold value is set based on the assigned sequential number. Since it is set, an appropriate threshold is set.

  The substrate inspection apparatus according to claim 10, wherein the number of the reference substrates is a predetermined number equal to or greater than 2, and the threshold setting unit includes an average value and a standard deviation of sequential numbers assigned to the measurement point sets. The threshold value is set based on at least one of the average value and the standard deviation of the obtained sequence numbers.

  According to the above configuration, the number of reference substrates is a predetermined number of 2 or more, and at least one of an average value and a standard deviation of the sequential numbers assigned to each measurement point set is obtained by the threshold setting unit, A threshold is set based on at least one of the average value and the standard deviation of the obtained sequence numbers.

  Therefore, since at least one of the average value and standard deviation of the sequence numbers assigned to each measurement point set is obtained, and the threshold is set based on at least one of the average value and standard deviation of the obtained sequence numbers, Furthermore, an appropriate threshold value is easily set.

  The substrate inspection apparatus according to an eleventh aspect is characterized in that the substrate to be inspected is a build-up substrate having vias.

  According to the above configuration, since the substrate to be inspected is a build-up substrate having a via, whether or not the inspection resistance value is good is accurately determined even when a bonding failure or the like occurs in the via.

  The substrate inspection method according to claim 13 is a continuity inspection between measurement point sets, which is a combination of two measurement points, set in advance on the wiring pattern with respect to a substrate to be inspected on which a plurality of wiring patterns are formed. A substrate inspection method for a substrate inspection apparatus for measuring a resistance value between the measurement point sets of a substrate to be inspected as an inspection resistance value, setting a threshold corresponding to the measurement point set, and the measurement point set Whether or not the inspection resistance value is good or bad is determined based on the threshold value every time.

  According to said method, the resistance value between the measurement point sets which is preset on the wiring pattern of a to-be-inspected board | substrate and is a combination of two measurement points is measured as an inspection resistance value. Then, a threshold value is set corresponding to the measurement point set, and the quality of the inspection resistance value is determined based on the threshold value set for each measurement point set.

  Therefore, the quality of the inspection resistance value, which is the resistance value between the measurement point sets, is determined based on the threshold value set corresponding to the measurement point set. Therefore, the threshold value is set to an appropriate value corresponding to the measurement point set. By setting, the quality of the inspection resistance value is accurately determined, and the continuity inspection of the substrate to be inspected is performed accurately.

  According to the invention described in claims 1, 12 and 13, the quality of the inspection resistance value, which is the resistance value between the measurement point sets, is determined based on the threshold value set for each measurement point set. By setting an appropriate value for each measurement point set, it is possible to accurately determine the quality of the inspection resistance value, and to accurately perform the continuity inspection of the substrate to be inspected.

  According to the second aspect of the present invention, since the difference between the inspection resistance values of the two measurement point sets is determined based on the corresponding threshold value, the comparison is made with the case where the inspection resistance value is determined for each measurement point set. Then, the quality of the inspection resistance value can be more accurately determined by canceling out the difference between the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected.

  According to the third aspect of the present invention, the difference between the inspection resistance values of the two measurement point sets adjacent to each other in the order number (that is, the reference resistance value is adjacent) is determined based on the corresponding threshold value. Therefore, the quality of the inspection resistance value can be more accurately determined by further canceling out the difference between the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected.

  According to the fourth aspect of the present invention, since the threshold is set based on at least one of the average value and the standard deviation of the reference resistance values of the two measurement point sets adjacent to each other in the order number, an appropriate threshold can be easily set. Can be set.

  According to the invention described in claim 5, since the inspection resistance value is corrected and determined by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values, the manufacturing condition for each substrate to be inspected, and the substrate to be inspected By correcting the difference in the measurement condition of the inspection resistance value for each, the quality of the inspection resistance value can be determined more accurately.

  According to the invention described in claim 6, since the threshold value is set by correcting the reference resistance value by the ratio of the sum of the inspection resistance values to the sum of the reference resistance values, the manufacturing conditions for each substrate to be inspected, and It is possible to set an appropriate threshold value in which the difference in the measurement condition of the inspection resistance value for each substrate to be inspected is corrected.

  According to the seventh aspect of the present invention, the threshold value is set based on at least one of the average value and the standard deviation of the reference resistance values of a predetermined number of reference boards of 2 or more, so that an appropriate threshold value can be easily set. .

  According to the invention described in claim 8, the measurement point sets are rearranged in ascending or descending order based on the magnitude of the inspection resistance value, and a sequential number is assigned to each measurement point set. Since the quality of the inspection resistance value is judged by comparing with the threshold value for the sequence number set by the setting means, the difference between the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected cancels each other. By doing so, the quality of the inspection resistance value can be determined more accurately.

  According to the ninth aspect of the present invention, for each reference substrate, the measurement point set is rearranged in ascending or descending order based on the magnitude of the reference resistance value, and a sequential number is assigned to each measurement point set. Since a threshold value is obtained based on the assigned sequence number, an appropriate threshold value can be set.

  According to the invention described in claim 10, at least one of the average value and standard deviation of the sequential numbers assigned to each measurement point set is obtained, and is based on at least one of the average value and standard deviation of the obtained sequential numbers. Therefore, a more appropriate threshold can be easily set.

  According to the eleventh aspect of the present invention, whether or not the inspection resistance value is good can be accurately determined even when a bonding failure or the like occurs in the via.

  FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are described.

  As shown in these drawings, in this substrate inspection apparatus, an opening / closing door 11 is disposed on the front side (−Y side) of the apparatus so as to be openable and closable with respect to the apparatus main body 1, and the opening / closing door 11 is opened. Then, a substrate 2 (corresponding to a substrate to be inspected: see FIG. 6), which is a build-up substrate having wiring patterns formed in a plurality of layers, is transferred from the loading / unloading portion 3 provided in the central portion on the front side of the device. It is possible to carry in. In addition, on the rear side (+ Y side) of the loading / unloading unit 3, a plurality of (for example, 500) contacts 44 for transmitting an inspection signal are provided, and a land (corresponding to a measurement point) of the wiring pattern of the substrate 2. An inspection unit 4 is provided for moving an inspection jig 41 (to be described later) so as to bring the contact 44 into contact therewith.

  Further, an instruction signal for moving the contactor 44 to contact the measurement point and an inspection signal output to the measurement point via the contactor 44 are output to the inspection unit 4, and A measurement execution unit 74 that receives an inspection signal or the like and transmits the inspection signal to a control unit 8 (not shown), which will be described later, is disposed at an appropriate position (here, in the upper part of the apparatus main body 1). Then, the substrate 2 that has been inspected by the inspection unit 4 and the measurement execution unit 74 (that is, pass / fail determination) is returned to the carry-in / out unit 3, and the opening / closing door 11 is opened, so that the operator can carry it out.

  In this substrate inspection apparatus, in order to transfer the substrate 2 between the loading / unloading unit 3 and the inspection unit 4, the transfer table 5 is provided movably in the Y direction, and the transfer table 5 is It is configured to be moved and positioned in the direction. That is, in the transport table drive mechanism 6, the two guide rails 61 extending in the Y direction are arranged apart from each other in the X direction by a predetermined interval, and the transport table 5 is slidable along these guide rails 61. .

  A ball screw 62 is disposed in parallel with the guide rails 61. One end (−Y side) of the ball screw 62 is pivotally supported by the apparatus main body 1, and the other end (+ Y side) is used for driving the transport table. It is connected with the rotating shaft 64 of the motor 63. Further, a bracket 65 to which the transport table 5 is fixed is screwed onto the ball screw 62, and when the motor 63 is rotationally driven in response to a command from the control unit 8 (see FIGS. 3 and 5) described later, The transfer table 5 moves in the Y direction according to the amount of rotation, and is reciprocated between the loading / unloading unit 3 and the inspection unit 4.

  With reference to FIG. 2, the transfer table 5 includes a substrate mounting portion 51 for mounting the substrate 2. The substrate platform 51 includes an urging means (not shown) that urges the substrate 2 from a direction opposite to the engagement pins 53 while the substrate 2 placed is engaged with the three engagement pins 53. ), The substrate 2 is urged toward the engagement pin 53 and the substrate 2 can be held on the substrate mounting portion 51. Further, in order to bring a contact 44 of the lower inspection unit 4D, which will be described later, into contact with the wiring pattern formed on the lower surface of the substrate 2 held in this manner, the substrate mounting portion 51 has a through opening (not shown). Is formed.

  The inspection unit 4 includes an upper inspection unit 4U for inspecting a wiring pattern formed on the upper surface side of the substrate 2 on the upper side (+ Z side) across the movement path of the transport table 5, and a lower side (−Z side). And a lower inspection unit 4D for inspecting a wiring pattern formed on the lower surface side of the substrate 2. The inspection units 4U and 4D have substantially the same configuration, and are arranged substantially symmetrically across the movement path of the transport table 5. The inspection units 4U and 4D include an inspection jig 41 and an inspection jig driving mechanism 43.

  FIG. 3 is a configuration diagram illustrating an example of an electrical configuration of the substrate inspection apparatus. The board inspection apparatus includes a CPU, a ROM, a RAM, a motor driver, and the like, and controls the entire apparatus according to a program stored in the ROM in advance (see FIG. 5), a tester controller 75, and a measurement execution unit 74. And.

  The tester controller 75 receives an inspection start command from the control unit 8, and in accordance with a program stored in advance, the wiring pattern to be inspected from among the plurality of contacts 44 abutted on the land of the wiring pattern on the substrate 2 The two contacts 44 respectively contacting the two lands (hereinafter referred to as “measurement point set”) located at both ends are sequentially selected. In addition, the tester controller 75 outputs a scan command to the measurement execution unit 74 so as to perform an inspection between the two selected contacts 44. Further, the tester controller 75 receives a resistance value measured from the measurement execution unit 74 (an inspection processing unit 741 described later with reference to FIG. 4) and transmits the resistance value to the control unit 8.

  On the other hand, as shown in FIG. 3, the inspection jig driving mechanism 43 is connected to an X jig driving unit 43 </ b> X that moves the inspection jig 41 in the X direction with respect to the apparatus main body 1 and an X jig driving unit 43 </ b> X. Y jig driving portion 43Y for moving the inspection jig 41 in the Y direction, θ jig driving portion 43θ connected to the Y jig driving portion 43Y for rotating the inspection jig 41 around the Z axis, and θ The Z jig driving section 43Z is connected to the jig driving section 43θ and moves the inspection jig 41 in the Z direction. The control section 8 moves the inspection jig 41 relative to the transport table 5 relative to the conveyance table 5. The contactor 44 can be brought into contact with or separated from the wiring pattern formed on the substrate 2 by positioning or raising / lowering the inspection jig 41 in the vertical direction (Z direction). ing.

  FIG. 4 is a conceptual diagram for explaining an example of the configuration of the measurement execution unit 74. The measurement execution unit 74 is generated in the wiring pattern by a current generation unit 742 including a DC current source that outputs a measurement DC current having a predetermined value (value set by the control unit 8) I0, and the measurement DC current. A voltage measuring unit 743 that measures the amount of voltage drop (potential difference) and a current generator 742 that is selected from a plurality of contacts 44 provided in the inspection jig 41 by a tester controller 75 (see FIG. 3). And a scanner 744 composed of a switch array or the like for connecting the voltage measuring unit 743.

  In response to the scan command from the tester controller 75, the inspection processing unit 741 connects the current generation unit 742 between the two contacts 44 that are current supply targets, and the voltage between the two contacts 44 that are potential difference detection targets. A control signal is output to the scanner 744 to connect the measuring units 743 to each other. Further, the inspection processing unit 741 divides the voltage value (potential difference) measured by the voltage measuring unit 743 by the DC current value for measurement I0, and the resistance between the two contacts 44 (that is, between the measurement point sets). The value is obtained and transmitted to the tester controller 75.

  FIG. 5 is a configuration diagram illustrating an example of a hardware configuration of the control unit 8. The control unit 8 includes, for example, a personal computer, and includes a main control unit 81 that controls the overall operation of the control unit 8, an operation unit 82 that includes an unillustrated keyboard and mouse that accept external operations, and an external device The data transmission path includes a speaker 83 for outputting sound, a monitor 84 for outputting an image to the outside, a communication control unit 85 for communicating with the tester controller 75, and a printer 86 for printing various information on recording paper. It is connected via the bus BA8.

  The main control unit 81 controls the overall operation of the control unit 8, and includes an information processing unit (CPU) 811, a RAM 812 that temporarily stores information during processing, an OS (operating system), a predetermined And a ROM 813 in which image information and the like are stored in advance.

  Of various data stored in the RAM 812 or the ROM 813, data that can be stored in a removable recording medium can be read by a driver such as a hard disk drive, an optical disk drive, a flexible disk drive, a silicon disk drive, or a cassette medium reader. In this case, the recording medium is, for example, a hard disk, an optical disk, a flexible disk, a CD, a DVD, a semiconductor memory, or the like.

  The interface units 821 and 861 are used to exchange data between the operation unit 82 and the printer 86 and the main control unit 81, respectively. The audio reproducing unit 831 outputs predetermined audio (for example, alarm, audio for operation guidance, etc.) to the speaker 83 in accordance with an instruction from the main control unit 81. The drawing processing unit 841 displays a required image on the monitor 84 in accordance with an image display instruction from the main control unit 81, and includes a video RAM and the like.

  FIG. 6 is a conceptual diagram showing an example of the configuration of the substrate 2. (A) is the perspective view which transparentized except the wiring pattern, (b) is sectional drawing. The substrate 2 includes a first substrate 21 having a wiring pattern 211a formed on the upper surface 211 of the insulating substrate 212, a wiring pattern 221a formed on the upper surface 221 of the insulating substrate 222, and a wiring pattern 223a formed on the lower surface 223. It is a build-up multilayer (here, three layers) printed wiring board (corresponding to a build-up board) composed of the second board 22.

  The wiring pattern 211a is connected to the wiring pattern 221a through the via TH1 formed in the insulating substrate 212 so as to be energized. Further, the wiring pattern 221a is connected to the wiring pattern 223a through the via TH2 formed in the insulating substrate 222. And connected to be energized. Here, the via TH1 and the via TH2 are laser vias, which are micro vias formed by a laser, and are defective in the bonding surface between the copper plating layer formed on the cylindrical side surface of the via and the wiring patterns 221a and 223a. However, when the defect is minor, the increase in the resistance value between the measurement point sets accompanying the defect (for example, between the measurement point MP1 and the measurement point MP2 on the wiring pattern 211a) is small, and detection is performed. May be difficult.

<First Embodiment>
Next, the board | substrate inspection apparatus which concerns on 1st Embodiment of this invention is demonstrated using FIGS. FIG. 7 is a configuration diagram illustrating an example of a functional configuration of the control unit 8 according to the first embodiment. The CPU 811 of the control unit 8 includes a reference resistance measurement unit 811a (corresponding to a reference resistance measurement unit) that measures a reference resistance value that is a resistance value between measurement point sets for a preselected reference substrate, and each measurement point set. A statistical calculation unit 811b (corresponding to a statistical calculation unit) for obtaining an average value and standard deviation of the reference resistance value, a threshold setting unit 811c (corresponding to a threshold setting unit) for setting a threshold for each measurement point set, An inspection resistance measuring unit 811d (corresponding to an inspection resistance measuring means) that measures a resistance value between measurement point sets on the inspection board as an inspection resistance value, and determines whether the inspection resistance value is good or not based on a threshold value for each measurement point set. A determination unit 811e (corresponding to a determination unit).

  In addition, the RAM 812 of the control unit 8 stores a reference resistance storage unit 812a that stores the reference resistance value in association with the identification information of the measurement point set, and a threshold value that stores the threshold value in association with the identification information of the measurement point set. A storage unit 812b and a test resistance storage unit 812c that stores the value of the test resistance in association with the identification information of the measurement point set are provided.

  The reference resistance measurement unit 811a is configured to measure a reference number of reference substrates, which are a predetermined number (30 in this case) of substrates to be inspected, selected from a plurality of (for example, 10,000) substrates of the same type between measurement point sets. As a reference resistance value, the obtained reference resistance value is stored in the reference resistance storage unit 812a in association with the identification information of the measurement point set.

  Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value. In addition, a reference board | substrate performs a conduction | electrical_connection test beforehand from 10000 to-be-inspected board | substrates of the same kind, and selects a thing with a favorable test result as a reference board.

  The statistical calculation unit 811b reads the reference resistance value measured by the reference resistance measurement unit 811a from the reference resistance storage unit 812a for each measurement point set with respect to a predetermined number (here, 30) of reference substrates, and calculates the average The value and the standard deviation are obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812a in association with the identification information of the measurement point set.

  The threshold value setting unit 811c assigns a sequential number to each measurement point set by rearranging the measurement point sets in ascending order based on the average value of the reference resistance values, and two measurement point sets having adjacent sequential numbers. The threshold value is set based on the difference between the average values of the reference resistance values, and the set threshold value is stored in the threshold value storage unit 812b in association with the sequential number information and the identification information of the two sets of measurement points. A specific threshold setting method will be described later with reference to FIG.

  The inspection resistance measuring unit 811d measures the resistance value between the measurement point sets of the substrate to be inspected as the inspection resistance value, and associates the obtained inspection resistance value with the identification information of the measurement point set in the inspection resistance storage unit 812c. To store. Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value.

  The determination unit 811e reads out the inspection resistance values of two sets of measurement points having adjacent sequential numbers from the inspection resistance storage unit 812c, obtains a difference between them (hereinafter referred to as inspection resistance difference ΔR), and sets the threshold value setting unit 811c. The determination is made based on the magnitude relationship with the corresponding threshold value. Specifically, the test resistance difference ΔR between two measurement point sets adjacent to each other in the order number is less than the lower limit value SHLA set by the threshold value setting unit 811c, or is poor when the upper limit value SHUA is exceeded. It is determined that it exists (see FIG. 8). More detailed processing will be described later using the flowchart shown in FIG.

  The reference resistance storage unit 812a uses the reference resistance value obtained by the reference resistance measurement unit 811a and the average value and standard deviation of the reference resistance value obtained by the statistical calculation unit 811b as identification information of two sets of measurement points. It is stored in association with each other.

  The threshold storage unit 812b stores the threshold set by the threshold setting unit 811c in association with the sequential number information and the identification information of the two sets of measurement points.

  The inspection resistance storage unit 812c stores the inspection resistance value obtained by the inspection resistance measurement unit 811d in association with the identification information of the measurement point set.

  Note that the board inspection program of the present invention that causes the control unit 8 to function as the reference resistance measurement unit 811a, the statistical calculation unit 811b, and the like is stored in, for example, the ROM 813 and is executed by the CPU 811 so that the control unit 8 performs the reference. It functions as each functional unit such as the resistance measuring unit 811a and the statistical calculation unit 811b.

  FIG. 8 is a graph for explaining a method for determining pass / fail of the inspection resistance value by the determination unit 811e. (A) is graph G1 which shows an example of test | inspection resistance value R, a horizontal axis is order number SN, and a vertical axis | shaft is test resistance value R. FIG. The sequence number SN is given by rearranging in ascending order on the basis of the average value of the reference resistance values for each measurement point set. The magnitude relationship of the reference resistance values between the measurement point sets and the inspection resistance value Therefore, the graph G1 is generally a curve in which the inspection resistance value R increases as the sequence number SN increases.

  However, here, there is a defective portion in the wiring pattern between the measurement point sets whose sequence number SN is “455”, and due to this defective portion, the inspection resistance value between the measurement point sets is shown in the graph G1. There is a defective portion EP where the inspection resistance value R increases rapidly at the position where the sequence number SN corresponding to R is “455”. The resistance value of the defective portion EP is equal to or greater than the resistance value R1 between the measurement point sets having the sequence number SN of 1, and between the measurement point sets having the maximum sequence number SN (here, “925”). Since it is equal to or less than the resistance value R2, it cannot be detected when a certain threshold is used for all measurement point sets in the substrate to be inspected.

(B) is a graph G2 of two sets of measurement points with adjacent sequential numbers corresponding to the inspection resistance value R shown in (a). The horizontal axis in the figure is the sequence number SN, and the vertical axis is the inspection resistance difference ΔR. Here, the inspection resistance difference ΔR will be described with reference to FIG. FIG. 9 is an explanatory diagram of the inspection resistance difference ΔR. The horizontal axis in the figure is the sequence number SN, and the vertical axis is the inspection resistance value R. The inspection resistance difference ΔRi is the difference between the inspection resistance values R of two measurement point sets adjacent to each other in the order number SN defined by the following equation (1) (here, the order numbers SN are i and (i + 1)). It is.
ΔRi = R (i + 1) −Ri (1)
However, Ri is the inspection resistance value R of the measurement point set whose sequence number SN is i. Note that i = 1 to 925.

  Again, referring back to FIG. 8B, the inspection resistance value R generally increases with the increase of the sequence number SN as described above. Therefore, the inspection resistance difference ΔR is usually small as shown in the graph G2. It becomes a positive value (for example, about 1 mΩ). However, since there is a defective portion EP where the inspection resistance value R increases rapidly at the position where the sequence number SN is “455”, the inspection resistance difference ΔRi where i is “454” is the other of the inspection resistance differences ΔRi. The inspection resistance difference ΔRi at a point is an extremely large value (for example, about 10 mΩ), and the inspection resistance difference ΔRi where i is “455” is an order of magnitude smaller than the inspection resistance difference ΔRi at another point (for example, -10 mΩ). Therefore, by setting the threshold values (the upper limit value indicated by the graph G3 in FIG. 8 and the lower limit value indicated by the graph G4) to appropriate values (for example, 3 mΩ and −2 mΩ), the defective portion EP can be accurately detected. It becomes possible.

  FIG. 10 is a chart for explaining an example of a threshold value calculation method. (A) is a chart showing the average value AV and the standard deviation σ calculated by the statistical calculation unit 811b, and (b) shows the threshold values (upper limit value SHUA and lower limit value SHLA) calculated by the threshold value setting unit 811c. It is a chart shown. (A) shows the reference resistance values measured by the reference resistance measuring unit 811a for the measurement point set number (hereinafter referred to as the point number PN) and the measurement point set corresponding to the point number PN in order from the top column. The average value AV and the standard deviation σ, and the sequence number SN assigned to each measurement point set by the threshold setting unit 811c are displayed.

  Here, the average value AVi of the measurement point set with the point number PN i is the smallest, and the sequence number SN corresponding to this point number PN (= i) is 1. The average value AVj of the measurement point set with the point number PN j is the second smallest, and the order number SN corresponding to this point number PN (= j) is 2.

In (b), the order number SN, the average value AV, and the standard deviation σ are displayed in order from the top column, and the result of sorting (rearranging) the data shown in (a) by the order number SN is shown. As described above, the point numbers PN of the measurement point sets whose sequence numbers SN are 1 and 2 are i and j, respectively. Here, the point numbers PN of the measurement point sets with the order numbers SN of n and (n + 1) are p and q, respectively. The upper limit SHUA and the lower limit SHLA set by the threshold setting unit 811c are displayed below the fourth point number PN column from the top in (b). Moreover, as shown in the margin, the upper limit value SHUAn and the lower limit value SHLAn set from the measurement point set having the sequence numbers SN of n and (n + 1) are obtained by the following equations (2) and (3), respectively.
SHUAn = (AVq−AVp) + 3 × (σp + σq) / 2 (2)
SHLAn = (AVq−AVp) −3 × (σp + σq) / 2 (3)
FIG. 11 is a flowchart illustrating an example of the operation up to the threshold setting of the control unit 8. This operation is executed as a preparatory operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate platform 51 shown in FIG.

  First, the reference resistance measurement unit 811a makes reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: number of measurement point sets) which are resistance values between the measurement point sets for 30 reference substrates. (Here, N = 925), M: number of reference substrates (here, M = 30)) is measured and associated with identification information (here, point number PN) of the measurement point set, and a reference resistance storage unit It is stored in 812a (step S101). Next, an average value AVi and standard deviation σi of the reference resistance value SRi, j is obtained for each measurement point set by the statistical calculation unit 811b, and is associated with the measurement point set identification information (here, the point number PN). It is stored in the reference resistance storage unit 812a (step S103).

  Then, the threshold value setting unit 811c assigns a sequence number SN to each measurement point set by rearranging in ascending order (that is, in order of decreasing average value AVi) based on the magnitude of the average value AVi of the reference resistance values SRi, j. (Step S105). Next, the threshold value setting unit 811c causes the average value AVi of the reference resistance values SRi, j of two measurement point sets adjacent to each other with the sequence number SN (here, the sequence number SN is a measurement point set with n and (n + 1)). And the standard deviation σi (according to the above-described equations (2) and (3)), the upper limit value SHUAn and the lower limit value SHLAn for the inspection resistance difference ΔRn are set (see FIG. 10), and the upper limit value SHUAn and the lower limit value SHLAn The sequential number SN information and the identification information (point number PN) of the two sets of measurement points are associated with each other and stored in the threshold value storage unit 812b (step S107), and the process ends.

  FIG. 12 is a flowchart showing an example of the operation of the control unit 8 when executing the inspection. This operation is executed in a state where the operation shown in FIG. 11 is completed and the substrate 2 to be inspected is placed on the substrate placement portion 51 shown in FIG. The following processing is performed by the determination unit 811e unless otherwise specified.

  First, the value of the counter k of the sequence number SK is initialized to 1 (step S201). Then, referring to the threshold value storage unit 812b, the point number PNk of the measurement point set in which the value of the sequence number SK is the value of the counter k (that is, the kth from the smaller average value AV of the reference resistance value) is obtained. (Step S203). Next, the resistance value Rk of the measurement point set of the point number PNk is measured by the inspection resistance measuring unit 811d and stored in the inspection resistance storage unit 812c in association with the point number PNk (step S205). Next, it is determined whether or not the value of the counter k is 1 (step S207).

When the value of the counter k is 1 (YES in step S207), the value of the counter k is incremented by 1 (step S209), the process is returned to step S203, and the processes after step S203 are repeatedly executed. The When the value of the counter k is not 1 (that is, 2 or more) (NO in step S207), the sequence numbers SK are adjacent (here, the sequence numbers SK are k and (k-1)). The inspection resistance values Rk and R (k−1) of the two measurement point sets are read from the inspection resistance storage unit 812c, and the inspection resistance difference ΔRk is obtained using the following equation (4) (step S211). .
ΔRk = Rk−R (k−1) (4)

  Then, it is determined whether or not the inspection resistance difference ΔRk is not less than the lower limit value SHUA (k−1) obtained in step S107 of the flowchart shown in FIG. 11 and not more than the upper limit value SHLA (k−1). (Step S213). The inspection resistance difference ΔRk is not less than the lower limit value SHLA (k−1) and not more than the upper limit value SHUA (k−1) (that is, less than the lower limit value SHLA (k−1) or the upper limit value SHUA (k−). 1) is over (NO in step S213), it is determined that the wiring pattern (or via) between the measurement point sets corresponding to the point number PN (k-1) is defective. (Step S221), the process ends.

  On the other hand, when it is determined that the inspection resistance difference ΔRk is not less than the lower limit value SHLA (k−1) and not more than the upper limit value SHUA (k−1) (YES in step S213), the value of the counter k is It is determined whether or not the number N of measurement point sets is greater than or equal to N (step S215). When it is determined that the value of the counter k is not greater than or equal to the number N of measurement point sets (that is, less than the number N of measurement point sets) (NO in step S215), the value of the counter k is incremented by 1. (Step S217), the process returns to Step S203, and the processes after Step S203 are repeatedly executed. On the other hand, when it is determined that the value of the counter k is equal to or greater than the number N of measurement point sets (YES in step S215), it is determined that the conductive state of the substrate 2 is good (step S219), and the process is performed. Is terminated.

  Thus, the quality of the inspection resistance value Rk, which is the resistance value between the measurement point sets, is determined based on the upper limit value SHUA (k-1) and the lower limit value SHLA (k-1) set for each measurement point set. Therefore, the quality of the inspection resistance value Rk is accurately determined by setting the upper limit value SHUA (k-1) and the lower limit value SHLA (k-1) to appropriate values for each measurement point set.

  Further, the difference ΔRk between the inspection resistance values Rk and R (k−1) of the two measurement point sets is determined based on the corresponding upper limit value SHUA (k−1) and lower limit value SHLA (k−1). Therefore, compared with the case where the inspection resistance value Rk is determined for each measurement point set, the difference between the manufacturing condition for each substrate to be inspected 2 and the measurement condition for the inspection resistance value Rk for each substrate to be inspected 2 is offset. Thus, the quality of the inspection resistance value Rk is determined more accurately.

  For example, the width of the wiring pattern in the substrate 2 varies depending on the manufacturing conditions, and even when there is no defective portion, the inspection resistance value Rk is large in the substrate 2 (the width of the wiring pattern is large). The inspection resistance value Rk is generally small in the substrate 2 (when the width of the wiring pattern is wide), but the difference ΔRk between the inspection resistance values Rk and R (k−1) is determined. Therefore, the influence of the fluctuation of the absolute value of the inspection resistance value Rk is suppressed.

  Similarly, even if the substrate 2 has no defective portion depending on measurement conditions, the inspection resistance value Rk is generally high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high), and the inspection resistance Although the value Rk may be generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), the difference ΔRk between the inspection resistance values Rk and R (k−1) is determined. The influence of the change in the absolute value of the resistance value Rk is suppressed.

  Further, the difference ΔRk between the inspection resistance values Rk and R (k−1) of two measurement point sets adjacent to each other with the sequential number SK (that is, the reference resistance value SR is adjacent) corresponds to the corresponding upper limit value SHUA ( k−1) and the lower limit value SHLA (k−1), so that the difference between the manufacturing conditions for each substrate 2 to be inspected and the measurement conditions for the inspection resistance value Rk for each substrate 2 to be inspected is further offset. As a result, the quality of the inspection resistance value Rk is more accurately determined.

  That is, two measurement points adjacent to each other by a sequence number SK that is the same as the substrate 2 to be inspected and in the order of the average value AV of the reference resistance value SR of the reference substrate that is a good conductive state substrate. Since the set is essentially a measurement point set having the same resistance value, the absolute value of the difference ΔRk between the corresponding inspection resistance values Rk and R (k−1) becomes small, so that it is more accurate. It is judged.

  In addition, based on the average value AV and the standard deviation σ of the reference resistance value SR of the two measurement point sets adjacent to each other with the sequence number SK (see the above formulas (2) and (3)), the upper limit value SHUAn Since the lower limit value SHLAn is set, appropriate upper limit value SHUAn and lower limit value SHLAn are easily set.

  Further, every time the inspection resistance value Rk is measured, the quality of the difference ΔRk between the inspection resistance values Rk and R (k−1) is determined, and the measurement of the inspection resistance value Rk is stopped when a defect occurs. Therefore, when the frequency of occurrence of defects is particularly high, the substrate 2 is efficiently inspected.

  In addition, this invention can take the following forms.

  (A) In the first embodiment, the threshold value setting unit 811c has a sequential number SN for each measurement point set based on the average value AV of the reference resistance values of a predetermined number (here, 30) of reference substrates. However, the order number SN may be assigned according to other rules. For example, the form of assigning the order of the measurement point set where the test resistance value R of the substrate 2 is measured as the sequence number SN may be used. In this case, the process for obtaining the average value AV of the reference resistance value is not necessary, and the process is simplified.

  (B) In the first embodiment, the case where the threshold setting unit 811c assigns the sequence number SN to each measurement point set in ascending order of the average value AV of the reference resistance values of the 30 reference substrates has been described. The number of substrates is not limited to 30 and may be any number (if the number of reference substrates is 1, the processing for obtaining the average value is not required), and the average value of the reference resistance values A form in which the sequence numbers SN are assigned in the order of descending order (descending order) instead of the order of increasing AV (ascending order) may be used.

  (C) In the first embodiment, the case in which the threshold setting unit 811c sets the lower limit SHLA and the upper limit SHUA has been described. However, at least one of the lower limit SHLA and the upper limit SHUA may be set. In this case, the process is simplified.

  (D) In the first embodiment, the case where the threshold setting unit 811c sets the lower limit SHLA and the upper limit SHUA based on the average value AV and the standard deviation σ of the reference resistance value of the reference board has been described. It may be configured to set based on at least one of the average value AV and the standard deviation σ. In this case, the process is simplified.

  (E) In the first embodiment, the threshold value setting unit 811c uses the above-described equations (2) and (3) regarding the average value AV and the standard deviation σ of the reference resistance value of the reference substrate to set the lower limit value SHLA and the upper limit value. Although the case where the value SHUA is set has been described, it may be set using other formulas or may be set via other sorting tables.

  For example, average values AVp and AVq, which are average values AV of reference resistance values of two measurement point sets, are divided at intervals of a predetermined size (for example, 2 mΩ), and a lower limit value SHLA and an upper limit value SHUA are stored for each division. The table (look-up table) may be set in advance, and the lower limit value SHLA and the upper limit value SHUA may be set based on the average values AVp and AVq and this table.

Second Embodiment
Next, the board | substrate inspection apparatus which concerns on 2nd Embodiment of this invention is demonstrated using FIGS. The configuration described with reference to FIGS. 1 to 6 is the same as that of the first embodiment, and thus the description thereof is omitted. FIG. 13 is a configuration diagram illustrating an example of a functional configuration of the control unit 8 according to the second embodiment. The CPU 811 of the control unit 8 includes a reference resistance measuring unit 811f (corresponding to a reference resistance measuring unit) that measures a reference resistance value that is a resistance value between measurement point sets for a preselected reference board, and one reference board. A reference sum calculation unit 811g (corresponding to a reference sum calculation unit) for calculating the sum of the reference resistance values per unit, and a statistical calculation unit 811h (statistic calculation unit) for calculating an average value and standard deviation of the reference resistance values for each measurement point set , A threshold setting unit 811i (corresponding to a threshold setting means) for setting a threshold for each measurement point set, and an inspection resistance measurement for measuring a resistance value between the measurement point sets of the substrate to be inspected as an inspection resistance value Unit 811j (corresponding to inspection resistance measuring means), an inspection sum calculating part 811k (corresponding to inspection sum calculating means) for obtaining the sum of inspection resistance values for each substrate to be inspected, and each measurement point set And a quality a determination unit 811m of the test resistance (corresponding to the determining means) based on a threshold.

  The RAM 812 of the control unit 8 stores a reference resistance storage unit 812f that stores a reference resistance value in association with measurement point set identification information, and a threshold value that stores a threshold value in association with measurement point set identification information. A storage unit 812g and a test resistance storage unit 812h that stores the value of the test resistance in association with the identification information of the measurement point set are provided.

  The reference resistance measuring unit 811f performs measurement point set measurement on a reference substrate that is a predetermined number (30 in this case) of substrates to be inspected selected from a plurality (for example, 10,000) of substrates of the same type. The reference resistance value that is the resistance value of the measurement point is measured, and the obtained reference resistance value is associated with the identification information of the measurement point set and stored in the reference resistance storage unit 812f.

  Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value. In addition, a reference board | substrate performs a conduction | electrical_connection test beforehand from 10000 to-be-inspected board | substrates of the same kind, and selects a thing with a favorable test result as a reference board.

  The reference sum calculation unit 811g calculates the sum of the reference resistance values per one reference substrate for the reference resistance value measured by the reference resistance measurement unit 811f, and stores the sum in the reference resistance storage unit 812f. Specifically, with respect to 30 reference boards, the sum of the reference resistance values of all the reference boards is obtained, and the sum of the reference resistance values per board is obtained by dividing by 30 which is the number of reference boards. is there.

  The statistical calculation unit 811h reads the reference resistance value measured by the reference resistance measurement unit 811f from the reference resistance storage unit 812f for each measurement point set with respect to a predetermined number (here, 30) of reference substrates, and calculates the average The value and the standard deviation are obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812f in association with the identification information of the measurement point set.

The threshold value setting unit 811i sets a threshold value based on the average value and standard deviation of the reference resistance values of the measurement point set, and stores the set threshold value in association with the identification information of the measurement point set in the threshold value storage unit 812g. It is. Specifically, using the average value AVi and standard deviation σi of the reference resistance values SRi (i = 1 to N, N: number of measurement point sets) of the measurement point set, the following equations (5) and (6) To obtain the upper limit value SHUBi and the lower limit value SHLBi, respectively (see FIG. 15).
SHUBi = AVi + 3 × σi (5)
SHLBi = AVi−3 × σi (6)

  The inspection resistance measuring unit 811j measures the resistance value between the measurement point sets of the substrate to be inspected as the inspection resistance value, and associates the obtained inspection resistance value with the identification information of the measurement point set in the inspection resistance storage unit 812h. To store. Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value.

  The inspection total calculation unit 811k calculates the total of the inspection resistance values per one board to be inspected for the inspection resistance values measured by the inspection resistance measuring unit 811j, and stores the total in the inspection resistance storage unit 812h.

The determination unit 811m reads the inspection resistance value Rk (k = 1 to N) of the measurement point set from the inspection resistance storage unit 812h, and the inspection resistance value Rk is the sum of the inspection resistance values obtained by the inspection total calculation unit 811k. The correction resistance value RNk is obtained by correction by the following equation (7) using TM and the total sum SM of the reference resistance values obtained by the reference sum calculation unit 811g, and is set by the correction resistance value RNk and the threshold setting unit 811i. The quality is judged based on the magnitude relationship between the corresponding upper limit value SHUBk and lower limit value SHLBk. Specifically, when the correction resistance value RNk of the measurement point set is less than the lower limit value SHLBk set by the threshold setting unit 811i or exceeds the upper limit value SHUBk, it is determined that the measurement point set is defective ( (See FIG. 14). Further detailed processing will be described later with reference to the flowchart shown in FIG.
RNk = Rk × (SM / TM) (7)

  The reference resistance storage unit 812f associates the reference resistance value obtained by the reference resistance measurement unit 811f and the average value and standard deviation of the reference resistance value obtained by the statistical calculation unit 811h with the identification information of the measurement point set. In addition to storing, the total sum of the reference resistance values obtained by the reference sum calculation unit 811g is stored.

  The threshold storage unit 812g stores the threshold set by the threshold setting unit 811i in association with the identification information of the measurement point set.

  The inspection resistance storage unit 812h stores the inspection resistance value obtained by the inspection resistance measurement unit 811j in association with the identification information of the measurement point set, and stores the sum of the inspection resistance values obtained by the inspection sum calculation unit 811k. To do.

  Note that the board inspection program of the present invention that causes the control unit 8 to function as the reference resistance measurement unit 811f, the statistical calculation unit 811h, and the like is stored in the ROM 813, for example, and is executed by the CPU 811 so that the control unit 8 can It functions as each functional unit such as a resistance measuring unit 811f and a statistical calculation unit 811h.

  FIG. 14 is a graph for explaining a method for determining pass / fail of the inspection resistance value by the determination unit 811m. This figure is a graph G1N showing an example of the corrected resistance value RN obtained by correcting the inspection resistance value R, where the horizontal axis is the sequence number SN and the vertical axis is the corrected resistance value RN. Here, the order number SN is given by rearranging in ascending order based on the average value of the reference resistance values for each measurement point set, and the magnitude relationship of the reference resistance values between the measurement point sets. Therefore, the graph G1N is generally a curve in which the inspection resistance value R increases as the sequence number SN increases.

  However, here, there is a defective portion in the wiring pattern between the measurement point sets whose sequence number SN is “455”, and due to this defective portion, the graph G1N shows the inspection resistance value between the measurement point sets. There is a defective portion EP where the correction resistance value RN rapidly increases at the position where the sequence number SN corresponding to R is “455”. Note that the resistance value of the defective portion EP is equal to or greater than the correction resistance value R1N between the measurement point sets having the sequence number SN of 1 and between the measurement point sets having the maximum sequence number SN (here, “925”). The correction resistance value R2N is equal to or less than the correction resistance value R2N, and cannot be detected when a certain threshold is used for all measurement point sets in the substrate to be inspected.

  As described above, the correction resistance value RN generally increases as the sequence number SN increases, and the upper limit value SHUBi and the lower limit value SHLBi are obtained by the threshold value setting unit 811i according to the equations (5) and (6), respectively. The SHUBi and the lower limit value SHLBi are graphs that are substantially translated in the vertical direction along the graph G1N, as shown in the graphs G5 and G6, respectively. Accordingly, the defective portion EP is accurately detected by appropriately setting the graph G5 and the graph G6 respectively corresponding to the upper limit value SHUBi and the lower limit value SHLBi (setting the interval between the graphs G5, G6 and the graph G1N appropriately). It becomes possible to do.

  FIG. 15 is a flowchart illustrating an example of the operation up to the threshold setting of the control unit 8. This operation is executed as a preparatory operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate platform 51 shown in FIG.

  First, the reference resistance measurement unit 811f performs reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: number of measurement point sets) that are resistance values between the measurement point sets for 30 reference substrates. (Here, N = 925), M: the number of reference substrates (here, M = 30)) is measured, and is associated with identification information (hereinafter referred to as point number PN) of the measurement point set, and a reference resistance storage unit It is stored in 812f (step S301). Next, the statistical calculation unit 811h obtains the average value AVi and standard deviation σi of the reference resistance values SRi, j for each measurement point set, and associates them with the measurement point set identification information (here, the point number PN). It is stored in the reference resistance storage unit 812f (step S303).

  Then, the total sum SM of the average values AVi (corresponding to the total sum of the reference resistance values per reference board) is obtained by the reference total calculation unit 811g (step S305). Next, the threshold value setting unit 811i uses the average value AVi and the standard deviation σi of the reference resistance values SRi, j of the measurement point set (according to the expressions (5) and (6) described above) to set the upper limit value SHUBi and the lower limit value SHLBi. Is set, the upper limit value SHUBi and the lower limit value SHLBi are stored in the threshold value storage unit 812g in association with the identification information (point number PN) of the measurement point set (step S307), and the process ends.

  FIG. 16 is a flowchart illustrating an example of the operation of the control unit 8 when the inspection is executed. This operation is executed in a state where the operation shown in FIG. 15 is completed and the target substrate 2 to be inspected is placed on the substrate placement portion 51 shown in FIG. The following processing is performed by the determination unit 811m unless otherwise specified.

  First, the inspection resistance values Rk (k = 1 to N) of all the measurement point sets are measured by the inspection resistance measuring unit 811j and stored in the inspection resistance storage unit 812h (step S401). Then, the inspection sum calculation unit 811k obtains the total sum TM of the inspection resistance values Rk and stores it in the inspection resistance storage unit 812h (step S403). Next, the test resistance value Rk is corrected by the above equation (7) using the total TM of the test resistance values and the total SM of the reference resistance values, thereby obtaining a corrected resistance value RNk (step S405).

  Then, it is determined whether or not the corrected resistance value RNk is not less than the lower limit value SHLBk and not more than the upper limit value SHUBk obtained in step S307 of the flowchart shown in FIG. 15 (step S407). When it is determined that at least one correction resistance value RNk is not less than the lower limit value SHLBk and not more than the upper limit value SHUBk (that is, less than the lower limit value SHLBk or more than the upper limit value SHUBk) (NO in step S407) Is determined to be defective (step S411), and the process is terminated.

  On the other hand, when it is determined that all the corrected resistance values RNk are not less than the lower limit value SHLBk and not more than the upper limit value SHUBk (YES in step S407), it is determined that the conductive state of the substrate 2 is good. (Step S409), the process ends.

  In this way, the quality of the inspection resistance value Rk, which is the resistance value between the measurement point sets, is determined based on the upper limit value SHUBk and the lower limit value SHLBk set for each measurement point set, so the upper limit value SHUBk and the lower limit value By setting the value SHLBk to an appropriate value for each measurement point set, the quality of the inspection resistance value Rk is accurately determined.

  Further, since the inspection resistance value Rk is determined as the corrected resistance value RNk corrected by the ratio of the sum TM of the inspection resistance value Rk to the sum SM of the reference resistance value RS, the manufacturing conditions for each substrate to be inspected and the inspection target By correcting the difference in the measurement conditions of the inspection resistance value for each substrate, the quality of the inspection resistance value Rk is more accurately determined.

  For example, the width of the wiring pattern in the substrate 2 varies depending on the manufacturing conditions, and even when there is no defective portion, the inspection resistance value Rk is large in the substrate 2 (the width of the wiring pattern is large). The inspection resistance value Rk is generally small in the substrate 2 (when the width of the wiring pattern is wide), but the inspection resistance value Rk is the reference resistance value RS of the sum TM of the inspection resistance values Rk. Therefore, the influence of the variation in the absolute value of the inspection resistance value Rk is suppressed.

  Similarly, even if the substrate 2 has no defective portion depending on measurement conditions, the inspection resistance value Rk is generally high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high), and the inspection resistance There are cases where the value Rk is generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), but the inspection resistance value Rk is a sum total of the inspection resistance values Rk with respect to the sum SM of the reference resistance values RS. Since it is determined as the corrected resistance value RNk corrected by the ratio, the influence of the variation in the absolute value of the inspection resistance value Rk is suppressed.

  Furthermore, since the upper limit value SHLBi and the lower limit value SHUBi are set based on the average value AVi and the standard deviation σi of the reference resistance value SR of the measurement point set (see the above formulas (5) and (6)), Appropriate upper limit value SHLAi and lower limit value SHUAi are easily set.

  In addition, this invention can take the following forms.

(F) In the second embodiment, the determination unit 811m corrects the test resistance value Rk using the total TM of the test resistance values and the total SM of the reference resistance values to obtain the corrected resistance value RNk, and the corrected resistance value Although the case where RNk is determined has been described, the upper limit value SHUBk and the lower limit value SHLBk may be corrected using the sum TM of inspection resistance values and the sum SM of reference resistance values. In this case, for example, the threshold value setting unit 811i may correct the upper limit value SHUBk and the lower limit value SHLBk by the following equations (8) and (9), respectively.
SHUBk ← SHUBk × (TM / SM) (8)
SHLBk ← SHLBk × (TM / SM) (9)
(G) In the second embodiment, a case has been described in which the threshold setting unit 811i calculates the sum SM using the average value AV of the reference resistance values of 30 reference substrates. However, the number of reference substrates is 30. It is not limited and any number of sheets may be used. For example, when the number of reference substrates is one, processing for obtaining the average value AV is not necessary.

  (H) In the second embodiment, the case where the threshold setting unit 811i sets the lower limit value SHLB and the upper limit value SHUB has been described. However, at least one of the lower limit value SHLB and the upper limit value SHUB may be set. In this case, the process is simplified.

  (I) In the second embodiment, the case where the threshold value setting unit 811i sets the lower limit value SHLB and the upper limit value SHUB based on the average value AV and the standard deviation σ of the reference resistance value of the reference board has been described. It may be configured to set based on at least one of the average value AV and the standard deviation σ. For example, the lower limit value SHLB and the upper limit value SHUB may be obtained by subtracting and adding a predetermined number (for example, 5 mΩ) preset to the average value AV, respectively. In this case, the process is simplified.

  (J) In the second embodiment, the threshold setting unit 811i uses the above formulas (5) and (6) for the average value AV and the standard deviation σ of the reference resistance value of the reference board, and the lower limit value SHLB and the upper limit. Although the case where the value SHUB is set has been described, it may be set using other formulas, or may be set via another sort table or the like.

  For example, a table (look-up table) in which the average value AV of the reference resistance values is divided at intervals of a predetermined size (for example, 2 mΩ) and the lower limit value SHLB and the upper limit value SHUB are stored for each division is set in advance. Alternatively, the lower limit value SHLB and the upper limit value SHUB may be set based on the average value AV and this table.

<Third Embodiment>
Next, a substrate inspection apparatus according to a third embodiment of the present invention will be described with reference to FIGS. The configuration described with reference to FIGS. 1 to 6 is the same as that of the first embodiment, and thus the description thereof is omitted. FIG. 17 is a configuration diagram illustrating an example of a functional configuration of the control unit 8 according to the third embodiment. The CPU 811 of the control unit 8 includes a reference resistance measurement unit 811p (corresponding to a reference resistance measurement unit) that measures a reference resistance value, which is a resistance value between measurement point sets, on a preselected reference substrate, and each measurement point set. , A statistical calculation unit 811q (corresponding to a part of the threshold setting means) for obtaining the average value and standard deviation of the sequential numbers, and a threshold setting unit 811r (corresponding to a part of the threshold setting means) for setting a threshold value for each measurement point set And an inspection resistance measuring unit 811s (corresponding to an inspection resistance measuring means) that measures the resistance value between the measurement point sets of the substrate to be inspected as an inspection resistance value, and an inspection resistance value based on a threshold value for each measurement point set. And a determination unit 811t (corresponding to a determination unit) for determining whether the quality is good or bad.

  In addition, the RAM 812 of the control unit 8 stores a reference resistance storage unit 812p that stores the reference resistance value in association with the identification information of the measurement point set, and a threshold value that stores the threshold value in association with the identification information of the measurement point set. A storage unit 812q and a test resistance storage unit 812r that stores the value of the test resistance in association with the identification information of the measurement point set are provided.

  The reference resistance measuring unit 811p is configured to measure a reference number of reference substrates, which are a predetermined number (in this case, 30) of substrates to be inspected, selected from a plurality (for example, 10000) of substrates of the same type between measurement point sets. Is measured, and the obtained reference resistance value is stored in the reference resistance storage unit 812p in association with the identification information of the measurement point set.

  Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value. In addition, a reference board | substrate performs a conduction | electrical_connection test beforehand from 10000 to-be-inspected board | substrates of the same kind, and selects a thing with a favorable test result as a reference board.

  The statistical calculation unit 811q reads the reference resistance value measured by the reference resistance measurement unit 811p from the reference resistance storage unit 812p for each reference board, assigns a sequential number for each measurement point set of the reference resistance value, and averages The value and the standard deviation are obtained, and the obtained average value and standard deviation are stored in the reference resistance storage unit 812p in association with the identification information of the measurement point set.

The threshold setting unit 811r sets the threshold based on the average value and the standard deviation of the sequential numbers obtained by the statistical calculation unit 811q for each measurement point set, and associates the set threshold with the identification information of the measurement point set. It is stored in the threshold storage unit 812q. Specifically, the measurement point set sequence numbers SNi, j (i = 1 to N, j = 1 to M, N: the number of measurement point sets (925 here), M: The upper limit value SHUCi and the lower limit value SHLCi are obtained by the following equations (10) and (11) using the average value NAVi and standard deviation Nσi of the number of sheets (here 30 sheets) (see FIG. 19). ).
SHUCi = NAVi + 3 × Nσi (10)
SHLCi = NAVi-3 × Nσi (11)

  The inspection resistance measuring unit 811s measures the resistance value between the measurement point sets of the substrate to be inspected as the inspection resistance value, and associates the obtained inspection resistance value with the identification information of the measurement point set in the inspection resistance storage unit 812r. To store. Specifically, a value obtained by dividing the voltage value measured by the voltage measurement unit 743 shown in FIG. 4 by the current value I0 given to the current generation unit 742 is obtained as the resistance value.

  The determination unit 811t reads out the inspection resistance values Ri (i = 1 to N) of the measurement point sets from the inspection resistance storage unit 812r, and rearranges the inspection resistance values Ri in ascending order to correspond to each measurement point set. The number TNi is obtained, and pass / fail is determined based on the magnitude relationship between the sequential number TNi and the corresponding upper limit value SHUCi and lower limit value SHLCi set by the threshold setting unit 811r. Specifically, when the order number TNi of the measurement point set is less than the lower limit value SHLCi set by the threshold value setting unit 811r or exceeds the upper limit value SHUCi, it is determined that the measurement point set is defective. 18). Further detailed processing will be described later with reference to the flowchart shown in FIG.

  The reference resistance storage unit 812p uses the reference resistance value obtained by the reference resistance measurement unit 811p and the average value and standard deviation of the reference resistance values obtained by the statistical calculation unit 811q as identification information of the measurement point set. It is stored in association with each other.

  The threshold storage unit 812q stores the threshold set by the threshold setting unit 811r in association with the identification information of the measurement point set.

  The inspection resistance storage unit 812r stores the inspection resistance value obtained by the inspection resistance measurement unit 811s in association with the identification information of the measurement point set.

  Note that the board inspection program of the present invention that causes the control unit 8 to function as the reference resistance measurement unit 811p, the statistical calculation unit 811q, and the like is stored in, for example, the ROM 813 and is executed by the CPU 811, whereby the control unit 8 It functions as each functional unit such as the resistance measuring unit 811p and the statistical calculation unit 811q.

  FIG. 18 is a graph illustrating a method for determining whether the inspection resistance value is good or bad by the determination unit 811t. (A) is the graph G7 which arranged the average value of the reference resistance value SR of each measurement point set in ascending order, the horizontal axis is the order number SN, and the vertical axis is the reference resistance value SR. Further, the average value NAVi of the sequential numbers of the predetermined measurement point set (hereinafter referred to as the “target measurement point set”), the upper limit value SHUCi, and the lower limit value SHLCi are shown in the drawing.

  (B) is a graph G8 in which the inspection resistance values R of each measurement point set of a certain substrate 2 to be inspected are arranged in ascending order, the horizontal axis is the order number SN, and the vertical axis is the inspection resistance value R. In the drawing, the order number TNi of the inspection resistance value Ri of the target measurement point set on this inspection board is displayed. In this substrate 2 to be inspected, since the sequence number TNi is not less than the lower limit value SHLCi and not more than the upper limit value SHUCi, it is determined to be good.

  (C) is a graph G9 in which the inspection resistance values R of the respective measurement point sets of the inspected substrate 2 different from (b) are arranged in ascending order, the horizontal axis is the sequence number SN, and the vertical axis is the inspection resistance. The value R. In the drawing, the order number TNi of the inspection resistance value Ri of the target measurement point set on this inspection board is displayed. Also in the substrate 2 to be inspected, the sequence number TNi is determined to be good because the sequence number TNi is not less than the lower limit value SHLCi and not more than the upper limit value SHUCi.

  (D) is a graph G10 in which the inspection resistance values R of the respective measurement point sets of the inspected substrate 2 different from (b) and (c) are arranged in ascending order, the horizontal axis is the sequence number SN, and the vertical The axis is the inspection resistance value R. In the drawing, the order number TNi of the inspection resistance value Ri of the target measurement point set on this inspection board is displayed. In this substrate 2 to be inspected, the sequence number TNi is over the upper limit SHUCi, so that it is determined to be defective.

  FIG. 19 is a flowchart illustrating an example of operations up to the threshold setting of the control unit 8. This operation is executed as a preparatory operation for inspecting the substrate 2 before the substrate 2 to be inspected is placed on the substrate platform 51 shown in FIG.

  First, the reference resistance measurement unit 811p makes reference resistance values SRi, j (i = 1 to N, j = 1 to M, N: number of measurement point sets) which are resistance values between measurement point sets for 30 reference substrates. (Here, N = 925), M: the number of reference substrates (here, M = 30)) is measured, and is associated with identification information (hereinafter referred to as point number PN) of the measurement point set, and a reference resistance storage unit It is stored in 812p (step S501). Next, the statistical calculation unit 811q sorts (rearranges) the reference resistance values SRi, j of the measurement point set in ascending order for each reference substrate, and assigns a sequence number SNi, j (step S503). Next, the statistical calculation unit 811q obtains the average value NAVi and the standard deviation Nσi of the sequence numbers SNi, j for each measurement point set, and associates them with the measurement point set identification information (here, the point number PN) as a reference. It is stored in the resistance storage unit 812p (step S505).

  Then, the threshold value setting unit 811r uses the average value NAVi and the standard deviation Nσi of the sequential numbers SNi, j of the measurement point set (according to the above formulas (10) and (11)) to set the upper limit value SHUCi and the lower limit value SHLCi. The upper limit value SHUBi and the lower limit value SHLBi are set in association with the identification information (point number PN) of the measurement point set and stored in the threshold value storage unit 812q (step S507), and the process ends.

  FIG. 20 is a flowchart illustrating an example of the operation of the control unit 8 when performing the inspection. This operation is executed in a state where the operation shown in FIG. 19 is completed and the target substrate 2 to be inspected is placed on the substrate platform 51 shown in FIG. The following processing is performed by the determination unit 811t unless otherwise specified.

  First, the inspection resistance measurement unit 811s measures the inspection resistance values Rk (k = 1 to N) of all the measurement point sets and stores them in the inspection resistance storage unit 812r (step S601). Then, the inspection resistance value Ri is rearranged in ascending order to obtain the corresponding sequence number TNi for each measurement point set (step S603). Next, it is determined whether or not the order number TNi is not less than the lower limit value SHLCi obtained in step S507 of the flowchart shown in FIG. 19 and not more than the upper limit value SHUCi (step S605).

  When it is determined that at least one sequence number TNi is not less than the lower limit value SHLCi and not more than the upper limit value SHUCi (that is, less than the lower limit value SHLCi or more than the upper limit value SHUCi) (NO in step S605). Is determined that the conductive state of the substrate 2 is defective (step S609), and the process is terminated.

  On the other hand, when it is determined that all the sequence numbers TNi are not less than the lower limit value SHLCi and not more than the upper limit value SHUCi (YES in step S605), it is determined that the conduction state of the substrate 2 is good ( Step S607), the process is terminated.

  In this way, the quality of the inspection resistance value Ri, which is the resistance value between the measurement point sets, is determined based on the upper limit value SHUCi and the lower limit value SHLCi set for each measurement point set, so the upper limit value SHUCi and the lower limit value By setting the value SHLCi to an appropriate value for each measurement point set, the quality of the inspection resistance value Ri is accurately determined.

  Further, the measurement point sets are rearranged in ascending order based on the magnitude of the inspection resistance value Ri, and a sequence number TNi is given to each measurement point set, and this sequence number TNi is compared with the upper limit value SHUCi and the lower limit value SHLCi. Since the inspection resistance value Ri is judged as good or bad, the difference between the manufacturing conditions for each substrate to be inspected and the measurement conditions for the inspection resistance value for each substrate to be inspected is canceled out. It is determined more accurately.

  For example, the width of the wiring pattern of the substrate 2 varies depending on the manufacturing conditions, and the inspection resistance value Ri is generally large in the substrate 2 even when there is no defective portion (the width of the wiring pattern is large). There are cases where the inspection resistance value Ri is small as a whole in the substrate 2 (when the width of the wiring pattern is wide), but the inspection resistance value Ri is the magnitude of the inspection resistance value Ri in the inspection substrate. Are sorted in ascending order based on, and are determined as a sequence number TNi, so that the influence of fluctuations in the absolute value of the inspection resistance value Rk is offset.

  Similarly, even if the substrate 2 has no defective portion depending on the measurement conditions, the inspection resistance value Ri is generally high in the substrate 2 (for example, when the surface temperature of the substrate 2 is high), and the inspection resistance Although the value Ri may be generally low in the substrate 2 (for example, when the surface temperature of the substrate 2 is low), the inspection resistance value Ri is in ascending order based on the magnitude of the inspection resistance value Ri in the inspection substrate. Therefore, the influence of the variation in the absolute value of the inspection resistance value Ri is canceled out.

  Further, for each reference substrate, the measurement point set is rearranged in ascending order based on the magnitude of the reference resistance value SR, and a sequence number SN is assigned to each measurement point set, and an upper limit is set based on the assigned sequence number SN. Since the value SHUCi and the lower limit value SHLCi are obtained, an appropriate threshold value is set.

  In addition, the average value NAVI and standard deviation Nσi of the sequence numbers SN assigned to each measurement point set are obtained, and based on the obtained average value NAVI and standard deviation Nσi of the sequence numbers SN, the upper limit value SHUCi and the lower limit value Since SHLCi is obtained (see the above-described equations (10) and (11)), more appropriate upper limit SHUCi and lower limit SHLCi are easily set.

  In addition, this invention can take the following forms.

  (K) In the third embodiment, the case where the threshold setting unit 811r sets the threshold based on the reference resistance value of the reference substrate has been described. However, the threshold may be set by other methods. For example, the threshold value may be set based on the inspection resistance value at the time of past measurement by the inspection resistance measuring unit 811s. In this case, the process is simplified.

  Specifically, a form in which a predetermined number (for example, 10) is subtracted and added based on the order number of the inspection resistance value that has been determined to be good in the past measurement is set as the lower limit value and the upper limit value, respectively. But you can.

  (L) In the third embodiment, the case where the threshold setting unit 811r sets the threshold using the average value NAV of the reference numbers of the reference resistance values of the 30 reference substrates has been described. The number is not limited to 30, and any number is possible. For example, when the number of reference substrates is one, processing for obtaining the average value NAV is not necessary.

  (M) In the third embodiment, the case where the threshold setting unit 811r sets the lower limit value SHLC and the upper limit value SHUC has been described, but at least one of the lower limit value SHLC and the upper limit value SHUC may be set. In this case, the process is simplified.

  (N) In the third embodiment, the case where the threshold value setting unit 811r sets the lower limit value SHLC and the upper limit value SHUC based on the average value NAV of the reference numbers of the reference resistance values of the reference board and the standard deviation Nσ will be described. However, it may be set based on at least one of the average value NAV and the standard deviation Nσ. For example, the lower limit value SHLC and the upper limit value SHUC may be obtained by subtracting and adding a predetermined number (for example, 10) set in advance to the average value NAV. In this case, the process is simplified.

  (O) In the third embodiment, the threshold value setting unit 811r uses the above-described equations (10) and (11) regarding the average value AV and the standard deviation σ of the reference resistance value of the reference board to set the lower limit value SHLC and the upper limit value. Although the case where SHUC is set has been described, a mode of setting using other expressions may be used, or a mode of setting via other sorting tables may be used.

  For example, a table (look-up table) in which the average value NAV of the reference resistance value sequence numbers is divided at intervals of a predetermined size (for example, 5) and the lower limit value SHLC and the upper limit value SHUC are stored for each division in advance. It may be set and the lower limit value SHLC and the upper limit value SHUC may be set based on the average value NAV and this table.

  Furthermore, the present invention can take the following forms.

  (P) In the first to third embodiments, the substrate inspection apparatus includes the upper inspection unit 4U and the lower inspection unit 4D. However, the substrate inspection apparatus is at least one of the upper inspection unit 4U and the lower inspection unit 4D. The form provided with.

  (Q) In the first to third embodiments, an inspection jig that supports a large number of contacts 44 and presses the tips of the contacts 44 to the respective measurement points of the substrate 2 by being moved in the Z-axis direction. Although the case where the present invention is applied to a substrate inspection apparatus provided with a so-called multi-needle inspection jig has been described, a pair of contactors 44 (or probes) are each independently X, Y, Z In a substrate inspection apparatus provided with an inspection jig (so-called moving probe type inspection jig) which is supported so as to be movable in the axial direction, and which sequentially presses the tip of the contactor 44 to a measurement point of the substrate 2 according to a preset program. The form to which this invention is applied may be sufficient.

  (R) In the first to third embodiments, the case where the substrate 2 to be inspected is a build-up substrate having vias has been described. However, other types of substrates (for example, one surface on one insulating substrate) Or a printed wiring board having a wiring pattern formed thereon.

  (S) In the first to third embodiments, the case where the reference substrate is selected from a plurality of substrates to be inspected of the same type as the reference substrate has been described. That's fine. For example, when inspecting a substrate to be inspected that has been inspected in the past and a substrate to be inspected with a different manufacturing lot, the reference substrate (a substrate selected from the substrates to be inspected) used in the past inspection is used as it is. A form may be sufficient, and the form which makes a reference | standard board | substrate by manufacturing a board | substrate without a defect at all by carrying out perfect manufacturing management may be sufficient.

It is side surface sectional drawing which shows one Embodiment of the board | substrate inspection apparatus which concerns on this invention. It is a top view of the board | substrate inspection apparatus shown in FIG. It is a block diagram which shows an example of the electrical structure of a board | substrate inspection apparatus. It is a conceptual diagram for demonstrating an example of a structure of a measurement execution part. It is a block diagram which shows an example of the hardware constitutions of a control part. It is a conceptual diagram which shows an example of a structure of a board | substrate. It is a block diagram which shows an example of a function structure of the control part which concerns on 1st Embodiment. It is a graph explaining the method of the quality determination of the test resistance value by the determination part which concerns on 1st Embodiment. It is explanatory drawing of a test resistance difference. It is a graph explaining an example of the calculation method of a threshold value. It is a flowchart which shows an example of operation | movement until the threshold value setting of the control part which concerns on 1st Embodiment. It is a flowchart which shows an example of the operation | movement at the time of the test | inspection execution of the control part which concerns on 1st Embodiment. It is a block diagram which shows an example of a function structure of the control part which concerns on 2nd Embodiment. It is a graph explaining the method of the quality determination of the test resistance value by the determination part which concerns on 2nd Embodiment. It is a flowchart which shows an example of operation | movement until the threshold value setting of the control part which concerns on 2nd Embodiment. It is a flowchart which shows an example of the operation | movement at the time of the test | inspection execution of the control part which concerns on 2nd Embodiment. It is a block diagram which shows an example of a function structure of the control part which concerns on 3rd Embodiment. It is a graph explaining the method of the quality determination of the test resistance value by the determination part which concerns on 3rd Embodiment. It is a flowchart which shows an example of operation | movement until the threshold value setting of the control part which concerns on 3rd Embodiment. It is a flowchart which shows an example of the operation | movement at the time of the test | inspection execution of the control part which concerns on 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Apparatus main body 2 Board | substrate 3 Carry-in / out part 4 Inspection part 44 Contactor 74 Measurement execution part 744 Scanner 75 Tester controller 8 Control part 81 Main control part 811 CPU
811a Reference resistance measuring unit (reference resistance measuring means)
811b Statistical calculation part (statistical calculation means)
811c Threshold setting unit (threshold setting means)
811d Inspection resistance measuring unit (Inspection resistance measuring means)
811e determination unit (determination means)
812 RAM
812a Reference resistance storage unit 812b Threshold storage unit 812c Inspection resistance storage unit

Claims (13)

A substrate inspection apparatus that performs a continuity inspection between measurement point sets that are set in advance on the wiring pattern for a substrate to be inspected on which a plurality of wiring patterns are formed, and is a combination of two measurement points,
Inspection resistance measuring means for measuring a resistance value between the measurement point sets of the substrate to be inspected as an inspection resistance value;
Threshold setting means for setting a threshold corresponding to the measurement point set;
A substrate inspection apparatus comprising: a determination unit that determines the quality of the inspection resistance value based on the threshold value for each measurement point set. The threshold value setting means assigns a sequential number which is a number representing an order according to a predetermined rule for each measurement point set, and a difference between resistance values corresponding to two measurement point sets adjacent to each other. Set the threshold of
The substrate inspection apparatus according to claim 1, wherein the determination unit determines a difference between inspection resistance values of two measurement point sets adjacent to each other based on a corresponding threshold value. A reference resistance measuring means for measuring a resistance value between the measurement point sets as a reference resistance value for a reference board of the same type as the board to be inspected,
The threshold value setting means assigns the order number for each measurement point set by rearranging the measurement point set in ascending or descending order based on the magnitude of the reference resistance value, and the two sets of adjacent sequential numbers The substrate inspection apparatus according to claim 2, wherein the threshold value is set based on a difference in reference resistance values of the measurement point set. The number of the reference substrates is a predetermined number of 2 or more,
Statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each measurement point set;
4. The substrate according to claim 3, wherein the threshold setting unit sets the threshold based on at least one of an average value and a standard deviation of reference resistance values of two measurement point sets adjacent to each other in the order number. Inspection device. For a reference substrate of the same type as the substrate to be inspected, a reference resistance measuring means for measuring a resistance value between the measurement point sets as a reference resistance value,
A reference sum calculating means for calculating a sum of the reference resistance values per one reference board;
An inspection total calculating means for calculating the total of the inspection resistance values for each substrate to be inspected,
The substrate inspection apparatus according to claim 1, wherein the determination unit determines the inspection resistance value by correcting the inspection resistance value by a ratio of a total sum of the inspection resistance values to a total sum of the reference resistance values. For a reference substrate of the same type as the substrate to be inspected, a reference resistance measuring means for measuring a resistance value between the measurement point sets as a reference resistance value,
A reference sum calculating means for calculating a sum of the reference resistance values per one reference board;
An inspection total calculating means for calculating the total of the inspection resistance values for each substrate to be inspected,
The substrate inspection apparatus according to claim 1, wherein the threshold setting unit sets the threshold by correcting the reference resistance value by a ratio of a total sum of the inspection resistance values to a total sum of the reference resistance values. The number of the reference substrates is a predetermined number of 2 or more,
Statistical calculation means for obtaining at least one of an average value and a standard deviation of reference resistance values of the predetermined number of reference substrates for each measurement point set;
The substrate inspection apparatus according to claim 5, wherein the threshold setting unit sets a threshold based on at least one of the average value and the standard deviation. The threshold setting means sets a threshold for a sequential number based on the magnitude of the inspection resistance value of the measurement point set,
The determination means rearranges the measurement point set in ascending or descending order based on the magnitude of the inspection resistance value, assigns a sequential number to each measurement point set, and compares the sequential number with the threshold value. The substrate inspection apparatus according to claim 1, wherein the inspection resistance value is judged as good or bad. A reference resistance measuring means for measuring a resistance value between the measurement point sets as a reference resistance value for a reference board of the same type as the board to be inspected,
The threshold value setting means rearranges the measurement point sets in ascending order or descending order based on the magnitude of the reference resistance value for each reference substrate, and assigns a sequential number to each measurement point set, and the assigned order. The substrate inspection apparatus according to claim 8, wherein the threshold is set based on a number. The number of the reference substrates is a predetermined number of 2 or more,
The threshold setting means obtains at least one of an average value and a standard deviation of the sequential numbers assigned to each measurement point set, and determines the threshold based on at least one of the obtained average values and standard deviations of the sequential numbers. The board inspection apparatus according to claim 9, wherein the board inspection apparatus is set.   The substrate inspection apparatus according to claim 1, wherein the substrate to be inspected is a build-up substrate having vias. A board inspection program for a board inspection apparatus that performs a continuity test between measurement point sets that are set in advance on the wiring pattern for a substrate to be inspected on which a plurality of wiring patterns are formed. The board inspection device
Inspection resistance measuring means for measuring a resistance value between the measurement point sets of the substrate to be inspected as an inspection resistance value;
Threshold setting means for setting a threshold corresponding to the measurement point set;
A board inspection program that functions as a determination unit that determines the quality of the inspection resistance value based on the threshold value for each measurement point set. A substrate inspection method for a substrate inspection apparatus that performs a continuity inspection between measurement point sets that are set in advance on the wiring pattern for a substrate to be inspected on which a plurality of wiring patterns are formed. And
Measure the resistance value between the set of measurement points on the substrate to be inspected as the inspection resistance value,
Set a threshold value corresponding to the measurement point set,
A substrate inspection method for determining whether the inspection resistance value is good or not based on the threshold value for each measurement point set.

Images