CN1992260A - Light emitting device module - Google Patents
Light emitting device module Download PDFInfo
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- CN1992260A CN1992260A CN 200610171404 CN200610171404A CN1992260A CN 1992260 A CN1992260 A CN 1992260A CN 200610171404 CN200610171404 CN 200610171404 CN 200610171404 A CN200610171404 A CN 200610171404A CN 1992260 A CN1992260 A CN 1992260A
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- light emitting
- luminescent device
- emitting device
- device module
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Abstract
A light emitting device module is provided. The light emitting device module includes a plurality of light emitting devices which are formed adjacent to each other, a plurality of radiating bases which support at least one of the plurality of the light emitting devices, and a heat transfer prevention unit which prevents heat from being conducted between the plurality of the radiating bases, wherein distances between the adjacent light emitting devices are less than mean values of the length along the adjacent direction of the adjacent light emitting devices.
Description
The application requires the 2005-374920 Japanese patent application submitted in Japanese Department of Intellectual Property on December 27th, 2005 and the priority of the 10-2006-0078763 korean patent application submitted in Korea S Department of Intellectual Property on August 21st, 2006, and it is open to be contained in this by reference fully.
Technical field
Light emitting device module according to the present invention comprises a plurality of luminescent devices, has reduced the thermal impact to luminescent device.
Background technology
Light emitting device module extensively is used in projecting apparatus, display, indicating device, traffic lights and the luminaire.By having the luminescent device combination of different wave length, relevant light emitting device module is launched white light or coloured light is arranged, by adopting for example brightness of light-emitting diode (LED) increase light of solid luminescence device.
In these light emitting device modules, self thermal impact when luminous, each luminescent device is arranged in separately in electrode or the substrate.
Example as this light emitting device module, No. 3329716 Japan Patent (below be called reference document 1) discloses a kind of light emitting device module, this light emitting device module comprises chip-type LED, and wherein, the led chip of each transmitting green light, ruddiness and blue light is arranged on the common electrode.The size of common electrode can maximize according to radiative property or reflectivity.With reference to the Fig. 1 in the reference document 1, the distance between the adjacent led chip with approximate square shape is obviously greater than this foursquare one side.
2005-159262 Japanese patent publication (below be called reference document 2) discloses a kind of light emitting device module, this light emitting device module comprises the transmissive member that is arranged in the luminescent device and the covering light-emitting diode of at least three approximate square shape on the main body that is formed by resin (for example, pottery and epoxy resin) with similar interval.Interval between the adjacent luminescent device is approximate foursquare while equating or being similar to foursquare greater than this with this.
These relevant light emitting device modules have following problems.
In reference document 1 and 2, because a plurality of adjacent luminescent device is to go up separately in radiation (for example, electrode or substrate) greater than each the interval of size of light-emitting area in the luminescent device, so luminescent device cools off by the radiation of radiation.Yet amount of radiation increases.Therefore, luminescent device may be to there being thermal impact each other.For example, the luminous efficiency official post gets the brightness decline of luminescent device or the lost of life of luminescent device.
For fear of thermal impact, radiation should be arranged greatly or with the interval of broad.Therefore, arrange that adjacent to each other problem has appearred in luminescent device.
In the light emitting device module that comprises a plurality of luminescent devices of arranging with specific interval each other, when an optical system makes when the light of each luminescent device emission focuses on, the light efficiency rate variance is perhaps departing from the line of axle of optical system when arranging the aberration variation a little when luminescent device.For example, when using a plurality of luminescent device in order to improve brightness, optical efficiency can variation.In addition, when the light that has a plurality of wavelength by employing is represented color, color spot can appear.
Summary of the invention
Shortcoming above exemplary embodiment of the present invention has overcome and top other shortcoming of not describing.In addition, the present invention is not required to overcome above-described shortcoming, and exemplary embodiment of the present invention may not overcome above-described all problems.
The invention provides a kind of light emitting device module, in this light emitting device module,, also can reduce a plurality of luminescent devices each other thermal impact even luminescent device is adjacent one another are.
According to an aspect of the present invention, provide a kind of light emitting device module, described light emitting device module comprises: a plurality of luminescent devices are formed adjacent to each other; At least one in described a plurality of luminescent device supported in a plurality of radiation substrates; Prevent heat transmission unit, prevent the heat conduction between described a plurality of radiation substrate, wherein, arrange described a plurality of adjacent luminescent device, make neighbor distance between two luminescent devices less than the mean value of the width of each adjacent luminescent device.
Description of drawings
By the detailed description that the reference accompanying drawing carries out exemplary embodiment of the present, of the present invention above and others will become clearer, wherein:
Figure 1A is the schematic plan view of light emitting device module according to an exemplary embodiment of the present invention;
Figure 1B is the cutaway view of the line A-A intercepting in Figure 1A;
Fig. 2 is the perspective view of the light emitting device module among Figure 1A according to an exemplary embodiment of the present invention;
Fig. 3 A, Fig. 3 B and Fig. 3 C are the plane graphs of arranging the example of the light emitting device module among Figure 1A according to an exemplary embodiment of the present invention;
Fig. 4 A is the schematic plan view of light emitting device module according to an exemplary embodiment of the present invention;
Fig. 4 B is the cutaway view of the line B-B intercepting in Fig. 4 A;
Fig. 5 A is the schematic plan view of light emitting device module according to an exemplary embodiment of the present invention;
Fig. 5 B is the cutaway view of the line C-C intercepting in Fig. 5 A.
Embodiment
Now, come with reference to the accompanying drawings to describe the present invention more fully, exemplary embodiment of the present invention has been shown in the accompanying drawing.Yet the present invention can implement with many different forms, is limited to the embodiment that proposes here and should not be construed as; More precisely, it is in order to make the disclosure fully and fully that these embodiment are provided, and design of the present invention is fully conveyed to those skilled in the art.In the drawings, identical label is represented components identical, therefore the description that will omit similar elements.
Figure 1A is the schematic plan view of light emitting device module 1 according to an exemplary embodiment of the present invention.Figure 1B is the cutaway view of the line A-A intercepting in Figure 1A.Fig. 2 is the perspective view of luminescent device 1 according to an exemplary embodiment of the present invention.Fig. 3 A, Fig. 3 B and Fig. 3 C are the plane graphs of arranging the example of luminescent device according to an exemplary embodiment of the present invention.
Light emitting device module 1 comprises a plurality of luminescent devices, can suitably be used in projecting apparatus, display, indicating device, traffic lights or the luminaire as by a plurality of luminescent device luminous light source.
With reference to Figure 1A, Figure 1B and Fig. 2, light emitting device module 1 comprises luminescent device 4A, 4B, 4C and 4D, main frame 2, heat insulator 5 and nesting frame 3.
With reference to Figure 1A, luminescent device 4A, 4B, 4C and the 4D that has emitting surface separately is the solid luminescence device, for example light-emitting diode (LED).Emitting surface is the rectangle with length H and width W.Because known configurations can be used in the chip structure of LED, so Figure 1A is the led module of prototype.Although shown in Figure 1A, not it will be understood by those skilled in the art that the structure according to luminescent device 4A, 4B, 4C and 4D, electrode or electric wire can be used among luminescent device 4A, 4B, 4C and the 4D.
Can determine each wavelength and the rated power among luminescent device 4A, 4B, 4C and the 4D.The size of emitting surface can change according to wavelength and rated power.According to exemplary embodiment of the present invention, the size of emitting surface is H * W.
The cross section of main frame 2 is approximate rectangular.Main frame 2 is the block member with thickness D.Main frame 2 comprises a plurality of throughhole portions 2B that relative to each other form and a plurality of bossing 2A that relative to each other form on another diagonal on a diagonal.A plurality of bossing 2A form each other a little dividually.Among a plurality of bossing 2A each forms rectangular shape.That is, each among a plurality of throughhole portions 2B comprises the sidewall 2d of a plurality of bossing 2A L shaped shape connected to one another and the bossing side surface 2b of bossing 2A.
See that from above the shape of main frame 2 is divided into four rectangle parts by a plurality of bossing 2A and a plurality of throughhole portions 2B.
Be formed with luminescent device 4A and 4C formation luminescent device carrier surface 2a thereon in a plurality of bossing 2A each.The area of luminescent device carrier surface 2a is greater than each the area of emitting surface among luminescent device 4A and the 4C.In addition, luminescent device 4A and 4C be along the edge placement at the center of main frame 2, makes every limit of light-emitting area and the approximate forming array in each edge of bossing 2A.
Luminescent device carrier surface 2a is connected with 4C with luminescent device 4A, and can with luminescent device 4A and 4C electric insulation or conduction.In order to come the light of selfluminous element 4A and 4C effectively to the ledge radiation of bossing 2A, can on the zone of arranging luminescent device 4A and 4C, form reflecting surface at least.
The thickness T of heat insulator 5 determines according to the material of heat insulator 5 and the thermal exposure of thermal conductivity and luminescent device 4A, 4B, 4C and 4D, thereby can realize the thermal insulation properties that heat insulator 5 is required.When main frame 2 and nesting frame 3 should electric insulations, determine the thickness T of heat insulator 5, make it possible to achieve required resistance.
Nesting frame 3 radiation come the light of selfluminous element 4B and 4D.Simultaneously, nesting frame 3 supports luminescent device 4B and 4D, and is adjacent with luminescent device 4A and 4C.Nesting frame 3 is arranged among the throughhole portions 2B of main frame 2 each.
Nesting frame 3 is formed by the material identical materials with main frame 2.
The shape of nesting frame 3 is the cuboids with thickness D.
On nesting frame 3, be formed with luminescent device 4B and 4D luminescent device carrier surface 3a disposed thereon.The area of luminescent device carrier surface 3a is greater than each the area of emitting surface among luminescent device 4B and the 4D.The surface condition of luminescent device carrier surface 3a is identical with the surface condition of luminescent device carrier surface 2a in being included in main frame 2.
As shown in Figure 2, nesting frame 3 is arranged among the throughhole portions 2B each, makes the center of each luminescent device carrier surface 3a towards main frame 2.Nesting frame 3 invests sidewall 2d.Heat insulator 5 is arranged between nesting frame 3 and the sidewall 2d.
As the result of this structure, each among luminescent device carrier surface 2a and the 3a is arranged to has identical height.
The width dW and the dH in slit 6 are minimum value, satisfy dW ∠ W when luminescent device 4A to 4D and gas (for example, air or inert gas) electric insulation, and dH ∠ H meets gas to each the tolerance limit of thermal impact in the adjacent luminescent device.Therefore, luminescent device 4A, 4B, 4C and 4D arrange that adjacent to each other the distance between each among luminescent device 4A, 4B, 4C and the 4D is enough little.
By this structure,, almost passage of heat is insulated, so each in the nesting frame 3 constitutes independently radiation substrate because heat insulator 5 is formed between nesting frame 3 and the main frame 2.
The heat that luminescent device 4B and 4D produce is transmitted to nesting frame 3 by luminescent device carrier surface 3a.Described heat by with the radiation of luminescent device carrier surface 3a opposing lower surface.Therefore, described heat is transmitted to main frame 2 hardly.Slit 6 prevents that heat conduction from arriving nesting frame 3.
Therefore, by determining the radiative property of nesting frame 3, even when nesting frame 3 is adjacent with 4C with other luminescent device 4A, also can reduce thermal impact to luminescent device 4B and 4D, the result, the temperature that prevents luminescent device 4B and 4D raises, and prevents that the brightness of luminescent device 4B and 4D from descending, and prevents the life-span deterioration of luminescent device 4B and 4D.
Be furnished with thereon in the main frame 2 of luminescent device 4A and 4C, heat insulator 5 and slit 6 are almost with passage of heat and nesting frame 3 insulation.
The heat that luminescent device 4A and 4C produce is transmitted to bossing 2A by luminescent device carrier surface 2a.Described heat by with the radiation of luminescent device carrier surface 2a opposing lower surface.Slit 6 prevents the radiating surface conduction heat from bossing 2A.
Therefore, by determining the radiative property of bossing 2A, even when bossing 2A is adjacent with 4D with other luminescent device 4B, also can reduce thermal impact to luminescent device 4A and 4C.As a result, prevent that the temperature of luminescent device 4A and 4C from raising, prevent that the brightness of luminescent device 4A and 4C from descending, prevent the life-span deterioration of luminescent device 4A and 4C.
In main frame 2, luminescent device 4A and 4C are adjacent one another are. Luminescent device 4A and 4C be fully underground heat isolation each other.
In light emitting device module 1, because luminescent device 4A, 4B, 4C and 4D are hot each other independent, so the example of luminescent device 4A, 4B, 4C and 4D on luminescent device carrier surface 2a and 3a is unrestricted.
Fig. 3 A, Fig. 3 B and Fig. 3 C are the plane graphs of example of light emitting device module 1 of distributing according to an exemplary embodiment of the present invention.With reference to Fig. 3 A, red emission device R, green light emitting device G, blu-ray emission device B and green light emitting device G can form luminescent device 4A, 4B, 4C and 4D respectively. Luminescent device 4A, 4B, 4C and 4D emission have coloured light.With reference to Fig. 3 B, four green light emitting device G can form luminescent device 4A, 4B, 4C and 4D.With reference to Fig. 3 C, red emission device R, blu-ray emission device B, red emission device R and blu-ray emission device B can form luminescent device 4A, 4B, 4C and 4D respectively.
Because the thermal insulation between the nesting frame 3 is greater than the thermal insulation between the bossing 2A, thus when two luminescent devices when different time is luminous, each luminescent device can be arranged on the nesting frame 3.When a luminescent device ended, this luminescent device did not almost have thermal impact to other luminescent device.Therefore, luminescent device has good performance.
For example, although not shown in Fig. 3 A, Fig. 3 B and Fig. 3 C, but hot light emitting devices R, green light emitting device G and blu-ray emission device B sequential turn-on and when showing the image that look separates, green light emitting device G, red emission device R, green light emitting device G and blu-ray emission device B form luminescent device 4A, 4B, 4C and 4D respectively.Therefore, owing on main frame 2, form simultaneously luminous green light emitting device G, so even between bossing 2A, conduct when hot also insulation between red emission device R, green light emitting device G and the blu-ray emission device B slightly.
According to exemplary embodiment of the present invention, arrange luminescent device, make width dW between the adjacent luminescent device and dH respectively less than the width W and the length H of luminescent device.For example, when making by an optical system when the light of a plurality of luminescent devices emission is assembled, described light can be launched near optical axis.In this case, the light source that obtains has good optical efficiency.The aberration variation of light can not take place in light source, color spot can not occur when coloured light time of light emitted.
According to exemplary embodiment of the present invention, heat insulator 5 is to prevent heat transfer unit, is formed by the material that has than the thermal conductivity of the heat conduction rate variance of radiation substrate (for example, main frame 2 and nesting frame 3).
Can prevent the heat transmission of heat conductor.According to exemplary embodiment of the present invention, the slit 6 of luminescent device ventilates near the gas the radiation substrate, constitutes to prevent conduction unit.
Can prevent the heat transmission of gas.In addition, when gas is ventilated well, can quicken thermal radiation.
Fig. 4 A is the schematic plan view of light emitting device module 50 according to an exemplary embodiment of the present invention.Fig. 4 B is the cutaway view of the line B-B intercepting in Fig. 4 A.
With reference to Fig. 4 A and Fig. 4 B, light emitting device module 50 comprises four radiation substrates 9, and comprises main frame 2 and nesting frame 3 at the light emitting device module shown in Figure 1A 1.Form heat conductor 15 between in radiation substrate 9 each and the radiation substrate support part 8 with good thermal conductivity.Radiation substrate support part 8 supports heat conductor 15.Below, will light emitting device module 50 be described according to the feature different with the feature of luminescent device 1 among Figure 1A.
Radiation substrate support part 8 is plate shape.When luminescent device 4A, 4B, 4C and 4D arrange, there is slit 6 between per two in four radiation substrates 9 as shown in Figure 1A, Figure 1B and Fig. 2.
The material of radiation substrate support part 8 is not subjected to the restriction of calorifics and electrical properties.
It is block that the shape of each radiation substrate 9 is.See that from above the area of the luminescent device carrier surface 9a of each radiation substrate 9 is equal to or slightly greater than each the area of light-emitting area among luminescent device 4A, 4B, 4C and the 4D, radiating surface 9 has four side surface 9c.In addition, with the close heat conductor 15 of luminescent device carrier surface 9a opposing lower surface 9b.
The slit that forms between two radiation substrates 9 of adjacent layout on the direction of width W has width dW.The slit that forms between two radiation substrates 9 of adjacent layout on the direction of length H has width dH.
In light emitting device module 50, the heat of each generation among luminescent device 4A, 4B, 4C and the 4D by with radiation substrate 9 in each luminescent device carrier surface 9a opposing lower surface 9b radiation.Simultaneously and since slit 6 almost with radiation substrate 9 and with radiation substrate 9 in the insulation of each adjacent passage of heat, so reduced 9 pairs of thermal impacts each other of radiation substrate.In addition, the passage of heat of each in the radiation substrate 9 passes heat conductor 15 and radiation substrate support part 8 forms.Because passage of heat is longer, so reduced 9 pairs of thermal impacts each other of radiation substrate.Since from the heat of lower surface 9b by effectively from heat conductor 15 and 8 radiation of radiation substrate support part, so each radiation substrate 9 be heat independently.
Fig. 5 A is the schematic plan view of light emitting device module 60 according to an exemplary embodiment of the present invention.Fig. 5 B is the cutaway view of the line C-C intercepting in Fig. 5 A.
With reference to Fig. 5 A and Fig. 5 B, light emitting device module 60 comprises framework 11, and the light emitting device module 1 shown in Figure 1A comprises main frame 2 and nesting frame 3.Below, will light emitting device module 60 be described according to the feature different with the feature of light emitting device module 1 among Figure 1A.
Luminescent device carrier surface 11a forms among radiation piece 11A, 11B, 11C and the 11D be formed with luminescent device 4A, 4B, 4C and 4D thereon respectively each.
Among luminescent device 4A, 4B, 4C and the 4D each is distributed as the structure that has as shown in Figure 1A, Figure 1B and Fig. 2.
In light emitting device module 60, the heat that luminescent device 4A, 4B, 4C and 4D produce is transmitted to radiation piece 11A, 11B, 11C and 11D, follows edge and lower surface radiation from framework 11.Because the passage of heat between per two among adjacent radiation piece 11A, 11B, 11C and the 11D almost insulate in the scope that forms heat insulator 5, so prevent directly conduction heat.
Therefore, by the edge of definite framework 11 and the radiative property of lower surface, can reduce heat conducting amount.Therefore, can realize per two thermal insulation properties among radiation piece 11A, 11B, 11C and the 11D.
Identical with the main frame 2 among Figure 1A, by extending the passage of heat in the light emitting device module 60, produced basic insulation condition.
Therefore, owing to form heat insulator 5 in the slit 6 between in radiation piece 11A, 11B, 11C and 11D per two,, improved thermal insulation properties better so compare with the thermal insulation properties of light emitting device module 1 among Figure 1A.
As mentioned above, in a radiation substrate, form a luminescent device.Yet, in a radiation substrate, can form more than one luminescent device.For example, when very hour, in a radiation substrate, can form a plurality of luminescent devices from the heat of the luminescent device radiation of a plurality of conductings.
According to exemplary embodiment of the present invention, the quantity of luminescent device is four.Yet the quantity of luminescent device is not limited to four.The quantity of luminescent device can be two or more.
In the superincumbent description, gas and luminescent device and light emitting device module direct neighbor.Therefore, can cover light emitting device module with light-transmissive resin encapsulates.
Light-transmissive resin can be formed directly on the luminescent device, in this case, should keep the thermal insulation properties between adjacent radiation substrate and the radiating surface relative with this radiation substrate.
Here, come selfluminous element heat hot and from the radiating surface except the radiating surface relative with the radiation substrate to be radiated in the packaged light emitting device module, perhaps the resin by the packaged light emitting device module conducts to be radiated outside.Alternatively, when the heat conduction rate variance of resin, conduction heat is with by radiation substrate radiation and from the radiating surface radiation.
Under the situation that does not break away from the spirit and scope of the present invention, can correspondingly organize structure of the present invention.For example, prevent that heat transfer unit from only comprising slit 6, as shown in Fig. 4 B.Yet, prevent that heat transfer unit from can comprise the heat insulator 5 that combines with slit 6, perhaps can not comprise the slit that prevents in the heat transfer unit.Alternatively, can form heat insulator 5 and replace heat conductor 15.
When the item of exemplary embodiment of the present invention and the different item of claim at once, these situations will be described.Red emission device R, green light emitting device G and blu-ray emission device B are luminescent devices according to an exemplary embodiment of the present invention.Main frame 2, nesting frame 3, radiation substrate 9 and radiation piece 11A, 11B, 11C and 11D are radiation substrates according to an exemplary embodiment of the present invention.Heat insulator 5 is to prevent heat transmission unit according to an exemplary embodiment of the present invention.Slit 6 is to prevent heat transmission unit according to an exemplary embodiment of the present invention.
In light emitting device module of the present invention, prevent that by formation heat transfer unit from preventing the heat conduction between the radiation substrate, can reduce to be formed on the suprabasil luminescent device of other radiation to each other thermal impact.Therefore, even be adjacent to form a plurality of luminescent devices, also can prolong the life-span of luminescent device.In addition, light emitting device module of the present invention prevents because the brightness of the light that thermal impact causes descends.
Although illustrate and described the present invention particularly with reference to exemplary embodiment of the present invention, but it should be understood by one skilled in the art that, under the situation that does not break away from the spirit and scope of the present invention that limit by claim and jural equivalent thereof, can do change on various forms and the details to it.
Claims (11)
1, a kind of light emitting device module comprises:
A plurality of luminescent devices are formed adjacent to each other;
At least one in described a plurality of luminescent device supported in a plurality of radiation substrates;
Prevent heat transfer unit, prevent the heat conduction between described a plurality of radiation substrate,
Wherein, the distance between the described adjacent luminescent device is less than the mean value of the length on the adjacent direction of described adjacent luminescent device.
2, light emitting device module as claimed in claim 1, wherein, the described heat transfer unit that prevents comprises the heat insulator that is formed less than the material of the thermal conductivity of described radiation substrate by thermal conductivity.
3, light emitting device module as claimed in claim 1, wherein, the described heat transfer unit that prevents comprises the gap that is formed between the adjacent radiation substrate, described gap ventilates the gas around the described radiation substrate.
4, light emitting device module as claimed in claim 2, wherein, the described heat transfer unit that prevents comprises the gap that is formed between the adjacent radiation substrate, described gap ventilates the gas around the described radiation substrate.
5, light emitting device module as claimed in claim 1, wherein, each in the described radiation substrate comprises:
Main frame, comprise a plurality of through holes that relative to each other on a diagonal, form and a plurality of bossings that relative to each other on another diagonal, form, wherein, a surface of each in the described bossing is the luminescent device carrier surface;
Nesting frame is formed in each in the described throughhole portions, and wherein, a surface of described nesting frame is the luminescent device carrier surface;
Wherein, between described main frame and described nesting frame, form the slit.
6, light emitting device module as claimed in claim 5 wherein, forms heat insulator in described slit.
7, light emitting device module as claimed in claim 5, wherein, when luminescent device when different time is luminous, on described nesting frame, load on each luminous described luminescent device of different time.
8, light emitting device module as claimed in claim 6, wherein, when luminescent device when different time is luminous, on described nesting frame, load on each luminous described luminescent device of different time.
9, light emitting device module as claimed in claim 1, wherein, described radiation base load forms heat conductor between each in described radiation substrate and the described radiation substrate support part on radiation substrate support part.
10, light emitting device module as claimed in claim 1, wherein, described a plurality of radiation substrates form the slit with cross shape, and have the predetermined width and the degree of depth on framework, make described framework be divided into four parts.
11, light emitting device module as claimed in claim 10, wherein, heat insulator is formed in the described slit with described cross shape.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005374920 | 2005-12-27 | ||
| JP2005374920A JP2007180163A (en) | 2005-12-27 | 2005-12-27 | Light emitting device module |
| KR1020060078763 | 2006-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1992260A true CN1992260A (en) | 2007-07-04 |
| CN100592510C CN100592510C (en) | 2010-02-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610171404A Expired - Fee Related CN100592510C (en) | 2005-12-27 | 2006-12-26 | Light emitting device module |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007180163A (en) |
| KR (1) | KR100823276B1 (en) |
| CN (1) | CN100592510C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101047778B1 (en) | 2010-04-01 | 2011-07-07 | 엘지이노텍 주식회사 | Light emitting device package and light unit having thereof |
| US9991238B2 (en) * | 2014-07-18 | 2018-06-05 | Koninklijke Philips N.V. | LED light source for automotive application |
| GB201413578D0 (en) | 2014-07-31 | 2014-09-17 | Infiniled Ltd | A colour iled display on silicon |
| WO2016208947A1 (en) * | 2015-06-25 | 2016-12-29 | 주식회사 포인트엔지니어링 | Substrate having metal and non-metal bonded together |
| KR101661140B1 (en) * | 2015-06-25 | 2016-09-29 | (주)포인트엔지니어링 | Nonmetal bonded metal substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60175476A (en) * | 1984-02-22 | 1985-09-09 | Toshiba Corp | Manufacture of integrated semiconductor device |
| JP2863678B2 (en) * | 1992-09-28 | 1999-03-03 | 三菱電機株式会社 | Semiconductor laser device and method of manufacturing the same |
| JP2001144333A (en) | 1999-11-10 | 2001-05-25 | Sharp Corp | Light-emitting device and manufacturing method therefor |
| JP2001267639A (en) * | 2000-03-16 | 2001-09-28 | Nippon Telegr & Teleph Corp <Ntt> | Optical element mounting board and multi-wavelength light source |
| JP2002329896A (en) * | 2001-05-02 | 2002-11-15 | Kansai Tlo Kk | Led surface light emission device |
-
2005
- 2005-12-27 JP JP2005374920A patent/JP2007180163A/en active Pending
-
2006
- 2006-08-21 KR KR1020060078763A patent/KR100823276B1/en not_active IP Right Cessation
- 2006-12-26 CN CN200610171404A patent/CN100592510C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100592510C (en) | 2010-02-24 |
| KR20070068993A (en) | 2007-07-02 |
| JP2007180163A (en) | 2007-07-12 |
| KR100823276B1 (en) | 2008-04-17 |
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