TW201541102A - Inspection jig, substrate inspection device and substrate inspection method - Google Patents

Abstract

The present invention discloses an inspection jig capable of reducing correction problems of an electrostatic capacity measurement unit and a substrate inspection device having the inspection jig. An inspection jig (3), which is detachably assembled to an inspection device main body (2) configured to inspect a substrate (100), includes a probe (Pr) for contacting inspection points arranged on the substrate (100); a connection terminal (36) for electrically connecting the probe (Pr) and the inspection device main body (2); a base capacitor (C1) having a predetermined base electrostatic capacity; and a connection terminal (37) for electrically connecting the standard capacitor (C1) and an electrostatic capacity measurement unit (45).

Description

Inspection jig, substrate inspection device, and substrate inspection method

The present invention relates to an inspection jig for contacting a probe with a substrate, a substrate inspection device including the inspection jig, and a substrate inspection method.

In recent years, a component-embedded substrate (embedded substrate, embedded substrate) in which a capacitor (multilayer ceramic capacitor: Multi-Layer Ceramic Capacitor, MLCC) is incorporated in a substrate inner layer has been used. In addition, a substrate inspection device that measures the capacitance of a capacitor built in the module-embedded substrate and inspects the built-in capacitor is known (for example, see Patent Document 1). In addition, a substrate inspection device that detects a short-circuit failure of a circuit pattern by measuring the electrostatic capacitance of the circuit pattern is known (for example, see Patent Document 2).

In such a substrate inspection apparatus, in order to maintain the inspection accuracy, it is necessary to periodically correct the capacitance measurement circuit that measures the capacitance. In order to calibrate the capacitance measuring circuit of the substrate inspection apparatus, first, a substrate for calibration in which a capacitor having a predetermined electrostatic capacitance is known is mounted. Next, the electrostatic capacitance of the substrate for calibration is measured by a capacitance measuring circuit to determine the difference between the measured value and the actual electrostatic capacitance value. Then, the capacitance measuring circuit is adjusted to eliminate the difference, thereby correcting the capacitance measuring circuit.

Conventional technical literature

Patent literature:

Patent Document 1: Japanese Laid-Open Patent Publication No. 2011-142202

Patent Document 2: Japanese Patent Publication No. 09-230005

technical problem

However, in order to correct the capacitance measuring circuit by the above-described correction method, it is necessary to store and manage the substrate for calibration, and each time the correction is performed, the substrate for calibration is mounted on the substrate inspection device for correction, and it is necessary to take it again after the correction. The substrate for calibration is stored and managed. Therefore, there is a problem that the correction of the capacitance measuring circuit is troublesome. In addition, when the inspection is performed using various electronic physical quantities such as resistance values, inductances, and impedances other than the electrostatic capacitance for inspection of the substrate, the physical quantity measuring unit that measures the electronic physical quantity is inconvenient.

An object of the present invention is to provide an inspection jig capable of reducing the trouble of correction of a physical quantity measuring unit, a substrate inspection device including the inspection jig, and a substrate inspection method.

Technical solutions

The inspection jig of the present invention is an inspection jig that is detachable with respect to the main body of the inspection apparatus for performing substrate inspection, and includes: a probe for contacting with a inspection point provided on the substrate; and a first terminal for The probe is electrically connected to the inspection apparatus main body; the reference has a predetermined electronic physical quantity; and the second terminal is for electrically connecting the reference to the inspection apparatus main body.

According to the composition of the inspection jig of the present invention, since the inspection jig includes the reference device, the user can measure the electronic physical quantity of the reference device by attaching the inspection jig corresponding to the substrate to the inspection device main body in order to inspect the substrate. As a result, the user does not need to install the substrate for calibration in order to correct the physical quantity measuring unit of the inspection apparatus main body, or replace the substrate for calibration with the substrate to be inspected after the correction, and thus it is possible to reduce the trouble of correction of the physical quantity measuring unit.

Further, it is preferable that the electronic physical quantity is an electrostatic capacity, and the reference is a reference capacitor.

According to the above configuration, it is suitable as a jig for a substrate inspection device that inspects a substrate based on the electrostatic capacitance of the substrate.

Further, it is preferable that the inspection jig includes a storage portion, and a characteristic message indicating a relationship between an electronic physical quantity obtained from the inspection point and an elapsed time is stored in advance.

Further, it is preferable that the substrate includes a capacitor, and the inspection point is connected to the capacitor, and the inspection jig includes a storage unit that stores in advance a characteristic information indicating a relationship between a capacitance of the capacitor and an elapsed time.

According to the above-described configuration, since the inspection jig includes the storage portion, the user only attaches the inspection jig corresponding to the substrate to the inspection device main body, and the inspection device main body can acquire the characteristic information of the inspection target substrate.

Further, the substrate inspection device of the present invention includes the above-described inspection jig and the above-described inspection device main body.

The inspection apparatus main body includes: a main body side first terminal connected to the first terminal; a main body side second terminal connected to the second terminal; a physical quantity measuring unit that measures a predetermined physical quantity; and a switching unit that switches the physical quantity measuring unit and the a connection relationship between the main body side first terminal and the main body side second terminal; the reference amount measuring processing unit connects the physical quantity measuring unit to the main body side second terminal by the switching unit, and the physical quantity measuring unit measures the reference device An electronic physical quantity; a correction processing unit that corrects the physical quantity measuring unit based on the measured electronic physical quantity of the reference; and a measurement processing unit that connects the physical quantity measuring unit to the main body side first terminal by the switching unit, and uses the physical quantity The measuring unit measures the electronic physical quantity of the inspection point.

According to the composition of the substrate inspection apparatus of the present invention, since the inspection jig includes the reference, in order to inspect the substrate, the user attaches the inspection jig corresponding to the substrate to the inspection apparatus main body, whereby the reference is second via the second terminal and the main body side. The terminal is connected to the main body of the inspection device. In addition, the reference amount measurement processing unit connects the physical quantity measuring unit to the main body side second terminal, and the physical quantity measuring unit measures the electrostatic capacitance of the reference unit, and the correction processing unit corrects the physical quantity measuring unit based on the electrostatic capacitance of the reference unit. Therefore, in order to correct the physical quantity measuring unit, the user does not need to install the substrate for calibration, or replace the substrate for calibration with the substrate to be inspected after the correction, and thus it is possible to reduce the trouble of correction of the physical quantity measuring unit.

Further, preferably, the substrate inspection device includes: a storage unit that stores in advance a characteristic information indicating a relationship between an electronic physical quantity obtained from the inspection point and an elapsed time; and an elapsed time receiving unit receives an input of the elapsed time regarding the substrate The determination reference value setting unit sets a determination reference value for determining the quality of the substrate based on the elapsed time received by the elapsed time receiving unit and the characteristic information, and a determination unit that based on the electronic component measured by the measurement processing unit The physical quantity and the above-described determination reference value determine the merits of the above substrate.

According to the composition of the substrate inspection apparatus of the present invention, even when the electronic physical quantity obtained from the inspection point of the substrate changes with the elapsed time after the manufacture, the determination reference value corresponding to the elapsed time is set, and the determination is made. Since the reference value determines the merits of the substrate correspondingly, the accuracy of the board is improved.

Further, preferably, the substrate inspection device stores, in advance, a storage unit, a characteristic information indicating a relationship between an electronic physical quantity obtained from the inspection point and an elapsed time, and an elapsed time estimating unit based on the measurement by the measurement processing unit. The electronic physical quantity and the characteristic information described above estimate the elapsed time after the substrate is manufactured.

According to the above composition, the user can know the elapsed time after the substrate is manufactured.

Further, preferably, the storage portion is provided in the inspection jig.

According to the composition of the substrate inspection device of the present invention, since the inspection jig includes the storage portion, the user can attach only the inspection jig corresponding to the substrate to the inspection device main body, and the determination reference value setting unit or the elapsed time estimation unit can acquire the inspection instrument. Check the characteristic information of the substrate of the object.

Further, the substrate inspection method of the present invention is a substrate inspection method for performing substrate inspection using the above-described inspection jig, and includes the following steps: a reference amount measurement program for measuring an electronic physical quantity of the reference by a physical quantity measuring unit that measures a predetermined physical quantity; The program corrects the physical quantity measuring unit based on the measured physical quantity of the reference unit and the measurement processing program, and the physical quantity measuring unit measures the electronic physical quantity of the check point.

According to the above configuration, since the inspection jig includes the reference device, in order to inspect the substrate, the user attaches the inspection jig corresponding to the substrate to the inspection device main body, thereby inspecting the electrophysical amount of the measurement device main body. As a result, in order to correct the physical quantity measuring unit of the inspection apparatus main body, the user does not need to install the substrate for calibration, or replace the substrate for calibration with the substrate to be inspected after the correction, and thus the correction time of the physical quantity measuring unit can be reduced.

The beneficial effects of the invention:

According to the inspection jig, the substrate inspection apparatus, and the substrate inspection method of the composition of the present invention, it is possible to reduce the trouble of correction of the physical quantity measurement unit.

Hereinafter, embodiments of the present invention will be described based on the drawings. In the respective drawings, the components having the same reference numerals denote the same components, and the description thereof will be omitted. Fig. 1 is a front view showing the configuration of a substrate inspection apparatus 1 that performs a substrate inspection method according to an embodiment of the present invention. The substrate inspection device 1 shown in Fig. 1 is a device for inspecting a circuit pattern of the substrate 100 to be inspected.

The substrate 100 is a component-embedded substrate in which a capacitor such as an MLCC is built in an inner layer of the substrate. In addition, the substrate 100 is not limited to the component-embedded substrate in which the capacitor is built in the inner layer of the substrate. The substrate 100 may be, for example, a printed wiring board, a flexible substrate, a ceramic multilayer wiring substrate, an electrode plate for a liquid crystal display or a plasma display, and a package substrate or a film carrier for a semiconductor package.

The substrate inspection apparatus 1 shown in Fig. 1 includes an inspection apparatus main body 2 and inspection tools 3U and 3D. The inspection apparatus main body 2 mainly includes inspection units 4U and 4D, inspection unit movement mechanisms 5U and 5D, a substrate fixing device 6, and a housing 7 that accommodates the respective portions. The substrate fixing device 6 is configured to fix the substrate 100 to be inspected to a predetermined position. The inspection unit moving mechanisms 5U and 5D appropriately move the inspection units 4U and 4D in the casing 7.

The inspection portion 4U is located above the substrate 100 fixed to the substrate fixing device 6. The inspection portion 4D is located below the substrate 100 fixed to the substrate fixing device 6. The inspection units 4U and 4D are configured to be attachable and detachable for use in inspection jigs 3U and 3D for inspecting circuit patterns formed on the substrate 100. Each of the inspection units 4U and 4D includes a connector 41 that is connected to the inspection jigs 3U and 3D. Hereinafter, the inspection units 4U and 4D are collectively referred to as an inspection unit 4.

Fig. 2 is a perspective view showing an example of the composition of the inspection jigs 3U and 3D shown in Fig. 1. Each of the inspection jigs 3U and 3D includes a plurality of probes Pr, a support block 31, a base 32, a base 33, a plurality of wirings 34, and reference capacitors C1 and C2 (reference).

The probe Pr is formed of a tough metal such as tungsten (W), high speed steel (SKH) or beryllium copper (BeCu) or a conductor other than the above, and is formed into a wire shape having bendable elasticity (flexibility). (sticky). The diameter of the probe Pr is, for example, about 100 μm.

A plurality of via holes supporting the probe Pr are formed in the support block 31. Each of the via holes is disposed so as to correspond to a position of a checkpoint set on a wiring pattern of the substrate 100 to be inspected. Thereby, the tip end portion of the probe Pr comes into contact with the inspection point of the substrate 100.

The support block 31 of the inspection jig 3U is disposed with the probe Pr corresponding to the inspection point on the upper surface of the substrate 100, and the support block 31 of the inspection jig 3D is disposed with the probe Pr corresponding to the inspection point on the lower surface of the substrate 100. The inspection jigs 3U and 3D are configured in the same manner except that the arrangement of the probes Pr is different and the mounting directions of the inspection portions 4U and 4D are reversed. Hereinafter, the inspection jigs 3U, 3D are collectively referred to as an inspection jig 3.

Since each of the via holes of the support block 31 is formed in cooperation with the wiring pattern of the substrate 100, the inspection jig 3 needs to use an inspection jig corresponding to the substrate 100. Therefore, when the substrate inspection apparatus 1 is used to inspect a substrate having a different wiring pattern, it is necessary to replace the inspection jig 3 with an inspection jig corresponding to the substrate.

The base 32 is composed of a plate 321 on which the support block 31 can be mounted and, for example, four tie bars 322 that join the plate 321 to the base 33. The connecting rod 322 is spaced apart from the base 33 to support the plate 321. Thereby, the wiring space of the wiring 34 is ensured to be disposed between the substrate 33 and the board 321.

The substrate 33 is, for example, a flat rectangular parallelepiped component. Reference capacitors C1, C2 are mounted on the first surface 33a of the base 33 on the side of the mounting base 32. The reference capacitors C1 and C2 have a reference electrostatic capacitance Cr which is set in advance and serves as a reference for correction.

A connector 35 detachably connected to the connector 41 of the inspection portion 4 is provided on the base 33. The connector 35 includes a plurality of connection terminals 36 (first terminals) for electrically connecting the probe Pr and the inspection portion 4, and a connection terminal 37 (second terminal) for electrically connecting the reference capacitors C1, C2 and the inspection portion 4 ).

The connection terminals 36 and 37 are, for example, needle-shaped connection terminals that penetrate the base 33 in the thickness direction. The rear end portions of the respective connection terminals 36 are connected to the respective probes Pr on the first surface 33a side by the wires 34, and the front end portions of the respective connection terminals 36 protrude from the second surface 33b on the opposite side to the first surface 33a. The connection terminal 37 includes connection terminals 37a, 37b, 37c.

The rear end of the connection terminal 37b is connected to one terminal of the reference capacitors C1, C2, the rear end of the connection terminal 37a is connected to the other terminal of the reference capacitor C1, and the rear end of the connection terminal 37c is connected to the other terminal of the reference capacitor C2. Further, the front end portions of the connection terminals 37a, 37b, and 37c protrude from the second surface 33b. Thereby, when the inspection jig 3 is attached to the inspection unit 4, the front end portions of the connection terminals 36, 37a, 37b, and 37c are connected to the connector 41 of the inspection unit 4. Incidentally, the number of reference capacitors may be one or three or more.

Fig. 3 is a view showing an example of the electrical composition of the substrate inspecting apparatus 1 shown in Fig. 1. The substrate 100 shown in FIG. 3 is a so-called component-embedded substrate, and a capacitor Cx is built in the substrate. The capacitor Cx is, for example, a multilayer ceramic capacitor (MLCC). Land pattern (inspection points) 102, 102 are formed on the surface of the substrate 100. The both end electrodes of the capacitor Cx are connected to the land patterns 102 and 102 via the internal wirings 101 and 101. The land patterns 102 and 102 are set at the inspection points.

Note that the substrate 100 is not necessarily a component-embedded substrate in which a capacitor is built in the substrate. The capacitance measuring circuit (physical quantity measuring unit) 45 to be described later may be, for example, a capacitance measuring circuit that measures the electrostatic capacitance generated between the wiring patterns.

The inspection jig 3 is provided with a ROM (Read Only Memory) 38 (storage portion) in the base 33. A characteristic message indicating the relationship between the electrostatic capacity (electrophysical quantity) of the capacitor Cx and the elapsed time after manufacture is stored in the ROM 38 in advance. The ROM 38 may be, for example, a flash memory or an EEPROM (Electrically Erasable Programmable Read-Only Memory), and various storage elements may be used.

Fig. 4 is a graph showing an example of a change in the electrostatic capacity of the capacitor Cx with respect to the elapsed time after manufacture. For example, the capacitor Cx of the multilayer ceramic capacitor is formed by laminating a dielectric and an electrode and sintering the dielectric. Even if the capacitor Cx thus formed is qualified, in the period of about 12 to 48 hours after the production, for example, as shown in Fig. 4, the electrostatic capacity is deteriorated as the time t after the production elapses. In the ROM 38, for example, the characteristic information shown in FIG. 4 is stored as a LUT (Lookup table).

Incidentally, an electrostatic physical capacity such as a resistance value, an inductance, or an impedance may be used instead of the electrostatic capacitance, and a characteristic information on these electronic physical quantities may be stored in the ROM 38.

The inspection unit 4 shown in FIG. 3 includes a connector 41, a switching unit 44, a capacitance measuring circuit 45 (a capacitance measuring unit, a physical quantity measuring unit), a keyboard 46 (elapsed time receiving unit), and a control unit 47. The connector 41 includes a plurality of main body side connection terminals 42 (main body side first terminals) and a plurality of main body side connection terminals 43 (main body side second terminals).

When the inspection jig 3 is attached to the inspection unit 4 and the connector 35 is connected to the connector 41, each main body side connection terminal 42 is connected to each connection terminal 36, and each main body side connection terminal 43 is connected to each connection terminal 37. Further, by attaching the inspection jig 3 to the inspection unit 4, the ROM 38 and the control unit 47 are removably connected by, for example, a connector. It should be noted that the ROM 38 can be accessed by the control unit 47 by means of wireless communication means, and the storage unit can be composed of, for example, RFID (Radio Frequency Identification).

The switching unit 44 switches the connection relationship between the capacitance measuring circuit 45 and each of the main body side connecting terminals 42 and each of the main body side connecting terminals 43. Specifically, the switching unit 44 includes switching elements SW1 to SW4. The main body side connection terminal 42 is connected to the capacitance measuring circuit 45 via the switching elements SW1 and SW2. The main body side connection terminals 43 and 43 are connected to the capacitance measuring circuit 45 via the switching elements SW3 and SW4. The switching elements SW1 to SW4 are turned on and off in accordance with control signals from the control unit 47.

The capacitance measuring circuit 45 measures the capacitance of the capacitor Cx or the reference capacitor C1 connected by the switching unit 44, and transmits the measured value to the control unit 47. In Fig. 3, an embodiment in which the reference capacitor C2 is not included is shown. Incidentally, an electrostatic physical quantity such as a resistance value, an inductance, or an impedance may be used instead of the electrostatic capacitance. Further, a circuit in which a resistor, an inductor, or a circuit element such as a resistor, a capacitor, or an inductor is combined may be used as a reference instead of the reference capacitors C1 and C2. Further, instead of the capacitance measuring circuit 45, a physical quantity measuring unit that measures these electronic physical quantities may be used.

The keyboard 46 transmits the input message to the control unit 47 by the user's operation. The user can operate the keyboard 46 to input the elapsed time from the substrate 100 on which the inspection object is manufactured. It should be noted that the elapsed time receiving unit is not limited to the keyboard 46. For example, the elapsed time receiving unit may be a touch panel or a communication unit that receives elapsed time by communication.

The control unit 47 is configured, for example, as a CPU (Central Processing Unit) that performs predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM that stores a predetermined control program or the like. Storage units such as HDD (Hard Disk Drive) and their peripheral circuits. The control unit 47 is a reference capacity measurement processing unit 471 (reference amount measurement processing unit), a correction processing unit 472, a measurement processing unit 473, a determination reference value setting unit 474, and a determination unit 475, for example, by executing a control program stored in the storage unit. Play a role.

The reference capacity measurement processing unit 471 connects the capacitance measuring circuit 45 to the main body side connection terminal 43 via the switching unit 44, and the electrostatic capacitance measuring circuit 45 measures the electrostatic capacitance of the reference capacitor C1.

The correction processing unit 472 corrects the capacitance measuring circuit 45 based on the measured capacitance of the reference capacitor C1.

The measurement processing unit 473 connects the capacitance measuring circuit 45 to the main body side connection terminal 42 via the switching unit 44, and measures the capacitance of the capacitor Cx by the capacitance measuring circuit 45.

The determination reference value setting unit 474 reads the characteristic information from the ROM 38, and sets a determination reference value for determining the merit of the capacitor Cx based on the elapsed time received by the keyboard 46 and the characteristic information.

The determination unit 475 determines the merit of the capacitor Cx based on the capacitance of the capacitor Cx measured by the measurement processing unit 473 and the determination reference value set by the determination reference value setting unit 474. The determination unit 475 indicates the result of the determination on, for example, the display device in which the drawing is omitted.

Next, an operation of the substrate inspection apparatus 1 that executes the substrate inspection method according to the embodiment of the present invention will be described. Fig. 5 is a flow chart showing an embodiment of the operation of the substrate inspection apparatus 1. First, when the substrate 100 is inspected, the user attaches the inspection jig 3 corresponding to the substrate 100 to the inspection portion 4, and causes the probe Pr of the inspection jig 3 to contact the inspection point of the substrate 100. Thereby, the capacitance of the reference capacitor C1 attached to the inspection jig can be measured by the capacitance measuring circuit 45.

Then, the reference capacity measurement processing unit 471 turns off the switching elements SW1 and SW2 of the switching unit 44, turns on the switching elements SW3 and SW4, connects the reference capacitor C1 to the capacitance measuring circuit 45, and measures the capacitance of the reference capacitor C1 by the capacitance measuring circuit 45. The electrostatic capacitance is used as the reference measurement value Crm (step S1: reference amount measurement program).

Next, the correction processing unit 472 compares the reference measured value Crm measured in step S1 with the reference electrostatic capacitance Cr, and corrects the capacitance measuring circuit 45 to cancel the difference between the reference measured value Crm and the reference electrostatic capacitance Cr (step S2: correction processing procedure) ). The correction can be performed, for example, by adjusting the circuit constant of the capacitance measuring circuit 45, or by adding or subtracting the correction value to the measured value of the capacitance measuring circuit 45.

In this case, since the inspection jig 3 includes the reference capacitor C1, the user can measure the static electricity of the reference capacitor C1 by the capacitance measuring circuit 45 by attaching the inspection jig 3 corresponding to the substrate 100 to the inspection unit 4 in order to inspect the substrate 100. The capacity is used as the reference measurement value Crm (step S1), and the capacitance measurement circuit 45 can be corrected based on the reference measurement value Crm (step S2). Therefore, it is not necessary to mount the substrate for calibration for correcting the capacitance measuring circuit 45, or to replace the substrate for calibration with the substrate 100 to be inspected after the correction, and thus it is possible to reduce the trouble of correcting the capacitance measuring circuit 45.

Then, the measurement processing unit 473 turns on the switching elements SW1 and SW2, turns off the switching elements SW3 and SW4, and measures the capacitance of the capacitor Cx as the measured value Cm by the capacitance measuring circuit 45 (step S3: measurement processing program). As the electrostatic capacitance measuring circuit 45, a conventional electrostatic capacitance measuring circuit can be used. For example, an electrostatic voltage can be applied and an electrostatic capacitance can be obtained from the flowing current, or an impedance measuring device or the like can be used.

At this time, since the capacitance of the capacitor Cx can be measured after the correction of the capacitance measuring circuit 45, the capacitance of the capacitor Cx can be measured with high accuracy.

Next, the determination reference value setting unit 474 reads the characteristic information from the ROM 38 (step S4), and acquires the elapsed time after the substrate 100 input by the user to the keyboard 46 is manufactured (step S5).

In this case, the inspection jig 3 includes the ROM 38. Therefore, in order to inspect the substrate 100, the user only attaches the inspection jig 3 corresponding to the substrate 100 to the inspection unit 4, and the determination reference value setting unit 474 can acquire the characteristics of the substrate 100 to be inspected. message. By integrating the inspection jig 3 corresponding to the substrate 100 to be inspected with the ROM 38 storing the characteristic information of the substrate 100, the characteristic information can be automatically switched to the characteristic information corresponding to the substrate 100 to be inspected. As a result, it is possible to prevent an erroneous operation of the user who uses the characteristic information different from the characteristic information of the substrate 100 when the substrate 100 is inspected, and it is possible to save time for the user to set the characteristic information corresponding to the substrate 100 to the substrate inspection apparatus 1.

In addition, the ROM 38 does not have to be provided in the inspection jig 3, and may be provided in the inspection apparatus main body 2.

Then, the determination reference value setting unit 474 sets the determination reference value based on the elapsed time and the characteristic information (step S6). Specifically, the determination reference value setting unit 474 refers to the LUT indicating the characteristic information shown in FIG. 4, and acquires the capacitance value corresponding to the elapsed time t. The determination reference value setting unit 474 calculates and sets the capacitance value of the capacitor Cx as a determination reference value for determining the merits of the capacitor Cx by adding or subtracting an allowable error to the capacitance value thus obtained. Upper and lower limits.

The determination unit 475 determines whether or not the measured value Cm measured in the step S3 is within the range of the determination reference value, that is, whether or not it is within the range of the lower limit value and the upper limit value of the determination reference value (step S7). When the measured value Cm is within the range of the determination reference value (YES in step S7), the determination unit 475 determines that the capacitor Cx is acceptable (step S8), and displays the determination result on the display unit in which the drawing is omitted, and ends the processing. . On the other hand, if the measured value Cm is outside the range of the determination reference value (NO in step S7), the determination unit 475 determines that the capacitor Cx is defective (step S9), and indicates the result of the determination in the display portion of the drawing. End processing.

According to the processing of steps S4 to S9, even when the capacitance Cx changes with the elapsed time after the manufacture, the determination reference value corresponding to the elapsed time is set, and it is determined in accordance with the determination reference value. Since the merits of the capacitor Cx are good, the accuracy of the determination of the merits of the capacitor Cx is improved.

In addition, the inspection of the substrate 100 may be performed a plurality of times during the period from the manufacture of the substrate 100 to the shipment. In this case, depending on the equipment management of the manufacturing plant of the substrate 100, in each inspection, for example, in the first inspection and the second inspection, substrate inspection apparatuses different from each other are sometimes used. In this case, in the conventional substrate inspection apparatus, the measurement error of the capacitance measuring circuit may vary between the respective substrate inspection apparatuses. In the past, when the capacitance of the capacitor Cx is measured by the substrate inspection device having different measurement errors and the quality is determined, even when the same substrate 100 is inspected, measurement errors between the substrate inspection devices occur ( Instrument error) caused by a different judgment result.

On the other hand, when the substrate inspection apparatus 1 performs the inspection of the substrate 100 a plurality of times using the plurality of substrate inspection apparatuses 1, the inspection jig 3 corresponding to the substrate 100 is inevitably attached to the inspection unit when the substrate 100 is inspected. 4. The capacitance measuring circuit 45 of each substrate inspection device 1 is corrected based on the reference capacitor C1 included in the inspection jig 3. As a result, the capacitance measuring circuit 45 of each substrate inspection device 1 is corrected using the same reference capacitor C1. As a result, since the measurement error (instrument error) between the substrate inspection devices is lowered, the possibility of different determination results due to measurement errors (instrument errors) between the substrate inspection devices is lowered.

In addition, the substrate inspection device 1 may further include an elapsed time estimating unit that estimates the elapsed time after the substrate 100 is manufactured based on the measured value Cm measured by the measurement processing unit 473 and the characteristic information. Specifically, the elapsed time estimating unit may acquire the time t corresponding to the measured value Cm as the elapsed time by referring to the LUT indicating the characteristic information shown in FIG. 4, and notify the display device or the like in which the elapsed time is omitted. . With this configuration, the user can know the elapsed time after the substrate 100 is manufactured. Therefore, for example, by performing the baking process on the substrate 100 that has passed the predetermined time after the manufacture, for example, 48 hours or longer, the electrostatic capacitance of the capacitor Cx can be restored. .

In addition, the ROM 38, the keyboard 46, and the determination reference value setting unit 474 may not be included, and the determination reference values may be set in advance without executing steps S4 to S6. In addition, the ROM 38, the keyboard 46, the determination reference value setting unit 474, and the determination unit 475 are not provided, and the steps S4 to S9 are not executed, and the substrate inspection apparatus 1 is configured as a measuring device for measuring the electrostatic capacitance of the substrate 100.

1‧‧‧Substrate inspection device
100‧‧‧Substrate
101‧‧‧Internal wiring
102‧‧‧ land pattern
2‧‧‧Checking device body
3, 3U, 3D‧‧‧ inspection fixture
31‧‧‧Support block
32‧‧‧Base
321‧‧‧ board
322‧‧‧Links
33‧‧‧Base
33a‧‧‧ first side
33b‧‧‧ second side
34‧‧‧Wiring
35, 41‧‧‧ connectors
36‧‧‧Connecting terminal
37, 37a, 37b, 37c‧‧‧ connection terminals
38‧‧‧ROM
4, 4D, 4U‧‧‧ Inspection Department
42‧‧‧ Main body side connection terminal
43‧‧‧ Main body side connection terminal
44‧‧‧Switching Department
45‧‧‧Electrostatic capacity measuring circuit
46‧‧‧ keyboard
47‧‧‧Control Department
471‧‧‧Base Capacity Measurement Processing Department
472‧‧‧Correction Processing Department
473‧‧‧Measurement and Processing Department
474‧‧‧Judgement reference setting unit
475‧‧‧Decision Department
5U, 5D‧‧‧ inspection department moving mechanism
6‧‧‧Substrate fixing device
7‧‧‧ frame
C1, C2‧‧‧ reference capacitor
Cm‧‧‧ measured value
Cr‧‧‧ reference electrostatic capacity
Crm‧‧‧ benchmark value
Cx‧‧‧ capacitor
Pr‧‧‧ probe
SW1～SW4‧‧‧Switching elements
S1～S9‧‧‧Steps

Fig. 1 is a front elevational view showing the composition of a substrate inspecting apparatus according to an embodiment of the present invention. Fig. 2 is a perspective view showing an embodiment of the inspection jig shown in Fig. 1. Fig. 3 is a view showing an embodiment of an electrical configuration of the substrate inspecting apparatus shown in Fig. 1. Fig. 4 is a graph showing an embodiment of a change in electrostatic capacitance of a capacitor with respect to elapsed time after manufacture. Fig. 5 is a flow chart showing an embodiment of the operation of the substrate inspecting apparatus shown in Fig. 1.

100‧‧‧Substrate

101‧‧‧Internal wiring

102‧‧‧ land pattern

3‧‧‧Check fixture

33‧‧‧Base

34‧‧‧Wiring

35, 41‧‧‧ connectors

36‧‧‧Connecting terminal

37‧‧‧Connecting terminal

38‧‧‧ROM

4‧‧‧ Inspection Department

42‧‧‧ Main body side connection terminal

43‧‧‧ Main body side connection terminal

44‧‧‧Switching Department

45‧‧‧Electrostatic capacity measuring circuit

46‧‧‧ keyboard

47‧‧‧Control Department

471‧‧‧Base Capacity Measurement Processing Department

472‧‧‧Correction Processing Department

473‧‧‧Measurement and Processing Department

474‧‧‧Judgement reference setting unit

475‧‧‧Decision Department

C1‧‧‧ reference capacitor

Cx‧‧‧ capacitor

Pr‧‧‧ probe

SW1~SW3‧‧‧Switching elements

Claims (9)

An inspection jig configured to be detachable from a main body of an inspection device for performing a substrate inspection, the inspection jig comprising: a probe for contacting with a checkpoint disposed on the substrate; a first terminal And for electrically connecting the probe to the inspection device body; a reference having a predetermined electronic physical quantity; and a second terminal for electrically connecting the reference to the inspection device body. The inspection jig according to claim 1, wherein the electronic physical quantity is an electrostatic capacity, and the reference is a reference capacitor. The inspection jig according to claim 1 or 2, wherein the inspection jig includes a storage portion, and a characteristic information indicating a relationship between the physical quantity of electrons obtained from the inspection point and an elapsed time is stored in advance. The inspection jig according to claim 2, wherein the substrate comprises a capacitor, and the inspection point is connected to the capacitor, the inspection fixture includes a characteristic message pre-stored indicating a relationship between electrostatic capacitance and elapsed time of the capacitor. One of the storage departments. A substrate inspection device comprising the inspection jig and the inspection device main body according to claim 1 or 2, wherein the inspection device main body comprises: a main body side first terminal connected to the first terminal; a second terminal connected to the second terminal; a physical quantity measuring unit that measures a predetermined physical quantity; and a switching unit that switches a connection relationship between the physical quantity measuring unit and the main body side first terminal and the main body side second terminal; The reference amount measurement processing unit connects the physical quantity measuring unit to the main body side second terminal, and the physical quantity measuring unit measures the electronic physical quantity of the reference unit; and the correction processing unit determines the reference based on the reference The physical quantity measuring unit corrects the physical quantity measuring unit, and a measuring processing unit that connects the physical quantity measuring unit to the main body side first terminal, and the physical quantity measuring unit measures the electronic physical quantity of the check point. The substrate inspection device of claim 5, further comprising: a storage unit that prestores a characteristic message indicating a relationship between the electronic physical quantity obtained from the inspection point and an elapsed time; Receiving an input of the elapsed time of the substrate; a determination reference value setting unit that sets a reference value for determining the quality of the substrate based on the elapsed time received by the elapsed time receiving unit and the characteristic message; The determination unit determines the merits of the substrate based on the electronic physical quantity measured by the measurement processing unit and the determination reference value. The substrate inspection apparatus according to claim 5, further comprising: a storage unit that stores in advance a characteristic information indicating a relationship between the physical quantity of the electron obtained from the inspection point and an elapsed time; and an elapsed time estimating unit The elapsed time after the substrate is manufactured is estimated based on the electronic physical quantity measured by the measurement processing unit and the characteristic information. The substrate inspection device of claim 6 or 7, wherein the storage portion is disposed in the inspection fixture. A substrate inspection method for performing substrate inspection using an inspection jig according to any one of claims 1 to 4, comprising the following steps: a reference amount measurement program using a physical quantity measuring unit that measures a predetermined physical quantity Measuring the electronic physical quantity of the reference; a calibration processing program correcting the physical quantity measuring unit based on the measured electronic physical quantity of the reference; and a measurement processing program for measuring the electronic quantity of the check point by the physical quantity measuring unit Physical quantity.