KR20060018879A - 온도 제어를 갖는 히트 파이프 - Google Patents

온도 제어를 갖는 히트 파이프 Download PDF

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Publication number
KR20060018879A
KR20060018879A KR1020057023381A KR20057023381A KR20060018879A KR 20060018879 A KR20060018879 A KR 20060018879A KR 1020057023381 A KR1020057023381 A KR 1020057023381A KR 20057023381 A KR20057023381 A KR 20057023381A KR 20060018879 A KR20060018879 A KR 20060018879A
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KR
South Korea
Prior art keywords
temperature
heat pipe
pressure
heat
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020057023381A
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English (en)
Korean (ko)
Inventor
앤드류 제이 헤즐턴
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20060018879A publication Critical patent/KR20060018879A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
KR1020057023381A 2003-06-05 2004-05-26 온도 제어를 갖는 히트 파이프 Withdrawn KR20060018879A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/455,004 US20040244963A1 (en) 2003-06-05 2003-06-05 Heat pipe with temperature control
US10/455,004 2003-06-05

Publications (1)

Publication Number Publication Date
KR20060018879A true KR20060018879A (ko) 2006-03-02

Family

ID=33489837

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057023381A Withdrawn KR20060018879A (ko) 2003-06-05 2004-05-26 온도 제어를 갖는 히트 파이프

Country Status (7)

Country Link
US (1) US20040244963A1 (https=)
EP (1) EP1629246A2 (https=)
JP (1) JP2006526757A (https=)
KR (1) KR20060018879A (https=)
CN (1) CN1798953A (https=)
TW (1) TW200504893A (https=)
WO (1) WO2004109757A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
US8350247B2 (en) 2006-11-16 2013-01-08 Samsung Electronics Co., Ltd. Resistive random access memory having a solid solution layer and method of manufacturing the same
KR101280399B1 (ko) * 2010-06-23 2013-07-01 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 리소그래피 장치 냉각 방법
US8525142B2 (en) 2006-05-04 2013-09-03 Samsung Electronics Co., Ltd. Non-volatile variable resistance memory device and method of fabricating the same

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US7174806B2 (en) * 2001-09-13 2007-02-13 Beacon Power Corporation Flexible bearing damping system, energy storage system using such a system, and a method related thereto
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
CN1892206A (zh) * 2005-07-08 2007-01-10 鸿富锦精密工业（深圳）有限公司 热管量测装置
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
US20080073563A1 (en) * 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
JP2008147026A (ja) * 2006-12-11 2008-06-26 Hitachi Ltd 固体酸化物形燃料電池
TWM348267U (en) * 2008-07-25 2009-01-01 Micro Star Int Co Ltd Heat conducting pipe and heat dissipation system using the same
JP5355043B2 (ja) * 2008-11-10 2013-11-27 キヤノン株式会社 露光装置およびデバイス製造方法
US8593810B2 (en) * 2009-01-23 2013-11-26 Nec Corporation Cooling device
US20100218496A1 (en) * 2009-03-02 2010-09-02 Miles Mark W Passive heat engine systems and components
US8883024B2 (en) 2010-10-18 2014-11-11 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources
EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
DE102011084324A1 (de) * 2011-10-12 2013-04-18 Siemens Aktiengesellschaft Kühleinrichtung für einen Supraleiter einer supraleitenden dynamoelektrischen Synchronmaschine
NL2010185A (en) * 2012-01-30 2013-08-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
KR20140140541A (ko) 2012-01-30 2014-12-09 에이에스엠엘 네델란즈 비.브이. 기판 테이블의 위치를 측정하기 위한 메트롤로지 시스템을 갖는 리소그래피 장치
KR101427924B1 (ko) 2012-11-21 2014-08-11 현대자동차 주식회사 연료 전지 시스템의 압축 공기 냉각 장치
US20150068703A1 (en) * 2013-09-06 2015-03-12 Ge Aviation Systems Llc Thermal management system and method of assembling the same
AU2014320060B2 (en) * 2013-09-12 2018-06-28 Renew Group Private Limited System and method of using graphene enriched products for distributing heat energy
TWI506261B (zh) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
CN105004232B (zh) * 2015-08-20 2017-06-06 安徽华茂纺织股份有限公司 一种千分尺读数放大装置
JP2017156465A (ja) * 2016-02-29 2017-09-07 キヤノン株式会社 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法
CN107300334B (zh) * 2017-07-31 2018-10-02 大连碧蓝节能环保科技有限公司 调节蒸发压力式热管
CN111566926A (zh) * 2017-11-06 2020-08-21 碧绿威自动化股份有限公司 具有散热能力及降热考虑的线性马达
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备
US10936031B2 (en) * 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10969841B2 (en) * 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
KR102098867B1 (ko) * 2018-09-12 2020-04-09 (주)아이테드 임프린팅 장치 및 임프린팅 방법
CA3141420A1 (en) * 2019-11-29 2021-06-03 Malcolm Barry James Fluid phase change thermal management arrangement and method
JP7182574B2 (ja) * 2020-02-28 2022-12-02 株式会社日立製作所 エレベーター制御装置およびエレベーター制御方法
CN112161501B (zh) * 2020-09-28 2022-02-25 北京空间飞行器总体设计部 可控热管
US12451448B2 (en) 2022-06-22 2025-10-21 International Business Machines Corporation Electromagnetic waveguiding through liquid cooling conduit
CN115779812A (zh) * 2022-11-15 2023-03-14 山东神驰石化有限公司 一种c3c4脱氢反应进料加热炉节能装置
CN115791882A (zh) * 2022-12-06 2023-03-14 东南大学 一种矸石山重力热管实验装置及实验方法
CN116538840A (zh) * 2023-05-05 2023-08-04 北京东方锐镭科技有限公司 一种自动补液的封闭式热管换热器

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US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
US3741289A (en) * 1970-07-06 1973-06-26 R Moore Heat transfer apparatus with immiscible fluids
JPS59180283A (ja) * 1983-03-29 1984-10-13 Toshiba Corp 可変コンダクタンスヒ−トパイプ
US4573525A (en) * 1985-03-28 1986-03-04 Boyd Hermon A Thermally actuated heat exchange method and system
JPH0631702B2 (ja) * 1985-09-30 1994-04-27 株式会社東芝 二相流体ル−プ
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
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US4787843A (en) * 1987-06-22 1988-11-29 Thermo Electron Corporation Pressure balanced heat pipe
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JP3475973B2 (ja) * 1994-12-14 2003-12-10 株式会社ニコン リニアモータ、ステージ装置、及び露光装置
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8525142B2 (en) 2006-05-04 2013-09-03 Samsung Electronics Co., Ltd. Non-volatile variable resistance memory device and method of fabricating the same
US8350247B2 (en) 2006-11-16 2013-01-08 Samsung Electronics Co., Ltd. Resistive random access memory having a solid solution layer and method of manufacturing the same
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
KR101280399B1 (ko) * 2010-06-23 2013-07-01 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 리소그래피 장치 냉각 방법
US8976333B2 (en) 2010-06-23 2015-03-10 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cooling method

Also Published As

Publication number Publication date
CN1798953A (zh) 2006-07-05
TW200504893A (en) 2005-02-01
WO2004109757A3 (en) 2005-03-31
US20040244963A1 (en) 2004-12-09
EP1629246A2 (en) 2006-03-01
JP2006526757A (ja) 2006-11-24
WO2004109757A2 (en) 2004-12-16

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PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

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R18-X000 Changes to party contact information recorded

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000