TW201403099A - Electric property detection method and electric property detection apparatus - Google Patents

Abstract

To provide an electric property detection method and an electric property detection apparatus which, for three electric components that constitute a delta circuit provided in a detection target substrate, can accurately detect the electric properties of the first and second electric components while adequately suppressing the effects of the third electric component. Of the plurality of second contact points 7a through 7d and third contact points 8a through 8d on the surface of a detection target substrate 1, one second contact point and one third contact point are selected as first and second selected contact points, in such a combination that the resistance value of a wiring path 10 between the second contact point and the first connection section 5a of the third electric component (for example an impedance element 5) is most similar to the resistance value of a wiring path 11 between the third contact point and a second connection section 5b of the third electric component. Then, the electric properties of the first and second electric components (for example capacitors 3 and 4) are detected via the first contact points 6a and 6b, the first selected contact point, and the second selected contact point.

Description

Electrical characteristic detecting method and detecting device

The present invention relates to an electrical characteristic detecting method and a detecting device for detecting electrical characteristics of two electronic components among three electronic components constituting a triangular circuit embedded in a substrate to be detected.

With the rapid development of the substrate manufacturing technology in recent years, research and development of built-in substrates (embedded substrates) in which electronic components such as capacitors and coils are built in a multilayered substrate are also being advanced. In such a miniaturized and complicated substrate, only the contact points formed on the substrate can be electrically connected to the external device, and thus it is difficult to detect the electrical characteristics of the built-in electronic component for the purpose of inspection or the like.

Further, when a triangular circuit in which three electronic components of the first to third electronic components are connected in a triangular shape is provided in the substrate, in order to accurately detect the first of the three electronic components constituting the triangular circuit, The electrical characteristics of the two electronic components of the second electronic component need to be excluded from the influence of the remaining third electronic component to perform electrical characteristics detection. Therefore, it is necessary to maintain the voltage levels of the connection portions on both sides of the third electronic component at the same level, and supply electric power for detecting the electrical characteristics to the first and second electronic components. In this regard, the applicant has filed a patent application of Japanese Patent Application No. 2011-255349 (unpublished).

However, even if the voltage levels of the two contact points of the substrate surface connected to the connection portions on both sides of the third electronic component are formed to the same level, in most cases, the respective contact points and both sides of the third electronic component The resistance values of the wiring paths between the connection portions are different. Therefore, the voltage levels of the connection portions on both sides of the third electronic component are different, and the influence of the third electronic component cannot be excluded, and there is a problem that the electrical characteristics of the first and second electronic components cannot be accurately detected.

Further, as a prior art document, for example, Patent Documents 1 and 2 can be cited.

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. Hei 8-211113

Patent Document 2: Japanese Laid-Open Patent Publication No. 2006-250743

Therefore, the problem to be solved by the present invention is to provide an electrical characteristic detecting method and a detecting device capable of sufficiently suppressing the influence of the third electronic component in the first to third electronic components constituting the triangular circuit provided in the substrate to be detected. The electrical characteristics of the first and second electronic components are correctly detected.

In order to solve the above problems, a first aspect of the present invention is an electrical characteristic detecting method in which a triangular circuit for connecting first to third electronic components into a triangular shape is provided in a substrate to be detected, and a surface of the substrate to be detected is provided. Providing a first contact point and a plurality of second and third contact points, wherein the first contact point is electrically connected to the first connection portion of the first electronic component and the second electronic component electrically connected to each other via a wiring path Each of the second contact points is electrically connected to the second connection portion of the first electronic component and the first connection portion of the third electronic component that are electrically connected to each other via a wiring path, and each of the third contacts Point separately The second connection portion of the second electronic component and the second connection portion of the third electronic component that are electrically connected to each other are electrically connected via a wiring path, and the electrical characteristic detecting method is to the first electronic component and the second electronic component An electrical characteristic detecting method for detecting electrical characteristics of a part, comprising: a contact point selecting step, wherein, from the plurality of the second contact points and the third contact point, the second contact point and the third electronic component a resistance value of the wiring path between the first connection portion or the second connection portion of the first electronic component, and the third contact point and the second connection portion of the third electronic component or the second electron a combination of the resistance values of the wiring paths between the second connecting portions of the components being the closest values, wherein each of the second contact points and the third contact points are selected as the first and second selected contact points; And an electrical characteristic detecting step, wherein the probe connected to the first contact point is connected to the first selected contact point And a second selector connected to the contact point of the probe to detect the electrical characteristics of a first electronic component and the second electronic component.

According to a second aspect of the present invention, in the contact point selecting step, the wiring and the via hole constituting the wiring path provided on the substrate to be detected are provided in the contact point selecting step. The through-hole related design data is stored in advance in a predetermined memory unit, and the predetermined information processing unit calculates the first connection portion and the first connection portion of the third electronic component and the first electronic component based on the design data. a resistance value of the wiring path between the second connection portions of an electronic component, and each of the third contact point and the second connection portion of the third electronic component or the second connection portion of the second electronic component The resistance value of the above wiring path is displayed, and the calculated resistance value is displayed on a predetermined display portion.

According to a third aspect of the present invention, in the second aspect of the present invention, the information processing unit is configured to form a wiring circuit pattern based on the design data stored in the memory unit, and to form the wiring circuit pattern and The calculated resistance value is displayed on the display unit, wherein the wiring pattern is a connection between the wiring image element and the via image element indicating the wiring and the via included in the wiring path. a structure of the wiring path between the second contact point and the first connection portion of the third electronic component or the second connection portion of the first electronic component, and each of the third contact point and the third electron The structure of the wiring path between the second connection portion of the component or the second connection portion of the second electronic component.

According to a fourth aspect of the present invention, in the electrical contact detecting method of the first aspect, in the contact point selecting step, the wiring and the via hole constituting the wiring path provided on the substrate to be detected are provided. The relevant design data is pre-stored in a predetermined memory unit, and the predetermined information processing unit calculates the first connection point and the first connection portion of the third electronic component or the first electronic component based on the design data. The resistance value of the wiring path between the second connection portions and the above-described third contact point and the second connection portion of the third electronic component or the second connection portion of the second electronic component a resistance value of the wiring path, and selecting the first selection contact point and the second selection contact point from the plurality of the second contact points and the third contact point based on the result of the calculation.

Further, a fifth aspect of the present invention is an electrical characteristic detecting device in which a triangular circuit for connecting first to third electronic components into a triangular shape is provided in a substrate to be detected, and a first surface is provided on a surface of the detection target substrate. a contact point and a plurality of second and third contact points, wherein the first contact point is electrically connected to the first connection portion of the first electronic component and the first connection portion of the second electronic component that are electrically connected to each other via a wiring path Each of the second contact points is electrically connected to the second connection portion of the first electronic component and the first connection portion of the third electronic component that are electrically connected to each other via a wiring path, and each of the third contact points is respectively routed via a wiring a second connection portion of the second electronic component and a second connection portion of the third electronic component that are electrically connected to each other, wherein the electrical characteristic detecting device is for the first electronic component and the second electronic component An electrical characteristic detecting device for detecting electrical characteristics, wherein the electrical characteristic detecting device includes: an inspection jig, wherein the inspection jig has a plurality of probes respectively connected to the first contact point, the second contact point, and the third contact point; and a detecting unit that detects the first electronic component and the first via the probe of the inspection jig An electrical connection characteristic of the two electronic components; a connection switching unit that switches an electrical connection relationship between the probe and the detection unit of the inspection jig; and a control unit that controls the detection unit and the connection switching unit Controlling, wherein the control unit selects, by the second contact point, the first connection of the third electronic component from the plurality of the second contact points and the third contact point a resistance value of the wiring path between the connection portion or the second connection portion of the first electronic component, and the third contact point and the second connection portion of the third electronic component or the second electronic component a mode in which the resistance value of the wiring path between the second connection portions is the closest value, each of the second contact points and the third contact point being selected as the first and second selection contact points, and the above control Controlling the inspection unit and the connection switching unit via the probe connected to the first contact point, the probe connected to the first selected contact point, and the probe connected to the second selected contact point The electrical characteristics of the first electronic component and the second electronic component are detected.

According to the first and fifth aspects of the present invention, from the plurality of second contact points and the third contact points of the surface of the detecting target substrate, the first contact portion of the second contact point and the third electronic component or the first The resistance value of the wiring path between the second connection portions of the electronic component and the resistance value of the wiring path between the third contact point and the second connection portion of the third electronic component or the second connection portion of the second electronic component The combination of the closest values selects a second contact point and a third contact point as the first and second selected contact points, respectively. Electrical characteristics of the first and second electronic components are detected via probes respectively coupled to the first contact point and probes coupled to the first selected contact point and the second selected contact point. Therefore, the voltage levels of the connection portions on both sides of the third electronic component can be maintained at substantially the same level, the influence of the third electronic component can be sufficiently suppressed, and the electrical characteristics of the first and second electronic components can be accurately detected. .

According to the second aspect of the present invention, the resistance value of the wiring path between the respective second contact points of the surface of the target substrate and the first connection portion of the third electronic component or the second connection portion of the first electronic component, and The resistance value of the wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component is based on design data related to the wiring and the via hole in each wiring path Automatically calculated and displayed on the display portion, therefore, based on the display content of the display portion, the operator can easily understand the second connection point of each of the second contact points and the third electronic component or the second connection of the first electronic component The resistance value of the wiring path between the portions and the resistance value of the wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component can be easily performed One and second choice Selecting a touch point selection operation or confirming the accuracy of the selected first and second selected contact points.

According to the third aspect of the present invention, the wiring circuit diagram is automatically created based on the design data of the memory in the memory portion, and the wiring circuit pattern is displayed on the display portion together with the calculated resistance value of each of the calculated wiring lines, wherein the wiring The circuit diagram connects the wiring image elements and the through-hole image elements indicating the wirings and the vias included in the wiring paths, and indicates the first contact points of the surface of the detection target substrate and the first of the third electronic components. a structure of a wiring path between the connection portion or the second connection portion of the first electronic component and a wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component Structure. Therefore, based on the display content of the display portion, the operator can easily understand the structure and resistance of the wiring path between the respective second contact points and the first connection portion of the third electronic component or the second connection portion of the first electronic component. The value, and the structure and resistance value of the wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component, the first and second can be performed more easily The selection operation of the contact point or the confirmation of the correctness of the selected first and second selection contact points is selected.

According to the fourth aspect of the present invention, the respective second contact points of the surface of the detection target substrate and the first connection portion of the third electronic component are automatically calculated based on the design data related to the wirings and the via holes in the respective wiring paths or a resistance value of a wiring path between the second connection portions of the first electronic component, and a wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component The resistance value, and based on this calculation result, the selection of the first and second selection contact points is automatically performed. Therefore, it is possible to reduce the burden on the operator related to the selection work of the first and second selection contact points.

1‧‧‧Detection substrate

2‧‧‧Electrical characteristic testing device

3‧‧‧First capacitor

3a‧‧‧First connection

3b‧‧‧Second connection

4‧‧‧second capacitor

4a‧‧‧First connection

4b‧‧‧Second connection

5‧‧‧impedance components

5a‧‧‧First connection

5b‧‧‧Second connection

6a, 6b‧‧‧ first touch point

7a~7d‧‧‧second touch point

8a~8d‧‧‧ third contact point

9~11‧‧‧Wiring path

21‧‧‧Check fixture

22‧‧‧Detection Department

22a‧‧‧Power Department

22b‧‧‧Voltage Measurement Department

22c‧‧‧ Current Measurement Department

23‧‧‧ Connection Switching Department

24‧‧‧Input Receiving Department

25‧‧‧Memory Department

26‧‧‧Display Department

27‧‧‧Control Department

31, 32‧‧‧ wiring circuit diagram

31a, 32a‧‧‧Wiring image elements

31b, 32b‧‧‧through hole image elements

31c, 32c‧‧‧Electronic parts image elements

31d, 32d‧‧‧ Connection image elements

31e, 32e‧‧‧ contact point image elements

P1~P10‧‧‧ probe

FIG. 1 is a view schematically showing a configuration and the like of a detection target substrate to be detected by an electrical characteristic detecting method according to an embodiment of the present invention.

2 is a view showing electrical characteristic inspection of an electrical characteristic detecting method to which an embodiment of the present invention is applied. A block diagram of the electrical structure of the device.

3A shows a wiring circuit diagram made of the electric characteristic detecting device of FIG. 2, which corresponds to a wiring path from the second connection portion of the first capacitor in the detection target substrate of FIG. 1 to each of the second contact points. Structure.

3B is a wiring circuit diagram prepared by the electric characteristic detecting device of FIG. 2, which corresponds to a wiring path from the second connection portion of the second capacitor in the detection target substrate of FIG. 1 to each of the third contact points. The structure corresponds.

4 is a view showing a circuit configuration when the electrical characteristics of the first and second capacitors in the substrate to be inspected in FIG. 1 are detected by the electrical characteristic detecting device of FIG. 2 .

An electrical characteristic detecting apparatus to which an electrical characteristic detecting method according to an embodiment of the present invention is applied will be described with reference to Figs. 1 to 4 .

First, the detection target substrate 1 to be detected by the electrical property detecting device 2 of the present embodiment will be described with reference to FIG. The detection target substrate 1 is a laminated substrate formed by laminating a plurality of substrates. As shown in FIG. 1, the first and second capacitors 3 and 4 and the impedance are formed in a triangular shape to form a triangular circuit. Impedance element (eg inductor) 5. The first and second capacitors 3, 4 correspond to the first and second electronic components of the present invention, and the impedance element corresponds to the third electronic component of the present invention. The first connection portion 3a of the first capacitor 3 and the first connection portion 4a of the second capacitor 4 are connected by a wiring path, and the second connection portion 3b of the first capacitor 3 and the first connection portion 5a of the impedance element 5 are wired. The path is connected, and the second connection portion 4b of the second capacitor 4 and the second connection portion 5b of the impedance element 5 are connected by a wiring path.

In the present embodiment, the case where the electronic components as the first and second capacitors 3 and 4 have the same electrical characteristics (here, capacitor capacity) will be described, but the capacitances of the two capacitors 3 and 4 may be different. . Further, the first and second capacitors 3 and 4 are exemplified as the first and second electronic components, and are not limited thereto. Further, the impedance element 5 is also an example of the third electronic component, and is not limited thereto.

Further, at least one (two in the example of FIG. 1) first contact points 6a, 6b (collectively, the component symbol "6") is used on the surface of the detection target substrate 1, and a plurality of (four in the example of FIG. 1) The second contact points 7a to 7d (collectively, the component symbol "7") and the plurality of (four in the example of FIG. 1) third contact points 8a to 8d (collectively, the component symbol "8" is used). In the present embodiment, the configuration of the detection target substrate 1 is simplified for the sake of simplification of the description. However, in the normal case, not only the capacitors 3 and 4 and the impedance element 5 but also the impedance element 5 are provided in the detection target substrate 1. There are other electronic components and wirings (for example, wiring patterns) accompanying them, and a plurality of contact points other than the first to third contact points 6 to 8 are provided on the surface of the detection target substrate 1. Here, the contact points 7 to 8 are constituted by a land portion provided on the wiring or a solder ball attached to the land portion.

The first contact point 6 is connected to the first connection portion 3a of the first capacitor 3 and the first connection portion 4a of the second capacitor 4 via the wiring path 9, respectively. The second contact point 7 is connected to the second connection portion 3b of the first capacitor 3 and the first connection portion 5a of the impedance element 5 via the wiring path 10, respectively. The third contact point 8 is connected to the second connection portion 4b of the second capacitor 4 and the second connection portion 5b of the impedance element 5 via the wiring path 11, respectively.

Next, the configuration of the electrical characteristic detecting device 2 will be described with reference to Fig. 2 . As shown in FIG. 2, the electrical characteristic detecting apparatus 2 includes an inspection jig 21, a detecting unit 22, a connection switching unit 23, an input receiving unit 24, a storage unit 25, a display unit 26, and a control unit 27 for detecting the target substrate 1. The electrical characteristics of the first and second capacitors 3, 4 (the capacitance in the present embodiment) are detected. The control unit 27 corresponds to the information processing unit of the present invention. Further, in the present embodiment, the capacitance of the first and second capacitors 3, 4 is detected by the electrical characteristic detecting device 2, but the present invention is not limited thereto, and other electrical characteristics (for example, impedance) of various electronic components may be detected. , resistance, etc.).

The inspection jig 21 includes a plurality of probes P1 to P10 that are in contact with and connected to the first to third contact points 6 to 8 of the detection target substrate 1 (collectively, the component symbol "P" is used). Further, as a modification, a plurality of probes P (for example, two) may be in contact with each of a part or all of the contact points 6 to 8. In addition, the structure shown in FIG. 2 is omitted for simplification, but The inspection jig 21 has an upper jig portion and a lower jig portion that are in contact with the upper surface side and the lower surface side of the detection target substrate 1, respectively. In the example of the diagram of FIG. 1, the probes P1 and P2 are respectively in contact with the first contact points 6a and 6b, the probes P3 to P6 are respectively in contact with the second contact points 7a to 7d, and the probes P7 to P10 are respectively in contact with the first Three contact points 8a~8d.

The detecting unit 22 includes a power supply unit 22a, a voltage measuring unit 22b, and a current measuring unit 22c. The power supply unit 22a converts the electric power for detecting the capacitance of the first and second capacitors 3, 4 (for example, the alternating current or the current value periodically varying DC) via the probe P of the inspection jig 21 in accordance with the control of the control unit 27. The current is supplied to the contact points 6 to 8 of the detection target substrate 1. The voltage measuring unit 22b measures the voltage applied between the contact points 6 to 8 of the detection target substrate 1 via the probe P of the inspection jig 21 under the control of the control unit 27, and supplies the measurement result to the control unit 27. The current measuring unit 22c measures the current supplied between the contact points 6 to 8 of the detection target substrate 1 via the probe P of the inspection jig 21 under the control of the control unit 27, and supplies the measurement result to the control unit 27.

The connection switching unit 23 is configured to include a plurality of switching elements that are turned on and off in accordance with the control of the control unit 27, and the respective probes P of the inspection jig 21 and the power supply unit 22a of the detecting unit 22 are controlled by the control unit 27. The electrical connection relationship between the voltage measuring unit 22b and the current measuring unit 22c is switched.

The input receiving unit 24 includes an operation unit (not shown) that receives an operation input to the electric characteristic detecting device 2, and includes a network or a detachable recording medium (a disk-shaped recording medium, a detachable semiconductor recording medium, etc.). A non-illustrated information acquisition unit that obtains information, etc. The substrate data on the structure of the detection target substrate 1 is input from the network or the detachable recording medium or the like via the input receiving unit 24.

The memory unit 25 is configured to include a semiconductor memory or a hard disk, and stores various data necessary for the detection operation of the electrical characteristic detecting device 2. For example, the memory unit 25 memorizes the substrate data related to the structure of the detection target substrate 1. The substrate data includes wirings and via holes that are formed on the detection target substrate 1 and that constitute respective wiring paths including the above-described wiring paths 9 to 11 and the like. Design data related to the three-dimensional configuration structure (position information, shape, etc. of each position on the path). In addition, the design data further includes respective connection portions (for example, connection portions 3a, 3b, 4a, 4b, 5a, 5b, etc.) and respective contact points (for example, contact points 6 to 8) provided on the respective wiring paths. Etc.) Relevant location information. Further, the substrate data includes resistivity data relating to the specific resistance of the wiring provided on the substrate 1 to be detected and the specific resistance of the via.

The display unit 26 displays operation information related to the operation of the electrical characteristic detecting device 2, a detection result related to the detection target substrate 1, and the like in accordance with the control of the control unit 27.

The control unit 27 is responsible for controlling the entire electric characteristic detecting device 2, specifically, receiving an instruction and information via the input receiving unit 24, etc., and storing the received information in the storage unit 25, and the power supply unit 22a and the voltage measuring unit. Control of 22b, current measuring unit 22c, connection switching unit 23, display unit 26, and the like.

Next, the control operation of the control unit 27 will be described, and the operation of the electrical characteristic detecting device 2 will be described. Among the functions of the control unit 27, a contact point selection function and an electrical characteristic detection function are included. Here, in the operation step of the electrical characteristic detecting device 2, the contact point selecting step in which the contact point selecting function is active and the electric characteristic detecting step in which the electric characteristic detecting function functions are included. In the contact point selecting step, one of the plurality of second and third contact points 7, 8 provided on the detecting target substrate 1 is selected for detecting the capacitance of the capacitors of the first and second capacitors 3, 4 The contact points 7, 8 used in the supply will be described later in detail. In the electrical characteristic detecting step, the detection of the capacitor capacities of the first and second capacitors 3, 4 is performed via the selected contact points 7, 8, and the like. In addition, when the detection of the capacitor capacity of the same type of detection target substrate 1 having the same configuration is continued, the contact point selection step is omitted for the second and subsequent detection target substrates 1.

In the contact point selection function of the control unit 27, the resistance of the wiring path 10 between the second contact point 7 and the first connection portion 5a of the impedance element 5 from among the plurality of second and third contact points 7, 8 The value and the resistance value of the wiring path 11 between the third contact point 8 and the second connection portion 5b of the impedance element 5 are the combination of the closest values, and each of the second contact points 7 and the The three contact points 8 serve as first and second selection contact points. Here, as an index for determining the proximity of the resistance value, for example, a quotient obtained by dividing the difference between the two resistance values of the comparison target by one of the two resistance values may be used. In this case, the first and second selected contact points are selected in such a way that the quotient has the smallest combination of resistance values. Further, as a modification, the resistance value of the wiring path 10 between the second contact point 7 and the second connection portion 3b of the first capacitor 3 and the second connection portion 8 and the second connection portion of the second capacitor 4 may be used. The resistance values of the wiring paths 11 between 4b are used to select the first and second selected contact points.

As a specific example, for example, the resistance values of the respective wiring paths 10 between the first connection portion 5a and the second contact points 7a to 7d of the impedance element 5 are 81.3 mΩ, 78.6 mΩ, 74.7 mΩ, and 75.9 mΩ, respectively, and the impedance element 5 The case where the resistance values of the respective wiring paths 11 between the second connection portion 5b and the third contact points 8a to 8d are 72.7 mΩ, 73.6 mΩ, 77.1 mΩ, and 79.3 mΩ, respectively, will be described. In this case, since the resistance value between the first connection portion 5a and the second contact point 7b is 78.6 mΩ and the resistance value between the second connection portion 5b and the third contact point 8d is the closest to 79.3 mΩ, the second contact Point 7b is selected as the first selected contact point and third contact point 8d is selected as the second selected contact point.

Such a selection of contact points 7, 8 for the resistance of the wiring path 10 between each of the second contact points 7 and the first connection portion 5a and between the third contact point 8 and the second connection portion 5b The resistance value of the wiring path 11 is calculated by the control unit 27 based on the above-described design data stored in the memory unit 25 in advance. Regarding the calculation of the resistance value, for example, in the case where the wiring path 10 is between the first connection portion 5a and the second contact point 7a, based on the wiring path 10 between the first connection portion 5a and the second contact point 7a The path length of the wiring path 10, the wiring on the wiring path 10, and the cross-sectional area of the via hole, and the resistivity of the wiring and the via hole are calculated to calculate the resistance value of the wiring path 10.

In addition, the contact point selection function of the control unit 27 further includes wiring circuit patterns 31 and 32 as shown in FIGS. 3A and 3B, which schematically show the configuration of the above-described wiring paths 10 and 11 provided on the detection target substrate 1. The function on the display unit 26 is displayed. The wiring circuit diagram 31 is a connection wiring image element 31a, a via image element 31b, an electronic component image element 31c, and a connection portion. The image element 31d and the contact point image element 31e show a structure of the wiring path 10 between each of the second contact points 7 and the first connection portion 5a of the impedance element 5, wherein the wiring image element 31a, the through hole The image element 31b, the electronic component image element 31c, the connection portion image element 31d, and the contact point image element 31e respectively indicate a wiring, a via hole, a impedance element 5, a first connection portion 5a, and a portion included in the wiring path 10. Two contact points 7. The wiring circuit diagram 32 is a connection wiring image element 32a, a through hole image element 32b, an electronic component image element 32c, a connection portion image element 32d, and a contact point image element 32e, and each of the third contact point 8 and the impedance element 5 is shown. A diagram of the structure of the wiring path 11 between the second connecting portions 5b, wherein the wiring image element 32a, the through hole image element 32b, the electronic component image element 32c, the connecting portion image element 32d, and the contact point image element 32e shows the wiring, the via hole, the impedance element 5, the second connection portion 5b, and the third contact point 8 included in the wiring path 11, respectively. Such wiring circuit patterns 31 and 32 are prepared based on the above-described design data stored in the memory unit 25 in advance.

Further, as shown in FIG. 3A and FIG. 3B, the resistance value between the first connecting portion 5a and the respective second contact points 7a to 7d calculated as described above and the second connecting portion 5b and each of the third contact points 8a are displayed. The resistance values between ~8d correspond to the contact point image elements 31e corresponding to the respective second contact points 7a-7d in the wiring circuit patterns 31, 32 on the display portion 26, and the respective third contacts The contact point image element 32e corresponding to the points 8a to 8d. Further, the second contact points 7a to 7d and the third contact points 8a to 8d selected to be the first and second selected contact points are distinguished from the other contact points 7a to 7d, 8a to 8d which are not selected. Display. For example, the contact point image elements 31e and 32e corresponding to the contact points 7a to 7d and 8a to 8d selected to select the contact point are contact points corresponding to the other contact points 7a to 7d, 8a to 8d which are not selected. The display elements (e.g., display color, flicker-non-flicker, presence or absence of arrow display, etc.) of the image elements 31e, 32e are displayed.

Next, the electrical characteristic detecting function of the control unit 27 will be described. In the electric characteristic detecting function, first, the connection switching portion 23 is controlled, as shown in FIG. 4, among the probes P1, P2 that are in contact with the first contact points 6a, 6b, and any one of the first contact points 6a, 6b. The probes P1 and P2 that are in contact (the probe P1 that is in contact with the contact point 6a in the example of FIG. 4) are connected to the detection unit 22 via the connection switching unit 23. In addition, among the probes P3 to P6 that are in contact with the second contact points 7a to 7d, Probes P3 to P6 (probes P4 that are in contact with the contact point 7b in the example of FIG. 4) that are in contact with any one of the first contact points 7a to 7d of the first selected contact point are connected to the detecting portion via the connection switching portion 23 and the detecting portion. 22 connections. Further, among the probes P7 to P10 that are in contact with the third contact points 8a to 8d, the probes P7 to P10 that are in contact with any one of the third contact points 8a to 8d selected as the second selected contact point (Fig. 4 In the example of the drawing, the probe P10) that is in contact with the contact point 8d is connected to the detecting portion 22 via the connection switching portion 23. At this time, the connection relationship between the probe P other than the probes P1, P4, and P10 and the detecting unit 22 is turned off by the connection switching unit 23.

Next, between the first connecting portions 3a, 4a and the second connecting portions 3b, 4b of the first and second capacitors 3, 4, the detecting portions are passed through the contact points 6a, 7b, 8d and the probes P1, P4, P10. The power supply unit 22a of the 22 applies electric power for detecting the capacity of the capacitor (in the present embodiment, for example, an alternating current of constant output), and detects supply to the capacitor 3 by either or both of the voltage measuring unit 22b and the current measuring unit 22c. One or both of the voltage and current of 4, and the capacitance of the capacitors 3 and 4 are detected based on the detection result.

Here, various methods can be employed as the detection method of the capacitor capacity. For example, in the present embodiment, since the capacitances of the two capacitors 3 and 4 are the same, the combined capacitance of the two capacitors 3 and 4 in the parallel relationship is detected, and the detected combined capacitance is divided by two. The capacitor capacity of each of the capacitors 3, 4 can be obtained. As a method of measuring the combined capacitance of the capacitors 3 and 4, various methods may be employed. As an example, for example, when an alternating current is applied between the connecting portions 3a and 4a and the connecting portions 3b and 4b, The voltage between the connection portions 3a, 4a and the connection portions 3b, 4b and the current flowing between the connection portions 3a, 4a and the connection portions 3b, 4b are measured, and the combined capacitance is calculated based on the voltage measurement value and the current measurement value.

Further, in the present embodiment, the case where the capacitor capacities of the first and second capacitors 3 and 4 are the same has been described. However, in the case where the capacitor capacities of the two capacitors 3 and 4 are different, it is only necessary to know two capacitors in advance. With a capacitance ratio of 3 and 4, the capacitor capacity of each of the capacitors 3, 4 can be obtained based on the capacitance ratio and the combined capacitance of the two capacitors 3, 4 detected as described above. In addition, in the case where the capacitance ratio of the two capacitors 3 and 4 is not known, for example, the method described in the prior patent application (Japanese Patent Application No. 2011-255349) by the present applicant can be used. The portion 22 detects the capacitance ratio of the two capacitors 3, 4 to obtain the capacitor capacities of the respective capacitors 3, 4. In this case, it is necessary to provide two power supply units 22a in the detecting unit 22, and at least one of the voltage measuring unit 22b and the current measuring unit 22c needs to be provided in two. Further, in this case, the detection of the capacitance ratio is performed using either one of the contact points 6a and 6b and the first and second selection contact points (for example, the contact points 7b and 8d) set as described above.

As described above, according to the present embodiment, when detecting the capacitor capacities of the first and second capacitors 3, 4, the second contact point is selected from the plurality of second contact points 7a to 7d and the third contact points 8a to 8d. The resistance value of the wiring path 10 between 7a and 7d and the first connection portion 5a of the impedance element 5 and the resistance value of the wiring path 11 between the third contact point 8a to 8d and the second connection portion 5b of the impedance element 5 are values. In the manner of the combination of the closest values, one second contact point 7a-7d and the third contact point 8a-8d are selected as the first and second selected contact points, respectively. Further, via the probes P1, P2 connected to any one of the first contact points 6, and any one of the second contact points 7a to 7d and the third contact point which are respectively selected as the first selected contact point and the second selected contact point, respectively The probes P3 to P6 and the probes P7 to P10 respectively connected to 8a to 8d detect the capacitor capacities of the first and second capacitors 3 and 4. Therefore, the voltage levels of the connecting portions 5a, 5b on both sides of the impedance element 5 can be maintained at substantially the same level, the influence of the impedance element 5 can be sufficiently suppressed, and the first and second capacitors 3, 4 can be correctly detected. Capacitor capacity.

Further, when the first and second selection contact points are selected, the resistance value of the wiring path 10 between each of the second contact points 7a to 7d and the connection portion 5a and between the respective third contact points 8a to 8d and the connection portion 5b The resistance value of the wiring path 11 is automatically calculated based on design data and the like related to the wiring and the via holes in the respective wiring paths 10, 11, and the selection of the first and second selection contact points is automatically performed based on the calculation result. Therefore, it is possible to reduce the burden on the operator related to the selection work of the first and second selection contact points.

Further, when the first and second selection contact points are selected, the structure of the wiring path 10 between the respective second contact points 7a to 7d and the connection portion 5a and the respective third contact points 8a to 8d and the connection portion are schematically shown. The wiring circuit patterns 31, 32 of the structure of the wiring path 11 between 5b are automatically formed based on the design data, and the above-described resistance value of the calculated wiring paths 10, 11 is one. It is displayed on the display unit 26. Therefore, based on the display content of the display unit 26, the operator can easily understand the structure and resistance value of the wiring path 10 between the respective second contact points 7a to 7d and the connection portion 5a, and the respective third contact points 8a to 8d. The structure and resistance value of the wiring path 11 between the connection portion 5b can easily confirm the correctness of the selected first and second selection contact points.

Next, a modification of the configuration of the above embodiment will be described. In the above configuration, the control unit 27 automatically selects the first and second selection contact points from the plurality of second contact points 7a to 7d and the third contact points 8a to 8d, but the operator may perform the first The selection of the first and second selection contact points, and the selected content is input to the electrical characteristic detecting device 2 via the input receiving unit 24. In this case, for example, by referring to the structure of the wiring path 10 between the respective second contact points 7a to 7d and the connection portion 5a given by the control portion 27, and the respective third contact points 8a to 8d and the connection portion 5b The resistance values of the above-described wiring circuit patterns 31 and 32 and the wiring paths 10 and 11 of the configuration of the wiring path 11 between the two can easily select the first and second selected contact points.

Further, in the above-described embodiment, the target portion of the wiring path provided on the detection target substrate 1 for causing the control unit 27 to calculate the resistance value and the wiring circuit pattern is set in advance as each of the second contact points 7a. ~7d and the wiring path 10 between the connection portion 5a and the wiring path 11 between the third contact points 8a to 8d and the connection portion 5b. As a modification of this point, the control unit 27 can be determined (set input) based on the instruction input by the operator via the input receiving unit 24, and the control unit 27 can perform the resistance value in the wiring path on the detection target substrate 1. Calculate and make the object portion of the wiring circuit diagram.

1‧‧‧Detection substrate

3‧‧‧First capacitor

3a‧‧‧First connection

3b‧‧‧Second connection

4‧‧‧second capacitor

4a‧‧‧First connection

4b‧‧‧Second connection

5‧‧‧impedance components

5a‧‧‧First connection

5b‧‧‧Second connection

6a, 6b‧‧‧ first touch point

7a~7d‧‧‧second touch point

8a~8d‧‧‧ third contact point

9~11‧‧‧Wiring path

P1~P10‧‧‧ probe

Claims (5)

An electrical characteristic detecting method in which a triangular circuit for connecting first to third electronic components into a triangular shape is provided in a substrate to be detected, and a first contact point and a plurality of second and second portions are provided on a surface of the detection target substrate a third contact point, the first contact point being electrically connected to the first connection portion of the first electronic component and the first connection portion of the second electronic component electrically connected to each other via a wiring path, each of the second contact points being respectively via a wiring path electrically connected to the second connection portion of the first electronic component and the first connection portion of the third electronic component that are electrically connected to each other, each of the third contact points being electrically connected to each other via a wiring path The second connection portion of the second electronic component and the second connection portion of the third electronic component, the electrical characteristic detecting method is an electrical characteristic detecting method for detecting electrical characteristics of the first electronic component and the second electronic component The electric characteristic detecting method includes: a contact point selecting step, wherein, from the plurality of the second contact points and the third contact point, a resistance value of the wiring path between the second contact point and the first connection portion of the third electronic component or the second connection portion of the first electronic component, and the third contact point and the third electron Selecting a second contact point and the third each of the second connection portion of the component or the resistance value of the wiring path between the second connection portion of the second electronic component is a combination of the closest values a contact point as the first and second selection contact points; and an electrical characteristic detecting step, wherein the probe connected to the first contact point, the probe connected to the first selected contact point, and the second selected contact are Point-connecting probes to detect electrical characteristics of the first electronic component and the second electronic component. The method of detecting an electrical characteristic according to the first aspect of the invention, characterized in that in the contact point selecting step, design data relating to wirings and through holes constituting the wiring path provided on the substrate to be inspected is pre-memorized Determining, between the predetermined information processing unit, a predetermined information processing unit between the second contact point and the first connection portion of the third electronic component or the second connection portion of the first electronic component based on the design data a resistance value of the wiring path, and a resistance value of the wiring path between each of the third contact point and the second connection portion of the third electronic component or the second connection portion of the second electronic component, and The calculated resistance value is displayed on a predetermined display portion. An electrical characteristic detecting method according to claim 2, wherein in the contact point selecting step, the information processing unit causes the information processing unit to make a wiring circuit pattern based on the design data stored in the memory portion, and to fabricate the wiring pattern The circuit diagram is displayed on the display unit together with the calculated resistance value, wherein the wiring circuit diagram connects the wiring image elements and the via image elements indicating the wirings and the vias included in the wiring paths. a structure of the wiring path between each of the second contact points and the first connection portion of the third electronic component or the second connection portion of the first electronic component, and each of the third contact points and the first The structure of the wiring path between the second connection portion of the three electronic component or the second connection portion of the second electronic component. The method of detecting an electrical characteristic according to the first aspect of the invention is characterized in that, in the contact point selecting step, design data relating to wirings and through holes constituting the wiring path provided on the substrate to be inspected are pre-memorized Determining, by the predetermined information processing unit, the predetermined information processing unit based on the design data for each of the second contact point and the first connection portion of the third electronic component or the second connection portion of the first electronic component a resistance value of the wiring path between the wiring lines, and a resistance value of the wiring path between each of the third contact points and the second connection portion of the third electronic component or the second connection portion of the second electronic component, And selecting the first selected contact point and the second selected contact point from the plurality of the second contact points and the third contact point based on the result of the calculation. An electrical characteristic detecting device is provided with a triangular circuit for connecting first to third electronic components into a triangular shape in a substrate to be detected, and a first contact point and a plurality of second and second portions are provided on a surface of the detection target substrate a third contact point, the first contact point being electrically connected to the first connection portion of the first electronic component and the first connection portion of the second electronic component electrically connected to each other via a wiring path, each of the second contact points being respectively via a wiring path electrically connected to the second connection portion of the first electronic component and the first connection portion of the third electronic component that are electrically connected to each other, each of the third contact points being electrically connected to each other via a wiring path a second connecting portion of the second electronic component and a second connecting portion of the third electronic component, wherein the electrical characteristic detecting device is an electrical characteristic detecting device that detects electrical characteristics of the first electronic component and the second electronic component , The electric characteristic detecting device includes: an inspection jig having a plurality of probes respectively connected to the first contact point, the second contact point, and the third contact point; and a detecting unit, the detecting unit Detecting electrical characteristics of the first electronic component and the second electronic component via the probe of the inspection jig; and connecting a switching portion that performs an electrical connection relationship between the probe and the detecting portion of the inspection jig And a control unit that controls the detection unit and the connection switching unit, wherein the control unit selects the second contact point and the third one of the plurality of second contact points and the third contact point a resistance value of the wiring path between the first connection portion of the electronic component or the second connection portion of the first electronic component, and the second contact point and the second connection portion of the third electronic component or the Selecting a second contact point and the third contact point as the first and the first in a manner that the resistance value of the wiring path between the second connection portions of the second electronic component is the closest value Selecting a contact point, and the control portion controls the inspection portion and the connection switching portion via the probe connected to the first contact point, the probe connected to the first selected contact point, and the second selection contact The probe connected to the point detects the electrical characteristics of the first electronic component and the second electronic component.