JP4730904B2 - Substrate inspection apparatus and substrate inspection method - Google Patents

Description

The present invention relates to a substrate inspection apparatus, and more particularly to a substrate inspection apparatus and a substrate inspection method for inspecting a wiring formed on a glass substrate used for an electrode plate of a back plate in a plasma display (referred to as PDP).
In the substrate inspection apparatus and the substrate inspection method according to the present invention, a substrate on which a plurality of wiring patterns having a certain shape such as a back plate of a PDP are arranged in parallel can be an inspection object. It is not limited to the back plate.

In general, as shown in FIG. 10, the PDP is formed of two corresponding glass substrates, a front plate 100 and a back plate 101.
A pair of electrodes regularly arranged on each of these glass substrates is provided, and a gas mainly composed of Ne, Xe, He or the like is enclosed between them. A voltage is applied between the electrodes, and discharge is generated in minute cells around the electrodes to cause each cell to emit light for display.

In order to inspect whether or not the wiring pattern formed on the back plate is correctly formed, devices and methods disclosed in Patent Document 1 and Patent Document 2 have been proposed.
The inspection method disclosed in Patent Document 1 is an electrode inspection method according to the present invention, in which a contact probe as a voltage supply means capable of making electrical connection by contacting each line of an electrode pattern formed on a substrate. And a non-contact probe as a voltage detecting means on the back side of the electrode forming surface of the substrate, and from the detection voltage generated by applying a predetermined AC voltage or DC voltage pulse between them, the electrode pattern This is a method of detecting a defect and specifying its position.

In addition, the inspection method disclosed in Patent Document 2 arranges a contact probe as a voltage detection means capable of electrical connection by contacting each line of an electrode pattern formed on a substrate, and a substrate. A non-contact probe as a voltage supply means is arranged on the electrode forming surface side of the electrode, and a defect in the electrode pattern is detected from the detection voltage generated by applying a predetermined AC voltage or DC voltage pulse between them, and the position It is a method to specify.
All of these methods can reduce the cost of expensive contact probes by reducing the number of contact probes that come into contact with the wiring pattern formed on the glass substrate compared to conventional inspection methods. It is said.

  However, in the inspection apparatuses and inspection methods disclosed in these Patent Documents 1 and 2, the number of contact probes is merely reduced, and the use of contact probes remains unchanged, and expensive contact probes are required. In addition, since the contact probe is used for inspection, the problem of contact marks remaining cannot be solved.

JP 2001-84904 A JP 2001-84905 A

  The present invention has been made in view of such a situation, and provides a substrate inspection apparatus and a substrate inspection method capable of simultaneously determining conduction and short-circuit of a wiring pattern without using any contact probe.

  The invention according to claim 1 is a board inspection apparatus for inspecting a board in which a plurality of wiring patterns are arranged side by side with a predetermined interval, and is arranged in a physically non-contact manner with respect to the plurality of wiring patterns. The first electrode portion that supplies signals to the plurality of wiring patterns and the one wiring pattern to be inspected are arranged in a physically non-contact manner, and the signals are supplied to the one wiring pattern. The second electrode section, the first signal supply means for applying a first signal having a constant period to the first electrode section, and the second electrode section having a phase difference of 180 degrees from the first periodic signal. Second signal supply means for applying two signals, detection means for detecting the voltage of the wiring pattern to be inspected, conduction of the wiring pattern based on the phase of the voltage or voltage output detected by the detection means, and Pass / fail judgment means for judging pass / fail of short circuit Providing a substrate inspection apparatus characterized by obtaining.

  The invention according to claim 2 is characterized in that the quality determination means determines that the wiring pattern to be inspected is a non-defective product if the phase of the voltage is within a predetermined range or the output of the voltage is substantially zero. A substrate inspection apparatus according to claim 1 is provided.

  The quality determination means determines that the wiring pattern to be inspected has a short circuit defect when the phase of the voltage is affected by the first signal. When the voltage phase is affected by the second signal, it is determined that the wiring pattern to be inspected has a conduction failure, and the voltage phase is determined by the first signal. 2. The substrate inspection apparatus according to claim 1, wherein the circuit pattern to be inspected is determined to be a non-defective product when it is equally affected by the second signal.

  According to a fourth aspect of the present invention, the pass / fail judgment means detects a measurement value detected by the detection means based on the first signal to calculate a voltage output, and the voltage output is preset. 2. The substrate inspection apparatus according to claim 1, wherein the wiring pattern is determined to be a non-defective product if the wiring pattern is within a predetermined range, and the wiring pattern is determined to be a defective product if the wiring pattern is outside the predetermined range. I will provide a.

  According to a fifth aspect of the present invention, when the predetermined range is set between an upper limit value and a lower limit value, and the output of the voltage is larger than the upper limit value, the non-defective product determining unit has a short circuit failure. The board inspection apparatus according to claim 4, wherein when the wiring pattern is smaller than the lower limit value, it is determined that the wiring pattern has a conduction failure.

  According to a sixth aspect of the present invention, the quality determination unit detects a measurement value detected by the detection unit based on the second signal to calculate a voltage output, and the voltage output is preset. 2. The substrate inspection apparatus according to claim 1, wherein the wiring pattern is determined to be a non-defective product if the wiring pattern is within a predetermined range, and the wiring pattern is determined to be a defective product if the wiring pattern is outside the predetermined range. I will provide a.

  According to a seventh aspect of the present invention, when the predetermined range is set between an upper limit value and a lower limit value and the output of the voltage is larger than the upper limit value, the non-defective product determining unit has a poor continuity. The circuit board inspection apparatus according to claim 6, wherein the wiring pattern is determined to have a short-circuit defect when it is determined that the wiring pattern is smaller than the lower limit value.

  The invention according to claim 8 is characterized in that the second electrode portion and the detecting means are simultaneously moved in a juxtaposed direction in which the wiring patterns are juxtaposed. Providing equipment.

The invention according to claim 9 is a substrate inspection method for inspecting a substrate in which a plurality of linear wiring patterns are arranged side by side with a predetermined interval, and is physically non-existent with respect to the plurality of wiring patterns. A first electrode portion that is arranged in contact and supplies a signal to the plurality of wiring patterns is disposed, and is physically disposed in a non-contact manner with respect to one wiring pattern to be inspected. A second electrode part for supplying a signal to the pattern is arranged, a first signal having a certain period is applied to the first electrode part, and the first period signal is 180 degrees out of phase with the second electrode part. Apply a second signal, detect the voltage of the wiring pattern to be inspected, and determine whether the wiring pattern is conductive or short-circuited based on the phase of the voltage detected by the detection means or the output of the voltage. A substrate inspection method is provided.
By providing these inventions, the above problems can be solved.

  According to the first aspect of the present invention, there is provided a substrate inspection apparatus for inspecting a substrate in which a plurality of wiring patterns are arranged side by side with a predetermined interval, and is physically non-contact with the plurality of wiring patterns. The first electrode unit that supplies signals to the plurality of wiring patterns and the one wiring pattern to be inspected are arranged in a physically non-contact manner, and the signal is transmitted to the one wiring pattern. A first signal supply means for applying a first signal having a constant period to the first electrode part, and a phase difference of 180 degrees from the first periodic signal to the second electrode part. Second signal supply means for applying the second signal to be detected, detection means for detecting the voltage of the wiring pattern to be inspected, and the phase of the voltage detected by the detection means or the output of the voltage. Pass / Fail judgment to judge pass / fail shortness Since it comprises a stage can be based on the influence of the wiring pattern by the first signal and the second signal in phase or the output of the voltage, completely without using a contact probe, to check the continuity determination and short-circuit determination.

  According to the invention of claim 2, the quality determination means determines that the inspection target wiring pattern is a non-defective product if the phase of the voltage is within a predetermined range or the output of the voltage is substantially zero. It is possible to easily determine continuity determination and short circuit determination.

  According to a third aspect of the present invention, when the voltage phase is affected by the first signal, the quality determination means has a short circuit defect in the wiring pattern to be inspected. If the phase of the voltage is affected by the second signal, it is determined that the wiring pattern to be inspected has a conduction failure, and the phase of the voltage is When the influence of one signal and the second signal is equally applied, it is determined that the wiring pattern to be inspected is a non-defective product, so it is easy to determine the continuity of the wiring pattern simply by calculating the voltage phase. And short circuit can be determined.

  According to the invention of claim 4, the pass / fail determination means detects a measurement value detected by the detection means based on the first signal, calculates a voltage output, and the voltage output is calculated in advance. If the wiring pattern is within a predetermined range, the wiring pattern is determined to be a non-defective product. If the wiring pattern is outside the predetermined range, the wiring pattern is determined to be a defective product. Since the continuity determination and the short circuit determination can be performed based on the output value, the determination can be easily made.

  According to a fifth aspect of the present invention, when the predetermined range is set between an upper limit value and a lower limit value and the voltage output is larger than the upper limit value, the non-defective product determination means Since it is determined that the wiring pattern has a short circuit failure and is smaller than the lower limit value, it is determined that the wiring pattern has a conduction failure. .

  According to a sixth aspect of the present invention, the quality determination unit detects a measurement value detected by the detection unit based on the second signal, calculates a voltage output, and the voltage output is calculated in advance. By calculating the output value of the voltage because the wiring pattern is determined to be a non-defective product if it is within the predetermined range and the wiring pattern is determined to be a defective product if it is outside the predetermined range. Whether the output value is within the predetermined range can determine whether the wiring pattern is good or bad.

  According to a seventh aspect of the present invention, the non-defective product determining means is configured such that when the predetermined range is set between an upper limit value and a lower limit value, and the voltage output is larger than the upper limit value, the wiring pattern is If the wiring pattern is determined to have a continuity failure and is smaller than the lower limit value, the wiring pattern is determined to have a short circuit failure. And short-circuit failure can be determined.

  According to the eighth aspect of the present invention, since the second electrode portion and the detection unit simultaneously move in the juxtaposed direction in which the wiring patterns are arranged side by side, a plurality of wiring patterns can be continuously determined. .

  The invention according to claim 9 is a substrate inspection method for inspecting a substrate in which a plurality of linear wiring patterns are arranged side by side with a predetermined interval, and is physically non-existent with respect to the plurality of wiring patterns. A first electrode portion that is arranged in contact and supplies a signal to the plurality of wiring patterns is disposed, and is physically disposed in a non-contact manner with respect to one wiring pattern to be inspected. A second electrode part for supplying a signal to the pattern is arranged, a first signal having a certain period is applied to the first electrode part, and the first period signal is 180 degrees out of phase with the second electrode part. Apply a second signal, detect the voltage of the wiring pattern to be inspected, and determine whether the wiring pattern is conductive or short-circuited based on the phase of the voltage detected by the detection means or the output of the voltage. So, to the wiring pattern by the first signal and the second signal Effect on the basis of the phase or the output of the voltage completely without using a contact probe, it is possible to check the continuity determination and short-circuit determination. Further, the continuity determination and the short circuit determination can be performed simultaneously.

The best mode for carrying out the present invention will be described.
FIG. 1 shows an embodiment of a substrate to be inspected to be inspected by the substrate inspection apparatus and the substrate inspection method of the present invention. FIG. 2 is a schematic block diagram showing the relationship between a substrate inspection apparatus and a substrate according to an embodiment of the present invention, and FIG. 3 is a schematic diagram showing signal transmission and reception between the substrate and the substrate inspection apparatus arranged on the substrate. FIG. 4 is a schematic diagram showing an electrical positional relationship between the substrate shown in FIG. 3 and the substrate inspection apparatus. In FIG. 4, the wiring pattern is indicated by oblique lines, the reference numeral 100 indicates a glass substrate, and the reference numeral 11 indicates a mounting table on which the substrate included in the substrate inspection apparatus 1 is mounted.

The substrate to be inspected of the present invention will be briefly described.
The substrate to be inspected by the present invention is most effective for a substrate on which a plurality of wiring patterns 8 are arranged in parallel.
For example, in the substrate as shown in FIG. 1, four wiring patterns 8 are arranged in parallel at a predetermined interval. The wiring pattern 8 includes a linear portion 81 having a certain length and a TAB (Tape Automated Bonding) electrode portion 82 formed at one end of the linear portion 81. As shown in FIG. 1, a plurality of linear portions 81 are arranged in parallel at a predetermined interval. A plurality of TAB electrode portions 82 are arranged in parallel at a narrower interval than the linear portion 81.
Although four wiring patterns 8 are shown in FIG. 1, there is no particular limitation, and the number of wiring patterns to be arranged is determined according to the size of the substrate.
As an example of the substrate shown in FIG. 1, a back plate of a PDP can be exemplified.

The substrate inspection apparatus 1 according to an embodiment of the present invention includes a first electrode unit 21, a second electrode unit 22, a first signal supply unit 31, a second signal supply unit 32, a detection unit 4, a pass / fail determination unit 5 and a display. Means 6 are provided.
The basic principle of the substrate inspection apparatus and the substrate inspection method according to the present invention is to supply a detection signal (detected from the wiring pattern 8 by supplying a signal having a phase difference of 180 degrees to the wiring pattern 8 to be inspected. By detecting what phase or output is detected (detected voltage), the continuity determination and short circuit determination of the wiring pattern to be inspected are performed.

The first electrode portion 21 is disposed physically in a non-contact manner with respect to the plurality of wiring patterns 8 and supplies a measurement signal (first signal) to the plurality of wiring patterns 8.
As shown in FIGS. 3 and 4, the first electrode portion 21 is disposed at one end portion of the plurality of wiring patterns 8 with a predetermined interval. The first electrode portion 21 needs to supply signals simultaneously to the wiring patterns located on both sides (adjacent) of the wiring pattern 8 to be inspected. This is because, in order to perform a short circuit inspection of a wiring pattern to be inspected, a signal is simultaneously supplied to both adjacent wiring patterns of the wiring pattern to be inspected.
In the present embodiment, it is arranged at the position of the TAB electrode portion 82 so that a measurement signal can be applied at once to all the wiring patterns to be inspected.

Since the first electrode portion 21 is arranged with a predetermined interval, a capacitance C <b> 1 is formed with respect to the wiring pattern 8. The predetermined interval is not particularly limited, but is set to 0.1 to 0.5 mm.
In addition, since the 1st electrode part 21 is arrange | positioned with a predetermined space | interval, a contact trace does not generate | occur | produce with respect to the wiring pattern 8 or the glass substrate (back plate) 101. FIG.

The second electrode unit 22 is disposed in a physically non-contact manner with respect to the wiring pattern 8 to be inspected, and supplies a measurement signal (second signal) only to the wiring pattern 8 to be inspected.
As shown in FIGS. 3 and 4, the second electrode portion 22 is disposed at a predetermined interval at the other end portion of the wiring pattern 8 to be inspected. The second electrode portion 22 is formed to be narrower than the interval between the wiring patterns 8 than the width of the second electrode portion 22 so that a measurement signal can be supplied only to the wiring pattern 8 to be inspected. .

Since the 2nd electrode part 22 is arrange | positioned with a predetermined space | interval, it forms the electrostatic capacitance C2 with respect to the wiring pattern 8 used as a test object. This predetermined interval is set to 0.1 to 0.5 mm, similarly to the first electrode portion 21.
In addition, since the 2nd electrode part 22 is arrange | positioned with a predetermined space | interval, a contact trace does not generate | occur | produce with respect to the wiring pattern 8 or the glass substrate 101. FIG.

  Although the details will be described later, the second electrode portion 22 supplies the second signal only to one wiring pattern 8, and therefore the wiring pattern 8 is used to supply the second signal to a plurality of wiring patterns. Are set so that they can move in the direction in which they are arranged side by side.

  The first signal supply unit 31 applies a first signal having a certain period to the first electrode unit 21. The first signal supply means 31 is connected to the first electrode portion 21 as shown in FIG. The first signal supplied by the first signal supply means 31 can be, for example, a frequency of 1 to 2 MHz and an effective voltage value of 0.1 to 7V.

The second signal supply means 32 applies a second signal that is 180 degrees out of phase with the first periodic signal to the second electrode portion 22. The second signal supply means 32 is connected to the second electrode portion 22 as shown in FIG.
The second signal supplied by the second signal supply means 32 is not particularly limited as long as the second signal is 180 degrees out of phase with the first signal. When the first signal and the second signal are applied to the wiring pattern 8, the output of the signal (voltage) detected from the wiring pattern is preferably adjusted to be zero.

The detecting means 4 detects the voltage of one wiring pattern 8 to be inspected. As shown in FIG. 3, the detection means 4 includes a detection unit 41 and a measurement unit 42.
The detection unit 41 is disposed at the end of the wiring pattern 8 in order to detect a conduction failure and a short-circuit failure of the wiring pattern 8.
The detection unit 41 is disposed at one end of the wiring pattern 8, the first electrode unit 21 is disposed at the other end of the wiring pattern 8, and the second electrode unit 22 is located on the inner side of the wiring pattern 8 than the detection unit 41. The part 21 is arranged at the most distant place. At this time, it is necessary to arrange them at regular intervals so that the detection unit 41 is not directly affected by the signal applied from the second electrode unit 22.
In the present embodiment, since the first electrode portion 21 is disposed in the TAB electrode portion, the detection portion 41 is disposed at the other end portion of the wiring pattern 8, and between the detection portion 41 and the first electrode portion 21. The second electrode unit 22 is disposed at a position adjacent to the detection unit 41.
The detection unit 41 can use a power feeding pad. Although it has a circular shape in plan view in FIG. 3, it is not particularly limited, and a signal (voltage) of one wiring pattern 8 is detected in a shape capable of reliably measuring an inspection signal. If you can.
The measurement unit 42 measures the signal detected by the detection unit 41. An AC voltmeter is used for the measuring unit 42.
In the embodiment shown in FIG. 3, an amplifier 43 for amplifying the magnitude of the signal detected by the detection unit 41 is provided.

Since the detection unit 41 detects a signal with respect to the wiring pattern 8 to be inspected, the direction in which the wiring patterns 8 are arranged in parallel (parallel arrangement) simultaneously with the second electrode unit 22 that supplies the second signal. Direction).
By forming the second electrode portion 22 and the detection portion 41 so as to move simultaneously, a second signal is supplied to the wiring pattern 8 to be inspected, and a signal (voltage) is supplied from the wiring pattern 8. Can be detected.
As described above, the second electrode portion 22 and the detection portion 41 are simultaneously held in order to perform signal application (application of the second signal) and signal detection (voltage detection) to one wiring pattern 8 at the same time. It can be exemplified that the portion 44 is arranged so as to be parallel to the wiring pattern 8.
Since the holding portion 44 moves in the direction in which the wiring patterns 8 are arranged, it is possible to continuously inspect the wiring patterns 8 for a plurality of wiring patterns.

The moving holding unit 44 preferably has a position determining unit (not shown) for specifying its own position on the glass substrate 101. This is because by including this position determination unit, it is possible to specify from which wiring pattern a defect is detected when a defect is detected when a continuity and / or short circuit inspection described later is performed.
The position determination unit can have the above function by calculating the xy movement distance using a speedometer or an amperometer, but determines the positions of the first and second measurement units 21 and 22. The function is not particularly limited as long as the function can be performed.

The pass / fail judgment means 5 judges the pass / fail of the wiring pattern 8 based on the phase of the voltage detected by the detection means 4 or the output of the voltage.
The pass / fail judgment means 5 is configured such that the phase of the voltage detected by the detection means 4 from the first signal or the second signal is shifted by the influence of the first signal or the influence of the second signal. It is determined whether the phase is shifted, whether the signal is affected by the first signal and the second signal, or not.
For example, when the wiring pattern 8 is a non-defective product, the first signal and the second signal are applied, and a substantially zero output signal is applied to the wiring pattern 8. For this reason, the detection means 4 detects a signal (voltage) of zero output.
Further, when the wiring pattern 8 has a conduction failure, it has a resistance in the middle of the wiring pattern 8, so that the detection means 4 is strongly influenced by the second signal, and the detection means The signal detected by 4 is approximately in phase with the second signal (180 degrees out of phase with the first signal).
On the other hand, when the wiring pattern 8 has a short circuit failure, the wiring pattern 8 is supplied with the first signal from the adjacent wiring pattern and is strongly influenced by the first signal. The signal detected by the means 4 is approximately in phase with the first signal (180 degrees out of phase with the second signal).
For this reason, since three types of phases (zero, same phase, 180 degree phase shift) can be calculated, it is possible to determine whether the wiring pattern 8 is good, continuity failure, and short-circuit failure according to each state. it can.
Note that the phase of the signal detected by the detection means 4 is only required to be able to detect a substantial phase difference (180 degree difference), and a slight phase width may be set in consideration of the case where noise is included. preferable.

The pass / fail judgment means 5 detects the signal detected by the detection means 4 based on the second signal and calculates the output.
In this case, the pass / fail determination means 5 determines continuity failure and short circuit failure based on the calculated output (output value).
For example, when the wiring pattern 8 is a non-defective product, the detection unit 4 calculates an output value of zero output. Therefore, if the output value is zero, there is no conduction failure and no short circuit failure.
Further, when the wiring pattern 8 has a conduction failure, it has a resistance in the middle of the wiring pattern 8, so that the detection means 4 is strongly influenced by the second signal, and the detection means. Since the signal detected by 4 is a signal in phase with the second signal, a positive output value is calculated.
On the other hand, when the wiring pattern 8 has a short circuit failure, the wiring pattern 8 is supplied with the first signal from the adjacent wiring pattern and is strongly influenced by the first signal. Since the signal detected by the means 4 is a signal having a phase different from that of the second signal by 180 degrees, a negative output value is calculated.
For this reason, since three types of output values (zero, positive, negative) can be calculated, it is possible to determine whether the wiring pattern 8 is non-defective, conductive failure, and short-circuit failure according to each state. .
The signal (voltage) detected by the detection means 4 may be substantially zero, and it is preferable to set a predetermined range in consideration of the case where noise is included.

Although the above quality determination means 5 has shown the method of detecting based on the second signal, a method of detecting based on the first signal can also be implemented.
In this case, the result of detection based on the second signal and the result of detection based on the first signal are reversed in polarity. For this reason, if a positive value is calculated based on the second signal, it is determined that the continuity is poor. If a positive value is calculated based on the first signal, a negative value is calculated to determine that the continuity is poor. .
In addition, when a negative value is calculated based on the second signal and it is determined that the short circuit is defective, a positive value is calculated based on the first signal and it is determined that the short circuit is defective.

FIG. 5 shows an image diagram for determining the inspection of the wiring pattern in accordance with the calculated output value.
For example, in FIG. 5, the vertical axis is the phase detection level and the horizontal axis is time. Therefore, it can be shown that the detection unit 4 continuously detects the plurality of wiring patterns 8. In addition, the continuity determination and the short circuit determination of the wiring pattern can be performed by the change in the output value on the vertical axis.
In the graph shown in FIG. 5, according to the value of the output value, it is divided into a non-defective product (PASS) region B, a conduction failure (Open NG) region A, a short circuit failure (Short NG) region C, and three types of regions. Yes.
This non-defective region A is divided by an upper limit value D and a lower limit value E. The upper limit value D and the lower limit value E are appropriately set by the user who uses the apparatus 1.
The case shown in FIG. 5 shows a case where the output value from the detection means 4 is calculated based on the second signal. When a value exceeding the upper limit value D is calculated, it is determined that the continuity is poor, and the lower limit is set. When a value lower than the value E is calculated, it is determined that the short circuit is defective.

The display unit 6 displays at least the determination result of the quality determination unit 5. The display means 6 can be a display device such as a so-called liquid crystal display.
Further, the display means 6 may be configured to visually check the continuity failure and the short-circuit failure by displaying the graph shown in FIG.
The above is the description of the configuration of the substrate inspection apparatus 1 according to the present invention.

Next, the operation of the substrate inspection apparatus of the present invention will be described.
FIG. 6 shows a state of an embodiment for inspecting a substrate to be inspected. The squares shown on the wiring pattern in FIG. 6 indicate the resistance O and indicate the location of the conduction failure. Further, a short-circuit location S that is present between the wiring patterns is indicated as a short-circuit location S. FIG. 7 is a diagram showing the state of output values when the inspection is performed on the inspected substrate of FIG. FIG. 8 shows a flowchart when the substrate inspection apparatus according to the embodiment of the present invention is implemented.

First, a glass substrate (back plate) 101 is placed on the mounting table 11 of the substrate inspection apparatus 1 and prepared so that the substrate 101 can be inspected (S1).
At this time, the first electrode portion 21 is disposed in a physically non-contact manner at a predetermined interval at one end (TAB electrode 82) of the plurality of wiring patterns 8. Further, the holding unit 44 is prepared so that the second electrode unit 22 and the detection unit 41 of the detection unit 4 are arranged at a predetermined position (pre-inspection position).
The substrate 101 stores information related to the shapes and arrangement intervals of the plurality of wiring patterns 8 in a storage device. The stored information and the detection signal detected by the detection means 4 are linked to each other. It is preferable to be able to specify which position (how many) the wiring pattern is detected from the inspection signal.

If the board | substrate 101 is prepared, the 1st signal supply means 31 will supply a 1st signal to the 1st electrode part 21 (S2).
The first signal is a signal having one cycle as described above. For example, a signal of 2 Vrms at 1 MHz is used.
And the 2nd signal supply means 32 supplies a 2nd signal to the 2nd electrode part 22 (S3).
This second signal is a signal that is 180 degrees out of phase with the first signal, and a 1 MHz signal is used. Note that, when the first signal and the second signal are applied to the non-defective wiring pattern 8, it is preferable to adjust the output so as to cancel out on the wiring pattern due to the phase difference of 180 degrees.

Next, the holding unit 44 is moved in the juxtaposition direction in which the wiring patterns are juxtaposed, and signals from the respective wiring patterns are detected (S4).
At this time, the detection unit 41 of the detection unit 4 transmits a signal (voltage) detected from the wiring pattern 8 to the quality determination unit 5. At this time, the quality determination unit 5 receives the first signal from the first signal supply unit 31 and / or the second signal from the second signal supply unit 32.
In this operation explanation part, the quality determination means 5 detects the second signal as a reference signal.

The pass / fail judgment means 5 receives the signal from the detection means 4 and performs detection based on the second signal. Next, the pass / fail determination means 5 performs the continuity determination and the short circuit determination of the wiring pattern based on the calculated output value (S5).
For example, referring to FIG. 7, the first wiring pattern from the top is a wiring pattern having a resistance O. For this reason, the output value output by the pass / fail judgment means 5 is output as a positive value (exceeding the upper limit value D). And the quality determination means 5 determines that this wiring pattern 8 has a continuity failure.
Further, in FIG. 7, a short-circuit portion exists between the second and third wiring patterns from the top. For this reason, the output value output by the pass / fail judgment means 5 is output as a negative value (below the lower limit value E). And the quality determination means 5 determines with these two wiring patterns having a short circuit defect.
The fourth wiring pattern from the top is a non-defective wiring pattern. For this reason, zero (substantially zero) is output as the output value output by the pass / fail judgment means 5. And the quality determination means 5 determines that this wiring pattern has no continuity failure and no short circuit failure.
The pass / fail judgment means 5 performs pass / fail judgment for each wiring pattern (S6).

When the pass / fail judgment means 5 performs pass / fail judgment, if all the wiring patterns are non-defective, the board to be inspected is judged to be non-defective and the display means 6 displays that fact (S7). ).
On the other hand, if there is a defect in the wiring pattern, the display unit 6 operates to display a notification to that effect (S8).
At this time, it is preferable to display which part of the wiring pattern has what kind of defect.

FIG. 9 shows another embodiment according to the present invention.
In this other embodiment, two sets of wiring pattern groups are arranged in line symmetry. Even in such a wiring pattern, by connecting the first electrode portion 21 of each TAB electrode portion in each location physically in a non-contact manner and arranging the second electrode portion 22 and the detection portion 41 on the other side, It becomes possible to perform the continuity determination and the short circuit determination of each wiring pattern simultaneously.

1 shows an embodiment of a substrate to be inspected which is an inspection object of a substrate inspection apparatus and a substrate inspection method of the present invention. It is a schematic block diagram which shows the relationship between the board | substrate inspection apparatus of one Embodiment which concerns on this invention, and a board | substrate. It is the schematic which shows transmission / reception of a board | substrate and the board | substrate inspection apparatus arrange | positioned on this board | substrate, and a signal. It is the schematic which shows the electrical positional relationship of the board | substrate shown in FIG. 3, and a board | substrate inspection apparatus. The image figure which determines the test | inspection of a wiring pattern according to the calculated output value is shown. The mode of one Embodiment which test | inspects a to-be-inspected board | substrate is shown. It is a figure which shows the mode of the output value at the time of test | inspecting with respect to the to-be-inspected board | substrate of FIG. The flowchart at the time of implementing the board | substrate inspection apparatus of one Embodiment which concerns on this invention is shown. Fig. 4 shows another embodiment according to the present invention. It is formed of two corresponding glass substrates, a front plate and a back plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board inspection apparatus 21 ... 1st electrode part 22 ... 2nd electrode part 31 ... 1st signal supply means 32 ... 2nd signal supply means 4 ... detection means 5 .... Pass / fail judgment means

Claims (9)

A substrate inspection apparatus for inspecting a substrate in which a plurality of wiring patterns are arranged side by side with a predetermined interval,
A first electrode portion that is disposed in a physically non-contact manner with respect to the plurality of wiring patterns and supplies a signal to the plurality of wiring patterns;
A second electrode part that is arranged in a physically non-contact manner with respect to one wiring pattern to be inspected, and supplies a signal to the one wiring pattern;
First signal supply means for applying a first signal having a constant period to the first electrode portion;
A second signal supply means for applying a second signal that is 180 degrees out of phase with the first periodic signal to the second electrode portion;
Detecting means for detecting the voltage of the wiring pattern to be inspected;
A board inspection apparatus comprising: a pass / fail judgment means for judging pass / fail of the continuity and short circuit of the wiring pattern based on a voltage phase or voltage output detected by the detection means.   The substrate inspection according to claim 1, wherein the quality determination unit determines that the inspection target wiring pattern is a non-defective product if the phase of the voltage is within a predetermined range or the output of the voltage is substantially zero. apparatus. The pass / fail judgment means
When the phase of the voltage is affected by the first signal, it is determined that the wiring pattern to be inspected has a short circuit failure,
When the phase of the voltage is affected by the second signal, it is determined that the wiring pattern to be inspected has a conduction failure,
2. The circuit according to claim 1, wherein when the phase of the voltage is equally affected by the first signal and the second signal, the wiring pattern to be inspected is determined to be a non-defective product. Board inspection equipment. The pass / fail judgment means detects a measurement value detected by the detection means based on the first signal, calculates a voltage output,
The output of the voltage is
When it is within a predetermined range set in advance, the wiring pattern is determined to be non-defective,
The substrate inspection apparatus according to claim 1, wherein when the wiring pattern is outside the predetermined range, the wiring pattern is determined to be defective. In the non-defective product determining means, the predetermined range is set between an upper limit value and a lower limit value,
The output of the voltage is
When larger than the upper limit, the wiring pattern is determined to have a short circuit failure,
The board inspection apparatus according to claim 4, wherein when the lower limit value is smaller, the wiring pattern is determined to have a conduction failure. The pass / fail judgment means detects a measurement value detected by the detection means based on the second signal, calculates a voltage output,
The output of the voltage is
When it is within a predetermined range set in advance, the wiring pattern is determined to be non-defective,
The substrate inspection apparatus according to claim 1, wherein when the wiring pattern is outside the predetermined range, the wiring pattern is determined to be defective. In the non-defective product determining means, the predetermined range is set between an upper limit value and a lower limit value,
The output of the voltage is
When it is larger than the upper limit value, it is determined that the wiring pattern has poor conduction,
The substrate inspection apparatus according to claim 6, wherein when the lower limit value is smaller, the wiring pattern is determined to have a short circuit defect.   The substrate inspection apparatus according to claim 1, wherein the second electrode unit and the detection unit move simultaneously in a juxtaposition direction in which the wiring patterns are juxtaposed. A substrate inspection method for inspecting a substrate in which a plurality of linear wiring patterns are arranged side by side with a predetermined interval,
The first electrode unit is disposed in a physically non-contact manner with respect to the plurality of wiring patterns, and supplies a signal to the plurality of wiring patterns,
Arranged in a physically non-contact manner with respect to one wiring pattern to be inspected, a second electrode portion for supplying a signal to the one wiring pattern,
Applying a first signal having a constant period to the first electrode portion;
Applying a second signal that is 180 degrees out of phase with the first periodic signal to the second electrode portion,
Detect the voltage of the wiring pattern to be inspected,
A substrate inspection method comprising: determining whether or not the wiring pattern is conductive and short-circuited based on a phase of voltage detected by the detecting means or a voltage output.

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