KR102251805B1 - Rigidity test device of semiconductor inspection equipment module - Google Patents

Abstract

The present invention relates to a rigidity tester of a semiconductor inspection equipment module, whereby it is possible to measure the rigidity of the semiconductor inspection equipment module more precisely. The rigidity tester comprises: a main base on which the semiconductor inspection equipment module is seated; an inspection module including at least one load cell and disposed above the main base; a first position adjusting unit for adjusting a relative position in the front-rear direction between the semiconductor inspection equipment module and the inspection module; and a second position adjusting unit for adjusting a relative position in the left-right direction between the semiconductor inspection equipment module and the inspection module. The inspection module comprise: a servo motor; and a load applying unit having an upper end connected to the servo motor and moving in the vertical direction. According to the present invention, it is possible to measure the rigidity of a semiconductor inspection equipment module more precisely.

Description

Stiffness tester of semiconductor inspection equipment module {RIGIDITY TEST DEVICE OF SEMICONDUCTOR INSPECTION EQUIPMENT MODULE}

The present invention relates to a stiffness tester that more accurately measures a range to be deformed and a range to be restored by applying a predetermined load to a semiconductor inspection equipment module.

The semiconductor process is generally divided into a pre-process and a post-process, and the post-process includes a semiconductor inspection step of inspecting the manufactured semiconductor wafer. In addition, the semiconductor inspection step is required to improve productivity as a large number of semiconductor inspection equipment is arranged in a limited inspection space by reducing the overall size and weight of the semiconductor inspection equipment according to the refinement of the process currently being improved and the larger diameter of the wafer. At this time, semiconductor inspection equipment can be largely divided into main inspection equipment, probe station, and handler burn-in equipment.

The probe station includes a probe card having a plurality of probe needles and a Z-axis module for fixing a semiconductor wafer, and the probe needles are configured to be in contact with the semiconductor wafer to inspect electrical characteristics. As a technology for this, it is currently disclosed in Korean Patent Publication No. 10-1784187 ("Semiconductor Wafer Prover", 2017.10.18. Announcement, hereinafter referred to as'prior art 1'). Prior Art 1 discloses a Z-axis module including a chuck and a Z-Stage, and a tilting function is included on the Z-axis module so that contact with the probe needle can be maintained more smoothly. At this time, when the semiconductor wafer is mounted on the chuck of the Z-axis module, the Z-axis module may rise or the probe card may descend to contact each other.

In addition, in Korean Patent Publication No. 10-1663004 ("Needle tip polishing device for prober and probe card", 2016.10.06. Announcement, hereinafter referred to as'prior art 2'), WAPP (Wide Wide) for polishing probe needle Area Polish Plate) is disclosed. The WAPP is configured to polish a worn probe needle by a load applied between the stage and the probe card, and may even include a function of cleaning the probe needle.

With the recent development and use of high rigidity probe cards, the load applied to the Z-axis module and WAPP as above has increased. Accordingly, the Z-axis module and the WAPP have a problem in that deformation occurs due to a high load, which leads to a problem that the reliability of the inspection result is lowered.

KR 10-1784187 B1 (announced on October 18, 2017) KR 10-1663004 B1 (2016.10.06.announcement)

The present invention was conceived to solve the problems of the prior art, and an object of the present invention is to provide a stiffness tester for a semiconductor inspection equipment module capable of more precisely measuring the stiffness of a Z-axis module or a WAPP.

In order to achieve the above object, the present invention provides a rigidity tester for testing the rigidity of a semiconductor inspection equipment module, comprising: a main base on which the semiconductor inspection equipment is mounted; A test module including at least one load cell and disposed above the main base; A first position control unit for adjusting a relative position in the front-rear direction between the semiconductor inspection equipment module and the inspection module; And a second position control unit for adjusting the relative position in the left and right direction between the semiconductor inspection equipment module and the inspection module, wherein the inspection module includes a servo motor and an upper end of which is connected to the servo motor and is moved vertically. It may include a load applying unit.

In addition, the semiconductor inspection equipment module may be composed of a Z-axis module including a chuck or a wide area probe polish (WAPP) for polishing a probe of a probe card.

In addition, the inspection module may include a Z-axis load cell connected to a lower end of the load application unit, and the Z-axis load cell may be driven vertically by power applied from the servo motor.

In addition, the inspection module may include a coupling housing in which a hollow is formed and the Z-axis load cell is disposed therein; And a plurality of side load cells disposed along the outer circumference of the coupling housing.

In addition, the plurality of side load cells may include a pair of side load cells each protruding in the front and rear direction, and a pair of side load cells each protruding in the left and right direction.

In addition, the first position control unit may include: a first guide rail disposed on an upper surface of the main base and extending in a front-rear direction; And a first moving member disposed on the upper surface of the semiconductor inspection equipment module to be transported in the front and rear directions on the first guide rail.

In addition, the second position control unit may include a second guide rail that is spaced apart from the upper side of the main base and extends in a left and right direction; And a second moving member coupled to one surface of the inspection module to be transferred in the left and right directions on the second guide rail.

In addition, the rigidity tester according to the present invention may further include a support frame for fixing the second position control unit on the main base.

In addition, the rigidity tester according to the present invention further comprises a control module connected to the inspection module, the first position control unit and the second position control unit, wherein the control module includes the first position control unit and the second position control unit. By adjusting the control unit, a relative position between the semiconductor inspection equipment module and the inspection module may be adjusted, and a measurement signal may be input from a load cell of the inspection module.

In addition, the rigidity tester according to the present invention further includes a sub-base on which the control module is seated, and the sub-base may be disposed in one of the front, rear, left and right directions of the main base.

The rigidity tester according to the present invention having the configuration as described above has the advantage of enabling more precise measurement of the semiconductor inspection equipment module by mechanically controlling the Z-axis load cell using a servo motor.

In addition, the stiffness tester according to the present invention has the advantage of being able to measure the stiffness in the lateral direction of the semiconductor inspection equipment module through a plurality of side load cells extending in the front and rear and left and right directions.

In addition, the stiffness tester according to the present invention has the advantage of reducing an error that appears in an actual inspection process by providing a basis for more accurately measuring the stiffness of the Z-axis module or WAPP.

1 is a perspective view of a stiffness tester according to the present invention.
Figure 2 is a front view of the stiffness tester according to the present invention.
3 is a plan view of a stiffness tester according to the present invention.
Figure 4 is a side cross-sectional view of the adjustment member according to the present invention.
Figure 5 is a perspective view of the inside of the measuring member according to the present invention is projected.
6 is a front view of a stiffness tester according to the present invention.
7 is a configuration diagram of a control system of a stiffness tester according to the present invention.

Hereinafter, a stiffness tester of a semiconductor inspection equipment module according to the present invention will be described in detail with reference to the accompanying drawings. The drawings introduced below are provided as examples in order to sufficiently convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the drawings presented below and may be embodied in other forms. In addition, the same reference numbers throughout the specification indicate the same elements.

If there are no other definitions in the technical terms and scientific terms used at this time, they have the meanings commonly understood by those of ordinary skill in the technical field to which this invention belongs, and the gist of the present invention is unnecessary in the following description and accompanying drawings. Descriptions of known functions and configurations that may be blurred will be omitted.

1 is related to an embodiment of a stiffness tester according to the present invention, and FIG. 1 is a perspective view of a stiffness tester.

Referring to FIG. 1, the stiffness tester 10 according to the present invention includes a main base 100 that supports a semiconductor inspection equipment module 200, and the semiconductor inspection equipment module is disposed above the main base 100. It may include an inspection module 300 including at least one or more load cells to measure the stiffness of 200. At this time, the semiconductor inspection equipment module 200 may be composed of any one of a Z-axis module including a chuck or a wide area probe polish (WAPP) for polishing a probe of a probe card. . In this case, the Z-axis module may be configured to support the lower portion of the semiconductor wafer on the probe station, and the WAPP may be a device configured to polish or clean the probe needle of the probe card on the probe station. This is a known means in the probe station of the semiconductor process, so a detailed description is omitted.

And the stiffness tester 10 according to the present invention, the first position control unit 400 for adjusting the relative position in the front-rear direction between the semiconductor inspection equipment module 200 and the inspection module 300 and the semiconductor inspection equipment module ( It may further include a second position control unit 500 for adjusting the relative position in the left and right direction between the 200) and the inspection module 300. At this time, the first position control unit 400 or the second position control unit 500 is installed on the upper surface of the main base 100 to transfer the semiconductor inspection equipment module 200 or the main base 100 It may be arranged to be spaced apart on the upper side of the) to be configured to transfer the inspection module 300. In the illustrated example, the first position adjusting part 400 is installed on the upper surface of the main base 100, and the second position adjusting part 500 is installed spaced apart from the upper side of the main base 100. I'm holding on to it.

The first position adjusting unit 400 includes a first guide rail 410 and a first moving member 420, and the second position adjusting unit 500 includes a second guide rail 510 and a second moving member. A member 520 may be included. At this time, for a more clear explanation, the direction in which the first guide rail 410 extends is defined as the front-rear direction (D ₁ ), and the lower left and upper right sides of the drawing are defined as _{front (D 11} ) and rear (D ₁₂₎ . In addition, a direction in which the second guide rail 510 extends is defined as a left-right direction (D ₂ ), and an upper left direction and a lower right direction in the drawing _{are defined as right (D 21} ) and left (D ₂₂ ), respectively. In addition, the Z-axis direction in which the semiconductor inspection equipment module 200 extends is defined as an up-down direction (D3), and an upper and a lower part of the drawing are defined as an _{upper side (D 31} ) and a lower side (D _{32 ), respectively.}

In the first position control unit 400, the first guide rail 410 extends in a front-rear direction, and the first moving member 420 may be transferred in a front-rear direction on the first guide rail 410. have. In addition, the semiconductor inspection equipment module 200 may be fixed and transported above the moving member 420.

The second position adjusting part 500 may have the second guide rail 510 extended in the left and right direction but the position may be fixed, and the second moving member 520 may be positioned on the second guide rail 510. It can be transferred left and right. In addition, the inspection module 300 may be fixed and transported on the moving member 520. In this case, the semiconductor inspection equipment 10 according to the present invention may further include a support frame 600 for fixing the second position control unit 500 on the main base 100. Here, the support frame 600 may consist of one or more pairs and include a first support frame 610 and a second support frame 620, and the first support frame 610 is on the main base 100. The right side of the position control unit 500 may be fixed to, and the second support frame 620 may fix the left side of the position control unit 500 on the main base 100. More specifically, the position control unit 500 may include a separate base to which the first guide rail 510 is coupled, and the base may be fixed in position through the support frame 600.

The rigidity tester 10 according to the present invention may further include a control module 700 connected to the inspection module 300, the first position control unit 400, and the second position control unit 500. At this time, the control module 700 is configured to enable input and output of information, and may be configured to store/calculate data transmitted from a load cell of the test module 300. In addition, the control module 700 may be mounted on the main base 100 or may be mounted on the main base 100 or the sub-base 800 fixed on the floor.

2 and 3 are related to an embodiment of a stiffness tester according to the present invention, FIG. 2 is a front view of the stiffness tester, and FIG. 3 is a plan view of the stiffness tester.

2 and 3, the test module 300 may be fixed on one surface of the second moving member 520, and the test module 300 includes an adjusting member 310 and a measuring member 320 ) Can be included. At this time, the adjusting member 310 and the measuring member 320 may be connected in a vertical direction, and the adjusting member 310 may be configured to adjust the vertical height of the measuring member 320. Here, the measuring member 320 may include a plurality of load cells, and some of the plurality of load cells may be arranged to measure loads on the front and rear sides and left and right sides.

The semiconductor inspection equipment module 200 may be formed as a Z-axis module including the chuck 210 as described above. Here, the inspection module 300 may adjust the load cell of the measuring member 320 to be positioned at the same height as the chuck 210 through the adjusting member 310. At this time, the load cell of the measuring member 320 and the chuck 210 may be height-adjusted up and down in a state that is spaced apart from each other in the front and rear or left and right directions, and after the height is adjusted, the first The position control unit 400 and the second position control unit 500 can be controlled. In addition, the first guide rail 410 and the second guide rail 510 of the first position control unit 400 and the second position control unit 500 are connected to a motor M, and the rail is actuated. Power may be transmitted, and the motor M may be connected to the control module 700 to receive a control signal.

The control module 700 may include a housing part 710, an LVDT measuring device 720 fixed to the housing part 710, a touch panel 730, and a controller 740. At this time, the LVDT measuring device 720 may be provided with a function of measuring a displacement amount of a module to be inspected when vertical and horizontal stiffness are measured. In addition, the touch panel 730 may be interlocked with an internal PLC to generate electrical input information by physical pressure input from the outside. In addition, it may be configured to output information calculated internally or a platform stored in a storage device to the outside. The controller 740 is interlocked with a heater, a servo motor of the inspection module 300, and a motor connected to the first position control unit 400 and the second position control unit 500 to provide numerical values (speed, temperature), and direction. And it may be configured to enable On/Off control.

4 and 5 are related to an embodiment of a stiffness tester according to the present invention, FIG. 4 is a side cross-sectional view of an adjustment member of the inspection module, and FIG. 5 is a perspective view of a projection of a measurement member of the inspection module, respectively.

Referring to FIG. 4, a servo motor and a cable C connected to the servo motor may be disposed on the adjusting member 310. In addition, the adjustment member 310 may include a load application part 311 connected to the above-described measuring member 320 and moved upward and downward, and a support part 312 receiving the load application part 311 therein. have. In addition, the adjusting member 310 may further include a power transmission unit 313, a ball screw 314, and a cover 315.

The power transmission unit 313 may connect between the servo motor and the load application unit 311, and may allow the power generated by the servo motor to be transmitted to the load application unit 311. And the ball screw 314 is connected between the power transmission unit 313 and the load applying unit 311 and converts the transmitted rotational force into an axial motion in the vertical direction and controls the load applying unit 311 to be transferred. can do. In addition, the cover 315 may be sealed so that the power transmission unit 313 and the ball screw 314 are not exposed to the outside.

5, the support part 312 of the adjusting member 310 may be fixed in position on the second moving member 520, and as described above, the load applying part of the adjusting member 310 ( 311) is driven up and down to control the height of the measuring member 320. At this time, the measuring member 320 is a Z-axis load cell 321 that extends in a downward direction and measures the load in the vertical direction, and a coupling housing 322 having a hollow formed so that the Z-axis load cell 321 is accommodated therein. And, it may include a plurality of side load cells 323 spaced apart from each other along the outer circumference of the coupling housing 322. Here, the Z-axis load cell 321 may descend to the upper surface of the chuck 210 to detect the load in the vertical direction, and the plurality of side load cells 323 extend in the front-rear direction and the left-right direction to the chuck ( 210) side load can also be detected.

6 is related to an embodiment of the stiffness tester according to the present invention, and FIG. 6 is a front view of the stiffness tester showing the measurement of a semiconductor inspection equipment module through a Z-axis load cell.

6, when analyzing the load on the chuck 210 through the Z-axis load cell 321, the semiconductor inspection equipment module 200 and the inspection module 300 can be adjusted as follows. have. The first position control unit 400 and the second position control unit 500 are the semiconductor inspection equipment module 200 so that the lower end of the Z-axis load cell 321 faces a position to be measured from the upper surface of the chuck 210. ) And the relative positions of the test module 300 in the front and rear directions and in the left and right directions, respectively. In addition, when the Z-axis load cell 321 descends downward through the servomotor coupled by the adjusting member 310 of the inspection module 300, the measurement may be performed in contact with the upper surface of the chuck 210. Accordingly, the present invention has the advantage that more precise detection is possible for the semiconductor inspection equipment module 200 of a high load specification, and the reliability of the result is also increased through an automated facility rather than manual operation.

7 is related to an embodiment of a stiffness tester according to the present invention, and FIG. 7 shows a configuration diagram of a control system of the stiffness tester.

Referring to FIG. 7, the stiffness tester according to the present invention has the advantage of enabling precise control more easily by controlling the touch panel, the heater, the left and right motors, the vertical servo motors, and the load cell data with a PCL. At this time, as described above, the overall operation is controlled through the touch panel and the measured values are stored and output in real time, thereby improving convenience.

As described above, in the present invention, specific matters such as specific components and the like have been described by the drawings of limited embodiments, but this is provided only to help a more general understanding of the present invention, and the present invention is limited to the above-described embodiment. It is not, and those of ordinary skill in the field to which the present invention pertains can make various modifications and variations from this description.

Therefore, the spirit of the present invention is limited to the described embodiments and should not be determined, and all things having equivalent or equivalent modifications to the claims as well as the claims to be described later fall within the scope of the spirit of the present invention. will be.

10: stiffness tester
100: main base
200: semiconductor inspection equipment module 210: chuck
300: inspection module
310: adjustment member 311: load application portion
312: support part 313: power transmission part
314: ball screw 315: cover
320: measuring member 321: Z-axis load cell
322: coupling housing 323: side load cell
400: first position control unit
410: first guide rail 420: first moving member
500: second position control unit
510: second guide rail 520: second moving member
600: support frame
610: first support frame 620: second support frame
700: control module 710: housing
720: LVDT measuring device 730: touch panel
740: controller
800: sub bass

Claims (10)

In a rigidity tester that tests the rigidity of a semiconductor inspection equipment module,
A main base on which the semiconductor inspection equipment module is mounted;
A test module including at least one load cell and disposed above the main base;
A first position control unit for adjusting a relative position in the front-rear direction between the semiconductor inspection equipment module and the inspection module; And
A second position control unit for adjusting the relative position in the left and right direction between the semiconductor inspection equipment module and the inspection module;
Including,
The inspection module,
A servo motor, and a load applying unit having an upper end connected to the servo motor and moving in a vertical direction;
A Z-axis load cell connected to the lower end of the load application unit;
A coupling housing in which a hollow is formed so that the Z-axis load cell is disposed therein; And
A plurality of side load cells disposed along an outer circumference of the coupling housing;
Including,
The Z-axis load cell is driven up and down by the power applied from the servo motor to measure the upper surface stiffness of the semiconductor inspection equipment module,
The plurality of side load cells,
A stiffness tester, characterized in that the lateral stiffness of the semiconductor inspection equipment module is measured by contacting the plurality of side load cells with the side surfaces of the semiconductor inspection equipment module by the first position control unit and the second position control unit.
The method of claim 1,
The semiconductor inspection equipment module,
Z-axis module (Z-Axis Module) including a chuck (Chuck), or,
Stiffness tester, characterized in that the WAPP (Wide Area Probe Polish) for polishing the probe of the probe card.
delete delete The method of claim 1,
The plurality of side load cells,
A stiffness tester comprising a pair of side load cells each protruding in a front-rear direction and a pair of side load cells protruding in a left and right direction.
The method of claim 1,
The first position control unit,
A first guide rail disposed on an upper surface of the main base and extending in a front-rear direction; And a first moving member having the semiconductor inspection equipment module disposed on an upper surface thereof and being transferred in a forward and backward direction on the first guide rail.
Stiffness tester comprising a.
The method of claim 1,
The second position control unit,
A second guide rail spaced apart from the upper side of the main base and extending in a left and right direction; And a second moving member coupled to one surface of the inspection module to be transported in the left and right directions on the second guide rail.
Stiffness tester comprising a.
The method of claim 7,
A support frame for fixing the second position control unit on the main base;
Stiffness tester characterized in that it further comprises.
The method of claim 1,
A control module connected to the inspection module, the first position control unit and the second position control unit;
Including more,
The control module,
Adjusting the first position control unit and the second position control unit to adjust the relative position between the semiconductor inspection equipment module and the inspection module,
Stiffness tester, characterized in that receiving a measurement signal from the load cell of the test module.
The method of claim 9,
A sub-base on which the control module is mounted;
Including more,
The stiffness tester, wherein the sub-base is disposed in one of the front, rear, left and right directions of the main base.

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