KR20070000578A - 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 - Google Patents
3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
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- 239000012535 impurity Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
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- 238000004381 surface treatment Methods 0.000 claims description 2
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- 230000003287 optical effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 62
- 230000035945 sensitivity Effects 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
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- 238000004080 punching Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
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- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
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Abstract
Description
Claims (8)
- 이미지 센서의 단위화소에 있어서,반도체 물질의 유형과는 반대의 불순물을 함유하고 있는 포토다이오드만으로 구성되고, 상기 포토다이오드의 광전하량을 외부로 전송하기 위한 패드를 구비하는 제1 웨이퍼;상기 포토다이오드를 제외한 트랜지스터 구성의 규칙적인 배열을 갖는 화소배열영역, 상기 화소배열 이외의 이미지 센서의 구조를 갖는 주변회로영역 및 상기 각 화소를 연결하기 위한 패드를 구비하는 제2 웨이퍼; 및상기 제1 웨이퍼의 패드와 상기 제2 웨이퍼의 패드를 연결하는 연결수단;을 포함함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제1항에 있어서, 상기 제1 웨이퍼는포토다이오드를 형성할 특정 물순물을 함유하고 있는 반도체 물질;구조물 형성의 용이함과 광 투과도 향상을 위해 상기 색상필터와 상기 반도체물질 사이에 삽입되어지는 제1 투명 버퍼층;상기 반도체 물질의 유형과는 반대의 불순물을 함유하고 있는 포토다이오드; 및상기 포토다이오드가 갖고 있는 광전하를 외부로 전송하기 위한 패드;를 포함함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제2항에 있어서, 상기 제1 웨이퍼는각 화소에 특정한 색상을 부여해 주는 색상필터(color filter);빛을 모아 포토다이오드로 집광하는 마이크로 렌즈; 및구조물 형성의 용이함과 광 투과도 향상을 위해 상기 마이크로렌즈와 상기 색상필터사이에 삽입되어지는 제2 투명버퍼층;을 더 구비함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제1항에 있어서, 상기 제2 웨이퍼의 화소배열영역은전송트랜지스터, 리셋 트랜지스터, 소스 팔로워 트랜지스터 및/또는 차단 스위치용 트랜지스터와 같은 화소의 나머지 부분회로로 규칙적인 배열을 갖는 것을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제1항에 있어서, 상기 제2 웨이퍼의 주변회로영역은이미지 센서의 신호 독출을 위한 회로, 상관중첩샘플링(CDS)회로, 일반 아날로그 신호처리를 위한 회로, 기타 디지털 제어회로 및 이미지 신호처리용 디지털 회로 등이 포함됨을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 복수의 트랜지스터 구조를 갖는 이미지 센서의 단위 화소의 제조방법에 있어서,(a)반도체 기판에 불순물 이온을 주입하여 형성된 포토다이오드만으로 구성된 제1 웨이퍼를 구성하는 단계;(b)상기 포토다이오드를 제외한 화소배열영역과 주변회로영역을 구비하는 제2 웨이퍼를 구성하는 단계;(c)상기 제1 웨이퍼와 상기 제2 웨이퍼의 픽셀 어레이 배치를 위하여 상하로 배열시키는 단계; 및(d)상기 상하로 배열된 상기 제1 웨이퍼와 상기 제2 웨이퍼에 형성된 픽셀 단위의 패드를 접착하는 단계; 및(e)상기 제1 웨이퍼 상에 칼라필터를 형성하는 단계;를 포함함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제6항에 있어서,(f)상기 칼라필터 상에 집광을 위한 마이크로렌즈를 형성하는 단계;를 더 포함함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
- 제6항 또는 제7항에 있어서,상기 제1 웨이퍼의 두께를 줄이기 위하여 상기 제1 웨이퍼의 뒷면(back side)을 얇게 하기 위한 표면처리공정을 수행하는 단계를 더 포함함을 특징으로 하는 3차원 구조를 갖는 이미지 센서의 분리형 단위화소.
Priority Applications (8)
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KR1020050056036A KR100718878B1 (ko) | 2005-06-28 | 2005-06-28 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
EP06769059.4A EP1900031B1 (en) | 2005-06-28 | 2006-06-27 | Separation type unit pixel of 3-dimensional image sensor and manufacturing method thereof |
US11/917,983 US8325221B2 (en) | 2005-06-28 | 2006-06-27 | Separation type unit pixel of 3-dimensional image sensor and manufacturing method thereof |
JP2008519169A JP2008544571A (ja) | 2005-06-28 | 2006-06-27 | 3次元構造を持つイメージセンサの分離型単位画素及びその製造方法 |
PCT/KR2006/002482 WO2007001146A1 (en) | 2005-06-28 | 2006-06-27 | Separation type unit pixel of 3-dimensional image sensor and manufacturing method thereof |
CN2006800235744A CN101213669B (zh) | 2005-06-28 | 2006-06-27 | 三维图像传感器的分离式单位像素及其制造方法 |
US13/531,530 US8669132B2 (en) | 2005-06-28 | 2012-06-23 | Separation type unit pixel of 3-dimensional image sensor and manufacturing method thereof |
JP2012287184A JP2013084980A (ja) | 2005-06-28 | 2012-12-28 | 3次元構造を持つイメージセンサの分離型単位画素及びその製造方法 |
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KR1020050056036A KR100718878B1 (ko) | 2005-06-28 | 2005-06-28 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
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US (2) | US8325221B2 (ko) |
EP (1) | EP1900031B1 (ko) |
JP (2) | JP2008544571A (ko) |
KR (1) | KR100718878B1 (ko) |
CN (1) | CN101213669B (ko) |
WO (1) | WO2007001146A1 (ko) |
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KR100882469B1 (ko) * | 2007-12-28 | 2009-02-09 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
KR100882468B1 (ko) * | 2007-12-28 | 2009-02-09 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
KR100895091B1 (ko) * | 2007-04-30 | 2009-04-28 | 주식회사 바이오리쏘스 | 혼합 뽕잎분말 조성물 및 발효 조성물 |
KR100898473B1 (ko) * | 2007-09-06 | 2009-05-21 | 주식회사 동부하이텍 | 이미지센서 |
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KR100922924B1 (ko) * | 2007-12-28 | 2009-10-22 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
US8004027B2 (en) | 2007-09-06 | 2011-08-23 | Dongbu Hitek Co., Ltd. | Image sensor and manufacturing method thereof |
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US20100013907A1 (en) | 2010-01-21 |
KR100718878B1 (ko) | 2007-05-17 |
JP2008544571A (ja) | 2008-12-04 |
EP1900031B1 (en) | 2015-10-21 |
EP1900031A4 (en) | 2012-01-11 |
US20120264251A1 (en) | 2012-10-18 |
CN101213669B (zh) | 2011-04-06 |
CN101213669A (zh) | 2008-07-02 |
US8325221B2 (en) | 2012-12-04 |
WO2007001146A1 (en) | 2007-01-04 |
JP2013084980A (ja) | 2013-05-09 |
EP1900031A1 (en) | 2008-03-19 |
US8669132B2 (en) | 2014-03-11 |
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