TW200601915A - Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus - Google Patents

Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus

Info

Publication number
TW200601915A
TW200601915A TW094118442A TW94118442A TW200601915A TW 200601915 A TW200601915 A TW 200601915A TW 094118442 A TW094118442 A TW 094118442A TW 94118442 A TW94118442 A TW 94118442A TW 200601915 A TW200601915 A TW 200601915A
Authority
TW
Taiwan
Prior art keywords
wiring board
flexible wiring
wiring
semiconductor chip
manufacturing
Prior art date
Application number
TW094118442A
Other languages
English (en)
Other versions
TWI347155B (zh
Inventor
Hidetaka Ohazama
Original Assignee
Pioneer Tohoku Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Tohoku Corp filed Critical Pioneer Tohoku Corp
Publication of TW200601915A publication Critical patent/TW200601915A/zh
Application granted granted Critical
Publication of TWI347155B publication Critical patent/TWI347155B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW094118442A 2004-06-28 2005-06-03 Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus TW200601915A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004189980A JP4443324B2 (ja) 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器

Publications (2)

Publication Number Publication Date
TW200601915A true TW200601915A (en) 2006-01-01
TWI347155B TWI347155B (zh) 2011-08-11

Family

ID=35780090

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118442A TW200601915A (en) 2004-06-28 2005-06-03 Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus

Country Status (4)

Country Link
JP (1) JP4443324B2 (zh)
KR (1) KR20060048605A (zh)
CN (2) CN1717147B (zh)
TW (1) TW200601915A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793620B (zh) * 2020-06-25 2023-02-21 日商豐田自動車股份有限公司 配線基板的製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934325B2 (ja) 2006-02-17 2012-05-16 株式会社フジクラ プリント配線板の接続構造及びプリント配線板の接続方法
CN101206681B (zh) * 2006-12-21 2011-05-18 英业达股份有限公司 信号线调整方法及系统
CN201007989Y (zh) 2007-02-06 2008-01-16 北京京东方光电科技有限公司 左右摆式排线结构
CN102131344B (zh) * 2009-11-19 2013-01-09 友达光电股份有限公司 布局方法与电路板
JP5528906B2 (ja) * 2010-05-28 2014-06-25 株式会社ジャパンディスプレイ 表示装置
CN103928415A (zh) * 2013-03-01 2014-07-16 厦门天马微电子有限公司 一种引脚区域的结构
US10149382B2 (en) 2016-11-18 2018-12-04 Ricoh Company, Ltd. Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
JP7006062B2 (ja) * 2016-11-18 2022-02-10 株式会社リコー 配線基板、配線部材、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
CN107203075B (zh) * 2017-05-22 2020-02-07 京东方科技集团股份有限公司 触摸显示面板和液晶显示设备
WO2023087210A1 (en) * 2021-11-18 2023-05-25 Boe Technology Group Co., Ltd. Driving apparatus, display apparatus, and method of fabricating driving apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204067A (ja) * 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd 回路基板モジュールの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793620B (zh) * 2020-06-25 2023-02-21 日商豐田自動車股份有限公司 配線基板的製造方法

Also Published As

Publication number Publication date
JP2006013230A (ja) 2006-01-12
CN101674705A (zh) 2010-03-17
JP4443324B2 (ja) 2010-03-31
CN1717147A (zh) 2006-01-04
CN1717147B (zh) 2010-05-05
KR20060048605A (ko) 2006-05-18
TWI347155B (zh) 2011-08-11
CN101674705B (zh) 2011-12-28

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