KR20070083501A - Inspecting apparatus, inspecting method and sensor for inspecting apparatus - Google Patents

Abstract

A conductor status inspecting apparatus which can accurately detect the status of an inspecting object with no contact in the case where the inspecting object is a conductor. The conductor to be inspected is supplied with an inspection signal from a supplying part. In the vicinity of the conductor, an insulating board is arranged. On the front plane of the insulating board, a plurality of X axis sensor plates are arranged substantially parallel to each other at prescribed intervals, and on the rear plane, a plurality of Y axis sensor plates which substantially orthogonally intersect with the X axis sensor plates are arranged substantially parallel to each other at prescribed intervals. The position of the conductor is detected by comparing the detection signal levels of the sensor plates and by calculating the relative values of the detection signal levels of the sensor plates.

Description

Inspection device and inspection method and sensor for inspection device {INSPECTING APPARATUS, INSPECTING METHOD AND SENSOR FOR INSPECTING APPARATUS}

The present invention relates to an inspection apparatus and an inspection method capable of detecting the position of an inspection object conductor to which an AC signal is applied.

When manufacturing the circuit board which forms a conductive pattern on a board | substrate, it was necessary to examine whether the conductive pattern formed on the board | substrate did not have a disconnection or a short circuit.

Conventionally, as an inspection method of a conductive pattern, like a patent document 1, a pin is made to contact a both end part of a conductive pattern, an electric signal is supplied from a pin of one end side to a conductive pattern, and the electric signal is received from the pin of the other end side. The contact inspection method (pin contact system) which conducts the conduction test of a conductive pattern, etc. by receiving power is known. The power supply of the electrical signal is performed by placing the metal probe at all terminals and flowing a current therefrom in a conductive pattern.

This pin contact method directly contacts the pin probe, and thus has an advantage of high S / N ratio.

Patent Document 1

Japanese Patent Laid-Open No. 62-269075

However, for example, in a circuit wiring pattern formed on a glass substrate used in a liquid crystal display panel, the pattern thickness is thin, and the adhesion strength with the substrate is small, and there is a problem that the pattern is damaged when the pins are brought into contact.

Moreover, in the liquid crystal panel for mobile telephones, the wiring pitch is also refined, and much labor and cost were required in order to manufacture many probes of a narrow pitch.

At the same time, each time the wiring pattern was different (for each inspection object), a new probe for use had to be manufactured. For this reason, inspection cost became higher and it became a big obstacle to the low cost of an electronic component.

In addition, when positioning a mounting board at a predetermined position at the time of component mounting, the contact type sensor is arrange | positioned at a positioning site | part as a positioning sensor, and a mounting board contacts a sensor, for example, turns on a mechanical switch. The positioning was confirmed. However, in mechanical contact, in addition to problems in durability, positioning accuracy was also poor.

This invention is made | formed in order to solve the above-mentioned subject, The test which can solve the above-mentioned subject and can test a pattern shape in any circuit pattern, and is non-contact and can detect the state of an inspection object with high precision. An object of the present invention is to provide an apparatus and an inspection method.

It is also an object of the present invention to provide an inspection apparatus and an inspection method which are non-contact and can accurately detect the position of the conductor and can easily inspect the defect of the conductor positioning.

As one means of achieving this object, the following configuration is provided, for example.

That is, it is a sensor for an inspection apparatus used for an inspection apparatus capable of non-contact inspection of the state of an inspection object conductor to which an AC inspection signal is applied, and opens a sensor plate formed in a rod shape capable of detecting a signal from the inspection object conductor at predetermined intervals. It is characterized in that it is arranged in the form (iii).

For example, the sensor plates may be disposed at predetermined intervals so as to be substantially orthogonal to the first thermal sensor plates on one side of the substrate formed of an insulating material at predetermined intervals, and on the other side of the substrate. It is characterized by including a 2nd thermal sensor plate.

In addition, for example, the sensor plate is disposed on a multilayer substrate, and the sensor plates disposed on the multilayer substrate are disposed at predetermined intervals so as to be substantially orthogonal to the first thermal sensor plate disposed at predetermined intervals and the first thermal sensor plate. And a second thermal sensor plate, wherein the first sensor plate and the second sensor plate are disposed on different surfaces or layers.

Or a sensor for an inspection apparatus used for an inspection apparatus capable of inspecting a state of an inspection object conductor to which an alternating current inspection signal is applied, wherein a sensor plate formed of a conductive material in a flat plate shape is disposed in a matrix, and is arranged in the matrix shape. With the sensor plate as the X-axis sensor plate and the Y-axis sensor plate for each row, the X-axis sensor plate connects the sensor plates for the same column to each other, while the Y-axis sensor plate connects the sensor plates for the same row to each other. The inspection signal from the inspection object conductor makes it possible to detect a relative detection level difference between the adjacent sensor plates.

Moreover, it is a sensor for test | inspection apparatus used for the test | inspection apparatus which can test | inspect the state of the test object conductor to which an alternating current test signal was applied, The sensor plate formed in the form of a flat plate as a conductive material is arrange | positioned in matrix form, and is arrange | positioned in the said matrix form. The sensor plate is arranged so that the X-axis sensor and the Y-axis sensor are alternately arranged for each adjacent sensor plate, and the X-axis sensor plate connects the sensor plates for the same column to each other, while the Y-axis sensor plate is the sensor plate for the same row. Are connected to each other, and the inspection signal from the inspection target conductor enables detection of the relative detection level difference between the adjacent sensor plates.

Or a sensor for an inspection apparatus used for an inspection apparatus capable of inspecting a state of an inspection object conductor to which an alternating current inspection signal is applied, wherein a sensor plate formed in a flat plate shape as a conductive material is arranged in a zigzag shape and arranged in the zigzag shape. With the sensor plate as the X-axis sensor plate and the Y-axis sensor plate for each row, the X-axis sensor plate connects the sensor plates for the same column to each other, while the Y-axis sensor plate connects the sensor plates for the same row to each other. The inspection signal from the inspection object conductor makes it possible to detect a relative detection level difference between the adjacent sensor plates.

For example, the sensor plate is disposed on a multi-layer substrate, and the X-axis sensor plate and the Y-axis sensor plate disposed on the multi-layer substrate are disposed on different surfaces or layers.

Further, for example, the sensor plate is disposed on the same surface of the substrate, and the X-axis sensor plate is connected in a wiring pattern arranged in a column in one direction of the substrate to connect the X-axis sensor plates for each column to each other, and the Y The axis sensor plate is connected to each other by a wiring pattern arranged in a row, and the Y axis sensor plates for each row are connected to each other.

Alternatively, the measuring means for measuring the signal from the inspection target conductor to which the sensor for inspection device according to any one of the above, the inspection signal detected by the sensor plate of the sensor for inspection device is supplied, and the measurement means And a judging means for judging the state of the inspection object conductor rather than the measurement signal strength, wherein the judging means is an inspection device for inspecting the state of the inspection object conductor from a relative comparison of the detection signal strength from the sensor plate. It is done.

Then, for example, the determination means examines the distance between each sensor plate and the inspection target conductor compared with the inspection signal level from the sensor plate having a high detection level and the relative signal level of the inspection signal level from another sensor plate. It is characterized by determining the state of the inspection target conductor.

For example, the said determination means judges that the inspection target position in a X direction is the measurement signal level from an X-axis sensor board, and the inspection target position in a Y direction is determined by a measurement level from a Y-axis sensor board. It is done.

In addition, for example, when the measurement level in the said level measuring means is a predetermined level or more, the said determination means is an area too large in the detection object area | region of the said test object conductor, and when it is below a predetermined level, at least of the said test object conductor It is characterized by determining that the area including the inspection subject area is undersized.

Or it is the test | inspection method in the test apparatus in any one of the above, It carries out the comparative comparison of the detection signal intensity | strength from several sensor boards, and test | inspects the test | inspection signal detection sensor board by the relative comparison result being within an allowable range. It is characterized by the inspection method which makes it possible to detect the position of a target conductor.

And it is set as the test | inspection method which detects the distance to the test object conductor, for example by obtaining the difference of the detection signal intensity from a some sensor board.

Further, for example, a defect in the inspection target conductor position is compared by comparing the relative detection signal strength of the standard inspection signal at the inspection target conductor position with respect to a predetermined sensor plate with the inspection signal intensity detection signal strength detected from the inspection target conductor. Characterized in that the inspection method.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the structure of the sensor unit used by the test | inspection apparatus of one Embodiment of this invention which concerns on this invention.

2 is a diagram for explaining a schematic configuration of an inspection apparatus of an example of the present embodiment.

3 is a diagram for explaining the relationship between the X-axis sensor plate and the inspection target conductor of the sensor unit of this embodiment example.

4 is a flowchart for explaining inspection control of the inspection apparatus of this embodiment example.

5 is a view for explaining the configuration of a sensor unit used in the inspection apparatus of the example of the second embodiment of the present invention.

6 is a view for explaining the configuration of a sensor unit used in the inspection apparatus of the example of the third embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment example which concerns on this invention is described in detail with reference to drawings. First, the detail of the sensor unit of the example of this embodiment used by a test | inspection apparatus is demonstrated.

(Example 1 Embodiment)

First, with reference to FIG. 1, the embodiment of one invention which concerns on this invention is described in detail. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the structure of the sensor unit used by the test | inspection apparatus of one Embodiment of this invention which concerns on this invention.

In the inspection apparatus of the present embodiment, an inspection signal (for example, an alternating current signal) is provided by, for example, a sensor unit shown in FIG. 1 in which a rod-shaped sensor plate (rectangular sensor plate) is arranged in a column at approximately constant intervals. The positional relationship with the supplied test object conductor is detected.

As shown in Fig. 1, a rod-shaped X-axis sensor plate, for example, X-axis sensor plates X1 to X11, for detecting the position in the X-direction of the inspection object is placed on the surface of the insulating substrate formed of an insulating material. Place them at approximately regular intervals.

Further, a rod-shaped Y-axis sensor plate for detecting the position in the Y-direction of the inspection object, for example, Y-axis sensor plates Y1 to Y7, is roughly orthogonal to the X-axis sensor plate on the back surface of the insulating substrate. Place at regular intervals. This spacing does not have to be precise enough that two or more sensor plates cover the conductor under test.

When the inspection target conductor to which the AC inspection signal is applied is detected in the detectable range of the sensor unit shown in FIG. 1, the inspection target conductor and the sensor plate proximate to the inspection target conductor can be brought into electrostatic coupling.

For this reason, if the detection signal level from a sensor board is measured, the detection signal of the level according to the distance to the test object conductor can be detected. By using this, the position of the inspection object conductor can be measured by comparing the detection signal levels from different sensor plates and calculating the relative value of the detection signal levels of the sensor plates.

By making reference to the relative value of the detection signal level in another sensor board, it is no longer influenced by the supply signal level of the test | inspection signal to a test object conductor. This makes it possible to inspect very high accuracy.

Specifically, when the sensor unit shown in FIG. 1 is positioned and positioned in the vicinity of the positioning position of the position detecting object conductor, and the position detecting object conductor to which the AC test signal is applied is near the sensor unit, the sensor unit The electrostatic coupling state occurs with the sensor plate.

For this reason, in the test | inspection apparatus main body mentioned later in detail, the test signal detection level from the detection target conductor to which the test signal detected by the sensor board of the sensor unit was applied is measured, and the test | inspection of a certain level in each sensor board of a sensor unit is measured. Investigate whether a signal has been detected. Then, the inspection target conductor position is detected from the relative comparison of the detection results from different sensor plates.

For example, the detection object conductor and the sensor plate are electrostatically coupled to determine the level of the detection signal from the inspection object detected by the sensor plate. The level of the detected detection signal is inversely proportional to the distance between the detection target conductor and the sensor plate, and the detection level decreases as the distance is separated.

On the other hand, the state of electrostatic coupling between the conductor under test and the sensor plate varies greatly depending on the surrounding environment, and the detection level value of the signal also varies greatly depending on the AC inspection signal supplied to the inspected conductor.

For this reason, there is a limit to ensuring the inspection accuracy even when the absolute value of the detected signal is obtained. Therefore, in the present embodiment, the detection signal level of another sensor plate, for example, another sensor plate is obtained, and the detection signal level of each sensor plate is relatively compared, and the detection target conductor and the sensor plate are compared from the relative comparison result. Detect the state.

For example, when it is desired to detect a defective positioning or a defective state of an inspected conductor, the inspected conductor of a normal state is previously positioned at a positioning position to be inspected with respect to the sensor unit, and at this time, each sensor plate Measure and register the relative test signal detection level. In actual inspection, the conductor to be inspected is positioned at a desired position, and the relative inspection signal level of each sensor plate at that time is compared with a value registered in advance. If it is judged to be normal, and it is not within the allowable range, it can be judged as a poor positioning or a bad state of the conductor to be inspected.

In this case, since the judgment can be made based on the relative value of the detection signal level of each sensor plate, the state of the inspection signal supplied to the inspection object conductor and the influence of the surrounding environment between the inspection object conductor and the sensor plate are canceled out. It is possible to obtain a test result with a simple structure and high precision.

Specifically, the ratio of the value of the peak value of the detection inspection signal from the inspection object detected by the plurality of sensor plates, for example, is determined, and the position of the inspection object can also be determined from the obtained ratio.

In addition, of course, you may arrange | position an X-axis sensor board and a Y-axis sensor board in any surface of an insulated substrate. Placement on any side does not affect the measurement results.

In addition, the present invention is not limited to the above example, and for example, the shape of the conductor to which the inspection signal in the inspection region is supplied or the distance to the conductor can be specifically determined to check whether the conductor is defective or whether the conductor is properly positioned. Of course it is good.

The schematic structure of the test | inspection apparatus of one Embodiment of this invention which concerns on this invention using the sensor unit provided with the above structure is demonstrated below with reference to FIG. 2 is a view for explaining a schematic configuration of an inspection apparatus of an embodiment of the invention according to the present invention.

In Fig. 2, reference numeral 500 denotes an inspection target conductor, and the inspection target conductor 500 may be, for example, a rod-shaped conductor or, for example, an inspection target substrate on which a wiring pattern is arranged. In the following description, the case of a rod-shaped conductor will be described.

Reference numeral 510 denotes an inspection signal supply unit for supplying an inspection signal to the inspection conductor 500 to be inspected, and for example, supplies an alternating current signal of 20 Vp-p to the inspection object conductor 500 at 1 Hz or more. In the following description, the AC signal having the above specification is used as the inspection signal, but the embodiment is not limited to the above example, and any signal can be used. However, Preferably it is 100 kPa or less.

The test signal supply method from the test signal supply unit 510 to the test conductor 500 is, for example, in addition to a method of directly connecting the test signal supply unit 510 and a part of the test conductor 500 to supply a test signal. Even if the conductive plate spaced apart from the conductor 500 by a predetermined distance is placed in the electrostatic coupling state with the test conductor 500 or the connection conductor connected to the test conductor, the test signal is supplied from the test signal supply unit 510 to the conductive plate. good. In this case, the test signal can be supplied to the test conductor 500 in a non-contact manner. In addition, a coil may be provided at the end portion, and may be fed by electromagnetic coupling in an electromagnetic coupling state. In this embodiment example, there is no limitation on the inspection signal feeding method to the inspection conductor 500.

Reference numeral 530 denotes a sensor unit having the configuration shown in FIG. 1, for example. The detection signal from the X-axis sensor plate from the sensor unit 530 is sent to the X-axis sensor amplifying circuit 540, and the inspection signal from the Y-axis sensor plate is sent to the Y-axis sensor amplifying circuit.

For example, in the example shown in FIG. 1, the X-axis sensor plate has 11 columns (11 channels) structure, and the Y-axis sensor has 7 rows (7 channels) structure. The detection signals from the sensor plates for each column and row are amplified by the amplifier circuits 540 and 550, and the sensor plate detection results of any one column or row are selected by the switching circuits (multiplex circuits) 560 and 570. Is transferred to the measurement circuit 580.

Reference numeral 540 denotes an X-axis sensor amplifier circuit for amplifying detection signals of the sensor unit 530, for example, from each X-axis sensor plate that performs position detection in the X-direction, and 550 denotes an example of the sensor unit 530. For example, it is a Y-axis sensor amplification circuit which amplifies the detection signal from each Y-axis sensor board which performs position detection of a Y direction.

Reference numeral 560 denotes an X-axis input switching circuit for selecting any one of the detection signals from the sensor plates amplified by the X-axis sensor amplifier circuit 540 and outputting the detection signal to the measurement circuit 580.

Reference numeral 570 denotes a Y-axis input switching circuit that selects any one of the detection signals from the sensor plates amplified by the Y-axis sensor amplifier circuit 550 and outputs the detection signal to the measurement circuit 580.

Both the X-axis input switching circuit 560 and the Y-axis input switching circuit 570 select the input signal (detection signal) from any one of the sensor plates under the control of the control unit 600 and supply it to the measurement circuit 580. .

In addition, in the example of FIG. 2, although the amplifying circuits 540 and 550 and the switching circuits 560 and 570 are comprised separately from the sensor unit 530, the amplifying circuits 540 and 550 and the switching circuits 560 and 570 ) Is integrated with the sensor unit 530, and outputs only the output signal from the switching circuits 560, 570 from the sensor unit to the measurement circuit 580, and receives the control signal from the control unit 600. You may also

Reference numeral 580 is a measuring circuit, for example, a receiving circuit, a band pass filter (BPF) circuit for extracting only a signal of a test signal frequency, a peak hold circuit for measuring a peak signal value, and an analog-to-digital conversion for digitalizing a measurement signal. Circuit and the like.

The measurement circuit 580 switches and measures the detection signal levels from the respective sensor plates of the sensor unit 530, converts them into corresponding digital signals, and outputs them to the determination circuit 590. However, the configuration of the measurement circuit 580 is not limited to the above example, and may be output to the determination circuit 590 as an analog signal.

Reference numeral 590 denotes a determination circuit, which determines whether or not the position of the inspection conductor 500 with respect to the sensor unit 530, the state of the inspection conductor, etc. are within a predetermined range from the measurement result from the measurement circuit 580.

Reference numeral 600 denotes a control unit which is in charge of the overall control of the inspection apparatus of the embodiment, and includes, for example, a one-chip CPU, an IC memory, an external memory, and the like, and may perform various controls in accordance with a control program. In addition, the control unit 600 may implement the function of the determination circuit 590.

The determination of the determination circuit 590 includes, for example, the inspection conductor in the case where the sensor unit 530 is previously positioned at the inspection position, and the inspection conductor 500 supplied with the inspection signal has been moved to a predetermined position. The defect of the state of the test | inspection conductor 500 is judged whether the measurement result of the detection signal from 500 is in a predetermined range.

If it is not within the predetermined range, the inspection conductor has a bad shape (when disconnected or broken in the middle, or if the area is exceeded by shorting with an adjacent conductor), or if the positioning position is defective. If not set, etc.) is considered.

For example, when the test conductor 500 is a wiring pattern, disconnection, short circuit with an adjacent pattern, partial breakage, etc. can be detected. In addition, when the test conductor 500 is a connector pin and it can be mounted in the correct position of a connector, when it is a test | inspection, the mounting position to a connector is bad, the connection state with a connection wire (such as disconnection or poor contact), Poor connector shape can be detected.

Specifically, the determination circuit 590 of the present embodiment subtracts the detection signals from the sensor plates adjacent to each other to obtain the detection signal intensity difference, while dividing the detection signal values from the sensor plates by the difference, and from the division result. Find the distance from the sensor plate.

3 shows the relationship between the respective sensor plates arranged on the surface of the sensor unit 530 and the conductor to be measured. 3 is a diagram for explaining the relationship between the X-axis sensor plate and the inspection target conductor of the sensor unit of this embodiment example. In the following description, the case where a detection object conductor is a rod-shaped conductor suitable for description of a detection principle is demonstrated as an example.

In addition, the relationship between the detection target conductor and the Y-axis sensor plate also differs only from the position of the detection target conductor, and in principle there is no other part, and the position detection in the Y direction can be similarly performed. In addition, since the X-axis sensor plate and the Y-axis sensor plate are in a state of being spaced apart from the front and back surfaces of the substrate by a predetermined distance, the Z-direction (sensor unit 530 is determined by relative comparison between the detection signal values of the X-axis sensor plate and the Y-axis sensor plate. ) Distance from the surface] can also be detected.

Thus, by using the sensor unit shown in FIG. 1, the position of the X direction and Y direction of the test object conductor with respect to a sensor unit can be measured, and the position of Z direction can also be measured.

3 shows the relationship between each sensor plate arranged on the surface of the sensor unit 570 and the conductor to be measured. 3 is a diagram for explaining the relationship between the X-axis sensor plate and the inspection target conductor of the sensor unit of this embodiment example. In the following description, the case where a detection object conductor is a rod-shaped conductor suitable for description of a detection principle is demonstrated as an example.

In addition, the relationship between the detection target conductor and the Y-axis sensor plate is also different only in the position of the detection target conductor, and in principle, there is no other part.

In the determination processing of the determination circuit 590, when the measurement level in the measurement circuit 580 is equal to or greater than the predetermined level, the inspection object when the area in the detection object region of the inspection object conductor 500 is excessive or less than the predetermined level. It may be determined that the area including at least the inspection target region of the conductor 500 is underestimated.

In the example of FIG. 3, each X-axis sensor plate is arrange | positioned at intervals (P) which are constant space | intervals, and when the rod-shaped conductor tip part to which the alternating current test signal was applied was positioned in the position shown in FIG. The target conductor becomes a signal source, and each sensor plate and the inspection target conductor are in an electrostatic coupling state.

For this reason, the test signal supplied to the test object conductor can be detected by each sensor board, and the detection signal level of the X-axis sensor board Xn which is closest to a rod-shaped conductor becomes the maximum value, and a detection level is next. This high one becomes a sensor plate of (Xn + 1), a sensor plate of (Xn-1), a sensor plate of (Xn + 2), and a sensor plate of (Xn-2) below.

The inspection procedure in the inspection apparatus of this embodiment example having the above configuration will be described below with reference to the flowchart in FIG. 4. 4 is a flowchart for explaining inspection control of the inspection apparatus according to the embodiment.

As an inspection procedure of the inspection apparatus, first, the sensor unit 530 is fixed to the predetermined detection position in step S1. Then, for example, the power of the inspection apparatus is turned on so that the inspection can be performed.

Since the inspection posture is arranged in this way, the inspection signal is supplied to the conductor under test in step S2. Subsequently, in step S3, the inspection object is conveyed or moved to the inspection position to determine the position.

In step S4, the switching circuits 560 and 570 are switched to measure the detected signal level detected by each sensor plate. And in step S5, the relative comparison value of the detection value from each sensor board is calculated. For example, as described above, the relative comparison value is calculated by subtracting the detected value of the adjacent sensor plate and dividing from the peak value. In subsequent step S6, it compares with the standard value measured and registered as a normal value previously.

In step S7, it is checked whether the measured value is suppressed within a predetermined range from the standard value. In the case of being suppressed within a predetermined range, the inspection object is positioned within the predetermined range, and furthermore, it can be confirmed that there is no disconnection or short circuit, and there is no omission or damage. Proceed.

On the other hand, if it is not within the predetermined range in step S7, the flow proceeds to step S8, and the defect of the inspection object is notified and the flow proceeds to step S10.

In step S10, it is checked whether all the audits have been completed or whether the inspection is to be continued, and when the inspection is continued, the flow returns to step S2, and the inspection signal is then supplied to continue the inspection. In addition, in this case, when a new test object positioning is unnecessary, the process of step S3 is skipped and it transfers to the signal detection process in a sensor board.

On the other hand, when inspection is complete | finished in step S10, the said inspection process is complete | finished.

As described above, according to the present embodiment, the position of the inspection target conductor in the X-axis direction can be measured by measuring and comparing the detection signal levels for each X-axis sensor plate. The same applies to the Y-axis sensor.

It is preferable that the specific method of test | inspection judges a defect as to whether it exists in the predetermined range compared with the registration value of the test result used as the reference mentioned above.

Whether or not the above inspection method is a reliable inspection method is also apparent in the following formula for the specific detection signal level. An example of the specific calculation formula at the time of using the sensor unit of the example of this embodiment is shown below.

The output Vxn of the sensor plate Xn which detects the inspection signal from the rod-shaped conductor of FIG. 3 is represented by the following formula.

Vxn: output voltage of the n-axis X-axis sensor, Zcn; If the impedance between the bar conductor and the sensor plate is

[Equation 1]

[Equation 2]

w = 2πf, f: test signal frequency,

Cn: The capacitance between the rod-shaped conductor and the n-axis X-axis sensor plate.

From (1) and (2),

[Equation 3]

Becomes Where Zcn >> R

[Equation 4]

If you substitute (2) into (4),

[Equation 5]

In addition, Cn can be represented by the following formula.

[Equation 6]

K = k × e

k: capacity constant

e: permittivity

S: effective area of condenser between rod conductor and sensor plate

t: distance between rod-type conductor and sensor plate

Substituting equation (6) into equation (5),

[Equation 7]

In addition, the absolute value of (Vxn),

(Eq. 8)

It can be represented as. The equation (8) also shows that the closer to the rod-shaped conductor, that is, the smaller t, the larger the output of the sensor plate is.

In addition, how far the rod-shaped conductor is from a sensor plate can be calculated | required from the following formula. The output voltage of the sensor board directly below the bar conductor and the output voltages Vxn and Vxn + 1 of the adjacent sensor board are given by the formula (8).

(9)

(Eq. 10)

It can be represented as.

L0: Xn sensor plate – distance between rod conductors

L1: Xn + 1 Sensor plate-Distance between bar conductors

(Eq. 11)

P: distance of adjacent sensor plate

Here, when the distance between the Xn sensor plate and the rod-shaped conductor becomes L (= L0 + ΔL), each voltage is

[Equation 12]

(Eq. 13)

[Equation 14]

When P >> ΔL,

(Eq. 15)

(Vxn + 1) becomes a substantially constant value regardless of the distance between the rod-shaped conductor and the sensor plate.

therefore,

[Eq. 16]

[Eq. 17]

l ₁ ≒ (constant)

The insertion depth can be measured. That is, even if the inspection signal supply potential to the rod-shaped conductor is unclear, the distance between the sensor plate can be calculated.

In this embodiment example, since the sensor plate is connected to the X-axis sensor plate in the Y direction, the output is from the above expression (6),

(Eq. 20)

m: X-axis sensor plate in Y direction

t0: distance between the sensor plate directly below the bar conductor and the bar conductor

tp-: Distance between m-th sensor plate and rod-shaped conductor

tp +: Distance between the n-th sensor plate and rod-shaped conductor in + direction

[Equation 21]

q: pitch in the Y-axis direction of the X-axis sensor plate

aq: Distance from the X-peak sensor (REF sensor) Detected value of the axis Distance to the maximum sensor plate

Here, the rod-shaped conductors are spaced Δt apart,

[Equation 22]

The position of the bar conductor can be obtained from the sensor plate.

As described above, according to the embodiment, the distance to the sensor plate can be inspected without contacting the inspection conductor.

(2nd Embodiment Example)

In the first embodiment described above, an example in which the bar-shaped sensor plates are arranged to be perpendicular to each other has been described. However, the present invention is not limited to the above examples, and when the X-axis sensor plate and the Y-axis sensor plate are arranged in a positional relationship substantially perpendicular to each other, the same inspection as in the first embodiment can be performed.

The disk-shaped sensor plates are arranged in a zigzag pattern on the surface of the insulated substrate, the X-axis sensor plates electrically connect each other with the sensor plates in the row direction and each row, and the Y-axis sensor plates are arranged in the column direction and each column. What is necessary is just to electrically connect the sensor board.

A second embodiment according to the present invention thus connected will be described below with reference to FIG. 5 is a view for explaining the configuration of a sensor unit used in the inspection apparatus of the example of the second embodiment of the present invention.

In the inspection apparatus of the second embodiment, for example, a disc-shaped sensor plate is arranged in a zigzag shape at approximately constant intervals, and the sensor plate for each row or column of the X-axis sensor plate and the Y-axis sensor plate is connected. The connection wiring patterns are arranged on different surfaces, and do not cross each other.

In the example of FIG. 5, the wiring pattern which connects an X-axis sensor board is arrange | positioned on the surface, and the wiring pattern which connects a Y-axis sensor board is arrange | positioned on the back surface. The Y-axis sensor plate and the wiring pattern are connected by through holes, for example.

In addition, in the example shown in FIG. 5, since the sensor plate was arrange | positioned in a zigzag form, a sensor plate can be arrange | positioned with high density and the inspection at high precision is attained. The sensor unit shown in FIG. 5 in which the sensor plate is arranged in a zigzag shape detects the positional relationship with the inspection target conductor supplied with the inspection signal (for example, an AC signal).

Specifically, when the sensor unit shown in FIG. 2 is positioned and positioned near the positioning position of the position detection object conductor, and the detection object conductor to which the AC inspection signal is applied comes near the sensor unit, An electrostatic coupling state occurs with the sensor plate.

For this reason, the inspection signal detection level from the detection target conductor to which the inspection signal detected by the sensor plate of the sensor unit is applied in the inspection apparatus main body which will be described later in detail, and at a certain level of each sensor plate of the sensor unit is measured. It is checked whether the inspection signal is detected and the inspection object conductor position is detected from the relative comparison of the detection results of the sensor plates with each other.

For example, the level of the detection signal from the inspection object detected by the sensor plate is obtained, the shape of the conductor supplied with the inspection signal in the inspection area or the distance from the conductor is determined by the obtained level, and the conductor is defective. Alternatively, it is possible to check whether the position of the conductor is appropriate.

In the second embodiment, unlike the first embodiment, the disk-shaped sensor plates are arranged in a zigzag form, and as a result, relative to the rectangular bar-shaped sensor plates, the relative values of the detection signal levels from the inspection target conductors for each sensor plate are compared. As a result, a large difference can be provided, and more accurate measurement and determination are possible.

In the second embodiment, the sensor plate is arranged in a zigzag shape as shown in Fig. 5 on the surface of the sensor unit on the inspection target side, and the Y-axis sensor plate and the X-axis sensor plate are arranged for each row. The Y-axis sensor plate electrically connects the horizontally aligned sensor plates of FIG. 5, and the X-axis sensor plate electrically connects the longitudinally aligned sensor plates of FIG. 5.

Specifically, the sensor unit is formed of, for example, a double-sided substrate, the sensor plates are arranged in a zigzag shape on the surface, and the Y-axis sensor plates connect the sensor plates at the same row position to each other in a surface-side conductive pattern, and X The axis sensor plate arranges a conductive pattern on the back surface side of the sensor plate at the same row position, and connects the X-axis sensor plates at the same row position on the surface side to each other through the through hole.

In the example shown in FIG. 5, the X-axis sensor plate is a matrix (zigzag) sensor having 11 columns (11 channels) configuration and the Y-axis sensor is 9 rows (9 channels) configuration. The X-axis sensor indicates the sensor name of each channel from the left in FIG. X11 sensor, Y-axis are Y1, Y2... Set to Y9 sensor.

Also in the example of 2nd embodiment, the structure of test | inspection apparatuses other than a sensor unit can be set as the structure similar to the example of 1st embodiment shown in FIG. 2 mentioned above, and the detection signal from the sensor board for every column is X-axis amplification. Amplified by the circuit 540 and the Y-axis amplifier circuit 550, the sensor plate detection result of any one of the columns and rows of the X-axis switch circuit 560 and the Y-axis switch circuit 570 which are multiplex circuits is selected, It is transferred to the measurement circuit 580.

It is preferable that the arrangement pitch of the sensor plate of the sensor unit 570 is a pitch equal to or less than the width or arrangement pitch of the conductor to be inspected, for example. The X-axis sensor plate and the Y-axis sensor plate are arranged at the same pitch.

In order to reduce the interference between the X-axis sensor and the Y-axis sensor, it is desirable to minimize the faces facing each other as much as possible. When the inspection target conductor to which the inspection signal is applied comes to the sensor unit position, electric potential is generated by the electrostatic induction to the sensor plate. The potential is higher closer to the test object and lowered further away. It can be seen that the conductor under test came near the sensor plate position indicating the maximum voltage by amplifying the potential generated on the X-axis sensor plate and the Y-axis sensor plate by comparing the detected voltage.

For example, when inspecting whether the inspection conductor 500 of the inspection object to which the inspection signal was applied was positioned at a predetermined position, in the state which positioned this sensor unit 530 in a fixed position, When the inspection conductor 500 detects the detection signal level of the sensor plate at the time of positioning and compares with the detection level at the time of positioning at the correct position, it can determine that it is a positioning failure.

In addition, the distance between the sensor plate and the conductor can be measured by measuring the sensor plate detection signal level when the inspection conductor 500 is close, and the level difference between the detection signal levels of each X-axis sensor and Y-axis sensor is measured. By detecting, the relative distance between each sensor plate can be calculated | required, for example, by positioning the sensor unit 570 at a reference position, it is in which position the conductor is compared with a reference position, the inspection conductor 500 The measurement can be performed accurately regardless of the level difference between the detection signals applied to the signals.

As described above, according to the second embodiment, since the sensor plates are arranged in a zigzag shape, deterioration in detection accuracy due to overlap of the sensor plates can be prevented, and noise components caused by the overlap of the sensor plates can be suppressed. A highly accurate detection result can be obtained.

(Third Embodiment Example)

The 2nd Embodiment Example demonstrated above demonstrated the example which arrange | positions a sensor plate in the zigzag form. However, the present invention is not limited to the above examples, and as a method of arranging in a matrix form, it is a matter of course that both the column position and the row position may be aligned without shifting the arrangement position of the sensor plate for each row.

Also in this case, similarly to the second embodiment, for example, the disk-shaped sensor plates are arranged in a matrix at approximately constant intervals, and each of the X-axis sensor plate and the Y-axis sensor plate is arranged on one side with each other in a wiring pattern. Connect.

What is necessary is just to arrange a sensor board in the same surface (for example, surface), for example, to arrange the wiring pattern which connects a Y-axis sensor board to the same surface, and to arrange the wiring pattern which connects an X-axis sensor board to another surface. The X-axis sensor plate and the wiring pattern are connected by, for example, through holes.

An example of the sensor plate of the third embodiment in which the disc-shaped sensor plates are arranged in a matrix at substantially constant intervals will be described with reference to FIG. 6. 6 is a view for explaining the configuration of a sensor unit used in the inspection apparatus of the example of the third embodiment of the present invention.

In the inspection apparatus of the third embodiment, for example, the disk-shaped sensor plates are arranged in a matrix at approximately constant intervals, and the sensor plates for each row or column of the X-axis sensor plate and the Y-axis sensor plate are connected. The connection wiring patterns are arranged on different surfaces, and do not cross each other.

In the example of FIG. 6, the wiring pattern which connects an X-axis sensor board is arrange | positioned on the surface, and the wiring pattern (not shown) which connects a Y-axis sensor board is arrange | positioned on the back surface. The Y-axis sensor plate and the wiring pattern are connected by through holes, for example.

Moreover, also in 3rd Embodiment Example, the method of detecting the positional relationship with the test object conductor supplied with the test signal (for example, an AC signal) by the sensor unit is 1st Embodiment Example or 2nd Embodiment mentioned above. Same as the example.

In addition, the shape of a sensor plate is not limited to the example of a substantially circular shape, For example, a rectangle or a square may be sufficient and it is not limited to a sensor plate shape.

(Example 4 Embodiment)

The 3rd Embodiment Example demonstrated above demonstrated the example which arrange | positions a sensor board for every column position and row position, and arrange | positions an X-axis sensor board and a Y-axis sensor board alternately for every row. However, the present invention is not limited to the above example, and the X-axis sensor plate and the Y-axis sensor plate may be arranged so that the sensor plates adjacent to each other alternately, that is, even in the same row, may be different sensor plates.

Alternatively, the sensor plates may be shifted from each other in the column direction so that the sensor plates adjacent to each other alternately in the column direction may be different sensor plates.

In this case, the wiring pattern connecting between the X-axis sensor plate and the Y-axis sensor plate needs to avoid other adjacent sensor plates.

In addition, also in the fourth embodiment, the method of detecting the positional relationship with the inspection target conductor supplied with the inspection signal (for example, an alternating current signal) by the sensor unit is the same as the above-described embodiment.

In addition, the shape of a sensor plate is not limited to the example of a substantially circular shape, For example, a rectangle or a square may be sufficient and it is not limited to a sensor plate shape.

(Other embodiment example)

The above description has described an example in which the X-axis sensor plate and the Y-axis sensor plate are disposed on the same surface of the insulating substrate constituting the sensor unit, for example. However, this invention is not limited to the above example, For example, you may arrange | position an X-axis sensor board and a Y-axis sensor board in the front and back surface, respectively.

In this way, it is not necessary to connect the connection wiring patterns for connecting the X-axis sensor plates or the Y-axis sensor plates with through holes or the like, and the sensor plate patterns and the connection wiring patterns can be formed on each surface by pattern etching. . For this reason, a structure can also be made simple.

Further, the insulating substrate may be a multilayer substrate, and by forming the multilayer substrate, the connection pattern can be easily formed even if the sensor board is wired on the surface. Moreover, if a shield pattern is arrange | positioned in an intermediate | middle layer and a connection pattern is arrange | positioned under it, it can be set as the sensor unit with which the detection signal level is less influenced by the connection wiring pattern between sensor plates.

According to the present invention, regardless of the supply state of the test signal to the test object, a highly reliable test of the test target conductor which reduces the influence of the surrounding environment during the test can be made non-contact with the test object.

Claims (15)

It is a sensor for an inspection apparatus used for an inspection apparatus capable of non-contact inspection of the state of an inspection object conductor to which an AC inspection signal is applied, And a sensor plate formed in a rod shape capable of detecting a signal from a conductor to be inspected in a column shape at predetermined intervals. The method of claim 1, wherein the sensor plate is disposed at predetermined intervals so as to be substantially perpendicular to the first thermal sensor plate disposed on one side of the substrate formed of an insulating material at a predetermined interval, and the first thermal sensor plate on the other side of the substrate. And a second thermal sensor plate provided therein. The sensor plate of claim 1, wherein the sensor plate is disposed on a multi-layered substrate, and the sensor plate disposed on the multi-layered substrate is disposed at predetermined intervals so as to be substantially orthogonal to the first thermal sensor plate and the first thermal sensor plate disposed at predetermined intervals. And a second thermal sensor plate arranged, wherein the first sensor plate and the second sensor plate are arranged on different surfaces or layers. It is a sensor for an inspection device used for an inspection device that can inspect the state of the inspection target conductor to which the AC inspection signal is applied, The sensor plate formed in the form of a plate with a conductive material is arranged in a matrix form, The sensor plates arranged in the matrix form are X-axis sensor plates and Y-axis sensor plates for each row, and the X-axis sensor plates connect the sensor plates for the same column to each other, while the Y-axis sensor plates are the sensor plates for the same row. Connect each other, A sensor for an inspection apparatus, characterized in that it is possible to detect a relative detection level difference between adjacent sensor plates of an inspection signal from the inspection object conductor. It is a sensor for an inspection device used for an inspection device that can inspect the state of the inspection target conductor to which the AC inspection signal is applied, The sensor plate formed in the form of a plate with a conductive material is arranged in a matrix form, The sensor plates arranged in the matrix form are arranged such that the X-axis sensor and the Y-axis sensor are alternately arranged for each of the adjacent sensor plates. The X-axis sensor plate connects the sensor plates for the same column to each other, while the Y-axis sensor plate connects the sensor plates for the same row to each other, A sensor for an inspection apparatus, characterized in that it is possible to detect a relative detection level difference between adjacent sensor plates of an inspection signal from the inspection object conductor. It is a sensor for an inspection device used for an inspection device that can inspect the state of the inspection target conductor to which the AC inspection signal is applied, The sensor plate formed in a flat plate shape as a conductive material is arranged in a zigzag shape, The sensor plates arranged in the zigzag shape are X-axis sensor plates and Y-axis sensor plates for each row. The X-axis sensor plate connects the sensor plates for the same column to each other, while the Y-axis sensor plate connects the sensor plates for the same row to each other, The inspection signal from the inspection object conductor makes it possible to detect a relative detection level difference between adjacent sensor plates. The sensor plate according to any one of claims 4 to 6, wherein the sensor plate is disposed on a multi-layer substrate, and the X-axis sensor plate and the Y-axis sensor plate disposed on the multi-layer substrate are disposed on different surfaces or layers. Sensor for inspection apparatus characterized by the above-mentioned. The sensor plate according to any one of claims 4 to 7, wherein the sensor plate is disposed on the same surface of the substrate, The X-axis sensor plate is connected in a wiring pattern arranged in a column in one direction of the substrate and the X-axis sensor plates for each column are connected to each other, The said Y-axis sensor board is connected by the wiring pattern arrange | positioned on the other side in the row form, and the Y-axis sensor board for each row is mutually connected, The sensor for inspection apparatuses characterized by the above-mentioned. The sensor for inspection apparatus in any one of Claims 1-8, Measuring means for measuring a signal from an inspection target conductor to which the inspection signal detected by the sensor plate of the sensor for inspection device is supplied; Determination means for determining the state of the inspection object conductor from the measurement signal strength of the measurement means; And the determining means inspects the state of the inspected conductor from the relative comparison of the detection signal strength from the sensor plate. 10. The inspection apparatus according to claim 9, wherein the determination means inspects the distance between each sensor plate and the inspection target conductor compared with the inspection signal level from the sensor plate having a high detection level and the relative signal level of the inspection signal level from another sensor plate. The inspection apparatus characterized by determining the state of an inspection object conductor by doing so. 11. The determination means according to claim 10, wherein the determination means determines the inspection target position in the X direction at the measurement signal level from the X-axis sensor plate, and the inspection target position in the Y direction at the measurement level from the Y-axis sensor plate. Inspection device characterized in that. 10. The test object conductor according to claim 9, wherein the determination means is configured such that when the level measured by the level measuring means is equal to or higher than a predetermined level, the test object conductor is excessive when the area of the test object is too large in the detection target area, and when the measurement level is equal to or less than a predetermined level. It is determined that the area including at least the inspection target region is too small. It is a test | inspection method in the test | inspection apparatus in any one of Claims 9-12, And detecting the position of the inspection target conductor with respect to the inspection signal detection sensor plate by comparing the detection signal strengths from the plurality of sensor plates with respect to whether or not the relative comparison result is within an allowable range. The inspection method according to claim 13, wherein the distance to the inspection object conductor is detected by obtaining a difference in the detection signal strengths from the plurality of sensor plates. The test target conductor according to claim 13 or 14, wherein the relative detection signal strength of the standard test signal at the test target conductor position with respect to the predetermined sensor plate is compared with the test signal strength detection signal strength detected from the test target conductor. An inspection method, characterized in that the inspection of the defective position.

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