KR20070013324A - 3족 질화물 소자를 제조하는 방법 및 그 방법을 이용하여제조된 소자 - Google Patents
3족 질화물 소자를 제조하는 방법 및 그 방법을 이용하여제조된 소자 Download PDFInfo
- Publication number
- KR20070013324A KR20070013324A KR1020067025952A KR20067025952A KR20070013324A KR 20070013324 A KR20070013324 A KR 20070013324A KR 1020067025952 A KR1020067025952 A KR 1020067025952A KR 20067025952 A KR20067025952 A KR 20067025952A KR 20070013324 A KR20070013324 A KR 20070013324A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- mirror
- substrate
- epitaxial semiconductor
- epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/862—Resonant cavity structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
- H10H20/8142—Bodies having reflecting means, e.g. semiconductor Bragg reflectors forming resonant cavity structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
Landscapes
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/848,937 | 2004-05-18 | ||
| US10/848,937 US7332365B2 (en) | 2004-05-18 | 2004-05-18 | Method for fabricating group-III nitride devices and devices fabricated using method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20070013324A true KR20070013324A (ko) | 2007-01-30 |
Family
ID=34970241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067025952A Withdrawn KR20070013324A (ko) | 2004-05-18 | 2005-05-17 | 3족 질화물 소자를 제조하는 방법 및 그 방법을 이용하여제조된 소자 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7332365B2 (enExample) |
| EP (1) | EP1763900B1 (enExample) |
| JP (1) | JP5468203B2 (enExample) |
| KR (1) | KR20070013324A (enExample) |
| CN (1) | CN1957481A (enExample) |
| CA (1) | CA2564995A1 (enExample) |
| TW (1) | TWI390759B (enExample) |
| WO (1) | WO2005117152A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011031098A3 (ko) * | 2009-09-10 | 2011-06-23 | 주식회사 에피밸리 | 반도체 발광소자 |
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|---|---|---|---|---|
| US7115896B2 (en) * | 2002-12-04 | 2006-10-03 | Emcore Corporation | Semiconductor structures for gallium nitride-based devices |
| US7791061B2 (en) * | 2004-05-18 | 2010-09-07 | Cree, Inc. | External extraction light emitting diode based upon crystallographic faceted surfaces |
| JP4747516B2 (ja) * | 2004-06-08 | 2011-08-17 | 富士ゼロックス株式会社 | 垂直共振器型面発光半導体レーザ装置 |
| US8482663B2 (en) * | 2004-06-30 | 2013-07-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
| KR100576870B1 (ko) * | 2004-08-11 | 2006-05-10 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조방법 |
| KR100682877B1 (ko) * | 2005-07-12 | 2007-02-15 | 삼성전기주식회사 | 발광다이오드 및 그 제조방법 |
| US20070019699A1 (en) * | 2005-07-22 | 2007-01-25 | Robbins Virginia M | Light emitting device and method of manufacture |
| JP2009530798A (ja) * | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
| US8643195B2 (en) | 2006-06-30 | 2014-02-04 | Cree, Inc. | Nickel tin bonding system for semiconductor wafers and devices |
| US7910945B2 (en) * | 2006-06-30 | 2011-03-22 | Cree, Inc. | Nickel tin bonding system with barrier layer for semiconductor wafers and devices |
| TWI309481B (en) | 2006-07-28 | 2009-05-01 | Epistar Corp | A light emitting device having a patterned substrate and the method thereof |
| US7915624B2 (en) | 2006-08-06 | 2011-03-29 | Lightwave Photonics, Inc. | III-nitride light-emitting devices with one or more resonance reflectors and reflective engineered growth templates for such devices, and methods |
| US7855459B2 (en) | 2006-09-22 | 2010-12-21 | Cree, Inc. | Modified gold-tin system with increased melting temperature for wafer bonding |
| EP1906461B1 (de) * | 2006-09-26 | 2020-03-18 | OSRAM Opto Semiconductors GmbH | Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement |
| EP2070123A2 (en) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led system and method |
| US8941141B2 (en) * | 2006-10-17 | 2015-01-27 | Epistar Corporation | Light-emitting device |
| KR100826412B1 (ko) * | 2006-11-03 | 2008-04-29 | 삼성전기주식회사 | 질화물 반도체 발광 소자 및 제조방법 |
| US7928471B2 (en) * | 2006-12-04 | 2011-04-19 | The United States Of America As Represented By The Secretary Of The Navy | Group III-nitride growth on silicon or silicon germanium substrates and method and devices therefor |
| TWI533351B (zh) | 2006-12-11 | 2016-05-11 | 美國加利福尼亞大學董事會 | 高效能非極性第三族氮化物光學裝置之金屬有機化學氣相沈積生長 |
| TWI492411B (zh) * | 2006-12-11 | 2015-07-11 | Univ California | 非極性與半極性發光裝置 |
| US8409972B2 (en) * | 2007-04-11 | 2013-04-02 | Cree, Inc. | Light emitting diode having undoped and unintentionally doped nitride transition layer |
| US8368100B2 (en) | 2007-11-14 | 2013-02-05 | Cree, Inc. | Semiconductor light emitting diodes having reflective structures and methods of fabricating same |
| US7915629B2 (en) | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
| US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
| DE102008006988A1 (de) | 2008-01-31 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| WO2009100358A1 (en) * | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
| US7842939B2 (en) | 2008-02-25 | 2010-11-30 | Lightwave Photonics, Inc. | Current-injecting/tunneling light-emitting device and method |
| KR101308130B1 (ko) * | 2008-03-25 | 2013-09-12 | 서울옵토디바이스주식회사 | 발광 소자 및 그 제조 방법 |
| US8877524B2 (en) | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
| KR101449035B1 (ko) * | 2008-04-30 | 2014-10-08 | 엘지이노텍 주식회사 | 반도체 발광소자 |
| US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| DE102008050538B4 (de) * | 2008-06-06 | 2022-10-06 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| US8017963B2 (en) | 2008-12-08 | 2011-09-13 | Cree, Inc. | Light emitting diode with a dielectric mirror having a lateral configuration |
| TW201034256A (en) * | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| US8096671B1 (en) | 2009-04-06 | 2012-01-17 | Nmera, Llc | Light emitting diode illumination system |
| US8529102B2 (en) | 2009-04-06 | 2013-09-10 | Cree, Inc. | Reflector system for lighting device |
| US8449128B2 (en) * | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US9362459B2 (en) * | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
| US9435493B2 (en) * | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
| US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| KR20110133241A (ko) | 2010-06-04 | 2011-12-12 | 서울옵토디바이스주식회사 | 발광 다이오드 제조 방법 |
| US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
| US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
| US8680556B2 (en) | 2011-03-24 | 2014-03-25 | Cree, Inc. | Composite high reflectivity layer |
| CN102738332A (zh) * | 2011-04-13 | 2012-10-17 | 展晶科技(深圳)有限公司 | 发光二极管磊晶结构及制造方法 |
| US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
| US8686429B2 (en) | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
| US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
| TWI495163B (zh) * | 2011-12-09 | 2015-08-01 | 中華電信股份有限公司 | A method for manufacturing a resonant cavity light emitting diode |
| US9608145B2 (en) * | 2012-03-14 | 2017-03-28 | Robbie J. Jorgenson | Materials, structures, and methods for optical and electrical III-nitride semiconductor devices |
| TW201340405A (zh) * | 2012-03-30 | 2013-10-01 | Lextar Electronics Corp | 發光二極體 |
| US8896008B2 (en) | 2013-04-23 | 2014-11-25 | Cree, Inc. | Light emitting diodes having group III nitride surface features defined by a mask and crystal planes |
| JP6500342B2 (ja) * | 2013-04-27 | 2019-04-17 | 日亜化学工業株式会社 | 半導体レーザ装置の製造方法並びにサブマウントの製造方法 |
| US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
| KR102380825B1 (ko) * | 2015-05-29 | 2022-04-01 | 삼성전자주식회사 | 반도체 발광다이오드 칩 및 이를 구비한 발광장치 |
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-
2004
- 2004-05-18 US US10/848,937 patent/US7332365B2/en not_active Expired - Lifetime
-
2005
- 2005-05-17 WO PCT/US2005/016987 patent/WO2005117152A1/en not_active Ceased
- 2005-05-17 JP JP2007527328A patent/JP5468203B2/ja not_active Expired - Lifetime
- 2005-05-17 CA CA002564995A patent/CA2564995A1/en not_active Abandoned
- 2005-05-17 KR KR1020067025952A patent/KR20070013324A/ko not_active Withdrawn
- 2005-05-17 CN CNA2005800158033A patent/CN1957481A/zh active Pending
- 2005-05-17 EP EP05751127.1A patent/EP1763900B1/en not_active Expired - Lifetime
- 2005-05-18 TW TW094116021A patent/TWI390759B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011031098A3 (ko) * | 2009-09-10 | 2011-06-23 | 주식회사 에피밸리 | 반도체 발광소자 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200608605A (en) | 2006-03-01 |
| CA2564995A1 (en) | 2005-12-08 |
| WO2005117152A1 (en) | 2005-12-08 |
| US20060049411A1 (en) | 2006-03-09 |
| TWI390759B (zh) | 2013-03-21 |
| JP2007538408A (ja) | 2007-12-27 |
| EP1763900B1 (en) | 2015-06-24 |
| EP1763900A1 (en) | 2007-03-21 |
| JP5468203B2 (ja) | 2014-04-09 |
| CN1957481A (zh) | 2007-05-02 |
| US7332365B2 (en) | 2008-02-19 |
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