KR20060113912A - 강한 인성의 지환족 에폭시드 수지 - Google Patents
강한 인성의 지환족 에폭시드 수지 Download PDFInfo
- Publication number
- KR20060113912A KR20060113912A KR1020067008596A KR20067008596A KR20060113912A KR 20060113912 A KR20060113912 A KR 20060113912A KR 1020067008596 A KR1020067008596 A KR 1020067008596A KR 20067008596 A KR20067008596 A KR 20067008596A KR 20060113912 A KR20060113912 A KR 20060113912A
- Authority
- KR
- South Korea
- Prior art keywords
- resin
- coating
- epoxide
- epoxy resin
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 0 COC(C1CC2OC2*C1)OC Chemical compound COC(C1CC2OC2*C1)OC 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
- C08G59/682—Alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
- C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Epoxy Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51687803P | 2003-11-03 | 2003-11-03 | |
| US60/516,878 | 2003-11-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060113912A true KR20060113912A (ko) | 2006-11-03 |
Family
ID=34572899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067008596A Ceased KR20060113912A (ko) | 2003-11-03 | 2004-09-10 | 강한 인성의 지환족 에폭시드 수지 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070042191A1 (https=) |
| EP (1) | EP1682599A1 (https=) |
| JP (1) | JP2007510772A (https=) |
| KR (1) | KR20060113912A (https=) |
| CN (1) | CN1875045A (https=) |
| AR (1) | AR046438A1 (https=) |
| BR (1) | BRPI0415812A (https=) |
| TW (1) | TW200523288A (https=) |
| WO (1) | WO2005044890A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005330335A (ja) * | 2004-05-18 | 2005-12-02 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
| US7288607B2 (en) * | 2004-10-12 | 2007-10-30 | E. I. Du Pont De Nemours & Co. | High solids primer composition based on epoxy ring opening curing reaction |
| JP4683933B2 (ja) * | 2005-01-19 | 2011-05-18 | ダイセル化学工業株式会社 | 硬化性樹脂組成物および層間絶縁膜 |
| JP4786200B2 (ja) * | 2005-02-28 | 2011-10-05 | ダイセル化学工業株式会社 | 紫外線硬化型缶用塗料組成物、塗装金属板、および塗装金属缶 |
| JP2007039521A (ja) * | 2005-08-02 | 2007-02-15 | Stanley Electric Co Ltd | 熱硬化性樹脂組成物、該組成物を熱硬化してなる透光性硬化物、該硬化物で封止された発光ダイオード |
| JP5319971B2 (ja) * | 2008-06-27 | 2013-10-16 | 昭和電工株式会社 | 脂環式エポキシ基含有エステル化合物の製造方法 |
| JP5196663B2 (ja) * | 2009-04-03 | 2013-05-15 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| JP5348764B2 (ja) * | 2009-07-07 | 2013-11-20 | 日本化薬株式会社 | 光半導体封止用硬化性樹脂組成物、及びその硬化物 |
| JP5505960B2 (ja) * | 2009-10-09 | 2014-05-28 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| JP5559207B2 (ja) * | 2009-12-24 | 2014-07-23 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物、並びに光半導体装置 |
| WO2011078322A1 (ja) * | 2009-12-24 | 2011-06-30 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物、およびその硬化物 |
| JP5878865B2 (ja) * | 2010-05-21 | 2016-03-08 | 日本化薬株式会社 | ジオレフィン化合物、エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| KR20130039330A (ko) | 2010-06-28 | 2013-04-19 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 수지 조성물 |
| EP2842980B1 (en) | 2013-08-09 | 2021-05-05 | DSM IP Assets B.V. | Low-viscosity liquid radiation curable dental aligner mold resin compositions for additive manufacturing |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US516878A (en) * | 1894-03-20 | Joseph sachs | ||
| JPS608246B2 (ja) * | 1980-11-03 | 1985-03-01 | ユニオン・カ−バイド・コ−ポレ−シヨン | 硬化し得るエポキシ樹脂含有組成物 |
| MX168518B (es) * | 1982-09-30 | 1993-05-27 | Union Carbide Corp | Composiciones de modelo que contienen resina epoxida curable |
| CA1312040C (en) * | 1985-12-19 | 1992-12-29 | Joseph Victor Koleske | Conformal coatings cured with actinic radiation |
| EP0286594A2 (de) * | 1987-04-06 | 1988-10-12 | Ciba-Geigy Ag | Verfahren zur Herstellung von photostrukturierbaren Ueberzügen |
| JPH0418460A (ja) * | 1990-05-11 | 1992-01-22 | Kansai Paint Co Ltd | カチオン電着塗料用樹脂組成物 |
| US5268489A (en) * | 1991-06-26 | 1993-12-07 | Union Carbide Chemicals & Plastics Technology Corporation | Production of unsaturated cycloaliphatic esters and derivatives thereof |
| US5948922A (en) * | 1997-02-20 | 1999-09-07 | Cornell Research Foundation, Inc. | Compounds with substituted cyclic hydrocarbon moieties linked by secondary or tertiary oxycarbonyl containing moiety providing reworkable cured thermosets |
| EP0864594A1 (de) * | 1997-03-06 | 1998-09-16 | Ciba SC Holding AG | Alpha-Glykolgruppen enthaltende Glycidylverbindungen |
| GB2344103B (en) * | 1998-11-24 | 2003-04-16 | Ciba Sc Holding Ag | Piperazinone derivatives |
| US6437045B1 (en) * | 1999-11-10 | 2002-08-20 | Vantico Inc. | Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide |
| US20030059618A1 (en) * | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
| JP5226162B2 (ja) * | 2001-05-14 | 2013-07-03 | 株式会社ダイセル | 液状エポキシ樹脂組成物及びその用途 |
| JP2002371073A (ja) * | 2001-06-12 | 2002-12-26 | Asahi Kasei Corp | エポキシ含有脂環式エステルの製法 |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US6916890B1 (en) * | 2001-10-09 | 2005-07-12 | Henkel Corporation | Thermally reworkable epoxy resins and compositions based thereon |
| JP2003342268A (ja) * | 2002-05-28 | 2003-12-03 | Nippon Kasei Chem Co Ltd | エポキシ基末端(メタ)アクリレートの製造方法 |
| JP2004067947A (ja) * | 2002-08-08 | 2004-03-04 | Nippon Soda Co Ltd | 光触媒層形成用塗布液および光触媒担持構造体 |
-
2004
- 2004-09-10 EP EP04788740A patent/EP1682599A1/en not_active Withdrawn
- 2004-09-10 KR KR1020067008596A patent/KR20060113912A/ko not_active Ceased
- 2004-09-10 BR BRPI0415812 patent/BRPI0415812A/pt not_active IP Right Cessation
- 2004-09-10 WO PCT/US2004/029996 patent/WO2005044890A1/en not_active Ceased
- 2004-09-10 US US10/575,286 patent/US20070042191A1/en not_active Abandoned
- 2004-09-10 CN CNA2004800322989A patent/CN1875045A/zh active Pending
- 2004-09-10 JP JP2006537988A patent/JP2007510772A/ja active Pending
- 2004-09-20 TW TW93128404A patent/TW200523288A/zh unknown
- 2004-11-02 AR ARP040104029 patent/AR046438A1/es not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| US20070042191A1 (en) | 2007-02-22 |
| BRPI0415812A (pt) | 2006-12-26 |
| AR046438A1 (es) | 2005-12-07 |
| TW200523288A (en) | 2005-07-16 |
| WO2005044890A1 (en) | 2005-05-19 |
| EP1682599A1 (en) | 2006-07-26 |
| JP2007510772A (ja) | 2007-04-26 |
| CN1875045A (zh) | 2006-12-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20060503 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20090908 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20110715 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20111010 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20110715 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |