KR20060097661A - 반도체 장치 및 그 제조 방법 - Google Patents

반도체 장치 및 그 제조 방법 Download PDF

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Publication number
KR20060097661A
KR20060097661A KR1020060022185A KR20060022185A KR20060097661A KR 20060097661 A KR20060097661 A KR 20060097661A KR 1020060022185 A KR1020060022185 A KR 1020060022185A KR 20060022185 A KR20060022185 A KR 20060022185A KR 20060097661 A KR20060097661 A KR 20060097661A
Authority
KR
South Korea
Prior art keywords
wiring board
semiconductor chip
wire
substrate
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060022185A
Other languages
English (en)
Korean (ko)
Inventor
히로따까 니시자와
다마끼 와다
겐지 오오사와
준이찌로 오오사꼬
미찌아끼 스기야마
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 르네사스 테크놀로지 filed Critical 가부시끼가이샤 르네사스 테크놀로지
Publication of KR20060097661A publication Critical patent/KR20060097661A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
    • A47G25/14—Clothing hangers, e.g. suit hangers
    • A47G25/20—Clothing hangers, e.g. suit hangers with devices for preserving the shape of the clothes
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47G—HOUSEHOLD OR TABLE EQUIPMENT
    • A47G25/00—Household implements used in connection with wearing apparel; Dress, hat or umbrella holders
    • A47G25/14—Clothing hangers, e.g. suit hangers
    • A47G25/48—Hangers with clamps or the like, e.g. for trousers or skirts
    • A47G25/50—Hooks on hangers for supporting trousers or skirts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020060022185A 2005-03-11 2006-03-09 반도체 장치 및 그 제조 방법 Withdrawn KR20060097661A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005068362A JP2006253430A (ja) 2005-03-11 2005-03-11 半導体装置およびその製造方法
JPJP-P-2005-00068362 2005-03-11

Publications (1)

Publication Number Publication Date
KR20060097661A true KR20060097661A (ko) 2006-09-14

Family

ID=36971628

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060022185A Withdrawn KR20060097661A (ko) 2005-03-11 2006-03-09 반도체 장치 및 그 제조 방법

Country Status (5)

Country Link
US (2) US7352588B2 (https=)
JP (1) JP2006253430A (https=)
KR (1) KR20060097661A (https=)
CN (1) CN1832166A (https=)
TW (1) TW200731140A (https=)

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* Cited by examiner, † Cited by third party
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JP2006253430A (ja) * 2005-03-11 2006-09-21 Renesas Technology Corp 半導体装置およびその製造方法
JP4886308B2 (ja) * 2005-09-16 2012-02-29 株式会社東芝 Ｕｓｂメモリ装置
DE602005014498D1 (de) * 2005-12-30 2009-06-25 Incard Sa Modul einer IC-Karte
US8053279B2 (en) * 2007-06-19 2011-11-08 Micron Technology, Inc. Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces
KR20100109243A (ko) * 2009-03-31 2010-10-08 삼성전자주식회사 반도체 패키지
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
CN102376012B (zh) * 2011-11-01 2016-10-26 上海仪电智能电子有限公司 一种双界面智能卡
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
EP2605188A1 (fr) * 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
EP2608114A1 (fr) * 2011-12-19 2013-06-26 Gemalto SA Procédé de fabrication d'un module à puce de circuit intégré protégé par pastille
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
TWD164807S (zh) * 2013-08-06 2014-12-11 璨圓光電股份有限公司 半導體發光元件之部分
CN104021415A (zh) * 2014-06-27 2014-09-03 南通富士通微电子股份有限公司 电子标签
USD736213S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736212S1 (en) * 2014-07-01 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD736216S1 (en) * 2014-07-30 2015-08-11 Samsung Electronics Co., Ltd. Memory card
USD739856S1 (en) * 2014-07-30 2015-09-29 Samsung Electronics Co., Ltd. Memory card
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
USD783622S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
USD783621S1 (en) * 2015-08-25 2017-04-11 Samsung Electronics Co., Ltd. Memory card
FR3058545B1 (fr) 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
CN118171678B (zh) * 2018-02-01 2025-05-23 华为技术有限公司 存储卡和终端
FR3094137A1 (fr) * 2019-03-20 2020-09-25 Stmicroelectronics (Grenoble 2) Sas Boîtier électronique comportant des pistes contactant des fils
TWI708533B (zh) * 2019-07-02 2020-10-21 華泰電子股份有限公司 半導體封裝件及其製法
CN112242388A (zh) * 2019-07-18 2021-01-19 华泰电子股份有限公司 半导体封装件及其制法
CN111863739B (zh) * 2020-07-29 2022-04-08 深圳市邦测检测技术有限公司 一种rf射频通信模块及其制造方法
EP4084063A1 (en) 2021-04-30 2022-11-02 Infineon Technologies Austria AG Semiconductor module with bond wire loop exposed from a moulded body and method for fabricating the same
DE102021213437A1 (de) 2021-11-29 2023-06-01 Robert Bosch Gesellschaft mit beschränkter Haftung Schaltungsanordnung und Verfahren zum Ausbilden einer Schaltungsanordnung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6359335B1 (en) * 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
KR100386061B1 (ko) * 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
EP1189271A3 (en) * 1996-07-12 2003-07-16 Fujitsu Limited Wiring boards and mounting of semiconductor devices thereon
US5989939A (en) * 1996-12-13 1999-11-23 Tessera, Inc. Process of manufacturing compliant wirebond packages
JP2978861B2 (ja) * 1997-10-28 1999-11-15 九州日本電気株式会社 モールドｂｇａ型半導体装置及びその製造方法
EP1278154A4 (en) 2000-04-28 2004-08-25 Hitachi Ltd SMART CARD
TW445608B (en) * 2000-05-19 2001-07-11 Siliconware Precision Industries Co Ltd Semiconductor package and manufacturing method thereof of lead frame without flashing
CN1259200C (zh) * 2000-10-02 2006-06-14 松下电器产业株式会社 卡型记录媒体及其制造方法
DE10209922A1 (de) * 2002-03-07 2003-10-02 Infineon Technologies Ag Elektronisches Modul, Nutzen mit zu vereinzelnden elektronischen Modulen und Verfahren zu deren Herstellung
JP2006253430A (ja) * 2005-03-11 2006-09-21 Renesas Technology Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
CN1832166A (zh) 2006-09-13
US20060205280A1 (en) 2006-09-14
US7352588B2 (en) 2008-04-01
US20080153205A1 (en) 2008-06-26
JP2006253430A (ja) 2006-09-21
TW200731140A (en) 2007-08-16

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000