JP4443324B2 - フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器 - Google Patents

フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器 Download PDF

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Publication number
JP4443324B2
JP4443324B2 JP2004189980A JP2004189980A JP4443324B2 JP 4443324 B2 JP4443324 B2 JP 4443324B2 JP 2004189980 A JP2004189980 A JP 2004189980A JP 2004189980 A JP2004189980 A JP 2004189980A JP 4443324 B2 JP4443324 B2 JP 4443324B2
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JP
Japan
Prior art keywords
wiring
semiconductor chip
input
conductive
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004189980A
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English (en)
Japanese (ja)
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JP2006013230A (ja
Inventor
秀隆 大峡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohoku Pioneer Corp
Original Assignee
Tohoku Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku Pioneer Corp filed Critical Tohoku Pioneer Corp
Priority to JP2004189980A priority Critical patent/JP4443324B2/ja
Priority to TW094118442A priority patent/TW200601915A/zh
Priority to KR1020050056207A priority patent/KR20060048605A/ko
Priority to CN2009101659890A priority patent/CN101674705B/zh
Priority to CN2005100811303A priority patent/CN1717147B/zh
Publication of JP2006013230A publication Critical patent/JP2006013230A/ja
Application granted granted Critical
Publication of JP4443324B2 publication Critical patent/JP4443324B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2004189980A 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器 Expired - Fee Related JP4443324B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004189980A JP4443324B2 (ja) 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器
TW094118442A TW200601915A (en) 2004-06-28 2005-06-03 Flexible wiring board and method for manufacturing the same, semiconductor chip mounted flexible wiring board and electronic apparatus
KR1020050056207A KR20060048605A (ko) 2004-06-28 2005-06-28 플렉시블 배선 기판과 그 제조 방법 및 반도체 칩 실장플렉시블 배선 기판과 전자기기
CN2009101659890A CN101674705B (zh) 2004-06-28 2005-06-28 柔性布线基板及制法、配芯片的柔性布线基板及电子设备
CN2005100811303A CN1717147B (zh) 2004-06-28 2005-06-28 柔性布线基板及制法、配芯片的柔性布线基板及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004189980A JP4443324B2 (ja) 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器

Publications (2)

Publication Number Publication Date
JP2006013230A JP2006013230A (ja) 2006-01-12
JP4443324B2 true JP4443324B2 (ja) 2010-03-31

Family

ID=35780090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004189980A Expired - Fee Related JP4443324B2 (ja) 2004-06-28 2004-06-28 フレキシブル配線基板及びその製造方法、半導体チップ実装フレキシブル配線基板、電子機器

Country Status (4)

Country Link
JP (1) JP4443324B2 (zh)
KR (1) KR20060048605A (zh)
CN (2) CN1717147B (zh)
TW (1) TW200601915A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4934325B2 (ja) 2006-02-17 2012-05-16 株式会社フジクラ プリント配線板の接続構造及びプリント配線板の接続方法
CN101206681B (zh) * 2006-12-21 2011-05-18 英业达股份有限公司 信号线调整方法及系统
CN201007989Y (zh) * 2007-02-06 2008-01-16 北京京东方光电科技有限公司 左右摆式排线结构
CN102131344B (zh) * 2009-11-19 2013-01-09 友达光电股份有限公司 布局方法与电路板
JP5528906B2 (ja) * 2010-05-28 2014-06-25 株式会社ジャパンディスプレイ 表示装置
CN103928415A (zh) * 2013-03-01 2014-07-16 厦门天马微电子有限公司 一种引脚区域的结构
JP7006062B2 (ja) * 2016-11-18 2022-02-10 株式会社リコー 配線基板、配線部材、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
US10149382B2 (en) 2016-11-18 2018-12-04 Ricoh Company, Ltd. Wiring substrate, wiring member, liquid discharge head, liquid discharge device, and liquid discharge apparatus
CN107203075B (zh) * 2017-05-22 2020-02-07 京东方科技集团股份有限公司 触摸显示面板和液晶显示设备
JP7306337B2 (ja) * 2020-06-25 2023-07-11 トヨタ自動車株式会社 配線基板の製造方法
CN116636315A (zh) * 2021-11-18 2023-08-22 京东方科技集团股份有限公司 驱动设备、显示设备和制造驱动设备的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204067A (ja) * 2000-12-28 2002-07-19 Matsushita Electric Ind Co Ltd 回路基板モジュールの製造方法

Also Published As

Publication number Publication date
CN101674705B (zh) 2011-12-28
TWI347155B (zh) 2011-08-11
CN1717147B (zh) 2010-05-05
TW200601915A (en) 2006-01-01
KR20060048605A (ko) 2006-05-18
CN1717147A (zh) 2006-01-04
CN101674705A (zh) 2010-03-17
JP2006013230A (ja) 2006-01-12

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