KR20070068993A - Light emitting device module - Google Patents

Abstract

A light emitting device module is provided to reduce a thermal influence between adjacent light emitting devices by installing a heat conduction preventing member between heat sink bases. Plural light emitting devices(4A,4C) are formed adjacent to each other. Plural heat sink bases support at least one of the light emitting devices. A heat conduction preventing member prevents heat from being conducted between the heat sink bases. A distance between the adjacent light emitting devices is less than a mean value of the length along the adjacent direction of the adjacent light emitting devices. The heat conduction preventing member has a thermal insulator formed of a material which has less thermal conductivity than the heat radiation bases.

Description

Light emitting device module

1A is a plan view showing a schematic configuration of a light emitting device module according to a first embodiment of the present invention, and FIG. 2B is a sectional view taken along the line A-A of FIG. 1A.

2 is an exploded perspective view of a light emitting device module according to a first embodiment of the present invention.

3A to 3C are plan views illustrating an arrangement example of a light emitting device module according to a first embodiment of the present invention.

4A is a plan view showing a schematic configuration of a light emitting device module according to a second embodiment of the present invention, and FIG. 4B is a sectional view taken along line B-B in FIG. 4A.

5A is a plan view showing a schematic configuration of a light emitting device module according to a third embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line C-C of FIG. 5A.

<Description of the symbols for the main parts of the drawings>

1,50,60 ... light emitting device module 2,11 ... main frame

2a, 3a, 9a, 11a ... light emitting device mounting surface

2b, 3b ... convex side 2A ... convex

2B ... Through hole 3 ... Nest frame

3e ... Nest frame side 4A, 4B, 4C, 4D ... light emitting device

5 ... thermal insulation member 6 ... gap

Heat dissipation base part 11A, 11B, 11C, 11D ... heat dissipation block part

11E ... bottom R ... red light emitting device

G ... green light emitting device B ... blue light emitting device

The present invention relates to a light emitting device module having a plurality of light emitting devices, and more particularly, to a light emitting device module having a structure capable of reducing thermal effects between a plurality of light emitting devices.

The light emitting device module is used in various ways such as a projector, a display, an indicator, a traffic sign, an illumination, and the like. Background Art Conventionally, light emitting device modules are known in which a plurality of solid state light emitting elements such as light emitting diodes (hereinafter referred to as LEDs) are provided so as to improve the light emission luminance or to emit white light or color light by combining solid state light emitting elements having different wavelengths.

In such a light emitting device module, in order to avoid the influence of self-heating at the time of light emission, each light emitting device was arrange | positioned enough on an electrode or a board | substrate.

As an example of such a light emitting device module, Patent Document 1 (Patent No. 3329716, Fig. 1) describes a chip type LED in which LED chips capable of emitting green, red and blue light are disposed on a common electrode, respectively. It is said that this common electrode is preferably made as large as possible in consideration of heat dissipation and reflectivity of the LED. In the figure, it is described that the adjoining distance of each square LED chip is substantially larger than the dimension of one side thereof.

In addition, Patent Document 2 (Japanese Patent Laid-Open No. 2005-159262, Fig. 1-9) discloses an approximately square light emitting element made of at least three LEDs at equal intervals on one base made of resin such as ceramics or epoxy resin. Disclosed is a light emitting device which is disposed in a dispersed manner and whose upper portion is covered with a light transmitting member. Each light emitting element is described in that the arrangement intervals are all approximately equal to or wider than one side of a square.

The above conventional light emitting device module has the following problems.

In the technique of Patent Literatures 1 and 2, a plurality of light emitting devices are arranged on the same heat dissipating member as the electrode, the substrate, the base, and the like apart from each other at an adjacent distance of about the size of the light emitting surface. Although cooled, the heat generation amount increases, and the thermal effects are easily affected. For example, the luminous efficiency is lowered, resulting in a decrease in luminance, or a shortened lifetime.

In order to eliminate such thermal effects, it is necessary to enlarge the heat dissipation member or to increase the intervals between arrangements, which makes it difficult to arrange the light emitting devices in close proximity.

In the light emitting device module including a plurality of light emitting devices having such a separation distance, when the light emitted by each light is focused in a common optical system, the light utilization efficiency of the light emitting devices arranged to be shifted from the optical axis of the optical system is reduced or aberrations are reduced. There is a problem that gets worse. For example, when a plurality of light emitting devices are provided in order to increase the brightness, the light utilization efficiency may deteriorate. Moreover, when color display is performed using a plurality of wavelength lights, there is also a problem of easily causing color unevenness.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a light emitting device module capable of reducing thermal effects of each other even when a plurality of light emitting devices are arranged in close proximity.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the light emitting device module of this invention is multiple light emitting devices arrange | positioned adjacent to each other; A plurality of heat dissipation base portions supporting at least one of the plurality of light emitting devices; And a heat transfer regulating unit for regulating heat transfer between the plurality of heat dissipation base parts, wherein the plurality of light emitting devices are disposed adjacent to a position relative to the size of the light emitting surface.

 Here, "position adjacent to the size of a light emitting surface" means the position where the adjoining distance of two light emitting devices adjacent to each other is shorter than the average value of the width dimension of the adjoining direction of the said adjacent light emitting devices.

According to the present invention, at least one or more of the plurality of light emitting devices arranged adjacent to the adjacent position is mounted on the heat dissipation base portion, and heat transfer between the heat dissipation base portions is regulated by the heat transfer restricting portion, so that on the other heat dissipation base portion, The thermal influence between the light emitting devices arranged can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, even when the embodiments are different, the same or corresponding members are given the same reference numerals, and common description is omitted.

(First embodiment)

The light emitting device module according to the first embodiment of the present invention will be described.

1A is a plan view showing a schematic configuration of a light emitting device module according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view taken along the line A-A of FIG. 1A. 2 is an exploded perspective view of the light emitting device module according to the first embodiment of the present invention. 3A, 3B and 3C are plan views showing an arrangement example of a light emitting device in the first embodiment of the present invention.

The light emitting device module 1 of the present embodiment is provided with a plurality of light emitting devices and emits them so that the light emitting device module 1 can be suitably used as a light source, for example, a projector, a display, an indicator, a traffic sign, or an illumination.

The schematic structure of the light emitting device module 1 is as shown to FIG. 1A, FIG. 1B, and FIG. 2, and the light emitting device 4A, 4B, 4C, 4D, the main frame 2, the heat insulation member 5, and a nest. (nest) consists of a frame (3).

The light emitting devices 4A, 4B, 4C, and 4D are solid state light emitting devices having a rectangular light emitting surface having a longitudinal variation dimension H in FIG. 1A and a transverse dimension dimension W. As shown in FIG. An appropriate solid state light emitting element may be employed, but the present embodiment employs an LED. Since the chip structure of LED can employ | adopt well-known appropriate structure, the whole chip is typically shown by the flat plate in the figure. Although not shown in particular, of course, an electrode, a wire wire, etc. are provided according to each structure.

Suitable wavelengths and rated outputs of the light emitting devices 4A, 4B, 4C, and 4D may be adopted, and the size of the light emitting surface may be changed accordingly. In this embodiment, all of them will be described as having a size of H × W.

The main frame 2 supports the light emitting devices 4A and 4C in a positional relationship arranged in their diagonal directions, and projects the light emitted therefrom in the out of page of FIG. 1A. To radiate heat by conducting heat from the light emitting devices 4A and 4C.

The main frame 2 has a plurality of through-holes 2B formed in a diagonal direction of a block member having a substantially rectangular cross section and a thickness D, and a plurality of convex portions 2A formed in a substantially rectangular parallelepiped shape slightly spaced diagonally in another diagonal direction. ) Is included. That is, each through-hole part 2B is enclosed by the L-shaped side wall 2d and the convex part side surface 2b of the convex part 2A in plan view by connecting each convex part 2A.

As for the shape seen from the top view of the main frame 2, the area | region is divided into quarter area by the convex part 2A and the through-hole part 2B.

The material of the main frame 2 may be any material as long as it has good thermal conductivity and is excellent in heat dissipation. For example, materials such as metals, semiconductors, ceramics, and synthetic resins may be adopted.

On the upper surface of each convex portion 2A, a light emitting device mounting surface 2a on which the light emitting devices 4A and 4C are mounted is formed. The area of the light emitting device mounting surface 2a is larger than the area of the light emitting surface of each light emitting device 4A, 4C. Further, the light emitting devices 4A and 4C are arranged in the edge portion at the center side of the main frame 2 so that each side of the light emitting surface is substantially aligned with the outer peripheral portion of the convex portion 2A.

The light emitting device mounting surface 2a is a plane connected to the light emitting device 4A (4C) in an electrically insulated state or a conductive state as necessary. In order to efficiently radiate the light from the light emitting devices 4A and 4C in the projecting direction of the convex portion 2A, it is preferable that a reflecting surface is formed at least in the arrangement area of the light emitting devices 4A and 4C.

The thermal insulation member 5 is a thermal insulator for reducing the thermal conductivity and regulating the thermal conductivity between the main frame 2 and the nest frame 3, which will be described later, to insulate or thermally insulate the space between them. It is arrange | positioned in layer shape suitably in the opposing part of the frame 2 and the nest frame 3.

The heat insulating member 5 is made of a material having a lower thermal conductivity than the main frame 2 and the nest frame 3.

In this embodiment, the heat transfer member 5 is made of a synthetic resin combined with an adhesive for fixing the nest frame 3 to the main frame 2, and as shown in Figs. It is provided so that the inner surface side of the side wall 2d may be covered substantially.

The thickness T is set to a thickness at which necessary thermal insulation is obtained according to the material of the thermal insulation member 5, the thermal conductivity and the amount of heat generated by the light emitting device. However, when it is necessary to electrically insulate between the main frame 2 and the nest frame 3, it sets so that required electrical insulation may be satisfied.

The nest frame 3 is a member for performing heat dissipation of the light emitting devices 4B and 4D and supporting the light emitting devices 4A and 4C in a positional relationship adjacent to the light emitting devices 4A and 4C. It is disposed in 2B.

As the material of the nest frame 3, the same material as that of the main frame 2 can be adopted.

In the present embodiment, the nest frame 3 is a rectangular flat plate of thickness D.

On the upper surface of the nest frame 3, the light emitting device mounting surface 3a on which the light emitting devices 4B and 4D are disposed is formed. In this embodiment, the area of the light emitting device mounting surface 3a is larger than the light emitting devices 4B and 4D. And the surface state of each light emitting device mounting surface 3a is set like the light emitting device mounting surface 2a provided in the main frame 2. As shown in FIG.

As shown in FIG. 2, the nest frame 3 is arrange | positioned in each through-hole part 2B so that each light emitting device mounting surface 3a may face the center side of the main frame 2, and the heat insulating member 5 is carried out. It is fixed to the side wall 2d with the space between.

By this structure, each light emitting device mounting surface 2a, 3a is aligned at the same height.

Then, the light emitting devices 4A and 4B and the light emitting devices 4D and 4C are disposed adjacent to each other in the width W direction, and are disposed between the convex side surfaces 2b and the nest frame side surfaces 3e in the width W direction. A gap 6 having a width dW is formed along the height direction.

In addition, the light emitting devices 4A and 4D and the light emitting devices 4B and 4C are similarly arranged in the width H direction with the gap 6 having the width dH therebetween.

The widths dW and dH of the gap 6 have a thermal effect on each of the light emitting devices adjacent to each other by satisfactory electrical insulation characteristics such as ambient atmosphere, for example, air or inert gas, and heat transfer of the surrounding atmosphere. Under the conditions within this allowable range, it is assumed that the smallest possible value is adopted to satisfy dW <W and dH <H. For this reason, the adjoining distance of each light emitting device is small enough and is arrange | positioned in the mutually adjacent position.

With this configuration, each nest frame 3 has a heat insulating member 5 therebetween, and the heat conduction path is substantially insulated, thereby forming an independent heat dissipation base.

The heat transfer path from the nest frame side surface 3e is also substantially insulated by the gap 6.

Therefore, heat generated in the light emitting devices 4B and 4D is conducted to the nest frame 3 through the light emitting device mounting surface 3a, and radiates through the bottom surface opposite to the light emitting device mounting surface 3a. That is, heat is generally not conducted to the main frame 2, and the influence of heat transfer from the surface of the nest frame 3 is suppressed by the gap 6.

Therefore, by appropriately setting the heat dissipation characteristics of the nest frame 3, the thermal effect can be reduced even if the nest frame 3 is disposed in the vicinity of another light emitting device. As a result, the temperature rise of the light emitting devices 4B and 4D is suppressed, and the luminance decrease and the life deterioration are reduced.

On the other hand, in the main frame 2 in which the light emitting devices 4A and 4C are arranged, the heat conduction path and the heat transfer path to the nest frame 3 are substantially insulated by the heat insulating member 5 and the gap 6.

Since the convex part 2A is continuous by the side wall 2d, the continuous heat conduction path is formed, but since the heat conduction path is long, mutual thermal influences are reduced.

For this reason, heat generated in the light emitting devices 4A and 4C is conducted to the convex portion 2A through the light emitting device mounting surface 2a and radiated through the bottom surface opposite to the light emitting device mounting surface 2a. In addition, the influence of heat transfer from the heat radiation surface is suppressed by the gap 6.

Therefore, by appropriately setting the heat radiation characteristic of the convex part 2A, even if the convex part 2A is arrange | positioned in the vicinity of another light emitting device, a thermal effect can be reduced. As a result, the temperature rise of the light emitting devices 4A and 4C can be suppressed, and the luminance deterioration and the deterioration of lifetime can be reduced.

That is, in the main frame 2, even if the light emitting devices 4A and 4C are spatially close, they form the state thermally separated enough.

Thus, in the light emitting device module 1, since thermal independence of each light emitting device is substantially maintained, the kind of light emitting device in the position of the light emitting device mounting surface 2a, 2a, 3a, 3a is not specifically limited. For example, as shown in FIG. 3A, the red light emitting device R, the green light emitting device G, the blue light emitting device B, and the green light emitting device G as the light emitting devices 4A, 4B, 4C, and 4D, respectively. ), The color light may be emitted, and as shown in FIG. 3B, all of the same color, for example, the green light emitting device G may be provided. As shown in FIG. 3C, the red light emitting device R, the blue light emitting device B, the red light emitting device R, and the blue light emitting device B are respectively represented as the light emitting devices 4A, 4B, 4C, and 4D. It may be provided so that two colors of light can be emitted.

However, since the nested frames 3 are higher in thermal insulation than those in which the convex portions 2A of the main frame 2 are different from each other, the nested frames 3 It is preferable to arrange in 3). In this case, when it is extinguished, since thermal effects from other light emitting devices are hardly achieved, better performance can be obtained.

For example, although not particularly shown, the light emitting device 4A is used when the red light emitting device R, the green light emitting device G, and the blue light emitting device B are sequentially turned on and used for the purpose of displaying a color separation image. If green light emitting device (G), red light emitting device (R), green light emitting device (G), and blue light emitting device (B) are provided as 4B, 4C, and 4D, light emission is always performed on the main frame 2 at the same timing. Since the green light emitting devices G and G are arranged, even if thermal conductivity is slightly generated between the convex portions 2A and 2A, thermal insulation is maintained between the three colors.

In this embodiment, since adjacent spacings dW and dH of adjacent light emitting devices are arranged so as to be smaller than W and H, respectively, for example, when a plurality of light emitting devices are focused in a common optical system, Since light emission can be performed, the light utilization efficiency is excellent, and in the case of aberration deterioration and color light, there is an advantage that a light source with reduced color unevenness can be formed.

As described above, in the present embodiment, the heat transfer member 5 is made of a material having a lower thermal conductivity than the heat dissipation base portions such as the main frame 2 and the nest frame 3 as the heat transfer regulating portion.

In this case, heat transfer by heat conduction can be regulated.

In addition, in this embodiment, it is the structure provided with the clearance gap 6 which can distribute an ambient atmosphere to the adjacent part of the said heat radiating base part as a heat transfer regulation part.

In this case, heat transfer by the ambient atmosphere can be regulated. In addition, heat dissipation can be promoted when the circulation of the ambient atmosphere is high.

(2nd Example)

A light emitting device module according to a second embodiment of the present invention will be described.

4A is a plan view showing a schematic configuration of a light emitting device module according to a second embodiment of the present invention. 4B is a cross-sectional view taken along line B-B in FIG. 4A.

4A and 4B, the light emitting device module 50 of the present embodiment includes four heat dissipation bases 9 in place of the main frame 2 and the nest frame 3 of the first embodiment. They are supported on the heat dissipation base holding member 8 with the heat conductive member 15 having good thermal conductivity therebetween. The following description will focus on differences from the first embodiment.

The heat dissipation base holding member 8 is a plate-shaped member, and when the light emitting devices 4A, 4B, 4C, and 4D are arranged in the same positional relationship as in the first embodiment, the four heat dissipation base portions 9 have a gap 6. ) So that they can be placed in between.

The material of the heat dissipation base holding member 8 is not particularly restricted both thermally and electrically.

The heat radiating base part 9 has the light emitting device mounting surface 9a which has an area equivalent to or slightly larger than the light emitting surface of the light emitting device 4A (4B, 4C, 4D) in planar view on the upper surface side, and has four side surfaces ( It is a block-shaped heat radiating member which has 9c). And the lower surface 9b which is the opposing surface of the light emitting device mounting surface 2a is arrange | positioned in contact with the thermal conductive member 15. As shown in FIG.

As in the first embodiment, the gap 6 is formed in the width dW between the heat dissipation base portions 9 adjacent in the width W direction, and the gap 6 is formed between the heat dissipation base portions 9 adjacent in the width H direction. ) Has a width dH.

As the material of the heat dissipation base 9, the same material as that of the main frame 2 and the nest frame 3 of the first embodiment can be adopted.

The thermally conductive member 15 may be an adhesive for adhering the heat dissipation base portion 9 to the heat dissipation base holding member 8.

According to such a light emitting device module 50, heat of each light emitting device is radiated from the bottom surface 9b which opposes the light emitting device mounting surface 9a of the heat radiating base part 9. On the other hand, since each heat dissipation base part 9 is substantially insulated from the heat dissipation base 9 adjacent to each other by the gap 6, the thermal effects of each other are reduced. In addition, although the heat conduction path is formed in each of the heat radiating base parts 9 via the heat conductive member 15 and the heat radiating base holding member 8, a long path is formed and the thermal effect is reduced, and the bottom face 9a is carried out. Since heat from the heat dissipates efficiently from the heat conductive member 15 and the heat dissipation base holding member 8, thermal independence is secured substantially.

(Third Embodiment)

A light emitting device module according to a third embodiment of the present invention will be described.

5A is a plan view showing a schematic configuration of a light emitting device module according to a third embodiment of the present invention. 5B is a cross-sectional view taken along the line C-C in FIG. 5A.

5A and 5B, the light emitting device module 60 of the present embodiment includes a frame 11 instead of the main frame 2 and the nest frame 3 of the first embodiment. Hereinafter, description will be focused on the differences from the above embodiment.

The frame 11 includes rectangular heat-dissipating block portions 11A, 11B, 11C, and 11D spaced at a predetermined distance. Specifically, the frame 11 has an area of, for example, (2 · H + dH) × (2 · W + dW) in a plan view, and divides the upper surface into quarters of the block-shaped member having a height D3. By forming the clearance gap 6 by the cross-shaped groove | channel (However, D4 <D3) of the width | variety dW, dH, and depth D4, it is the top of plate-shaped bottom 11E of height D3-D4. The rectangular parallelepiped heat radiation block portions 11A, 11B, 11C, and 11D are formed.

The light emitting device mounting surface 11a which arrange | positions the light emitting device 4A, 4B, 4C, 4D is formed in the upper surface side of the heat radiation block part 11A, 11B, 11C, 11D, respectively.

The arrangement position of each light emitting device is the same arrangement as that of the first embodiment.

In the gap 6 that divides these heat dissipation block portions, a heat insulating member 5 is provided over part or all of the gap 6. The structure of the thermal insulation member 5 can adopt the structure similar to the said 1st Example.

The material of the frame 11 is made of the same material as the main frame 2, and the light emitting device mounting surface 11a is a surface in the same state as the light emitting device mounting surface 2a.

According to the light emitting device module 60, the heat of each light emitting device conducts the heat dissipation block portions 11A, 11B, 11C, and 11D, and radiates heat from the outer peripheral portion and the bottom of the frame 11. At this time, since the heat conduction paths between adjacent heat dissipation block portions in the range where the heat insulation member 5 is provided are substantially insulated, direct heat transfer is suppressed.

Therefore, by appropriately setting the heat dissipation from the outer circumferential portion and the bottom surface, it is possible to secure thermal insulation between the heat dissipation block portions 11A, 11B, 11C, and 11D by reducing the heat conduction at the bottom portion 11E.

That is, in this configuration, as in the main frame 2 of the first embodiment, the thermally conductive path is extended to form a state that is substantially thermally insulated.

In this embodiment, since the heat insulating member 5 is disposed in the gap 6 between the heat dissipation block portions, the heat insulating property is improved compared with the first embodiment.

In addition, although the above description demonstrated the case where one light emitting device is arrange | positioned at the heat radiating base part, at least any one light emitting device should just be arrange | positioned. For example, you may arrange | position these some light emitting device to one heat dissipation base part, such as a case where the amount of heat generation is small in light emitting devices etc. which are simultaneously lighted.

In the above description, the example of the case where there are four light emitting devices has been described, but the number of the light emitting devices is not limited thereto, and any number may be two or more.

Incidentally, in the above description, the ambient atmosphere is the meaning of the ambient atmosphere closest to the light emitting device and the heat dissipation base portion. For this reason, the light emitting device module may be packaged covered with a light-transmissive resin.

Moreover, such resin may be directly formed on the light emitting device. However, thermal insulation between adjacent heat dissipation bases and opposing heat dissipation surfaces is maintained.

In these cases, heat from the heat dissipation surface other than the heat dissipation surface opposite to the light emitting device and the adjacent heat dissipation base is dissipated in the package, or the resin of the package is thermally conductive to finally dissipate to the outside. Alternatively, in the case where the thermal conductivity of such a resin is poor, after the heat dissipation base portion is thermally conductive, heat is radiated from the heat radiating surface.

In addition, the component demonstrated in each said embodiment can be implemented combining suitably in the range of the technical idea of this invention if technically possible. For example, in the second embodiment, the heat transfer restricting portion has been described as an example in which only a gap is formed. For example, the heat insulating member 5 may be used or used in place of the gap 6. Alternatively, if necessary, the thermal insulating member 5 may be provided in place of the thermal conductive member 15.

Here, the case where the name differs about the correspondence of the term of each said Example and the term of a claim is demonstrated.

The red light emitting device R, the green light emitting device G, and the blue light emitting device B are one embodiment of the light emitting device. The main frame 2, the nest frame 3, the heat dissipation base portion 9, and the heat dissipation block portions 11A, 11B, 11C, and 11D are one embodiment of the heat dissipation base portion. The thermal insulation member 5 is one embodiment in which the heat transfer restriction portion is implemented as a thermal insulator. The gap 6 is one embodiment of the heat transfer control unit.

In the light emitting device module according to the present invention, by installing a heat transfer restricting portion to regulate heat transfer between the heat dissipation base portions, thermal effects between light emitting devices disposed on other heat dissipation base portions can be reduced. Therefore, even if the plurality of light emitting devices are arranged in close proximity, the life of the light emitting device can be improved, and the luminance decrease due to the thermal effect can be suppressed.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Therefore, the true technical protection scope of the present invention should be defined within the following claims.

Claims (9)

A plurality of light emitting devices arranged adjacent to each other; A plurality of heat dissipation base portions supporting at least one of the plurality of light emitting devices; And a heat transfer regulator configured to regulate heat transfer between the plurality of heat dissipation base parts. A distance in the adjacent direction between the adjacent light emitting devices is shorter than an average value of the width dimensions in the adjacent direction of the adjacent light emitting devices. The method of claim 1, The heat transfer control unit includes a heat insulating member made of a material having a lower thermal conductivity than the heat dissipation base unit. The method according to claim 1 or 2, And the heat transfer restricting portion includes a gap formed between the adjacent heat dissipation base portions to allow an atmosphere around the heat dissipation base portion to flow therethrough. The method of claim 1, The heat dissipation base unit, A main frame having a plurality of rectangular through-holes formed along a diagonal direction and a plurality of convex portions formed along a different diagonal direction, wherein one surface of each of the convex portions serves as a mounting surface of the light emitting device; A nest frame disposed in each of the through-holes, one surface of which is a mounting surface of the light emitting device; And a gap is provided between the main frame and the nest frame. The method of claim 4, wherein Light emitting device module, characterized in that the gap is provided with a heat insulating member. The method according to claim 4 or 5, When the plurality of light emitting devices includes a plurality of light emitting devices that emit light at different timings, And the plurality of light emitting devices emitting light at different timings are mounted on the nest frame. The method of claim 1, The plurality of heat dissipation base portion is mounted on a heat dissipation base holding member, A light emitting device module, characterized in that a thermal conductive member is provided between each of the heat radiation base portion and the heat radiation base holding member. The method of claim 1, And the plurality of heat dissipation base parts is formed by forming a cross-shaped groove having a predetermined width and a predetermined depth that divides the frame into four parts on the frame. The method of claim 7, wherein A light emitting device module, characterized in that the thermal insulation member is disposed in the cross-shaped groove.

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