JP2015206673A - Inspection jig, substrate inspection device, and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection jig capable of reducing work for calibrating a capacitance measurement section, and a substrate inspection device including the inspection jig.SOLUTION: An inspection jig 3 which is configured detachably from an inspection device body 2 for inspecting a substrate 100 includes: a probe Pr for contacting with an inspection point provided on the substrate 100; connection terminals 36 for electrically connecting the probe Pr to the inspection device body 2; a reference capacitor C1 having predetermined reference capacitance; and connection terminals 37 for electrically connecting the reference capacitor C1 to a capacitance measurement circuit 45.

Description

  The present invention relates to an inspection jig for bringing a probe into contact with a substrate, a substrate inspection apparatus including the inspection jig, and a substrate inspection method.

  In recent years, a component-embedded substrate (embedded substrate) in which a capacitor (MLCC: Multi-Layer Ceramic Capacitor) is embedded in a substrate inner layer has been used. There is known a board inspection apparatus that measures the capacitance of a capacitor built in such a component built-in board and inspects the built-in capacitor (see, for example, Patent Document 1). There is also known a board inspection apparatus that detects a short-circuit fault in a circuit pattern by measuring the capacitance of the circuit pattern (see, for example, Patent Document 2).

  In order to maintain the inspection accuracy in such a substrate inspection apparatus, it is necessary to calibrate a capacitance measuring circuit that periodically measures the capacitance. In order to calibrate the capacitance measuring circuit of the substrate inspection apparatus, first, a calibration substrate on which a capacitor with a known capacitance is attached is prepared. Next, the capacitance between the calibration substrate is measured by a capacitance measuring circuit, and the difference between the measured value and the actual capacitance value is obtained. Then, the capacitance measuring circuit is calibrated by adjusting the capacitance measuring circuit so as to cancel this difference.

JP 2011-142202 A JP 09-230005 A

  However, in order to calibrate the capacitance measurement circuit by the calibration method as described above, it is necessary to store and manage the calibration substrate, and each time the calibration is performed, the calibration substrate is stored in the substrate inspection apparatus. It was necessary to calibrate it after attaching it, and after calibration, it was necessary to remove the substrate for calibration and store and manage it again. For this reason, there is a disadvantage that it takes time to calibrate the capacitance measuring circuit. In addition, when performing inspection using various electrical physical quantities such as resistance values, inductances, impedances, etc. other than capacitance for the purpose of inspecting the substrate, the configuration of a physical quantity measuring unit that measures such physical quantities Inconvenience that it takes time and effort.

  The objective of this invention is providing the inspection jig | tool which can reduce the effort of the calibration of a physical quantity measurement part, the board | substrate inspection apparatus provided with the inspection jig | tool, and a board | substrate inspection method.

  An inspection jig according to the present invention is an inspection jig configured to be detachable from an inspection apparatus main body for inspecting a substrate, and a probe for contacting an inspection point provided on the substrate; A first terminal for electrically connecting the probe to the inspection apparatus body, a reference unit having a preset electrical physical quantity, and electrically connecting the reference unit to the inspection apparatus body. And a second terminal for connection to the terminal.

  According to this configuration, since the inspection jig includes the reference device, the inspection device main body is attached to the inspection device main body in order to inspect the substrate, so that the inspection device main body is a physical quantity of the reference device. Can be measured. As a result, in order to calibrate the physical quantity measuring unit of the inspection apparatus body, the user does not need to attach a calibration board or replace the calibration board with the board to be inspected after calibration. It is possible to reduce the labor of calibration of the part.

  The physical quantity is preferably a capacitance, and the reference device is preferably a reference capacitor.

  This configuration is suitable as a jig for a substrate inspection apparatus that inspects a substrate based on the capacitance of the substrate.

  Moreover, it is preferable that the said inspection jig | tool contains the memory | storage part which memorize | stores beforehand the characteristic information which shows the relationship between the electrical physical quantity obtained from the said test | inspection point, and elapsed time.

  The substrate includes a capacitor, the inspection point is connected to the capacitor, and the inspection jig includes a storage unit that preliminarily stores characteristic information indicating a relationship between capacitance and elapsed time of the capacitor. It is preferable to contain.

  According to these configurations, since the inspection jig includes the storage unit, in order to inspect the substrate, the user simply attaches the inspection jig corresponding to the substrate to the inspection apparatus main body, and the inspection apparatus main body can be inspected. It becomes possible to acquire the characteristic information of the substrate.

  In addition, a substrate inspection apparatus according to the present invention includes the above-described inspection jig and the inspection apparatus body, and the inspection apparatus body includes a body-side first terminal connected to the first terminal, and the second. A main body side second terminal connected to the terminal, a physical quantity measuring unit for measuring a predetermined physical quantity, the physical quantity measuring unit, and a switching unit for switching a connection relationship between the main body side first terminal and the main body side second terminal. A reference quantity measurement processing unit that connects the physical quantity measurement unit and the main body side second terminal by the switching unit, and measures the physical quantity of the reference unit by the physical quantity measurement unit, and the measured reference unit A calibration processing unit that calibrates the physical quantity measuring unit based on a physical quantity of the sensor, and the switching unit that connects the physical quantity measuring unit and the first terminal on the main body side so that the physical quantity measuring unit measures the physical quantity of the inspection point. Measurement And a processing section.

  According to this configuration, since the inspection jig includes the reference device, when the user attaches the inspection jig corresponding to the substrate to the inspection apparatus main body in order to inspect the substrate, the reference device is connected to the second terminal. The main body side second terminal is connected to the inspection apparatus main body. Then, the reference quantity measurement processing unit connects the physical quantity measurement unit and the main body side second terminal by the switching unit, measures the capacitance of the reference unit by the physical quantity measurement unit, and the calibration processing unit sets the capacitance of the reference unit. Calibrate the physical quantity measurement unit based on the capacity. Therefore, the user does not need to attach a calibration board to calibrate the physical quantity measurement unit or replace the calibration board with the board to be inspected after calibration. Can be reduced.

  In addition, the substrate inspection apparatus includes a storage unit that preliminarily stores characteristic information indicating a relationship between an electrical physical quantity obtained from the inspection point and an elapsed time, and an elapsed time reception unit that receives an input of the elapsed time related to the substrate. A determination reference value setting unit for setting a determination reference value for determining the quality of the substrate based on the elapsed time received by the elapsed time reception unit and the characteristic information, and the measurement processing unit. It is preferable to include a determination unit that determines the quality of the substrate based on the physical quantity and the determination reference value.

  According to this configuration, even when the electrical physical quantity obtained from the inspection point of the substrate changes according to the elapsed time after manufacture, the determination reference value is set according to the elapsed time, and the determination is made. Since the quality of the substrate is determined according to the reference value, the accuracy of determining the quality of the substrate is improved.

  In addition, the substrate inspection apparatus includes a storage unit that stores in advance characteristic information indicating a relationship between an electrical physical quantity obtained from the inspection point and an elapsed time, the physical quantity measured by the measurement processing unit, and the characteristic information. Preferably, an elapsed time estimation unit that estimates an elapsed time after the manufacture of the substrate is provided.

  According to this configuration, the user can know the elapsed time after the manufacture of the substrate.

  Moreover, it is preferable that the said memory | storage part is provided in the said inspection jig.

  According to this configuration, since the inspection jig includes the storage unit, in order to inspect the substrate, the user simply attaches the inspection jig corresponding to the substrate to the inspection apparatus body, and the determination reference value setting unit or the elapsed time The estimation unit can acquire characteristic information of the substrate to be inspected.

  The substrate inspection method according to the present invention is a substrate inspection method for inspecting a substrate using the above-described inspection jig, and is a reference for measuring a physical quantity of the reference device by a physical quantity measuring unit that measures a predetermined physical quantity. A quantity measurement step, a calibration processing step for calibrating the physical quantity measurement unit based on the measured physical quantity of the reference device, and a measurement processing step for measuring the physical quantity of the inspection point by the physical quantity measurement unit.

  According to this configuration, since the inspection jig includes the reference device, the inspection device main body is attached to the inspection device main body in order to inspect the substrate, so that the inspection device main body is a physical quantity of the reference device. Measure. As a result, in order to calibrate the physical quantity measuring unit of the inspection apparatus body, the user does not need to attach a calibration board or replace the calibration board with the board to be inspected after calibration. It is possible to reduce the labor of calibration of the part.

  The inspection jig, the substrate inspection apparatus, and the substrate inspection method having such a configuration can reduce the labor of calibration of the physical quantity measuring unit.

It is a front view showing roughly the composition of the substrate inspection device concerning one embodiment of the present invention. It is a perspective view which shows an example of a structure of the inspection jig shown in FIG. It is a block diagram which shows notionally an example of an electrical structure of the board | substrate inspection apparatus shown in FIG. It is a graph which shows an example of the change of the electrostatic capacitance with respect to the elapsed time after manufacture of a capacitor. It is a flowchart which shows an example of operation | movement of the board | substrate inspection apparatus shown in FIG.

  Embodiments according to the present invention will be described below with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted. FIG. 1 is a front view schematically showing a configuration of a substrate inspection apparatus 1 that executes a substrate inspection method according to an embodiment of the present invention. A substrate inspection apparatus 1 shown in FIG. 1 is an apparatus for inspecting a circuit pattern formed on a substrate 100 to be inspected.

  The substrate 100 is a component built-in substrate in which a capacitor such as MLCC is built in an inner layer of the substrate. The substrate 100 is not necessarily limited to a component-embedded substrate in which a capacitor is embedded in an inner layer of the substrate. The substrate 100 may be, for example, various substrates such as a printed wiring board, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, a package substrate for a semiconductor package, or a film carrier, in which components are not incorporated. Good.

  A board inspection apparatus 1 shown in FIG. 1 includes an inspection apparatus main body 2 and inspection jigs 3U and 3D. The inspection apparatus main body 2 mainly includes inspection units 4U and 4D, inspection unit moving mechanisms 5U and 5D, a substrate fixing device 6, and a housing 7 that accommodates these units. The substrate fixing device 6 is configured to fix the substrate 100 to be inspected at a predetermined position. The inspection unit moving mechanisms 5U and 5D appropriately move the inspection units 4U and 4D within the housing 7.

  The inspection unit 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection unit 4D is located below the substrate 100 fixed to the substrate fixing device 6. The inspection units 4U and 4D are configured to be detachable from inspection jigs 3U and 3D for inspecting a circuit pattern formed on the substrate 100. The inspection units 4U and 4D include connectors 41 connected to the inspection jigs 3U and 3D, respectively. Hereinafter, the inspection units 4U and 4D are collectively referred to as an inspection unit 4.

  FIG. 2 is a perspective view showing an example of the configuration of the inspection jigs 3U and 3D shown in FIG. Each of the inspection jigs 3U and 3D includes a plurality of probes Pr, a support block 31, a pedestal 32, a base 33, a plurality of wirings 34, and reference capacitors C1 and C2 (reference devices).

  The probe Pr is formed of a tough metal such as tungsten (W), high-speed steel (SKH), beryllium copper (BeCu), or other conductor, and has a wire shape (flexible) that can be bent (flexible). It is formed in a rod shape. The diameter of the probe Pr is, for example, about 100 μm.

  A plurality of guide holes for supporting the probe Pr are formed in the support block 31. Each guide hole is arranged so as to correspond to the position of the inspection point set on the wiring pattern of the substrate 100 to be inspected. As a result, the tip of the probe Pr is brought into contact with the inspection point of the substrate 100.

  The support block 31 of the inspection jig 3U is provided with the probe Pr corresponding to the inspection point on the upper surface of the substrate 100, and the support block 31 of the inspection jig 3D is provided with the probe Pr corresponding to the inspection point on the lower surface of the substrate 100. Has been. The inspection jigs 3U and 3D are configured in the same manner except that the arrangement of the probes Pr is different and that the mounting directions to the inspection units 4U and 4D are upside down. Hereinafter, the inspection jigs 3U and 3D are collectively referred to as an inspection jig 3.

  Since each guide hole of the support block 31 is formed according to the wiring pattern of the substrate 100, it is necessary to use the inspection jig 3 corresponding to the substrate 100. Therefore, when the board inspection apparatus 1 inspects a board having a different wiring pattern, it is necessary to replace the inspection jig 3 with one corresponding to the board.

  The pedestal 32 includes a plate 321 to which the support block 31 is attached, and, for example, four connecting rods 322 that connect the plate 321 to the base 33. The connecting rod 322 supports the plate 321 with a space between it and the base 33. As a result, a wiring space for wiring the wiring 34 is secured between the base 33 and the plate 321.

  The base 33 is, for example, a flat rectangular parallelepiped member. Reference capacitors C1 and C2 are attached to the first surface 33a of the base 33 on the side where the pedestal 32 is attached. The reference capacitors C1 and C2 have a reference capacitance Cr that is set in advance and serves as a calibration reference.

  The base 33 is provided with a connector 35 detachably connected to the connector 41 of the inspection unit 4. The connector 35 includes a plurality of connection terminals 36 (first terminals) for electrically connecting the probe Pr to the inspection unit 4, and connection terminals 37 for electrically connecting the reference capacitors C 1 and C 2 to the inspection unit 4. (Second terminal).

  The connection terminals 36 and 37 are, for example, needle-like connection terminals that penetrate the base 33 in the thickness direction. The rear end portion of each connection terminal 36 is connected to each probe Pr on the first surface 33a side by the wiring 34, and the front end portion of each connection terminal 36 is the second surface 33b opposite to the first surface 33a. Protruding from. The connection terminal 37 includes connection terminals 37a, 37b, and 37c.

  The rear end of the connection terminal 37b is connected to one terminal of the reference capacitors C1 and C2, the rear end of the connection terminal 37a is connected to the other terminal of the reference capacitor C1, and the rear end of the connection terminal 37c is the other end of the reference capacitor C2. Connected to the terminal. And the front-end | tip part of connecting terminal 37a, 37b, 37c protrudes from the 2nd surface 33b. Thus, when the inspection jig 3 is attached to the inspection unit 4, the tip ends of the connection terminals 36, 37 a, 37 b, and 37 c are connected to the connector 41 of the inspection unit 4. The reference capacitor may be one, or may be three or more.

  FIG. 3 is a block diagram conceptually showing an example of the electrical configuration of the substrate inspection apparatus 1 shown in FIG. A substrate 100 shown in FIG. 3 is a so-called component built-in substrate, and a capacitor Cx is built in the substrate. The capacitor Cx is, for example, a multilayer ceramic capacitor (MLCC). Pad patterns 102 and 102 are formed on the surface of the substrate 100. Both end electrodes of the capacitor Cx are connected to pad patterns 102 and 102 via internal wirings 101 and 101, respectively. The pad patterns 102 and 102 are set as inspection points.

  The substrate 100 does not necessarily have to be a component built-in substrate in which a capacitor is built in the substrate. The later-described capacitance measuring circuit 45 may measure, for example, a capacitance generated between the wiring patterns.

  The inspection jig 3 includes a ROM (Read Only Memory) 38 (storage unit) in the base 33. The ROM 38 stores in advance characteristic information indicating the relationship between the capacitance (physical quantity) of the capacitor Cx and the elapsed time after manufacture. The ROM 38 may be, for example, a flash memory or an EEPROM (Electrically Erasable Programmable Read-Only Memory), and various storage elements can be used.

  FIG. 4 is a graph showing an example of the change in capacitance of the capacitor Cx with respect to the elapsed time after manufacture. For example, the capacitor Cx of the multilayer ceramic capacitor is formed by laminating a dielectric and an electrode and sintering the dielectric. Even if the capacitor Cx formed in this way is a non-defective product, the electrostatic capacity of the capacitor Cx increases with the lapse of time t after the manufacture, for example, as shown in FIG. The capacity is reduced. For example, the characteristic information shown in FIG. 4 is stored in the ROM 38 as an LUT (Lookup table).

  Instead of the capacitance, electrical physical quantities such as resistance value, inductance, impedance, etc. may be used, and the ROM 38 may store characteristic information regarding these physical quantities.

  3 includes a connector 41, a switching unit 44, a capacitance measuring circuit 45 (capacitance measuring unit, physical quantity measuring unit), a keyboard 46 (elapsed time receiving unit), and a control unit 47. With. The connector 41 includes a plurality of main body side connection terminals 42 (main body side first terminals) and a plurality of main body side connection terminals 43 (main body side second terminals).

  When the inspection jig 3 is attached to the inspection unit 4 and the connector 35 is connected to the connector 41, each main body side connection terminal 42 is connected to each connection terminal 36, and each main body side connection terminal 43 is connected to each connection terminal 37. Is connected. Further, by attaching the inspection jig 3 to the inspection unit 4, the ROM 38 is connected so as to be accessible from the control unit 47 by, for example, a connector. The ROM 38 may be accessible from the control unit 47 by wireless communication means, for example, and the storage unit may be configured using, for example, RFID (Radio Frequency IDentification).

  The switching unit 44 switches the connection relationship between the capacitance measuring circuit 45, each main body side connection terminal 42, and each main body side connection terminal 43. Specifically, the switching unit 44 includes switching elements SW1 to SW4. The main body side connection terminals 42 and 42 are connected to the capacitance measuring circuit 45 via the switching elements SW1 and SW2. The main body side connection terminals 43 and 43 are connected to the capacitance measuring circuit 45 through the switching elements SW3 and SW4. The switching elements SW <b> 1 to SW <b> 4 are turned on / off according to a control signal from the control unit 47.

  The capacitance measuring circuit 45 measures the capacitance of the capacitor Cx or the reference capacitor C1 connected by the switching unit 44 and transmits the measured value to the control unit 47. FIG. 3 shows an example in which the reference capacitor C2 is not provided. In place of the capacitance, an electrical physical quantity such as a resistance value, an inductance, or an impedance may be used. Further, instead of the reference capacitors C1 and C2, a resistor, an inductor, or a circuit in which circuit elements such as a resistor, a capacitor, and an inductor are combined may be used as the reference device. In place of the capacitance measuring circuit 45, a physical quantity measuring unit that measures these physical quantities may be used.

  The keyboard 46 transmits information input by a user operation to the control unit 47. The user can input an elapsed time after the substrate 100 to be inspected is manufactured by operating the keyboard 46. Note that the elapsed time reception unit is not limited to the keyboard 46. For example, the elapsed time reception unit may be a touch panel or a communication unit that receives the elapsed time by communication.

  The control unit 47 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, a ROM and HDD (Hard Disk Drive) that store predetermined control programs, and the like. And the like and a peripheral circuit thereof. The control unit 47 executes a control program stored in the storage unit, for example, thereby executing a reference capacity measurement processing unit 471 (reference amount measurement processing unit), a calibration processing unit 472, a measurement processing unit 473, and a determination reference value setting unit 474. , And the determination unit 475.

  The reference capacitance measurement processing unit 471 connects the capacitance measurement circuit 45 and the main body side connection terminal 43 by the switching unit 44 and causes the capacitance measurement circuit 45 to measure the capacitance of the reference capacitor C1.

  The calibration processing unit 472 calibrates the capacitance measuring circuit 45 based on the measured capacitance of the reference capacitor C1.

  The measurement processing unit 473 causes the switching unit 44 to connect the capacitance measuring circuit 45 and the main body side connection terminal 42 and causes the capacitance measuring circuit 45 to measure the capacitance of the capacitor Cx.

  The determination reference value setting unit 474 reads characteristic information from the ROM 38, and sets a determination reference value for determining the quality of the capacitor Cx based on the elapsed time received by the keyboard 46 and the characteristic information.

  The determination unit 475 determines pass / fail of the capacitor Cx based on the capacitance of the capacitor Cx measured by the measurement processing unit 473 and the determination reference value set by the determination reference value setting unit 474. The determination unit 475 displays the determination result on a display device (not shown), for example.

  Next, the operation of the substrate inspection apparatus 1 that executes the substrate inspection method according to the embodiment of the present invention will be described. FIG. 5 is a flowchart showing an example of the operation of the substrate inspection apparatus 1. First, when inspecting the substrate 100, the user attaches the inspection jig 3 corresponding to the substrate 100 to the inspection unit 4 and brings the probe Pr of the inspection jig 3 into contact with the inspection point of the substrate 100. As a result, the capacitance of the reference capacitor C1 attached to the inspection jig can be measured by the capacitance measuring circuit 45.

  Next, the reference capacitance measurement processing unit 471 turns off the switching elements SW1 and SW2 and turns on the switching elements SW3 and SW4 of the switching unit 44 to connect the reference capacitor C1 to the capacitance measuring circuit 45 to measure the capacitance. The circuit 45 causes the capacitance of the reference capacitor C1 to be measured as a reference measurement value Crm (step S1: reference amount measurement step).

  Next, the calibration processing unit 472 compares the reference measurement value Crm measured in step S1 with the reference capacitance Cr, and electrostatically cancels the difference between the reference measurement value Crm and the reference capacitance Cr. The capacity measuring circuit 45 is calibrated (step S2: calibration processing step). The calibration may be performed, for example, by adjusting a circuit constant path of the capacitance measuring circuit 45, or may be performed by adding / subtracting a correction value to / from a measured value of the capacitance measuring circuit 45.

  In this case, since the inspection jig 3 includes the reference capacitor C1, in order to inspect the substrate 100, the user attaches the inspection jig 3 corresponding to the substrate 100 to the inspection unit 4, so that the capacitance measuring circuit 45 Thus, the capacitance of the reference capacitor C1 is measured as the reference measurement value Crm (step S1), and the capacitance measurement circuit 45 can be calibrated based on the reference measurement value Crm (step S2). Therefore, it is not necessary to calibrate the capacitance measuring circuit 45, and it is not necessary to attach a calibration substrate or replace the calibration substrate with the substrate 100 to be inspected after calibration. Can reduce the labor of calibration.

  Next, the measurement processing unit 473 turns on the switching elements SW1 and SW2, turns off the switching elements SW3 and SW4, and measures the capacitance of the capacitor Cx as the measured value Cm by the capacitance measuring circuit 45 (step S3). : Measurement processing step). As the capacitance measuring circuit 45, a known capacitance measuring circuit can be used. For example, the capacitance can be obtained from the flowing current by applying an AC voltage, or an impedance measuring device can be used. it can.

  In this case, since the capacitance of the capacitor Cx can be measured after the capacitance measuring circuit 45 is calibrated, the capacitance of the capacitor Cx can be measured with high accuracy.

  Next, the determination reference value setting unit 474 reads the characteristic information from the ROM 38 (step S4), and acquires the elapsed time after the manufacture of the substrate 100, which is input to the keyboard 46 by the user (step S5).

  In this case, since the inspection jig 3 includes the ROM 38, in order to inspect the substrate 100, the user simply attaches the inspection jig 3 corresponding to the substrate 100 to the inspection unit 4, and the determination reference value setting unit 474 It becomes possible to acquire the characteristic information of the substrate 100 to be inspected. As described above, the inspection jig 3 corresponding to the substrate 100 to be inspected and the ROM 38 in which the characteristic information of the substrate 100 is integrated are integrated into the substrate 100 to be inspected automatically. Switch to the corresponding characteristic information. As a result, it is possible to prevent a user's erroneous operation using characteristic information different from the characteristic information of the substrate 100 when inspecting the substrate 100 and to set the characteristic information corresponding to the substrate 100 in the substrate inspection apparatus 1. Can be omitted.

  Note that the ROM 38 is not necessarily provided in the inspection jig 3 and may be provided in the inspection apparatus body 2.

  Then, the determination reference value setting unit 474 sets a determination reference value based on the elapsed time and the characteristic information (Step S6). Specifically, the determination reference value setting unit 474 refers to the LUT indicating the characteristic information illustrated in FIG. 4 and acquires the capacitance value corresponding to the elapsed time t. The determination reference value setting unit 474, for example, uses a capacitor as a determination reference value for determining the quality of the capacitor Cx by adding or subtracting an allowable error to the capacitance value thus obtained. An upper limit value and a lower limit value of the capacitance value of Cx are calculated and set.

  The determination unit 475 determines whether or not the measurement value Cm measured in step S3 is within the range of the determination reference value, that is, whether or not the measurement value Cm is within the range of the determination reference value not less than the lower limit value and not more than the upper limit value (step S7). ). If the measured value Cm is within the range of the determination reference value (YES in step S7), the determination unit 475 determines that the capacitor Cx is a non-defective product (step S8), and displays the determination result on a display unit (not shown). And display the process. On the other hand, if the measured value Cm is outside the range of the determination reference value (NO in step S7), the determination unit 475 determines that the capacitor Cx is defective (step S9), and displays the determination result on a display unit (not shown). And display the process.

  According to the processing of steps S4 to S9, even when the capacitance of the capacitor Cx changes according to the elapsed time after manufacture, a determination reference value corresponding to the elapsed time is set, and the determination reference Since the quality of the capacitor Cx is determined according to the value, the quality determination accuracy of the capacitor Cx is improved.

  In addition, the inspection of the substrate 100 may be performed a plurality of times during the period from when the substrate 100 is manufactured until it is shipped. In such a case, different board inspection apparatuses may be used for each inspection, for example, the first inspection and the second inspection, for the convenience of facility management in the manufacturing factory of the substrate 100. In such a case, in the conventional board inspection apparatus, there is a possibility that the measurement error of the capacitance measurement circuit varies between the board inspection apparatuses. Conventionally, when the capacitance of the capacitor Cx is measured by the board inspection apparatus having different measurement errors as described above, and the pass / fail judgment is made, even if the same board 100 is inspected, the board inspection apparatuses are connected to each other. Inconvenience that different determination results may be obtained due to the measurement error (instrument difference).

  On the other hand, according to the substrate inspection apparatus 1, even when the inspection of the substrate 100 is executed a plurality of times using the plurality of substrate inspection apparatuses 1, the inspection treatment corresponding to the substrate 100 is always performed when inspecting the substrate 100. The tool 3 is attached to the inspection unit 4, and the capacitance measuring circuit 45 of each board inspection apparatus 1 is calibrated based on the reference capacitor C1 provided in the inspection jig 3. As a result, the capacitance measuring circuit 45 of each board inspection apparatus 1 is calibrated using the same reference capacitor C1. As a result, since the measurement error (instrument difference) between the substrate inspection apparatuses is reduced, the possibility of different determination results due to the measurement error (instrument difference) between the substrate inspection apparatuses is reduced.

  The substrate inspection apparatus 1 may further include an elapsed time estimation unit that estimates an elapsed time after manufacturing the substrate 100 based on the measured value Cm measured by the measurement processing unit 473 and the characteristic information. Specifically, the elapsed time estimation unit refers to the LUT indicating the characteristic information shown in FIG. 4, acquires the time t corresponding to the measurement value Cm as the elapsed time, and displays the elapsed time on a display device (not shown). You may alert | report by doing. Thus, the user can know the elapsed time after the manufacture of the substrate 100. For example, the substrate 100 that has passed a predetermined time after the manufacture, for example, 48 hours or more, is baked to recover the capacitance of the capacitor Cx. Can be performed.

  Further, the ROM 38, the keyboard 46, and the determination reference value setting unit 474 may not be provided, and the determination reference value may be set in advance without executing steps S4 to S6. Further, the ROM 38, the keyboard 46, the determination reference value setting unit 474, and the determination unit 475 are not provided, and steps S4 to S9 are not performed, and the board inspection apparatus 1 is configured as a measurement apparatus that measures the capacitance of the board 100. May be.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 2 Inspection apparatus main body 3, 3U, 3D Inspection jig | tool 4, 4D, 4U Inspection part 5U, 5D Inspection part moving mechanism 6 Board | substrate fixing device 7 Case 31 Support block 32 Base 33 Base 33a 1st surface 33b Second surface 34 Wiring 35, 41 Connector 36 Connection terminal (first terminal)
37, 37a, 37b, 37c Connection terminal (second terminal)
42, 42 Body side connection terminal (Main body side first terminal)
43, 43 Main unit side connection terminal (Main unit side second terminal)
44 switching unit 45 capacitance measuring circuit (physical quantity measuring unit)
46 Keyboard 47 Control unit 100 Substrate 101, 101 Internal wiring 102, 102 Pad pattern (inspection point)
321 Plate 322 Connecting rod 471 Reference capacity measurement processing unit (reference amount measurement processing unit)
472 Calibration processing unit 473 Measurement processing unit 474 Determination reference value setting unit 475 Determination unit C1, C2 Reference capacitor (reference device)
Cm measurement value Cr reference capacitance Crm reference measurement value Cx capacitor Pr probe SW1 to SW4 switching element

Claims (9)

An inspection jig configured to be detachable from an inspection apparatus body for inspecting a substrate,
A probe for contacting an inspection point provided on the substrate;
A first terminal for electrically connecting the probe to the inspection apparatus body;
A reference device having a preset electrical physical quantity;
An inspection jig comprising a second terminal for electrically connecting the reference device to the inspection apparatus main body. The physical quantity is a capacitance,
The inspection jig according to claim 1, wherein the reference device is a reference capacitor.   The inspection jig according to claim 1, wherein the inspection jig includes a storage unit that stores in advance characteristic information indicating a relationship between an electrical physical quantity obtained from the inspection point and an elapsed time. The substrate includes a capacitor;
The inspection point is connected to the capacitor;
The inspection jig is
The inspection jig according to claim 2, further comprising: a storage unit that preliminarily stores characteristic information indicating a relationship between capacitance and elapsed time of the capacitor. The inspection jig according to claim 1 or 2, and the inspection apparatus main body,
The inspection apparatus main body is:
A main body-side first terminal connected to the first terminal;
A body-side second terminal connected to the second terminal;
A physical quantity measuring unit for measuring a predetermined physical quantity;
A switching unit that switches a connection relationship between the physical quantity measurement unit, the main body side first terminal, and the main body side second terminal;
A reference quantity measurement processing unit that connects the physical quantity measurement unit and the main body side second terminal by the switching unit, and measures the physical quantity of the reference device by the physical quantity measurement unit;
A calibration processing unit for calibrating the physical quantity measuring unit based on the measured physical quantity of the reference device;
A substrate inspection apparatus comprising: a measurement processing unit configured to connect the physical quantity measurement unit and the main body side first terminal by the switching unit and measure the physical quantity of the inspection point by the physical quantity measurement unit. A storage unit that prestores characteristic information indicating a relationship between an electrical physical quantity obtained from the inspection point and an elapsed time;
An elapsed time receiving unit for receiving an input of the elapsed time related to the substrate;
A determination reference value setting unit that sets a determination reference value for determining the quality of the substrate based on the elapsed time received by the elapsed time reception unit and the characteristic information;
The substrate inspection apparatus according to claim 5, further comprising a determination unit that determines the quality of the substrate based on the physical quantity measured by the measurement processing unit and the determination reference value. A storage unit that prestores characteristic information indicating a relationship between an electrical physical quantity obtained from the inspection point and an elapsed time;
The substrate inspection apparatus according to claim 5, further comprising: an elapsed time estimation unit that estimates an elapsed time after manufacture of the substrate based on the physical quantity measured by the measurement processing unit and the characteristic information.   The substrate inspection apparatus according to claim 6, wherein the storage unit is provided in the inspection jig. A substrate inspection method for inspecting a substrate using the inspection jig according to any one of claims 1 to 4,
A reference quantity measuring step of measuring a physical quantity of the reference device by a physical quantity measuring unit for measuring a predetermined physical quantity;
A calibration process for calibrating the physical quantity measuring unit based on the measured physical quantity of the reference device;
And a measurement processing step of measuring a physical quantity of the inspection point by the physical quantity measuring unit.

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