KR20060048605A - 플렉시블 배선 기판과 그 제조 방법 및 반도체 칩 실장플렉시블 배선 기판과 전자기기 - Google Patents

플렉시블 배선 기판과 그 제조 방법 및 반도체 칩 실장플렉시블 배선 기판과 전자기기 Download PDF

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Publication number
KR20060048605A
KR20060048605A KR1020050056207A KR20050056207A KR20060048605A KR 20060048605 A KR20060048605 A KR 20060048605A KR 1020050056207 A KR1020050056207 A KR 1020050056207A KR 20050056207 A KR20050056207 A KR 20050056207A KR 20060048605 A KR20060048605 A KR 20060048605A
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KR
South Korea
Prior art keywords
wiring board
semiconductor chip
wiring
conductive
input
Prior art date
Application number
KR1020050056207A
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English (en)
Korean (ko)
Inventor
히데다카 오하자마
Original Assignee
도호꾸 파이오니어 가부시끼가이샤
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Application filed by 도호꾸 파이오니어 가부시끼가이샤 filed Critical 도호꾸 파이오니어 가부시끼가이샤
Publication of KR20060048605A publication Critical patent/KR20060048605A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
KR1020050056207A 2004-06-28 2005-06-28 플렉시블 배선 기판과 그 제조 방법 및 반도체 칩 실장플렉시블 배선 기판과 전자기기 KR20060048605A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004189980A JP4443324B2 (ja) 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器
JPJP-P-2004-00189980 2004-06-28

Publications (1)

Publication Number Publication Date
KR20060048605A true KR20060048605A (ko) 2006-05-18

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ID=35780090

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050056207A KR20060048605A (ko) 2004-06-28 2005-06-28 플렉시블 배선 기판과 그 제조 방법 및 반도체 칩 실장플렉시블 배선 기판과 전자기기

Country Status (4)

Country Link
JP (1) JP4443324B2 (ja)
KR (1) KR20060048605A (ja)
CN (2) CN101674705B (ja)
TW (1) TW200601915A (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934325B2 (ja) 2006-02-17 2012-05-16 株式会社フジクラ プリント配線板の接続構造及びプリント配線板の接続方法
CN101206681B (zh) * 2006-12-21 2011-05-18 英业达股份有限公司 信号线调整方法及系统
CN201007989Y (zh) * 2007-02-06 2008-01-16 北京京东方光电科技有限公司 左右摆式排线结构
CN102131344B (zh) * 2009-11-19 2013-01-09 友达光电股份有限公司 布局方法与电路板
JP5528906B2 (ja) * 2010-05-28 2014-06-25 株式会社ジャパンディスプレイ 表示装置
CN103928415A (zh) * 2013-03-01 2014-07-16 厦门天马微电子有限公司 一种引脚区域的结构
JP7006062B2 (ja) * 2016-11-18 2022-02-10 株式会社リコー 配線基板、配線部材、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
US10149382B2 (en) 2016-11-18 2018-12-04 Ricoh Company, Ltd. Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
CN107203075B (zh) 2017-05-22 2020-02-07 京东方科技集团股份有限公司 触摸显示面板和液晶显示设备
JP7306337B2 (ja) * 2020-06-25 2023-07-11 トヨタ自動車株式会社 配線基板の製造方法
CN116636315A (zh) * 2021-11-18 2023-08-22 京东方科技集团股份有限公司 驱动设备、显示设备和制造驱动设备的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204067A (ja) * 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd 回路基板モジュールの製造方法

Also Published As

Publication number Publication date
CN101674705A (zh) 2010-03-17
JP2006013230A (ja) 2006-01-12
CN101674705B (zh) 2011-12-28
TWI347155B (ja) 2011-08-11
JP4443324B2 (ja) 2010-03-31
TW200601915A (en) 2006-01-01
CN1717147A (zh) 2006-01-04
CN1717147B (zh) 2010-05-05

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