KR20060123462A - 웨이퍼의 전사방법 - Google Patents

웨이퍼의 전사방법 Download PDF

Info

Publication number
KR20060123462A
KR20060123462A KR1020067013783A KR20067013783A KR20060123462A KR 20060123462 A KR20060123462 A KR 20060123462A KR 1020067013783 A KR1020067013783 A KR 1020067013783A KR 20067013783 A KR20067013783 A KR 20067013783A KR 20060123462 A KR20060123462 A KR 20060123462A
Authority
KR
South Korea
Prior art keywords
wafer
adhesive sheet
frame
chip
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020067013783A
Other languages
English (en)
Korean (ko)
Inventor
킨야 모치다
미키오 코미야마
켄이찌 와타나베
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20060123462A publication Critical patent/KR20060123462A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067013783A 2004-03-01 2005-02-25 웨이퍼의 전사방법 Ceased KR20060123462A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004055720A JP4768963B2 (ja) 2004-03-01 2004-03-01 ウェハの転写方法
JPJP-P-2004-00055720 2004-03-01

Publications (1)

Publication Number Publication Date
KR20060123462A true KR20060123462A (ko) 2006-12-01

Family

ID=34908879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067013783A Ceased KR20060123462A (ko) 2004-03-01 2005-02-25 웨이퍼의 전사방법

Country Status (6)

Country Link
JP (1) JP4768963B2 (enrdf_load_stackoverflow)
KR (1) KR20060123462A (enrdf_load_stackoverflow)
DE (1) DE112005000448T5 (enrdf_load_stackoverflow)
MY (1) MY162177A (enrdf_load_stackoverflow)
TW (1) TW200532786A (enrdf_load_stackoverflow)
WO (1) WO2005083763A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101160200B1 (ko) * 2005-02-18 2012-06-26 가부시기가이샤 디스코 웨이퍼의 분할방법
KR20190028099A (ko) * 2017-09-08 2019-03-18 삼성전자주식회사 반도체 제조 장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5275553B2 (ja) * 2006-06-27 2013-08-28 スリーエム イノベイティブ プロパティズ カンパニー 分割チップの製造方法
JP2011091293A (ja) * 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd ウエーハの加工方法
JP5533695B2 (ja) * 2011-01-26 2014-06-25 豊田合成株式会社 半導体チップの製造方法および半導体チップの実装方法
JP6044986B2 (ja) * 2012-11-13 2016-12-14 株式会社ディスコ 切削装置
JP5855034B2 (ja) * 2013-02-18 2016-02-09 古河電気工業株式会社 半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法
JP5657828B1 (ja) * 2014-07-17 2015-01-21 大宮工業株式会社 転写方法及び転写装置
JP6695173B2 (ja) 2016-03-07 2020-05-20 日東電工株式会社 基板転写方法および基板転写装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2893741B2 (ja) * 1989-08-02 1999-05-24 日本電気株式会社 電歪効果素子
JPH063321B2 (ja) * 1989-10-13 1994-01-12 貞一 阿部 温水ボイラー
JP2877997B2 (ja) * 1991-08-29 1999-04-05 日東電工株式会社 半導体ウエハの処理方法
JP2001110757A (ja) * 1999-10-06 2001-04-20 Toshiba Corp 半導体装置の製造方法
JP2001257222A (ja) * 2000-03-09 2001-09-21 Hitachi Ltd 半導体実装装置およびその製造方法
JP3408805B2 (ja) * 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP2003086540A (ja) * 2001-09-07 2003-03-20 Toshiba Corp 半導体装置の製造方法及びその製造装置
JP3624909B2 (ja) * 2002-03-12 2005-03-02 浜松ホトニクス株式会社 レーザ加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101160200B1 (ko) * 2005-02-18 2012-06-26 가부시기가이샤 디스코 웨이퍼의 분할방법
KR20190028099A (ko) * 2017-09-08 2019-03-18 삼성전자주식회사 반도체 제조 장치

Also Published As

Publication number Publication date
JP4768963B2 (ja) 2011-09-07
DE112005000448T5 (de) 2007-03-29
MY162177A (en) 2017-05-31
WO2005083763A1 (ja) 2005-09-09
TWI354325B (enrdf_load_stackoverflow) 2011-12-11
JP2007220693A (ja) 2007-08-30
TW200532786A (en) 2005-10-01

Similar Documents

Publication Publication Date Title
JP5111938B2 (ja) 半導体ウエハの保持方法
KR100830111B1 (ko) 반도체 기판용 지그 및 그를 이용한 반도체 장치의 제조방법
US7888239B2 (en) Semiconductor device manufacturing method
US20180158712A1 (en) Method for Bonding Thin Semiconductor Chips to a Substrate
KR20170066251A (ko) 웨이퍼의 가공 방법
JP2002280330A (ja) チップ状部品のピックアップ方法
KR20180131389A (ko) 웨이퍼의 가공 방법
JP5522773B2 (ja) 半導体ウエハの保持方法、チップ体の製造方法、およびスペーサ
JP6009240B2 (ja) ウェーハの加工方法
KR20060123462A (ko) 웨이퍼의 전사방법
KR20050088784A (ko) 백 그라인딩 공정용 표면 보호 테이프를 이용하여 다이싱공정을 수행하는 반도체 장치의 제조 방법
JP2022054894A (ja) ウェーハの加工方法
JP2006156456A (ja) フィルム剥離方法およびフィルム剥離装置
JP2005260154A (ja) チップ製造方法
JP2005045149A (ja) エキスパンド方法
JP2002353296A (ja) ウェハの保護テープ剥離装置およびウェハのマウント装置
JP2017199780A (ja) ウエーハの加工方法
JP2002270560A (ja) ウエハの加工方法
JP2005243910A (ja) 半導体チップの製造方法
JP2010192510A (ja) ワークの移載方法および移載装置
JP2015005648A (ja) ウエーハの加工方法
JP2013219245A (ja) 半導体装置の製造方法
US8580070B2 (en) Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer
JP2012182313A (ja) チップ状部品のピックアップ方法
JP2003086540A (ja) 半導体装置の製造方法及びその製造装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20060707

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20100216

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20110607

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20120130

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20110607

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I