KR20060052081A - 도포막 형성 장치 및 도포막 형성 방법 - Google Patents

도포막 형성 장치 및 도포막 형성 방법 Download PDF

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Publication number
KR20060052081A
KR20060052081A KR1020050094004A KR20050094004A KR20060052081A KR 20060052081 A KR20060052081 A KR 20060052081A KR 1020050094004 A KR1020050094004 A KR 1020050094004A KR 20050094004 A KR20050094004 A KR 20050094004A KR 20060052081 A KR20060052081 A KR 20060052081A
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KR
South Korea
Prior art keywords
nozzle
substrate
processing liquid
coating film
film forming
Prior art date
Application number
KR1020050094004A
Other languages
English (en)
Korean (ko)
Inventor
류세이 토미타
요시히로 카와구치
후미히코 이케다
나오키 후지타
Original Assignee
동경 엘렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동경 엘렉트론 주식회사 filed Critical 동경 엘렉트론 주식회사
Publication of KR20060052081A publication Critical patent/KR20060052081A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020050094004A 2004-10-07 2005-10-06 도포막 형성 장치 및 도포막 형성 방법 KR20060052081A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00295141 2004-10-07
JP2004295141 2004-10-07
JP2005218221A JP4738085B2 (ja) 2004-10-07 2005-07-28 塗布膜形成装置、及び塗布膜形成方法
JPJP-P-2005-00218221 2005-07-28

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120083909A Division KR101257660B1 (ko) 2004-10-07 2012-07-31 도포막 형성 방법

Publications (1)

Publication Number Publication Date
KR20060052081A true KR20060052081A (ko) 2006-05-19

Family

ID=36728527

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020050094004A KR20060052081A (ko) 2004-10-07 2005-10-06 도포막 형성 장치 및 도포막 형성 방법
KR1020120083909A KR101257660B1 (ko) 2004-10-07 2012-07-31 도포막 형성 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020120083909A KR101257660B1 (ko) 2004-10-07 2012-07-31 도포막 형성 방법

Country Status (3)

Country Link
JP (1) JP4738085B2 (ja)
KR (2) KR20060052081A (ja)
TW (1) TWI293583B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101289407B1 (ko) * 2011-12-19 2013-07-24 주식회사 나래나노텍 저점도 도액의 흐름 방지 장치 및 방법, 및 이를 구비한 슬릿 다이
KR101309037B1 (ko) * 2006-06-23 2013-09-17 엘지디스플레이 주식회사 슬릿코터

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101243087B1 (ko) * 2006-09-14 2013-03-13 주식회사 케이씨텍 슬릿 코터
TWI452646B (zh) * 2007-07-12 2014-09-11 Kondoh Ind Ltd A dry air or a nitrogen gas filling device in a semiconductor wafer storage container, and a wafer electrostatic removing device using the same
KR200454943Y1 (ko) 2007-08-10 2011-08-05 주식회사 케이씨텍 슬릿 노즐
KR101522611B1 (ko) * 2013-10-04 2015-06-25 주식회사 케이씨텍 기판 코터 장치
JP6760709B2 (ja) * 2017-05-31 2020-09-23 東芝三菱電機産業システム株式会社 ミスト塗布成膜装置の塗布ヘッドおよびそのメンテナンス方法
JP2021008970A (ja) * 2019-06-28 2021-01-28 株式会社アルバック 凍結乾燥用ノズル、凍結乾燥装置、および、造粒方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06170306A (ja) * 1992-12-03 1994-06-21 Konica Corp 塗布装置
JP3645586B2 (ja) * 1994-06-08 2005-05-11 大日本スクリーン製造株式会社 処理液塗布装置
JP3245813B2 (ja) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JP3918106B2 (ja) * 1999-12-20 2007-05-23 富士フイルム株式会社 塗布装置
JP2002282760A (ja) * 2001-03-26 2002-10-02 Dainippon Screen Mfg Co Ltd 液体供給ノズル及びその製造方法、処理装置ならびに処理方法
JP2003164793A (ja) * 2001-09-18 2003-06-10 Matsushita Electric Works Ltd 塗布具及び塗布方法
JP3840238B2 (ja) 2004-07-08 2006-11-01 大日本スクリーン製造株式会社 処理液塗布装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309037B1 (ko) * 2006-06-23 2013-09-17 엘지디스플레이 주식회사 슬릿코터
KR101289407B1 (ko) * 2011-12-19 2013-07-24 주식회사 나래나노텍 저점도 도액의 흐름 방지 장치 및 방법, 및 이를 구비한 슬릿 다이

Also Published As

Publication number Publication date
KR101257660B1 (ko) 2013-04-29
JP4738085B2 (ja) 2011-08-03
JP2006135294A (ja) 2006-05-25
TW200624181A (en) 2006-07-16
TWI293583B (en) 2008-02-21
KR20120103526A (ko) 2012-09-19

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