TW200601915A - Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus - Google Patents
Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatusInfo
- Publication number
- TW200601915A TW200601915A TW094118442A TW94118442A TW200601915A TW 200601915 A TW200601915 A TW 200601915A TW 094118442 A TW094118442 A TW 094118442A TW 94118442 A TW94118442 A TW 94118442A TW 200601915 A TW200601915 A TW 200601915A
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring board
- flexible wiring
- wiring
- semiconductor chip
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189980A JP4443324B2 (ja) | 2004-06-28 | 2004-06-28 | フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200601915A true TW200601915A (en) | 2006-01-01 |
TWI347155B TWI347155B (zh) | 2011-08-11 |
Family
ID=35780090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118442A TW200601915A (en) | 2004-06-28 | 2005-06-03 | Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4443324B2 (zh) |
KR (1) | KR20060048605A (zh) |
CN (2) | CN1717147B (zh) |
TW (1) | TW200601915A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI793620B (zh) * | 2020-06-25 | 2023-02-21 | 日商豐田自動車股份有限公司 | 配線基板的製造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4934325B2 (ja) | 2006-02-17 | 2012-05-16 | 株式会社フジクラ | プリント配線板の接続構造及びプリント配線板の接続方法 |
CN101206681B (zh) * | 2006-12-21 | 2011-05-18 | 英业达股份有限公司 | 信号线调整方法及系统 |
CN201007989Y (zh) * | 2007-02-06 | 2008-01-16 | 北京京东方光电科技有限公司 | 左右摆式排线结构 |
CN102131344B (zh) * | 2009-11-19 | 2013-01-09 | 友达光电股份有限公司 | 布局方法与电路板 |
JP5528906B2 (ja) * | 2010-05-28 | 2014-06-25 | 株式会社ジャパンディスプレイ | 表示装置 |
CN103928415A (zh) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | 一种引脚区域的结构 |
US10149382B2 (en) | 2016-11-18 | 2018-12-04 | Ricoh Company, Ltd. | Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus |
JP7006062B2 (ja) * | 2016-11-18 | 2022-02-10 | 株式会社リコー | 配線基板、配線部材、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置 |
CN107203075B (zh) * | 2017-05-22 | 2020-02-07 | 京东方科技集团股份有限公司 | 触摸显示面板和液晶显示设备 |
WO2023087210A1 (en) * | 2021-11-18 | 2023-05-25 | Boe Technology Group Co., Ltd. | Driving apparatus, display apparatus, and method of fabricating driving apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002204067A (ja) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Ind Co Ltd | 回路基板モジュールの製造方法 |
-
2004
- 2004-06-28 JP JP2004189980A patent/JP4443324B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-03 TW TW094118442A patent/TW200601915A/zh unknown
- 2005-06-28 KR KR1020050056207A patent/KR20060048605A/ko not_active Application Discontinuation
- 2005-06-28 CN CN2005100811303A patent/CN1717147B/zh active Active
- 2005-06-28 CN CN2009101659890A patent/CN101674705B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI793620B (zh) * | 2020-06-25 | 2023-02-21 | 日商豐田自動車股份有限公司 | 配線基板的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4443324B2 (ja) | 2010-03-31 |
CN101674705A (zh) | 2010-03-17 |
JP2006013230A (ja) | 2006-01-12 |
CN1717147B (zh) | 2010-05-05 |
CN101674705B (zh) | 2011-12-28 |
TWI347155B (zh) | 2011-08-11 |
CN1717147A (zh) | 2006-01-04 |
KR20060048605A (ko) | 2006-05-18 |
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