TW201428305A - Inspection method for test jig - Google Patents

Abstract

The object of the present invention is to easily detect whether a plurality of inspection probes conductively connected with the VG network has the desired insulating properties. The present invention provides an inspection method for test jig, comprising the following steps: mounting the test jig on a substrate inspection apparatus, in a state of the substrate inspection apparatus being not mounted with a substrate, whilst selecting a plurality inspection probes in contact with a wiring pattern which is set to be in contact with a plurality of inspection probes as one end group, choosing inspection probes other than the selected inspection probes as the other end group; using an inspection tool to generate a predetermined potential difference between the inspection probes of one end group and inspection probes of the other end group; calculating the insulating state between the inspection probes of one end group and inspection probes of the other end group while the potential difference being generated; according to the calculation result, determining whether the insulating state between the inspection probes of one end group and inspection probes of the other end group is good or not.

Description

Detection method of detection fixture

The present invention relates to an electrical connection substrate and substrate detecting device for detecting a good or bad detecting jig of a wiring pattern formed on a substrate.

Further, the present invention is not limited to a printed wiring board, and can be applied to, for example, a flexible substrate, a multilayer wiring board, a liquid crystal display or an electrode plate for a plasma display, and an electric circuit in various substrates such as a package substrate for a semiconductor package or a film carrier. In the detection of wiring, these various wiring boards are collectively referred to as "substrate" in the present specification.

A wiring pattern composed of a plurality of wirings is formed on the substrate, and various substrate detecting devices have been proposed and practically applied in order to detect whether or not the wiring patterns are designed as designed.

As such a substrate detecting device, for example, it is possible to select a detection position on a wiring pattern of any two of a plurality of wiring patterns constituting a wiring pattern, and to detect electrical characteristics such as whether the circuit is disconnected or the circuit is turned on between the detection positions. Device.

In such an apparatus, the conduction state of the substrate to be detected and the control unit for processing the electrical signal can be realized by a jig that holds a plurality of probes for detection. The detecting jig includes: a detecting probe having one end in conductive contact with a predetermined position of a wiring pattern formed on the substrate; a connecting portion electrically connected to the control portion; and a cable electrically connecting the detecting probe and the connecting portion unit.

Recently, the substrate wiring pattern is being complicated and miniaturized, and the detection point set on the wiring pattern is made finer and the pitch is narrower, and in order to adapt to this, the diameter of the detection probe is reduced or The detecting probe is placed at a fine pitch to manufacture a detecting jig.

Further, the substrate has a wiring pattern called a signal network (signal line) inside and outside the substrate, and a wiring pattern such as a power supply layer or a ground layer called a VG network (power supply wiring and ground wiring). . At this time, for the signal line, the detection probe is placed in contact with both ends of the wiring (wiring pattern), and a plurality of detection probes are placed in contact with the VG network.

The detection jig generally needs to be formed by disengaging a predetermined cable portion from a predetermined connection portion and electrically connecting it to a predetermined detection probe. For this reason, an invention of a test method of a test jig disclosed in Patent Document 1, for example, has been proposed.

In the invention disclosed in Patent Document 1, a method of attaching a test jig to a test machine and detecting the wiring of the test jig by a test machine without using a special wiring detecting device such as a flying probe is disclosed. Further, in the invention, in order to perform the test jig detection, the theoretical output value of the test channel is used from the test channel in the test machine.

In particular, recently, probes for detection have been formed at a fine pitch. In the detection method of the test jig of Patent Document 1, even if the conduction and ‧ short-circuit states of the respective wires of the detection jig are good, it is impossible to detect whether or not the plurality of detection probes that are in conduction with the VG mesh are sufficient as a whole. Insulation.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-55985

The present invention has been made in view of the above circumstances, and provides a detection method for detecting whether or not a plurality of detection probes connected to a VG network of a detection jig have a desired insulating property in order to detect a VG network.

According to an embodiment of the present invention, there is provided a detecting method of a detecting jig for detecting a detecting jig for electrically connecting a wiring pattern and a detecting tool, wherein a plurality of wiring patterns are formed on the substrate, and the detecting tool is disposed on the substrate detecting device When the wiring pattern of the substrate is detected, the detection jig is attached to the substrate detecting device, and in the state where the substrate is not mounted on the substrate detecting device, a wiring pattern that contacts the plurality of detecting probes is selected to be in contact with each other. When a plurality of detection probes are used as one end group, a detection probe group other than the one end group is selected as the other end group, and a detection probe group at one end group and a detection probe group at the other end group are selected. In the meantime, a predetermined potential difference is generated by the detection tool, and an insulation state between the detection probe group of the one end group and the detection probe group of the other end group when the potential difference is generated is calculated, and the one end group is calculated based on the calculation result. The determination of the insulation state between the detection probe group and the detection probe group of the other end group is good or not.

According to an embodiment of the present invention, in order to use the detection tool, a predetermined potential difference is generated between the detection probe group of one end group and the detection probe group of the other end group, and the detection probe of the one end group is connected in series The group and the upstream terminal of the detecting tool are connected in series to the detecting probe group of the other end group and the downstream side terminal of the detecting tool.

According to an embodiment of the present invention, the determination of the goodness of the detection jig based on the calculation result is performed by comparing the calculation result with a preset reference value.

According to the present invention, it is possible to easily detect whether or not a plurality of detecting probes that are electrically connected to the VG mesh disposed in the detecting jig have desired insulating properties.

By using the upstream side and the downstream side terminal of the detecting tool connected in series with the substrate detecting device, the substrate detecting device can be effectively utilized to provide a detecting method of the detecting jig.

By comparing with a preset reference value, it is possible to determine whether or not the detection jig of the VG net of the substrate is good or not. Moreover, by setting this reference value for each VG network, the detection precision of the detection jig can be improved.

1. . . Detection fixture

1a. . . Upper detection fixture

1b. . . Lower detection fixture

12. . . Detection probe

13. . . Hold body

131. . . Front end guide

132. . . Back end guide

133. . . Support

14. . . Electrode body

141. . . Electrode part

142. . . Electrode support

143. . . board

15. . . Cable

16. . . Connector

161. . . Connection

2. . . Substrate detecting device

20. . . Control tool

twenty one. . . Selection tool

twenty three. . . Power tool

twenty four. . . Current detection tool

27. . . Decision tool

28. . . Display tool

29. . . Memory tool

A, B, C, D, E, F, G. . . Wiring

CB. . . Substrate

CP. . . Detection probe

CP1~CP5. . . Electrical pathway

SW1, SW2. . . Switching element

SWs. . . Switch group

1~30. . . symbol

Fig. 1 is a schematic view showing the configuration of a detecting jig according to the present invention.
Fig. 2 is a schematic view showing the relationship between a substrate and a detecting jig.
Fig. 3 is a schematic configuration diagram showing a configuration of a substrate detecting device.
Fig. 4 is a view showing an embodiment of a detection state of the detecting jig when the substrate detecting device is used.

Preferred embodiments for carrying out the invention will now be described.

The detection jig 1 for detecting according to the detection method of the present invention will be described. Fig. 1 is a schematic view showing the configuration of a detecting jig according to the present invention. The detecting jig 1 shown in Fig. 1 includes a plurality of detecting probes 12, a holding body 13 for holding the detecting probes 12 in a multi-needle shape, and a supporting probe 12 while supporting the holding body 13. An electrode body 14 of a plurality of electrode portions 141 that are in contact with each other; a connector 16 having a plurality of connection portions 161 for electrically connecting to a detecting tool (not shown) of the substrate detecting device; and an electrode for electrically connecting The portion 141 and the cable 15 of the connecting portion 161. In Fig. 1, the detection probe 12 and the cable 15 are shown as three, respectively.

The detecting probe 12 is a terminal that is in contact with each detecting point of the wiring pattern formed on the substrate to be inspected, and the leading end thereof is in contact with the detecting point, and the rear end thereof is in contact with the electrode portion 141, and further, the detecting point and the electrode portion. 141 electrical connection. The detecting probe 12 is formed to contact the detecting point and the electrode portion 141 by pressing. For example, it is formed by a spring having a telescopic shape in the longitudinal direction of the detecting probe 12, or a member having a cylindrical shape having conductivity and flexibility. In the first drawing, as the detecting probe 12, a needle-shaped member having conductivity and flexibility is shown.

The holder 13 guides the distal end of the plurality of detection probes 12 to each predetermined detection point, and guides the rear end of the detection probe 12 to each predetermined electrode portion 141. The holding body 13 is not particularly limited. For example, as shown in FIG. 1, it may be formed to include a leading end guiding portion 131 that guides the leading end of the detecting probe 12 to the detecting point and a leading end to the electrode portion 141. The rear end guide portion 132 and the support portion 133 having a predetermined space and supporting the front end guide portion 131 and the rear end guide portion 132.

The front end guide portion 131 may be a plate-like member formed with a guide hole that guides the tip end of the detecting probe 12 to the detection point. Further, the front end guide portion 131 may be formed of one plate member or may be formed by laminating a plurality of plate members. The rear end guide portion 132 may be a plate-like member formed with a guide hole that guides the rear end of the detecting probe 12 to the electrode portion 141. Further, the rear end guide portion 132 may be formed of one plate member as in the front end guide portion 131, or may be formed by laminating a plurality of plate members. By arranging the distal end guide portion 131 and the rear end guide portion 132 in a predetermined space, when the flexible needle-shaped detecting probe 12 is used, the detecting probe 12 can be bent in this space.

The electrode body 14 is configured to have a plurality of electrode portions 141 that are electrically connected to the rear ends of the plurality of detecting probes 12. This electrode body 14 is for supporting the holding body 13 and the connecting body 16 which will be described later. The electrode body 14 has a position determining plate 143 as a base when the detecting jig 1 is attached to the substrate detecting device, and has an electrode supporting portion 142 for holding the electrode portion 141. The plate 143 is a plate-like member formed to match the substrate detecting device, and has an appropriate strength and size for the purpose of determining the position. The electrode support portion 142 is disposed to protrude from the plate 143 as shown in the embodiment of Fig. 1 . By such formation, a space in which the cable 15 to be described later is disposed is formed in the electrode portion 141. As shown in Fig. 1, the electrode assembly 14 is formed such that the detection probe 12 is disposed upward from one side (the right side of the paper surface), and the connection portion 161 to be described later is disposed downward from the other side (the left side of the paper surface).

One end of the cable 15 is electrically connected to the electrode portion 141, and the other end is electrically connected to the connecting portion 161, thereby having a function of electrically connecting the electrode portion 141 and the connecting portion 161. This cable 15 can be, for example, a wire.

The connector 16 is a connector portion that is electrically connected to the substrate detecting device. The detecting probe 12 is electrically connected to a detecting tool (not shown) of the substrate detecting device by the connecting body 16, and the wiring pattern of the substrate is electrically connected to the detecting tool. The number of the connecting portions 161 of this connecting body 16 is configured to be equal to or larger than the number of detecting probes 12. Although not illustrated, the substrate detecting device is provided with a connecting portion on the detecting device side that is connected to the connecting portion 161 of the connecting body 16.

The detecting jig 1 is configured as described above, and the detection point provided on the wiring pattern of the substrate is electrically connected to the detecting tool of the substrate detecting device via the detecting probe 12, the electrode portion 141, the cable 15 and the connecting portion 161. At this time, the detecting probe 12, the electrode portion 141, the cable 15 and the connecting portion 161 are formed to have a good conduction state as one conductive path, and need to be kept insulated from other conductive paths. Further, the detection points are set based on the wiring pattern of the substrate, and the number or position of the detecting probes 12 that are in contact with each other is determined based on the number or position of the detection points.

Next, the wiring formed on the detecting jig 1 will be described. Fig. 2 is a schematic view showing an embodiment of the wiring of the detecting jig, showing the arrangement of the detecting probes of the upper and lower detecting jigs according to the upper and lower surfaces of the substrate. In the substrate shown in FIG. 2, the substrate is shown by a schematic cross-sectional view, and the wiring pattern of the substrate is described. In the substrate CB of Fig. 2, wirings A, B, E, F, G as signal lines and wirings C and D as VG nets are shown. Further, a detection point for detecting each wiring is set on the substrate (the upper side and the lower side), and a detection probe that is in conduction contact with the detection point is displayed (the other components are omitted), and a reference symbol for explanation is given to each detection probe. (the symbols 1 to 14 in the upper detecting jig 1a and the symbols 21 to 30 in the lower detecting jig 1b are illustrated).

As described above, the substrate CB shown in FIG. 2 has the wiring A to the wiring G, and in order to detect the conduction and the short-circuit of the wirings A to G, the upper detecting jig 1a and the lower detecting jig that are in contact with the upper surface of the substrate CB are prepared. 1b, and the predetermined position of each wiring is set as a detection point. In the substrate CB of Fig. 2, 14 detection points are set on the upper surface side of the substrate CB, and 10 detection points are set on the lower surface side. In this detection point, the upper detection jig 1a has 14 detection probe lower detection jigs 1b having ten detection probes in order to be in contact with the 14 detection points on the upper side.

A method of detecting the wiring pattern of the substrate CB will now be briefly described.

In the substrate CB, since the wiring A to the wiring G are formed, the detection of the conduction and the short-circuit of the wiring A to the wiring G is performed. The detection procedure of the wiring A to the wiring G is not particularly limited, and the conduction of each wiring can be detected, and then the short circuit of each wiring can be detected.

When the wiring pattern of the substrate CB of FIG. 2 is detected, first, the conduction detection of the wiring A to the wiring G is performed. At this time, the wiring A selects the No. 1 detecting probe of the upper detecting jig and the No. 21 detecting probe of the lower detecting jig, and the electric signal is supplied by the No. 1 detecting probe and the No. 21 detecting probe. In the same manner as in the wiring B, the wiring E, the wiring F, and the wiring G, the detection probe is selected from the upper detection jig 1a and the lower detection jig 1b, and an electrical signal for conduction detection is supplied.

In the wiring C and the wiring D, since a plurality of detection probes are set in the upper detection jig 1a and the lower detection jig 1b, for example, two detection probes are selected from each of the detection probes, and a round robin is further performed. Turn-on detection of the number of times. For example, in the case of the wiring C, conduction detection of the combination of the probe No. 3 and the probes of No. 5, No. 9, 13, 23, and 29 is performed, and then the probe No. 5 and the probes 9 and 13 are implemented. The conduction detection of the four combinations of the detection probes No. 23 and No. 29 was carried out in the same manner as in the order of the detection probes Nos. 13, 23, and 29. In the above-described conduction detection, although the combination having no repetition has been described, the conduction detection may be repeated with repetition.

When the conduction detection of the wirings A to G is performed, the short-circuit detection of the wiring A to the wiring G is performed. At this time, select one wiring and check the insulation state with other wirings. When the insulation detection of the wiring A of the substrate CB is performed, the wiring A is selected as one end, and the wiring B to the wiring G is selected as the other end, and is divided into two groups, and the insulation state between the groups is measured. More specifically, one of the No. 1 detecting probe or the No. 21 detecting probe which is one end of the wiring A is selected, and the detecting probe connected to the wiring B to the wiring G as the other end is selected from each wiring. Select at least one of them, and use an electrical signal to calculate the insulation state between one end and the other end. Similarly, the insulation detection of the wiring B to the wiring G is performed. In the above-described insulation detection, although the repeated combination has been described, the insulation detection may be performed based on a combination that is not repeated.

The detection of the detection jig and the wiring of the substrate using the detection jig has been described above.

Next, a method of detecting the detecting jig will be described.

As described above, the detecting jig 1 is formed such that the electrical path from the detecting probe 12 to the connecting portion 161 is electrically conducted and insulated from other electrical paths. However, in the electrical path of the detecting probe connected to the VG network of the substrate CB, in actual detection, a plurality of electrical paths are connected to one wiring (wiring C or wiring D in FIG. 2) even if the electrical path is individual. Conduction ‧ Insulation is good, but there may be problems with electrical influences from other electrical paths when performing actual tests.

In view of the above, in the detecting method of the detecting jig of the present invention, even if the electrical paths of the detecting jig are turned on and the short circuit is in a good state, in order to detect the wiring pattern such as the VG mesh, it is possible to detect whether or not the detecting jig is manufactured satisfactorily.

The detection method of the detection jig of the present invention will be described with reference to the substrate CB of Fig. 2 . In the substrate CB of FIG. 2, the wiring C and the wiring D are wirings that electrically connect a plurality of detection probes 12. In the wiring C, the detection probes 12 of No. 3, No. 5, No. 9 and No. 13 are set in the upper detection jig 1a, and the detection probes 12 on the 23rd and 29th are set in the lower detection jig 1b. In the wiring D, the detecting probes 12 of No. 4, 6, 8, 10, and 12 are set in the upper detecting jig 1a, and the detecting probes 12 in the 24, 26, and 28 are set in the lower detecting jig 1b.

First, the insulation state of the electrical path set by the plurality of detection probes 12 connected to the wiring C of the upper detection jig 1a is detected. Specifically, first, the detection probes 12 (symbols 3, 5, 9, and 13) connected to the wiring C are selected as one end group, and all the remaining detection probes 12 of the upper detection jig 1a are selected (symbol 1, 2, 4, 6, 7, 8, 10, 11, 12, 14) as the other end group.

Next, a potential difference is generated between the selected one end group and the other end group. For example, a power tool such as a DC power source capable of applying a predetermined voltage is prepared, and an electrical one end side is connected in series to one end group (in this case, the detecting probe itself is connected in parallel), and the other end side is electrically connected in series with the other end group. . Then, by applying a predetermined voltage by the power tool, a predetermined potential difference is generated between the one end group and the other end group.

Next, an insulation state when a predetermined potential difference occurs between the one end group and the other end group is calculated. For example, according to the power tool described above, by measuring a current when a predetermined potential difference is generated between one end group and the other end group, the resistance value between the one end group and the other end group is calculated from the measured voltage value and current value. Based on the calculated resistance value, the insulation state between the one end group and the other end group can be determined. At this time, by setting a predetermined reference value for determining the insulation state in advance, the reference value is compared with the calculated result value, and the determination can be performed. From the result of this insulation state, it is possible to know whether or not the insulation state of the wiring C of the upper detecting jig 1a is good or not.

The substrate CB is formed from the wiring D, and then the insulating state of the detecting probe 12 of the upper detecting jig 1a related to the wiring D is detected. At this time, the detection probes 12 of No. 4, 6, 8, 10, and 12 which are electrically connected to the wiring D are selected as one end group, and the remaining detection probe 12 of the upper detection jig 1a is used as the other end group, and the end group is calculated. Insulation state with the other end group. As a result, when the insulation state of the one end group and the other end group is good, it is judged that the upper detection jig is also formed well.

As a result, it can be judged that the upper detecting jig 1a is manufactured satisfactorily.

The detection method of the lower detection jig 1b is also the same as that of the upper detection jig. First, the detection probes 12 of No. 23 and No. 29 of the wiring C are selected as one end group, and all the remaining detection probes 12 of the lower detection jig 1b are selected as the other end. group. The insulation state of the one end group and the other end group is detected. In the same manner, for the insulation detection of the detection probe group for the wiring D, the detection probes 12 of No. 24, No. 26, and No. 28 are selected as one end group, and all the remaining detection probes 12 of the lower detection jig 1b are selected as the other end. group.

In this way, the detection probes for the respective wirings are selected, and the insulation state of the detection jig can be detected by performing insulation detection of each group.

The detection method of the detection jig can be performed in a state where the detection jig is attached to the substrate inspection device. Although the details will be described later, in this case, in a state where the detecting jig 1 is connected to the substrate detecting device 2, and the substrate CB is not mounted (the substrate CB is not in contact with the detecting jig), the detection is performed. In view of this, this detection is performed when the detecting jig 1 is mounted on the substrate detecting device 2. Although the details will be described later, the detecting jig 1 can perform detection using the substrate detecting device 2.

Each element constituting the substrate detecting device 2 will be described. The control tool 20 controls the switch group SWs, including the selection tool 21, the determination tool 27, and the memory tool 29. The selection tool 21 selects one wiring pattern or detection probe 12 to be detected, or a wiring pattern or a detection probe other than the detection target among the plurality of wiring patterns included in the substrate CB.

A specific selection method is to use a switch group SWs having a plurality of switching elements SW1 and SW2 and a selection tool 21 (SW switching control tool) for switching and controlling the respective switching elements, according to the opening of each of the switching elements SW1 and SW2 in accordance with the selection tool 21. ‧The switching operation is performed, and the detection target is selected and implemented.

Here, FIG. 3 shows a schematic configuration diagram of the substrate detecting device 2, but the detecting jig 2 is indicated by a portion indicated by a symbol CP in the drawing. Each of the detection probes CP can be connected to the power supply tool 23 via the switch SW1, and can be connected to the current detection tool 24 via the switch SW2.

In order to set a predetermined potential difference between the detection targets, the power tool 23 is connected by each symbol SW1 to apply a predetermined voltage. According to this power tool 23, the voltage between the detection targets (one end group and the other end group) can be changed. The power tool 23 may have a predetermined potential difference, and may be a DC power source or an AC power source, and is not particularly limited. The predetermined potential difference applied by the power tool 23 is not particularly limited.

As shown in FIG. 3, the current detecting tool 24 detects a current by connecting the switch SW2 and the detecting probe CP to the detection target in series. This current detecting tool 24 uses an ammeter capable of measuring a current value. When the current detecting tool 24 measures the current value, it transmits it to the determining tool 27 to be described later.

A voltage detecting tool (not shown) for detecting a voltage between the detection targets can be provided. This voltage detecting tool can use a voltmeter that can measure the voltage value between the detected objects. The voltage value measured by this voltage detecting tool is sent to the determination tool 27.

The determination tool 27 receives the measurement current value from the current detection tool 24 and the measurement voltage value from the voltage detection tool, and determines whether or not the substrate is a defective product based on the measurement value, and determines the detection target between the detection jigs (the The insulation state between a group and a second group.

The determination by the determination tool 27 prepares a reference value that can be judged to be good, and calculates the resistance value by calculating the current value from the current detection tool 24 and the voltage value from the voltage detection tool, and calculating the resistance value. The comparison of the value with the above reference value.

The memory tool 29 stores information on the substrate CB, information on the detection jig 1, information such as a reference value, and the like. The display tool 28 can display the detection result or the calculation result and the measurement result.

Next, a specific detection method will be described using the substrate detecting device 2.

Fig. 4 is a view showing an embodiment in which the detecting jig 1 is attached to the substrate detecting device and the operation of the detecting jig 1 is performed. In FIG. 4, five detection points are arbitrarily provided as the substrate CB corresponding to the detection jig 1, and five detection probes 12 (electrical paths CP1 to CP5) are provided to the detection jig 1 for the detection surface of the substrate CB. . And the substrate CB has three signal lines and one VG network.

As a state in which the detecting jig 1 is mounted on the substrate detecting device 2 and before the substrate CB is mounted, for example, the insulating state of the detecting jig 1 of the VG mesh for the substrate CB can be detected. At this time, the detection probes CP1, CP2, and CP5 are selected as the one end group, and the detection probes CP3 and CP4 are selected as the other end group. Specifically, in order to turn on the upstream terminal and the detection probes CP1, CP2, and CP5 of the power tool 23, the corresponding switches SW1 are turned ON. Next, in order to turn on the downstream side terminal (current detecting tool 24) of the power supply tool 23 and the detecting probes CP3 and CP4, the corresponding switches SW2 are turned ON. Thus, by switching the switching elements, one end group and the other end group can be set.

When the setting of the one end group and the other end group is completed, an electric signal for detecting the insulation state is supplied from the power source tool 23, and a predetermined potential difference is applied between the one end group and the other end group. When a predetermined potential difference is applied to the one end group and the other end group, the current value is measured by the current detecting tool 24. Based on this current value and voltage value, the resistance values of the one end group and the other end group are calculated. The insulation state of the one end group and the other end group is determined based on the calculated resistance value. From the result of this determination, it is possible to detect whether or not the detecting jig 1 has a good state.

The above is the description of the detection method of the detecting jig according to the present invention.

1. . . Detection fixture

12. . . Detection probe

13. . . Hold body

131. . . Front end guide

132. . . Back end guide

133. . . Support

14. . . Electrode body

141. . . Electrode part

142. . . Electrode support

143. . . board

15. . . Cable

16. . . Connector

161. . . Connection

Claims (3)

A detecting method for detecting a jig, detecting a detecting jig for electrically connecting a wiring pattern and a detecting tool, wherein a plurality of wiring patterns are formed on the substrate, and the detecting tool is disposed on the substrate detecting device to detect a good wiring pattern of the substrate no;
Mounting the detecting fixture on the substrate detecting device;
In a state where the substrate is not mounted on the substrate detecting device, the plurality of detecting probes that are in contact with a wiring pattern that contacts a plurality of detecting probes are selected as one end group, and the selection is selected in addition to the selected one. As the other end group, the detection probe other than the one end group;
A predetermined potential difference is generated between the detection probe group of the one end group and the detection probe group of the other end group by the detection tool;
Calculating an insulation state between the detection probe group of the one end group and the detection probe group of the other end group when the potential difference is generated;
Based on the calculation result, the determination of the insulation state between the detection probe group of the one end group and the detection probe group of the other end group is performed. The detection method of the detection jig according to the first aspect of the invention, wherein the detection device generates a predetermined potential difference between the detection probe group of the one end group and the detection probe group of the other end group. ;
Connecting the detection probe group of the one end group and the upstream side terminal of the detection tool in series;
The detection probe group of the other end group and the downstream side terminal of the detection tool are connected in series. The detection method of the detection jig according to claim 1 or 2, wherein the determination of the goodness of the detection jig based on the calculation result is performed by comparing the calculation result with a predetermined reference value.