CN105209924A - Board inspection method - Google Patents
Board inspection method Download PDFInfo
- Publication number
- CN105209924A CN105209924A CN201480028288.1A CN201480028288A CN105209924A CN 105209924 A CN105209924 A CN 105209924A CN 201480028288 A CN201480028288 A CN 201480028288A CN 105209924 A CN105209924 A CN 105209924A
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- Prior art keywords
- terminal
- wiring graph
- substrate
- detection
- wiring
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000007689 inspection Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims description 178
- 238000001514 detection method Methods 0.000 claims description 127
- 238000010998 test method Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 description 16
- 238000004806 packaging method and process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Environmental & Geological Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
Abstract
An inspection method that reduces the number of times an inspection is performed on multi-terminal wiring patterns is provided. A board inspection method is a method for inspecting wiring patterns of a sheet board that includes a plurality of unit boards, each having a plurality of multi-terminal wiring patterns, by connecting wiring patterns of at least two of the unit boards to a board inspection apparatus for performing electrical inspection, to determine quality of the wiring patterns. The method includes selecting one wiring pattern that is formed on one unit board and is targeted for inspection and another wiring pattern that is formed on another unit board in the same manner as the one wiring pattern, electrically connecting an arbitrary terminal of the one wiring pattern and an arbitrary terminal of the other wiring pattern to establish a short circuit between the one wiring pattern and the other wiring pattern, and performing an inspection for continuity between a terminal other than the arbitrary terminal of the one wiring pattern and a terminal other than the arbitrary terminal of the other wiring pattern.
Description
Technical field
The present invention relates to a kind of detection method and method of testing substrate of substrate, more particularly, relating to a kind of method of testing substrate improving detection beat (tact) time when detecting many-sided IC base plate for packaging.
Background technology
In the past, distribution on substrate is formed in for the IC loaded on the substrate or semiconductor device or electronic unit transceive electrical signals in addition.This distribution along with the miniaturization of recent electronic unit, and is formed finer and more complicated, has lower resistance simultaneously.As the example of this substrate, there is the substrate being called as IC base plate for packaging.
This IC base plate for packaging is used for the electrical connection or fixing of IC chip and printing distributing board, or for the protection of IC chip in case affecting by outside dust etc. or moisture.
This IC base plate for packaging, as mentioned above, owing to bearing the effect of the intermediary layer (interposer) connecting IC chip and printing distributing board, therefore IC base plate for packaging also needs the fine layout techniques corresponding with IC chip.Given this, the distribution being arranged on IC base plate for packaging is formed by very fine distribution.
This IC base plate for packaging, in order to ensure that each distribution can pass on electric signal exactly, utilize the check point be set in advance on distribution, the electrical specifications such as the resistance value between mensuration institute regular inspection measuring point or Leakage Current, and judge the whether good of this distribution based on this measurement result.
Further, this IC base plate for packaging is manufactured in a large number, but in a manufacturing process multiple IC base plate for packaging is formed as a sheet (Sheet).Given this, exist corresponding with the check point of the multiple unit substrate becoming detected object and configure multiple detection fixture and carry out the technology (such as, referenced patent document 1) of disposable detection for the multiple unit substrate in this plate shape substrates.
In patent documentation 1, for the plate shape substrates that multiple unit substrate is configured by multiple lines and multiple rows, combine multiple detection clamp head corresponding with unit substrate and form detection fixture, and detected by this detection fixture, thus multiple unit substrate is processed with disposable detection, improve detection efficiency with this. simultaneously
Further, when the substrate detection fixture using patent documentation 1 to disclose, owing to just having multiple detection clamp head corresponding with each unit substrate, therefore detection itself carries out electro-detection for each unit substrate.Especially, for use in order to supply line voltage or ground connection (ground) or for shield (shield) the distribution with multiple terminal being called as VG net (Voltage/Ground-net) for, need to carry out respectively taking turns the conduction detection of being the combination number of times dispatching (RoundRobin) mode to a terminal and other terminals.Therefore, even if having multiple detection clamp head, also need to carry out electro-detection to each unit substrate, therefore can not shorten detection time.
[prior art document]
[patent documentation]
Japanese Patent Application Publication (putting down) 8-21867 publication
Summary of the invention
Technical matters
The present invention considers this truth and realizes, and provides a kind of detection clamp head corresponding with unit substrate when detection comprises the plate shape substrates of multiple unit substrate.
Technical solution
First example of the present invention is the method for testing substrate of the wiring graph for detecting the plate shape substrates comprising multiple unit substrate, wherein, each unit substrate has multiple multi-terminal wiring graph, by the wiring graph of plural unit substrate is connected with the substrate detection apparatus being used for carrying out electro-detection, in order to judge the whether good of described wiring graph.Described method comprises the steps: to select and is formed in a unit substrate and becomes a wiring graph of detected object, and is identically formed another wiring graph in another unit substrate with a described wiring graph; In order to make a described wiring graph and another wiring graph phase short circuit described, any terminal of a described wiring graph is electrically connected with any terminal of another wiring graph described; And the conduction detection between terminal beyond described any terminal of terminal beyond the described any terminal carrying out a described wiring graph and another wiring graph described.According to second example of the present invention
2
, be arranged on substrate detection fixture for being electrically connected described substrate detection apparatus and described plate shape substrates for making a described wiring graph and the short-circuiting terminal of another wiring graph phase short circuit described.According to the 3rd example of the present invention, for making a described wiring graph be arranged on the connecting portion for being electrically connected substrate detection fixture and described substrate detection apparatus with the short-circuiting terminal of another wiring graph phase short circuit described, wherein said substrate detection fixture is for being electrically connected described substrate detection apparatus and described plate shape substrates.According to the 4th example of the present invention, to the combination of the connection of a described wiring graph and another wiring graph described all terminates, the conduction detection between the terminal beyond the terminal beyond the described any terminal carrying out a described wiring graph and described any terminal of another wiring graph described.
Beneficial effect
According to first example of the present invention, in order to make a wiring graph and another wiring graph phase short circuit, any terminal of a wiring graph is electrically connected with any terminal of another wiring graph, and then implement conduction detection between the terminal beyond above-mentioned any terminal of the terminal beyond any terminal of a wiring graph and another wiring graph, therefore can reduce detection number of times.Especially, than detection method in the past, owing to by only about half of for the reduction of detection number of times, therefore can greatly improve detection pitch time.According to second example of the present invention, substrate detection fixture for being electrically connected substrate detection apparatus and plate shape substrates is arranged on for making a wiring graph and the short-circuiting terminal of another wiring graph phase short circuit, therefore by manufacturing substrate detection fixture, just the present invention can be implemented.Given this, cheaply detection method of the present invention can be implemented.According to the 3rd example of the present invention, the connecting portion for being electrically connected substrate detection fixture and substrate detection apparatus is arranged on the short-circuiting terminal of another wiring graph phase short circuit for making a wiring graph, wherein substrate detection fixture is for being electrically connected substrate detection apparatus and plate shape substrates, therefore form short position by the connecting portion at substrate detection apparatus, without the need to forming complicated device, just energy is easy and easily carry out substrate detection.
According to the 4th example of the present invention, conduction detection between the terminal beyond the terminal beyond any terminal of a wiring graph and any terminal of another wiring graph is carried out till the connection combination of a wiring graph and another wiring graph all terminates, and therefore can carry out the conduction detection of a wiring graph and another wiring graph exactly and shorten detection time.
Accompanying drawing explanation
Fig. 1 is the planimetric map of the example that plate shape substrates is shown.
Fig. 2 is the unit substrate general profile chart of the wiring graph that detected object of the present invention is shown.
Fig. 3 is the cut-open view of the summary side elevation of substrate detection apparatus of the present invention.
Fig. 4 is the summary side elevation of substrate detection fixture of the present invention.
Fig. 5 is the diagram of the outline that the present invention's example is shown, is the diagram of state when briefly showing detection four unit substrate.
Fig. 6 is the conceptual diagram that detection method is shown.
Embodiment
Now be described for for implementing optimal morphology of the present invention.
The object of the invention is effectively to carry out to be formed with more than one to be there is the unit substrate CB of the wiring graph P of multi-terminal and the detection of the plate shape substrates B connected by multiple.For this reason, be described for the plate shape substrates B becoming detected object.
Fig. 1 shows an example of plate shape substrates B.Plate shape substrates B shown in Fig. 1 to be configured by matrix shape by multiple unit substrate CB being formed with multiple wiring graph and is formed as sheet.This substrate B, as shown in Figure 1, is formed by the matrix shape of multiple lines and multiple rows by the multiple unit substrate CB becoming detected object.This substrate B is split into each unit substrate CB after carrying out check processing etc.Constituent parts substrate CB is formed as having same multiple wiring graphs.Substrate B shown in Fig. 1 is formed by the structure of 5 row, 15 row by unit substrate CB.The line number that unit substrate CB is formed is not limited especially.Convenience in order to illustrate in this instructions and each accompanying drawing, represents the column direction of substrate B with x direction, is represented by the line direction with column direction orthogonal with y direction, and is represented with z direction in direction (normal direction) vertical for the plane for substrate B.
Be formed with the wiring graph employing the metals such as copper at unit substrate CB, and carry out conducting and the short-circuit detecting of these wiring graphs.The check point for contact terminal conducting contact described later has been preset in these wiring graphs.Further, in this manual the end points of this check point as wiring graph P is described.This check point is set to usually to connect with contact terminal and then from substrate detection apparatus transceive electrical signals.
Next, the wiring graph of multi-terminal is described.The cut-open view of the unit substrate CB shown in Fig. 2 shows three wiring graph P (P1 ~ P3).Wiring graph P1 and wiring graph P2 is the distribution of the signal net (Signal-net: so-called signal wire) be called as passing on signal, and one side is formed on the surface C B1 of unit substrate CB, and its another side is formed on the CB2 of the back side.Thus, surface C B1 and the back side CB2 of unit substrate CB can be electrically connected.Further, signal net to be set between connection two pad (land) portions thus can to carry out the transmitting-receiving of electric signal, and therefore have many compared with the situation of simple wiring path, the situation that whole path and surface area etc. are less is also many.
Wiring graph P3 uses in order to supply line voltage or ground connection or the distribution being called as VG net (Voltage/Ground-net: so-called bus plane etc.) for shielding.The embodiment of Fig. 2 shows the wiring graph having four end points and overleaf CB2 also has four end points on the surface C B1 of unit substrate CB.Need to the multiple positions supply line voltage in unit substrate CB or ground connection due to this VG net (wiring graph P3) and play the effect of the shielding to signal net simultaneously, therefore the situation by netted setting in unit substrate CB is many, and the situation that overall path length and surface area etc. are large is also many.
The object of the invention is the wiring graph P of the multi-terminal effectively detected as being formed in the wiring graph P3 on the unit substrate CB of plate shape substrates B.Plate shape substrates B has multiple unit substrate CB, and each unit substrate CB has multiple wiring graph P.This wiring graph P has signal net, also there is VG net.Further, because the present invention is applicable to detect the wiring graph of multi-terminal, therefore in explanation subsequently by substantially omit about such as wiring graph P1 or wiring graph P2 be used for connect the fixed signal net (wiring graphs at two ends) of 2.
Next, be described for the substrate detection apparatus 1 detecting substrate used in the present invention.Fig. 3 is the structure cut-open view of the substrate detection apparatus 1 illustrated about an example of the present invention.From the view point of the moving direction of clear and definite convey table 20 and the first and second detection fixture moving parts 30,40, show the orthogonal coordinate system according to XYZ axle at Fig. 3.For Y-axis, be positive dirction from the table side of the paper of Fig. 3 towards the direction of inboard.
Substrate detection apparatus 1 has the substrate moving part 60 for moving convey table 20 along X-axis, and for the first and second detection fixture moving parts 30,40 being provided with the detection fixture 32,42 of multiple substrate detection probe 35,45 mobile in YZ face.First and second detections with fixture moving part 30,40 about the balanced configuration of XY face.
Convey table 20 has the support (bracket) 63 for carrying the board holder 22 and fixing cylindrical shape in its lower section detecting substrate 21.Cylindric support 63 is formed with screw hole through along its length.
Substrate moving part 60 has the ball screw (Ballscrew) 62 be combined with the screw hole phase screw of support 63, and the drive division 61 that this ball screw 62 is rotated.In order to simplify and screw thread on not shown ball screw 62 and screw channel.If make ball screw 62 rotate according to drive division 61, then according to its rotation amount and sense of rotation, determine the support 63 i.e. amount of movement along X-direction of convey table 20 and moving direction.
First detection fixture moving part 30 has detection fixture maintaining part 33, and this detection fixture maintaining part 33 moves this detection fixture 32 while keeping being provided with the detection fixture 32 of multiple probes 35 that substrate detects and then multiple probes 35 that substrate is detected contact with the check point of the distribution of the detected object on detection substrate 21.And multiple probes 35 grade that substrate detects is via detection fixture maintaining part 33, and then is electrically connected with the scanner (scanner) (illustrate and omit) for carrying out substrate detection and mensuration.
Second detection fixture moving part 40 has the detection fixture maintaining part 43 identical with the detection fixture maintaining part 33 of the first detection fixture moving part 30, and this detection fixture maintaining part 43 has the function identical with detection fixture maintaining part 33.
First and second detection fixture moving parts 30,40 and substrate moving part 60 mobile controls be control device (illustrate and omit) according to substrate detection apparatus 1 and carry out.Further, the first and second detection fixture moving parts 30,40 in order to particular detection substrate 21 and convey table 20 position and be respectively arranged with principal phase machine (camera) 34,44.
Next, the detection fixture 32,42 that substrate detection apparatus 1 uses is described.Fig. 4 shows an example of detection fixture.Detection fixture 32 comprises multiple contact terminal 35,45; The holder 3 of those contact terminals is kept by spininess shape; There is while supporting this holder 3 electrode body 4 of the electrode section contacting and then become with substrate detection apparatus conducting state with contact terminal 35; The extended wire portion 5 from electrode section electrical connection; And there is the connector 6 of the connecting portion 6a be electrically connected with substrate detection apparatus.Fig. 4 shows the summary side elevation for illustration of detection fixture 32.Although contact terminal 35 is illustrated as three in the diagram, do not limit especially.
The check point be set on wiring graph P and electrode section described later are electrically connected by contact terminal 35.One side of this contact terminal 35 connects with check point, and another side of contact terminal 35 connects with electrode section.By this contact terminal 35, check point is electrically connected with electrode section.This contact terminal 35 such as can adopt and formed by slender rod shaped and had electric conductivity and flexual parts simultaneously.And also can adopt the parts employing the spring stretched by length direction.
The electrode section (illustrate omit) of electrode body 4 for being electrically connected with substrate detection apparatus while keeping contacting with another side of contact terminal 35.This electrode section is formed by roughly the same plane relative to the surface of electrode body 4.Preferably, this electrode section is formed as the external diameter slightly larger than contact terminal 35.
The connecting portion 61 of the electrode section of electrode body 4 and connector described later 6 is electrically connected by wire portion 5.Electrode section and connecting portion 61 can be electrically connected by this wire portion 5, such as, can adopt the metallic threadlike lines such as copper cash.
When utilizing metal wire to manufacture wire portion 5, through hole can be formed in electrode body 4, and at this through hole configuration wire, cut off wire by the plane identical with the surface of electrode body 4, thus can electrode section be formed.Now, an end of metal wire can be used as electrode section, and the other end of metal wire is connected with connecting portion 61 conducting.
Connector 6 is for keeping the connecting portion 61 be electrically connected with substrate detection apparatus.This connecting portion 61 is by being electrically connected with the junction conducting contact being set in substrate detection apparatus 1.This connection such as can adopt the connector (connector) formed respectively by concaveconvex shape to connect.
One side of contact terminal 35, while keeping in touch terminal 35, is guided to check point and another side of contact terminal 35 is guided to electrode section by holder 3.The holder 3 of Fig. 4 is determining deviation and two plate-shaped members configuring and formed according to being separated by, and contact terminal 35 can be made to bend in the space that these two plate-shaped members are formed.
This substrate detection fixture 32,42 is formed as comprising at least plural detection clamp head corresponding with unit substrate CB (diagram is omitted).Detection clamp head connects with the check point on the wiring graph P being set in advance in unit substrate CB by contact terminal 35,45 and configures.Given this, for unit substrate CB, detection is pressed corresponding one to one by clamp head.Therefore, if substrate detection fixture 32 comprises four detection clamp head, then by once pressing down four unit substrate CB that (press) can detect plate shape substrates B, according to the quantity of detection clamp head, the quantity of detectable unit substrate CB when once pressing down can be set.
Be described in detail follow-up, the present invention is owing to detecting the wiring graph being formed in a unit substrate CB with the identical wiring graph phase short circuit being formed in another the unit substrate CB being different from this unit substrate CB, therefore preferably, detection clamp head is set to even number.Its reason is effectively utilize detection clamp head by detection clamp head being set to even number thus shortening detection time.
Next, in order to implement the present invention, by the wiring graph P phase short circuit being formed in another unit substrate CB identical with this wiring graph for the wiring graph P being formed in a unit substrate CB.This is electrically connected by any terminal of any terminal of a unit substrate CB wiring graph P with the wiring graph P being formed in another unit substrate CB.That is, a wiring graph P and another wiring graph P is connected in series, therefore a unit substrate CB and another unit substrate CB determine to be connected in series between wiring graph.
Further, short-circuiting terminal SW, except the above, can adopt the connecting portion (illustrate and omit) for being electrically connected substrate detection fixture 32 and substrate detection apparatus 1, and wherein substrate detection fixture 32 is for being electrically connected substrate detection apparatus 1 and plate shape substrates B.When utilizing connecting portion as above, be set as that one end of a wiring graph P can be electrically connected at this connecting portion with one end of another wiring graph P.Further, identical with above-mentioned situation, preferably, short-circuiting terminal SW is made for the switching function with the ON/OFF switching carrying out short-circuit condition.
The position relationship of a wiring graph P and another wiring graph P does not do special restriction, preferably, utilizes adjacent unit substrate CB.By utilizing each wiring graph P of adjacent unit substrate CB, unit substrate CB can be effectively utilized.
If a wiring graph P and another wiring graph P can be connected in series, then each any terminal of connection wiring graph P and another wiring graph P is not limited especially.The short-circuiting terminal be connected in series each other between this wiring graph P can be arranged on the substrate detection fixture 32,42 for being electrically connected substrate detection apparatus 1 and plate shape substrates B.More particularly, the wire portion 5 of substrate detection fixture 32 as shown in Figure 4 can be used.The method that short-circuiting terminal SW is set can be adopted, the wire portion 5 phase short circuit that this short-circuiting terminal SW makes the wire portion 5 that is electrically connected with the terminal of a wiring graph P and the terminal of another wiring graph P that is connected in series with one end of this wiring graph P is electrically connected.This short-circuiting terminal SW can adopt on-off element, preferably, is set as making the personnel carrying out detecting can change the ON/OFF of short-circuit condition.
Fig. 5 is the key diagram that the situation using short-circuiting terminal SW1 and short-circuiting terminal SW2 is described.In the embodiment of Fig. 5, be formed with four unit substrate CB (unit substrate CB (A) ~ CB (D)) at plate shape substrates B, and those unit substrate CB (A) ~ CB (D) is formed with wiring graph P (wiring graph P (1) ~ P (4)) respectively.And five terminals 1 ~ 5 be formed in this wiring graph P as terminal.Each terminal arrangement has the group for the contact terminal 35 be electrically connected with substrate detection apparatus 1.This unit substrate CB only illustrates and shows the wiring graph P of so-called multi-terminal, and the wiring graph of all unit substrate CB (wiring graph P (1) ~ P (4)) is identical wiring graph.
For the embodiment of Fig. 5, by short-circuiting terminal SW1, conducting is connected the terminal 1 of the terminal 5 of the wiring graph P (1) of unit substrate CB (A) and the wiring graph P (2) of unit substrate CB (B).By short-circuiting terminal SW2, conducting is connected the terminal 1 of the terminal 5 of the wiring graph P (3) of unit substrate CB (C) and the wiring graph P (4) of unit substrate CB (D).Short-circuiting terminal SW1 and short-circuiting terminal SW2 is formed by the switch that can carry out ON/OFF respectively.
Substrate detection apparatus 1 comprises not shown switch group and power supply and voltmeter or galvanometer, and according to the ON/OFF action of switch group, can realize the mensuration of detected object.Such as, when whether good the resistance of the distribution between the terminal 1 judging wiring graph P (1) and terminal 2 is, apply fixed voltage between terminal 1 and terminal 2, and then be determined at the electric current of flowing between terminal 1 and terminal 2.Calculate resistance value based on potential difference (PD) (magnitude of voltage) now and current value, and carry out whether good judgement based on this resistance value calculated.
Below be then to the explanation for implementing substrate detection apparatus 1 of the present invention and substrate detection fixture 32 and short-circuiting terminal SW.
Next, for detection method of the present invention, utilize Fig. 5 and Fig. 6 to be described.The present invention effectively can detect the wiring graph P be formed on unit substrate CB.The situation of Fig. 4, first, is in ON by short-circuiting terminal SW1.
Next, via short-circuiting terminal SW1, the terminal 2 of the terminal 4 of wiring graph P (1) and wiring graph P (2) is formed as closed circuit, and calculates the resistance value between this terminal 4 and terminal 2, and then carry out the whether good of distribution and judge.Next, via short-circuiting terminal SW1, the terminal 3 of the terminal 3 of wiring graph P (1) and wiring graph P (2) is formed as closed circuit, and the resistance value calculated between the terminal 3 of this wiring graph P (1) and the terminal 3 of wiring graph P (2), and then carry out the whether good of distribution and judge.Next, via short-circuiting terminal SW1, the terminal 4 of the terminal 2 of wiring graph P (1) and wiring graph P (2) is formed as closed circuit, and the resistance value calculated between the terminal 2 of this wiring graph P (1) and the terminal 4 of wiring graph P (2), and then carry out the whether good of distribution and judge.And, via short-circuiting terminal SW1, the terminal 5 of the terminal 1 of wiring graph P (1) and wiring graph P (2) is formed as closed circuit, and the resistance value calculated between the terminal 1 of this wiring graph P (1) and the terminal 5 of wiring graph P (2), and then carry out the whether good of distribution and judge.As described above, according to short-circuiting terminal SW1 conducting connection wiring figure P (1) and wiring graph P (2), eight in the past time can be detected number of times and be reduced to half that is four times.
Be omitted although describe in detail, but also carry out same process by each wiring graph P (wiring graph P (3), P (4)) for unit substrate CB (C) and unit substrate CB (D), detection number of times can be made than ever to reduce by half mutually, and carry out the detection of wiring graph P.
Industrial applicibility
In the present invention, although IC base plate for packaging is called and detects thing and be illustrated, but this detection thing can be such as printed wiring board, flexibility (flexible) substrate, ceramic multilayer wiring substrate, liquid crystal display or plasma display battery lead plate and the various substrate such as semiconductor-sealing-purpose base plate for packaging or thin-film carrier, be also applicable to semiconductor wafer (wafer) or the semiconductor device such as semi-conductor chip or CSP (ChipSizePackage).
Description of reference numerals
1: substrate detection apparatus
32: substrate detection fixture
B: plate shape substrates
CB: unit substrate
SW: short-circuiting terminal
Claims (4)
1. a method of testing substrate, for detecting the wiring graph of the plate shape substrates comprising multiple unit substrate, wherein, unit substrate described in each has multiple multi-terminal wiring graph, by the wiring graph of plural described unit substrate is connected with the substrate detection apparatus being used for carrying out electro-detection, in order to judge the whether good of described wiring graph, described method of testing substrate comprises the steps:
Select and be formed in a unit substrate and become a wiring graph of detected object, and be identically formed another wiring graph in another unit substrate with a described wiring graph;
In order to make a described wiring graph and another wiring graph phase short circuit described, any terminal of a described wiring graph is electrically connected with any terminal of another wiring graph described; And
Conduction detection between the terminal beyond the terminal beyond the described any terminal carrying out a described wiring graph and described any terminal of another wiring graph described.
2. method of testing substrate as claimed in claim 1, is characterized in that for making a described wiring graph and the short-circuiting terminal of another wiring graph phase short circuit described be arranged on substrate detection fixture for being electrically connected described substrate detection apparatus and described plate shape substrates.
3. method of testing substrate as claimed in claim 1, it is characterized in that wherein said substrate detection fixture is for being electrically connected described substrate detection apparatus and described plate shape substrates for making a described wiring graph be arranged on the connecting portion for being electrically connected substrate detection fixture and described substrate detection apparatus with the short-circuiting terminal of another wiring graph phase short circuit described.
4. as the method for testing substrate in claims 1 to 3 as described in any one, it is characterized in that to the connection of a described wiring graph and another wiring graph described is combined and all terminated, the conduction detection between the terminal beyond the terminal beyond the described any terminal carrying out a described wiring graph and described any terminal of another wiring graph described.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013105984A JP6182974B2 (en) | 2013-05-20 | 2013-05-20 | Board inspection method |
| JP2013-105984 | 2013-05-20 | ||
| PCT/JP2014/002631 WO2014188701A1 (en) | 2013-05-20 | 2014-05-19 | Board inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105209924A true CN105209924A (en) | 2015-12-30 |
| CN105209924B CN105209924B (en) | 2018-11-20 |
Family
ID=51933268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480028288.1A Active CN105209924B (en) | 2013-05-20 | 2014-05-19 | Fixture is used in method of testing substrate and substrate detection |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6182974B2 (en) |
| KR (1) | KR101663920B1 (en) |
| CN (1) | CN105209924B (en) |
| TW (2) | TWI536027B (en) |
| WO (1) | WO2014188701A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109075565A (en) * | 2016-05-02 | 2018-12-21 | 微软技术许可有限责任公司 | The enabling being powered using the equipment of appropriate component |
| CN109884501A (en) * | 2019-03-06 | 2019-06-14 | 惠科股份有限公司 | A kind of detection board, broken string short-circuit detecting machine and bearing calibration |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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Also Published As
| Publication number | Publication date |
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| TW201445145A (en) | 2014-12-01 |
| TWI613451B (en) | 2018-02-01 |
| WO2014188701A1 (en) | 2014-11-27 |
| JP2014228301A (en) | 2014-12-08 |
| KR101663920B1 (en) | 2016-10-07 |
| TWI536027B (en) | 2016-06-01 |
| CN105209924B (en) | 2018-11-20 |
| TW201627676A (en) | 2016-08-01 |
| KR20150130506A (en) | 2015-11-23 |
| JP6182974B2 (en) | 2017-08-23 |
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