KR20060050146A - 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 - Google Patents
화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 Download PDFInfo
- Publication number
- KR20060050146A KR20060050146A KR1020050063511A KR20050063511A KR20060050146A KR 20060050146 A KR20060050146 A KR 20060050146A KR 1020050063511 A KR1020050063511 A KR 1020050063511A KR 20050063511 A KR20050063511 A KR 20050063511A KR 20060050146 A KR20060050146 A KR 20060050146A
- Authority
- KR
- South Korea
- Prior art keywords
- chemical mechanical
- mechanical polishing
- aqueous dispersion
- mass
- ceria
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (5)
- 세리아와 양이온성 유기 입자를 혼합하여 얻어지는 복합 입자를 포함하는 지립(abrasive)을 1.5 질량% 이하의 농도로 함유하며, 상기 양이온성 유기 입자의 혼합량이 세리아 100 질량부에 대하여 100 질량부 이하이고, 상기 지립의 평균 분산 입경이 1.0 ㎛ 이상인 것을 특징으로 하는 화학 기계 연마용 수계 분산체.
- 제1항에 있어서, 추가로 음이온성 수용성 유기 중합체를 함유하는 화학 기계 연마용 수계 분산체.
- 평균 분산 입경이 1.0 ㎛ 미만인 세리아를 함유하는 수분산체를 세리아 환산으로 100 질량부로, 평균 분산 입경이 1.0 ㎛ 미만인 양이온성 유기 입자를 함유하는 수분산체를 양이온성 유기 입자 환산으로 100 질량부 이하로 혼합하는 것을 특징으로 하는, 제1항에 기재된 화학 기계 연마용 수계 분산체의 제조 방법.
- 제1항 또는 제2항에 기재된 화학 기계 연마용 수계 분산체를 사용하여 절연막을 연마하는 것을 특징으로 하는 화학 기계 연마 방법.
- 제4항에 있어서, 절연막이 PETEOS막, HDP막, 열 CVD법에 의해 얻어지는 산화 실리콘막, 붕소인실리케이트막 또는 불소 도핑 실리케이트막인 것을 특징으로 하는 화학 기계 연마 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00208609 | 2004-07-15 | ||
JP2004208609A JP4292117B2 (ja) | 2004-07-15 | 2004-07-15 | 化学機械研磨用水系分散体及び化学機械研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060050146A true KR20060050146A (ko) | 2006-05-19 |
KR100737202B1 KR100737202B1 (ko) | 2007-07-10 |
Family
ID=35169259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050063511A KR100737202B1 (ko) | 2004-07-15 | 2005-07-14 | 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7550020B2 (ko) |
EP (1) | EP1616927B1 (ko) |
JP (1) | JP4292117B2 (ko) |
KR (1) | KR100737202B1 (ko) |
CN (1) | CN1324106C (ko) |
DE (1) | DE602005002409T2 (ko) |
TW (1) | TWI304090B (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4292117B2 (ja) | 2004-07-15 | 2009-07-08 | Jsr株式会社 | 化学機械研磨用水系分散体及び化学機械研磨方法 |
JP5182483B2 (ja) * | 2005-12-16 | 2013-04-17 | Jsr株式会社 | 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット |
US20090325323A1 (en) * | 2006-07-18 | 2009-12-31 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, production method thereof, and chemical mechanical polishing method |
JPWO2008032680A1 (ja) * | 2006-09-11 | 2010-01-28 | 旭硝子株式会社 | 半導体集積回路装置用研磨剤、研磨方法および半導体集積回路装置の製造方法 |
JP4811586B2 (ja) * | 2006-09-28 | 2011-11-09 | Jsr株式会社 | 化学機械研磨用水系分散体およびその製造方法ならびに化学機械研磨方法 |
US20090090696A1 (en) * | 2007-10-08 | 2009-04-09 | Cabot Microelectronics Corporation | Slurries for polishing oxide and nitride with high removal rates |
KR101260575B1 (ko) | 2008-04-23 | 2013-05-06 | 히타치가세이가부시끼가이샤 | 연마제 및 이 연마제를 이용한 기판의 연마방법 |
CN102477261B (zh) * | 2010-11-26 | 2015-06-17 | 安集微电子(上海)有限公司 | 一种化学机械抛光液 |
US10287457B2 (en) | 2012-11-02 | 2019-05-14 | Lawrence Livermore National Security, Llc | Polishing slurry preventing agglomeration of charged colloids without loss of surface activity |
US10227518B2 (en) | 2013-09-30 | 2019-03-12 | Fujimi Incorporated | Polishing composition and method for producing same |
US11136474B2 (en) * | 2017-02-08 | 2021-10-05 | Showa Denko Materials Co., Ltd. | Polishing liquid and polishing method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60235631A (ja) | 1984-05-09 | 1985-11-22 | Toho Chem Ind Co Ltd | 非自己重合性反応性カチオン界面活性剤 |
JP3335667B2 (ja) | 1992-05-26 | 2002-10-21 | 株式会社東芝 | 半導体装置の製造方法 |
JPH09270402A (ja) | 1996-03-29 | 1997-10-14 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の製造法 |
US5876490A (en) | 1996-12-09 | 1999-03-02 | International Business Machines Corporatin | Polish process and slurry for planarization |
TW420716B (en) | 1996-12-09 | 2001-02-01 | Ibm | Polish process and slurry for planarization |
JP3371775B2 (ja) * | 1997-10-31 | 2003-01-27 | 株式会社日立製作所 | 研磨方法 |
JP2000109809A (ja) | 1998-10-08 | 2000-04-18 | Hitachi Chem Co Ltd | Cmp研磨剤及び基板の研磨方法 |
JP2000252245A (ja) | 1999-03-01 | 2000-09-14 | Hitachi Chem Co Ltd | Cmp研磨液 |
JP3784988B2 (ja) | 1999-03-18 | 2006-06-14 | 株式会社東芝 | 半導体装置の製造方法 |
KR100447552B1 (ko) * | 1999-03-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 수계 분산체 및 반도체 장치의 제조에 사용하는 화학 기계연마용 수계 분산체 및 반도체 장치의 제조 방법 및 매립배선의 형성 방법 |
JP2001007061A (ja) | 1999-06-18 | 2001-01-12 | Hitachi Chem Co Ltd | Cmp研磨剤及び基板の研磨方法 |
KR100444239B1 (ko) * | 1999-11-22 | 2004-08-11 | 제이에스알 가부시끼가이샤 | 복합화 입자의 제조 방법, 이 방법에 의해 제조되는복합화 입자 및 이 복합화 입자를 함유하는 화학 기계연마용 수계 분산체, 및 화학 기계 연마용 수계 분산체의제조 방법 |
JP2001185514A (ja) | 1999-12-27 | 2001-07-06 | Hitachi Chem Co Ltd | Cmp研磨剤及び基板の研磨方法 |
JP4123685B2 (ja) * | 2000-05-18 | 2008-07-23 | Jsr株式会社 | 化学機械研磨用水系分散体 |
JP2002204353A (ja) | 2000-12-28 | 2002-07-19 | Fujitsu Ltd | 画像状態推定方法、画像補正方法および補正装置 |
US7004819B2 (en) * | 2002-01-18 | 2006-02-28 | Cabot Microelectronics Corporation | CMP systems and methods utilizing amine-containing polymers |
JP2003313542A (ja) | 2002-04-22 | 2003-11-06 | Jsr Corp | 化学機械研磨用水系分散体 |
TWI256971B (en) * | 2002-08-09 | 2006-06-21 | Hitachi Chemical Co Ltd | CMP abrasive and method for polishing substrate |
US7005382B2 (en) * | 2002-10-31 | 2006-02-28 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing |
EP1566420A1 (en) | 2004-01-23 | 2005-08-24 | JSR Corporation | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
JP4292117B2 (ja) | 2004-07-15 | 2009-07-08 | Jsr株式会社 | 化学機械研磨用水系分散体及び化学機械研磨方法 |
-
2004
- 2004-07-15 JP JP2004208609A patent/JP4292117B2/ja active Active
-
2005
- 2005-07-13 DE DE602005002409T patent/DE602005002409T2/de active Active
- 2005-07-13 EP EP05015261A patent/EP1616927B1/en not_active Expired - Fee Related
- 2005-07-14 US US11/180,619 patent/US7550020B2/en not_active Expired - Fee Related
- 2005-07-14 KR KR1020050063511A patent/KR100737202B1/ko active IP Right Grant
- 2005-07-14 TW TW094123890A patent/TWI304090B/zh not_active IP Right Cessation
- 2005-07-15 CN CNB200510084026XA patent/CN1324106C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200602473A (en) | 2006-01-16 |
KR100737202B1 (ko) | 2007-07-10 |
DE602005002409T2 (de) | 2008-06-12 |
US20060010781A1 (en) | 2006-01-19 |
US7550020B2 (en) | 2009-06-23 |
TWI304090B (en) | 2008-12-11 |
JP4292117B2 (ja) | 2009-07-08 |
EP1616927A1 (en) | 2006-01-18 |
DE602005002409D1 (de) | 2007-10-25 |
JP2006032611A (ja) | 2006-02-02 |
CN1721494A (zh) | 2006-01-18 |
EP1616927B1 (en) | 2007-09-12 |
CN1324106C (zh) | 2007-07-04 |
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