JPH05164803A - Open test device for in-circuit tester - Google Patents

Open test device for in-circuit tester

Info

Publication number
JPH05164803A
JPH05164803A JP3350056A JP35005691A JPH05164803A JP H05164803 A JPH05164803 A JP H05164803A JP 3350056 A JP3350056 A JP 3350056A JP 35005691 A JP35005691 A JP 35005691A JP H05164803 A JPH05164803 A JP H05164803A
Authority
JP
Japan
Prior art keywords
value
range
measured
primary
reference value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3350056A
Other languages
Japanese (ja)
Other versions
JP3241777B2 (en
Inventor
Hideto Yamakoshi
秀人 山越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hioki EE Corp
Original Assignee
Hioki EE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hioki EE Corp filed Critical Hioki EE Corp
Priority to JP35005691A priority Critical patent/JP3241777B2/en
Publication of JPH05164803A publication Critical patent/JPH05164803A/en
Application granted granted Critical
Publication of JP3241777B2 publication Critical patent/JP3241777B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

PURPOSE:To reduce inaccuracy of judgement on test results faking place at the time of the contact inferiority of a probe. CONSTITUTION:An open device is provided with a means 42 which prepares criterions by using a good quality printed-circuit board 28, and when the measured resistance at a specified position on the said board exceeds the value inputted, the inputted value is decided as the primary criterion value, and when the measured resistance by the maximum range of resistance measurement at the same position exceeds the maximum range value, the secondary criterion is set up as the over-range, and, in the case where the measured resistance is less than the maximum range value the secondary criterion is set up as being in the range over the primary criterion value. Moreover, the device is provided with an open test means 48 for a printed- circuit board 28 to be tested, and judges whether the measured resistance value at the same position on the printed-circuit board 28 to be tested is over the primary criterion value or not. Hence it is judged whether the specified position is in a short circuit condition or not. When the measured resistance exceeds the maximum range value, the same position is measures again with the maximum range. And in the case where the measured resistance is over the maximum range value, a second criterion judging means 46 decides that the measured resistance is in the over range, and while in the case where the measured resistance is less than the maximum range, the secondary criterion whether the measured resistance is in the range over the primary criterion value or not. Hence the device can judge whether a probe is in contact inferiority or not.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は実装基板の良否の判定に
使用するインサーキットテスタ用のオープンテスト装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an open test device for an in-circuit tester used for judging the quality of a mounting board.

【0002】[0002]

【従来の技術】従来、実装基板即ち多数の電気部品を半
田付けしたプリント基板はインサーキットテスタを用い
て基板の良否の判定を行なっている。その際、基板の各
指定箇所にある部品や回路網等の必要な測定ポイントに
適宜プローブを接触させ、電圧や電流等の信号を印加
し、各種の検査項目に付き電気的測定を行ない、それ等
の結果を総合的に判断して良否の判定を行なう。
2. Description of the Related Art Conventionally, a mounting board, that is, a printed circuit board to which a large number of electric components are soldered, is judged by using an in-circuit tester. At that time, a probe is appropriately contacted with a necessary measurement point such as a component or a circuit network in each designated portion of the board, a signal such as voltage or current is applied, and electrical measurement is performed for various inspection items. The result of the above is comprehensively judged to judge the quality.

【0003】このようなインサーキットテスタによる基
板検査の項目の一つにオープンテストがある。オープン
テストでは被検査基板の各指定箇所毎に抵抗測定を行な
い、その測定値が基準値を超えれば合格として“GO”
と判定し、基準値以下の場合には不合格として“NG”
と判定する。
An open test is one of the items of board inspection by such an in-circuit tester. In the open test, the resistance is measured at each specified location on the board to be inspected, and if the measured value exceeds the reference value, it is regarded as a pass and "GO".
If the result is below the standard value, it is rejected and "NG"
To determine.

【0004】その際、抵抗測定器として指定箇所の測定
ポイントに直流の定電圧を印加し、電流値を読み取っ
て、演算により抵抗値を求めるものが多く用いられる。
そして、基準値としての抵抗値は基本的には実装されて
いる各部品等の測定により或いは論理的に求めて作成す
る。しかし、最終的には良品基板を決定してその測定値
から得るようにする。
At that time, a resistance measuring device is often used in which a constant DC voltage is applied to a designated measurement point, a current value is read, and a resistance value is calculated.
Then, the resistance value as a reference value is basically created by measuring or logically obtaining each mounted component. However, finally, a non-defective substrate is determined and obtained from the measured value.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、インサ
ーキットテスタによるオープンテストの場合、そのよう
にして指定箇所毎に基準値を定めず、基準値を一般的に
数10Ω程度に設定することが多い。しかも、測定値が
基準値を超えれば合格と判定するため、プローブが接触
不良を起こしていても、判定結果が“GO”となる。そ
れ故、被検査基板を正確に判定できない。
However, in the case of the open test by the in-circuit tester, the reference value is not set for each designated place in this way, and the reference value is generally set to about several tens Ω. Moreover, if the measured value exceeds the reference value, it is determined as a pass, so that the determination result is "GO" even if the probe has a contact failure. Therefore, the board to be inspected cannot be accurately determined.

【0006】本発明はこのような従来の問題点に着目し
てなされたものであり、プローブの接触不良時に起こる
判定の不正確さを少なくし得るインサーキットテスタ用
オープンテスト装置を提供することを目的とする。
The present invention has been made in view of such conventional problems, and it is an object of the present invention to provide an open test device for an in-circuit tester capable of reducing the inaccuracy of judgment that occurs when a probe has a poor contact. To aim.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
の手段を、以下本発明を明示する図1を用いて説明す
る。このインサーキットテスタ用オープンテスト装置は
操作部12を有し、実装基板28にプローブを接触し
て、予め設定した指定箇所の抵抗値を測定する抵抗測定
器40を備える。そして、オープンテスト用の判定基準
を良品基板28を用いて作成する判定基準作成手段42
として、仮の判定基準値を入力しながら、良品基板28
における指定箇所の抵抗値を入力値に対応するレンジで
測定し、その測定値が入力値を超える場合に、その入力
値を1次判定基準値と決定する1次判定基準決定手段4
4と、同一指定箇所の抵抗値を最高レンジで判定し、そ
の測定値が最高レンジ値に相当する2次判定基準値を超
える場合に、2次判定基準をオーバレンジと設定し、2
次判定基準値以下の場合に、2次判定基準を1次判定基
準値を超えたレンジ範囲と設定する2次判定基準設定手
段46とを備える。
Means for achieving the above object will be described below with reference to FIG. 1 which clearly shows the present invention. This open test device for an in-circuit tester has an operation unit 12, and is equipped with a resistance measuring device 40 that measures a resistance value at a preset designated position by bringing a probe into contact with the mounting substrate 28. Then, the judgment reference creating means 42 for creating the judgment reference for the open test using the non-defective substrate 28.
While inputting the temporary judgment reference value,
The primary judgment criterion determining means 4 for measuring the resistance value of the designated place in the range of 1) in the range corresponding to the input value, and determining the input value as the primary judgment criterion value when the measured value exceeds the input value.
4 and the resistance value of the same designated place is judged in the maximum range, and when the measured value exceeds the secondary judgment reference value corresponding to the maximum range value, the secondary judgment standard is set as overrange and 2
A secondary judgment reference setting means 46 is provided for setting the secondary judgment reference to a range range exceeding the primary judgment reference value when the value is equal to or smaller than the next judgment reference value.

【0008】又、更に被検査基板に対するオープンテス
ト手段48として、被検査基板28における同一指定箇
所の抵抗値を1次判定基準値に対応するレンジで測定
し、その測定値が1次判定基準値を超えるか判定する1
次判定手段50と、その測定値が1次判定基準値を超え
る場合に、最高レンジで同一指定箇所の抵抗値を再度測
定し、その測定値が2次判定基準値を超える場合には2
次判定基準がオーバレンジか判定し、測定値が2次判定
基準値以下の場合には2次判定基準が1次判定基準値を
超えたレンジ範囲か判定する2次判定手段52とを備え
る。
Further, as the open test means 48 for the inspected substrate, the resistance value of the same designated place on the inspected substrate 28 is measured in the range corresponding to the primary determination reference value, and the measured value is the primary determination reference value. 1 to determine if it exceeds
When the next determination means 50 and its measured value exceed the primary determination reference value, the resistance value at the same designated location is measured again in the highest range, and when the measured value exceeds the secondary determination reference value, 2
The secondary determination means 52 determines whether the next determination criterion is overrange, and when the measured value is equal to or less than the secondary determination reference value, determines whether the secondary determination criterion is a range range exceeding the primary determination reference value.

【0009】[0009]

【作用】上記のように構成し、先ず良品基板28を用い
て、仮の判定基準値を入力しながら、良品基板28にお
ける指定箇所の抵抗値を入力値に対応するレンジで測定
し、その測定値が入力値を超える場合に、その入力値を
1次判定基準値と決定する。更に、同一指定箇所の抵抗
値を最高レンジで測定し、その測定値が2次判定基準値
を超える場合に、2次判定基準をオーバレンジと設定
し、2次判定基準値以下の場合に、2次判定基準を1次
判定基準値を超えたレンジ範囲と設定する。
With the above-described structure, the resistance value of the designated portion on the non-defective substrate 28 is measured in the range corresponding to the input value by using the non-defective substrate 28 while inputting the temporary judgment reference value. When the value exceeds the input value, the input value is determined as the primary determination reference value. Furthermore, the resistance value of the same designated location is measured in the highest range, and when the measured value exceeds the secondary judgment reference value, the secondary judgment reference is set as overrange, and when the measured value exceeds the secondary judgment reference value, The secondary judgment standard is set as the range range that exceeds the primary judgment standard value.

【0010】次に、被検査基板28における同一指定箇
所の抵抗値を1次判定基準値に対応するレンジで測定
し、その測定値が1次判定基準値を超えるか判定する。
その際、測定値が1次判定基準値以下の場合には指定箇
所がショート状態にあると判定する。そして、測定値が
1次判定基準値を超える場合には更に最高レンジで同一
指定箇所の抵抗値を再度測定し、その測定値が2次判定
基準値を超える場合には2次判定基準がオーバレンジか
判定し、測定値が2次判定基準値以下の場合には2次判
定基準が1次判定基準値を超えたレンジ範囲か判定す
る。その際、測定値が2次判定基準値を超えるにも係わ
らず、2次判定基準が1次判定基準値を超えたレンジ範
囲であればプローブが接触不良であると判定する。
Next, the resistance value of the same designated place on the inspected substrate 28 is measured in the range corresponding to the primary determination reference value, and it is determined whether the measured value exceeds the primary determination reference value.
At that time, if the measured value is less than or equal to the primary determination reference value, it is determined that the designated portion is in the short-circuited state. When the measured value exceeds the primary judgment reference value, the resistance value at the same designated position is measured again in the highest range, and when the measured value exceeds the secondary judgment reference value, the secondary judgment reference is exceeded. If the measured value is less than or equal to the secondary determination reference value, it is determined whether the range is a range in which the secondary determination reference exceeds the primary determination reference value. At that time, even if the measured value exceeds the secondary determination reference value, it is determined that the probe has a poor contact in the range range in which the secondary determination reference exceeds the primary determination reference value.

【0011】[0011]

【実施例】以下、添付図面に基づいて、本発明の実施例
を説明する。図2は本発明を適用したフィクスチャー式
インサーキットテスタのオープンテスト部の構成を示す
ブロック図である。図中、10はインサーキットテス
タ、12はその操作部、14は計測部、16はマルチプ
レクサ、18は表示部、20は演算制御部である。この
操作部12にはキーボード、各種スイッチ等を備える。
それ故、キーやスイッチ等を適宜操作すると、外部から
第1次判定基準値等のデータを入力し、測定レンジの切
り替え等を実施できる。
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 2 is a block diagram showing the configuration of the open test unit of the fixture type in-circuit tester to which the present invention is applied. In the figure, 10 is an in-circuit tester, 12 is its operation unit, 14 is a measurement unit, 16 is a multiplexer, 18 is a display unit, and 20 is a calculation control unit. The operation unit 12 includes a keyboard, various switches and the like.
Therefore, by appropriately operating a key, a switch, or the like, data such as the primary determination reference value can be input from the outside, and the measurement range can be switched.

【0012】計測部14には直流の定電圧電源22、電
流測定器24等を備え、それ等をマルチプレクサ16と
接続する。更に、マルチプレクサ16に備えた多数のス
イッチから出る各チャンネルをフィクスチャー(図示な
し)上に立設させた対応するプローブ26とそれぞれ接
続する。それ故、フィクスチャー上に実装した実装基板
(被検査基板或いは良品基板)28を載せ、予め設定し
た各指定箇所にある部品や回路網等の必要な測定ポイン
トにそれぞれプローブを接触させると、各指定箇所毎に
定電圧を印加して、そこに流れる電流を測定できる。そ
の際、演算制御部20からマルチプレクサ16を制御
し、設定した測定順に従って指定箇所に対応するスイッ
チを選択し、計測部14と各プローブ26とを適宜オ
ン、オフする。
The measuring section 14 is provided with a DC constant voltage power source 22, a current measuring device 24, etc., which are connected to the multiplexer 16. Further, each channel output from a large number of switches provided in the multiplexer 16 is connected to a corresponding probe 26 provided upright on a fixture (not shown). Therefore, when the mounting board (the board to be inspected or the non-defective board) 28 mounted on the fixture is placed and the probes are brought into contact with the necessary measurement points such as the parts and the circuit networks at the respective preset locations set in advance, A constant voltage can be applied at each designated location, and the current flowing there can be measured. At this time, the arithmetic and control unit 20 controls the multiplexer 16 to select the switch corresponding to the designated portion in accordance with the set measurement order, and turn on and off the measuring unit 14 and each probe 26 as appropriate.

【0013】表示部18にはCRT等の画面表示装置を
備える。それ故、外部から入力したデータ、設定した1
次、2次判定基準値、指定箇所の合格、不合格を示す
“GO”、“NG”やプローブの接触不良を示す判定結
果等を適宜表示することができる。
The display unit 18 includes a screen display device such as a CRT. Therefore, the data input from the outside, the set 1
Next, secondary determination reference values, “GO” and “NG” indicating pass / fail of designated locations, and determination results indicating contact failure of the probe can be displayed as appropriate.

【0014】演算制御部20にはCPU(中央処理装
置)30、ROM(読出し専用メモリ)32、RAM
(読出し書き込み可能メモリ)34、入出力ポート3
6、バスライン38等からなるマイクロコンピュータを
備える。このCPU30はマイクロコンピュータの中心
となる頭脳部に相当し、プログラムの命令に従って全体
に対する制御を実行すると共に算術、論理演算を行い、
その結果も一時的に記憶する。又、周辺装置に対しても
適宜制御を行う。ROM32には全体を制御するための
制御プログラム等を格納する。
The arithmetic and control unit 20 includes a CPU (central processing unit) 30, a ROM (read only memory) 32, and a RAM.
(Readable / writable memory) 34, input / output port 3
6, a microcomputer including a bus line 38 and the like. The CPU 30 corresponds to a central part of the brain of the microcomputer, which executes control over the whole according to instructions of a program and performs arithmetic and logical operations,
The result is also temporarily stored. In addition, peripheral devices are also controlled appropriately. The ROM 32 stores a control program for controlling the whole.

【0015】又、RAM34は外部から入力した入力デ
ータ、1次、2次判定基準値、測定した電流値、指定箇
所の合格、不合格、プローブの接触不良を示す判定結
果、フロッピーディスクから入力したオープンテスト用
判定基準処理プログラム、オープンテスト処理プログラ
ム、CPU30で演算した抵抗値等の各種データを記憶
する。入出力ポート36は操作部12、計測部14、マ
ルチプレクサ16、表示部18等に備えた各種機器等と
接続する。又、バスライン38はそれ等を接続するため
のアドレスバスライン、データバスライン、制御バスラ
イン等を含み、周辺装置とも適宜結合している。
Further, the RAM 34 receives input data input from the outside, primary and secondary determination reference values, measured current values, determination results indicating pass / fail of specified locations, probe contact failure, and input from a floppy disk. Various data such as the open test determination reference processing program, the open test processing program, and the resistance value calculated by the CPU 30 are stored. The input / output port 36 is connected to the operation unit 12, the measurement unit 14, the multiplexer 16, various devices provided in the display unit 18, and the like. Further, the bus line 38 includes an address bus line, a data bus line, a control bus line and the like for connecting them, and is properly coupled to peripheral devices.

【0016】次に、本実施例の動作を説明する。図3は
オープンテスト用判定基準処理プログラムによる動作を
示すP1〜P8のステップからなるフローチャートであ
る。先ず、被検査基板28と同種の良品基板28を用い
て、その良品基板28をフィクスチャー上の所定箇所に
載せて固定し、各指定箇所の測定ポイントにそれぞれプ
ローブを接触させる。
Next, the operation of this embodiment will be described. FIG. 3 is a flowchart consisting of steps P1 to P8 showing the operation of the open test judgment reference processing program. First, a non-defective substrate 28 of the same type as the inspected substrate 28 is used, the non-defective substrate 28 is placed and fixed at a predetermined location on the fixture, and the probe is brought into contact with the measurement points at each designated location.

【0017】そこで、プログラムによる処理を開始し、
P1で予め設定した測定順に従って、測定する1指定箇
所の測定ポイントを設定する。次にP2へ行く。P2で
は操作部12にあるキーボードを操作し、仮の1次判定
基準値aを入力する。次にP3へ行く。P3では指定箇
所の抵抗値を入力値に対応するレンジで測定し、その測
定値xが1次判定基準値aを超えるか判定する。YES
の場合にはP4へ行く。P4では入力値を1次判定基準
値aとして確定する。
Then, the processing by the program is started,
According to the measurement order preset in P1, a measurement point at one designated place to be measured is set. Then go to P2. At P2, the keyboard on the operation unit 12 is operated to input a temporary primary determination reference value a. Then go to P3. At P3, the resistance value at the specified location is measured in the range corresponding to the input value, and it is determined whether the measured value x exceeds the primary determination reference value a. YES
In case of, go to P4. At P4, the input value is confirmed as the primary determination reference value a.

【0018】NOの場合にはP2へ戻り、P3でYES
と判定されるまで、1次判定基準値aを調整して入力す
る。その際、測定値xに対し、検査の際の許容範囲を考
慮して1次判定基準値aを確定するが、通常は数10Ω
程度に設定する。なお、指定箇所の抵抗値xは既知の定
電圧vと測定した電流値iからx=v/iの式を用いて
算出する。
If NO, the process returns to P2 and P3 returns YES.
Until the determination is made, the primary determination reference value a is adjusted and input. At that time, with respect to the measured value x, the primary judgment reference value a is determined in consideration of the allowable range at the time of inspection, but normally, it is several tens Ω.
Set to a degree. The resistance value x at the designated location is calculated from the known constant voltage v and the measured current value i using the equation x = v / i.

【0019】1次判定基準値aを確定後P5へ行く。P
5では測定可能な最高レンジに設定し、その最高レンジ
値例えば10MΩを2次判定基準値bに定める。次にP
6へ行く。P6では同一指定箇所の抵抗値を最高レンジ
で測定し、その測定値x´が2次判定基準値b以下か判
定する。YESの場合にはP7へ行く。P7では2次判
定基準cを1次判定基準値aを超えたレンジ範囲、即ち
1次判定基準値aを超え、2次判定基準値bより小さい
範囲にあることを示すLに設定する。
After confirming the primary judgment reference value a, the process goes to P5. P
In step 5, the highest measurable range is set, and the highest range value, for example, 10 MΩ is set as the secondary judgment reference value b. Then P
Go to 6. In P6, the resistance value at the same designated location is measured in the highest range, and it is determined whether the measured value x'is less than or equal to the secondary determination reference value b. If YES, go to P7. At P7, the secondary judgment reference c is set to L indicating that it is in the range exceeding the primary judgment reference value a, that is, the range exceeding the primary judgment reference value a and smaller than the secondary judgment reference value b.

【0020】NOの場合はP8へ行く。P8では2次判
定基準cをオーバレンジ即ち2次判定基準値bを超えて
いることを示すHに設定する。なお、抵抗値測定用に備
えられている複数のレンジから最大レンジを選んで用い
ると、オーバレンジかプローブの接触不良かの判定を確
実に行なえるようになる。このようにして、順次指定箇
所毎に1次判定基準値aと2次判定基準cとを定める。
If NO, go to P8. At P8, the secondary judgment criterion c is set to H indicating that it is over the range, that is, exceeds the secondary judgment criterion value b. It should be noted that if the maximum range is selected from a plurality of ranges provided for resistance value measurement and used, it can be surely judged whether it is overrange or contact failure of the probe. In this way, the primary determination reference value a and the secondary determination reference c are sequentially determined for each designated location.

【0021】図4はオープンテスト処理プログラムによ
る動作を示すP10〜P19のステップからなるフロー
チャートである。先ず、良品基板28に替えて、被検査
基板28をフィクスチャー上の所定箇所に固定し、各指
定箇所の測定ポイントにそれぞれプローブを接触させ
る。
FIG. 4 is a flowchart consisting of steps P10 to P19 showing the operation of the open test processing program. First, in place of the non-defective substrate 28, the substrate 28 to be inspected is fixed at a predetermined position on the fixture, and the probe is brought into contact with each measurement point at each designated position.

【0022】そこで、プログラムによる処理を開始し、
P10で予め設定した測定順に従って、測定する1指定
箇所の測定ポイントを設定する。次にP11へ行く。P
11では指定箇所の抵抗値を1次判定基準値aに対応す
るレンジで測定する。次にP12へ行く。P12ではそ
の測定値xが先に定めた1次判定基準値aを超えるか判
定する。NOの場合にはP13へ行く。P13では指定
箇所がショート状態にあるとして不合格“NG”と判定
する。
Then, the processing by the program is started,
According to the measurement order preset in P10, one designated measurement point to be measured is set. Then go to P11. P
In 11, the resistance value at the specified location is measured in the range corresponding to the primary determination reference value a. Then go to P12. In P12, it is determined whether the measured value x exceeds the previously determined primary determination reference value a. If NO, go to P13. In P13, it is determined that the designated portion is in the short-circuited state, and the rejection is "NG".

【0023】YESの場合にはP14へ行く。P14で
は同一指定箇所の抵抗値を最高レンジで再度測定する。
次にP15へ行く。P15ではその測定値x´が2次判
定基準値b以下か判定する。NOの場合にはP16へ行
く。P16では先に定めた判定基準cがHか判定する。
NOの場合にはP17へ行く。P17では接触不良状態
にあると判定する。この場合にはプローブを良く接触さ
せて再度検査を行なう。それ故、プローブの接触不良を
一律的に合格と判定するような誤りを防止できる。
If YES, go to P14. In P14, the resistance value at the same designated location is measured again in the maximum range.
Then go to P15. At P15, it is determined whether the measured value x'is less than or equal to the secondary determination reference value b. If NO, go to P16. In P16, it is determined whether the previously determined criterion c is H.
If NO, go to P17. At P17, it is determined that the contact is poor. In this case, the probe is contacted well and the inspection is performed again. Therefore, it is possible to prevent such an error that the contact failure of the probe is uniformly determined as acceptable.

【0024】先のP15でYESと判定される場合には
P18へ行く。P18では先に定めた判定基準cがLか
判定する。YESの場合もNOの場合もP19へ行く。
P19では合格として“GO”と判定する。又、先のP
16でYESと判定される場合もP19へ行き“GO”
と判定する。このようにして、順次指定箇所毎にオープ
ンテストを実施する。
If YES is determined in P15, the process goes to P18. At P18, it is determined whether the previously determined criterion c is L. If YES or NO, go to P19.
In P19, it is judged as "GO" as a pass. Also, the previous P
Even if it is judged as YES in 16, go to P19 and "GO"
To determine. In this way, the open test is sequentially performed at each designated location.

【0025】なお、P18の判定がNOの場合には回路
網に問題があると推測できるが、ショート状態にある
“NG”等と判定することなく、一律的に“GO”と判
定する。何故なら、回路網の不良は使用する部品のばら
つきにより発生し易く、他の検査ステップ、或いは検査
項目で発見できる確率が非常に高いため、オープンテス
トでは無視した方が良いからである。
When the determination in P18 is NO, it can be inferred that there is a problem in the circuit network, but it is uniformly determined as "GO" without determining as "NG" or the like in the short circuit state. This is because the failure of the circuit network is likely to occur due to variations in the parts used and has a very high probability of being found in other inspection steps or inspection items, and should be ignored in the open test.

【0026】上記実施例では本発明をフィクスチャー式
インサーキットテスタに適用したものを説明したが、当
然フィクスチャーレスのX−Yユニットを備えたインサ
ーキットテスタにも適用することができる。
Although the present invention is applied to the fixture type in-circuit tester in the above embodiment, it is naturally applicable to the in-circuit tester equipped with a fixtureless XY unit.

【0027】[0027]

【発明の効果】以上説明した本発明によれば、オープン
テスト用判定基準として1次判定基準値と2次判定基準
とを作成し、その1次判定基準値を指定箇所がショート
状態にあるか否かの判定に用い、2次判定基準をプロー
ブの接触状態の良否の判定に用いるため、プローブの接
触不良時に起こる判定の不正確さを少なくすることがで
きる。
According to the present invention described above, a primary judgment standard value and a secondary judgment standard are prepared as the judgment standard for the open test, and whether the designated parts of the primary judgment standard value are short-circuited or not. Since it is used to determine whether or not the contact state of the probe is good or bad, the inaccuracy of the determination that occurs when the probe has a poor contact can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるインサーキットテスタ用オープン
テスト装置の構成を示すブロック図である。
FIG. 1 is a block diagram showing the configuration of an open test device for an in-circuit tester according to the present invention.

【図2】本発明を適用したフィクスチャー式インサーキ
ットテスタのオープンテスト部の構成を示すブロック図
である。
FIG. 2 is a block diagram showing a configuration of an open test unit of a fixture type in-circuit tester to which the present invention is applied.

【図3】同インサーキットテスタのRAM中に格納する
オープンテスト用判定基準処理プログラムによる動作を
示すフローチャートである。
FIG. 3 is a flowchart showing an operation by a judgment reference processing program for open test stored in a RAM of the in-circuit tester.

【図4】同インサーキットテスタのRAM中に格納する
オープンテスト処理プログラムによる動作を示すフロー
チャートである。
FIG. 4 is a flowchart showing an operation by an open test processing program stored in a RAM of the in-circuit tester.

【符号の説明】[Explanation of symbols]

10…インサーキットテスタ 12…操作部 14…計
測部 16…マルチプレクサ 18…表示部 20…演
算制御部 26…プローブ 28…実装基板 40…抵抗測定器 42…オープンテスト用判定基準作
成手段 44…1次判定基準決定手段 46…2次判定
基準決定手段 48…オープンテスト手段 50…1次
判定手段 52…2次判定手段
DESCRIPTION OF SYMBOLS 10 ... In-circuit tester 12 ... Operation part 14 ... Measuring part 16 ... Multiplexer 18 ... Display part 20 ... Arithmetic control part 26 ... Probe 28 ... Mounting board 40 ... Resistance measuring device 42 ... Open test judgment reference creating means 44 ... Primary Judgment criterion determining means 46 ... Secondary judgment criterion determining means 48 ... Open test means 50 ... Primary judging means 52 ... Secondary judging means

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 操作部を有し、実装基板にプローブを接
触して、予め設定した指定箇所の抵抗値を測定する抵抗
測定器を備えたインサーキットテスタ用オープンテスト
装置において、上記オープンテスト用の判定基準を良品
基板を用いて作成する判定基準作成手段として、仮の判
定基準値を入力しながら、良品基板における指定箇所の
抵抗値を入力値に対応するレンジで測定し、その測定値
が入力値を超える場合に、その入力値を1次判定基準値
と決定する1次判定基準決定手段と、同一指定箇所の抵
抗値を最高レンジで測定し、その測定値が最高レンジ値
に相当する2次判定基準値を超える場合に、2次判定基
準をオーバレンジと設定し、2次判定基準値以下の場合
に、2次判定基準を1次判定基準値を超えたレンジ範囲
と設定する2次判定基準設定手段とを備え、被検査基板
に対するオープンテスト手段として、被検査基板におけ
る同一指定箇所の抵抗値を1次判定基準値に対応するレ
ンジで測定し、その測定値が1次判定基準値を超えるか
判定する1次判定手段と、その測定値が1次判定基準値
を超える場合に、最高レンジで同一指定箇所の抵抗値を
再度測定し、その測定値が2次判定基準値を超える場合
には2次判定基準がオーバレンジか判定し、測定値が2
次判定基準値以下の場合には2次判定基準が1次判定基
準値を超えたレンジ範囲か判定する2次判定手段とを備
えることを特徴とするインサーキットテスタ用オープン
テスト装置。
1. An open test device for an in-circuit tester, comprising an operation unit, and a resistance measuring device for measuring a resistance value at a preset designated position by contacting a probe with a mounting board. As a judgment criterion creating means for creating the judgment criterion of (3) using a non-defective board, while inputting a temporary judgment reference value, the resistance value at the specified location on the non-defective board is measured in the range corresponding to the input value, and the measured value is When the input value is exceeded, the primary determination standard determining means for determining the input value as the primary determination standard value and the resistance value at the same designated location are measured in the maximum range, and the measured value corresponds to the maximum range value. When the secondary judgment reference value is exceeded, the secondary judgment reference is set to overrange, and when it is less than the secondary judgment reference value, the secondary judgment reference is set to the range range exceeding the primary judgment reference value 2 Next judgment A reference setting means is provided, and as an open test means for the board to be inspected, the resistance value at the same designated place on the board to be inspected is measured in the range corresponding to the primary judgment reference value, and the measured value is the primary judgment reference value. When the primary judgment means for judging whether or not it exceeds and the measured value exceeds the primary judgment reference value, the resistance value at the same designated location is measured again in the highest range, and the measured value exceeds the secondary judgment reference value. Determines whether the secondary criterion is overrange and the measured value is 2
An open test device for an in-circuit tester, comprising: a secondary determination means for determining whether the secondary determination reference is in a range exceeding the primary determination reference value when the secondary determination reference value is less than or equal to the secondary determination reference value.
JP35005691A 1991-12-10 1991-12-10 Open test equipment for in-circuit tester Expired - Fee Related JP3241777B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35005691A JP3241777B2 (en) 1991-12-10 1991-12-10 Open test equipment for in-circuit tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35005691A JP3241777B2 (en) 1991-12-10 1991-12-10 Open test equipment for in-circuit tester

Publications (2)

Publication Number Publication Date
JPH05164803A true JPH05164803A (en) 1993-06-29
JP3241777B2 JP3241777B2 (en) 2001-12-25

Family

ID=18407931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35005691A Expired - Fee Related JP3241777B2 (en) 1991-12-10 1991-12-10 Open test equipment for in-circuit tester

Country Status (1)

Country Link
JP (1) JP3241777B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005257568A (en) * 2004-03-12 2005-09-22 Mitsui Mining & Smelting Co Ltd Electrical test method of printed wiring board for mounting electronic component, electrical inspection device, and computer-readable recording medium
WO2006077823A1 (en) * 2005-01-18 2006-07-27 Nidec-Read Corporation Substrate inspecting apparatus and substrate inspecting method
JP2007298288A (en) * 2006-04-27 2007-11-15 Ricoh Co Ltd Electronic device, and contact state detection device of its connection part
JP2009294101A (en) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp Apparatus and method of inspecting printed board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005257568A (en) * 2004-03-12 2005-09-22 Mitsui Mining & Smelting Co Ltd Electrical test method of printed wiring board for mounting electronic component, electrical inspection device, and computer-readable recording medium
WO2006077823A1 (en) * 2005-01-18 2006-07-27 Nidec-Read Corporation Substrate inspecting apparatus and substrate inspecting method
JP2006200946A (en) * 2005-01-18 2006-08-03 Nidec-Read Corp Apparatus, program, and method for substrate inspection
KR101135440B1 (en) * 2005-01-18 2012-05-25 니혼덴산리드가부시키가이샤 Substrate inspecting apparatus and substrate inspecting method
JP2007298288A (en) * 2006-04-27 2007-11-15 Ricoh Co Ltd Electronic device, and contact state detection device of its connection part
JP2009294101A (en) * 2008-06-05 2009-12-17 Mitsubishi Electric Corp Apparatus and method of inspecting printed board

Also Published As

Publication number Publication date
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