JP2006526757A - 温度制御付きヒートパイプ - Google Patents

温度制御付きヒートパイプ Download PDF

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Publication number
JP2006526757A
JP2006526757A JP2006514959A JP2006514959A JP2006526757A JP 2006526757 A JP2006526757 A JP 2006526757A JP 2006514959 A JP2006514959 A JP 2006514959A JP 2006514959 A JP2006514959 A JP 2006514959A JP 2006526757 A JP2006526757 A JP 2006526757A
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JP
Japan
Prior art keywords
heat pipe
temperature
heat
pressure
flow path
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Pending
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JP2006514959A
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English (en)
Japanese (ja)
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JP2006526757A5 (https=
Inventor
アンドリュー， ジェイ． ハゼルトン，
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Nikon Corp
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Nikon Corp
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Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JP2006526757A publication Critical patent/JP2006526757A/ja
Publication of JP2006526757A5 publication Critical patent/JP2006526757A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
JP2006514959A 2003-06-05 2004-05-26 温度制御付きヒートパイプ Pending JP2006526757A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/455,004 US20040244963A1 (en) 2003-06-05 2003-06-05 Heat pipe with temperature control
PCT/US2004/016495 WO2004109757A2 (en) 2003-06-05 2004-05-26 Heat pipe with temperature control

Publications (2)

Publication Number Publication Date
JP2006526757A true JP2006526757A (ja) 2006-11-24
JP2006526757A5 JP2006526757A5 (https=) 2007-08-02

Family

ID=33489837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006514959A Pending JP2006526757A (ja) 2003-06-05 2004-05-26 温度制御付きヒートパイプ

Country Status (7)

Country Link
US (1) US20040244963A1 (https=)
EP (1) EP1629246A2 (https=)
JP (1) JP2006526757A (https=)
KR (1) KR20060018879A (https=)
CN (1) CN1798953A (https=)
TW (1) TW200504893A (https=)
WO (1) WO2004109757A2 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114397A (ja) * 2008-11-10 2010-05-20 Canon Inc 露光装置およびデバイス製造方法
JP2014103099A (ja) * 2012-11-21 2014-06-05 Hyundai Motor Company Co Ltd 燃料電池システムの圧縮空気冷却装置
JP2015511398A (ja) * 2012-01-30 2015-04-16 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造方法
US9684249B2 (en) 2012-01-30 2017-06-20 Asml Netherlands B.V. Lithographic apparatus with a metrology system for measuring a position of a substrate table

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US7174806B2 (en) * 2001-09-13 2007-02-13 Beacon Power Corporation Flexible bearing damping system, energy storage system using such a system, and a method related thereto
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
CN1892206A (zh) * 2005-07-08 2007-01-10 鸿富锦精密工业（深圳）有限公司 热管量测装置
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
KR101239962B1 (ko) 2006-05-04 2013-03-06 삼성전자주식회사 하부 전극 상에 형성된 버퍼층을 포함하는 가변 저항메모리 소자
US20080073563A1 (en) * 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
KR101206036B1 (ko) 2006-11-16 2012-11-28 삼성전자주식회사 전이 금속 고용체를 포함하는 저항성 메모리 소자 및 그제조 방법
JP2008147026A (ja) * 2006-12-11 2008-06-26 Hitachi Ltd 固体酸化物形燃料電池
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
TWM348267U (en) * 2008-07-25 2009-01-01 Micro Star Int Co Ltd Heat conducting pipe and heat dissipation system using the same
US8593810B2 (en) * 2009-01-23 2013-11-26 Nec Corporation Cooling device
US20100218496A1 (en) * 2009-03-02 2010-09-02 Miles Mark W Passive heat engine systems and components
NL2006809A (en) * 2010-06-23 2011-12-27 Asml Netherlands Bv Lithographic apparatus and lithographic apparatus cooling method.
US8883024B2 (en) 2010-10-18 2014-11-11 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources
EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
DE102011084324A1 (de) * 2011-10-12 2013-04-18 Siemens Aktiengesellschaft Kühleinrichtung für einen Supraleiter einer supraleitenden dynamoelektrischen Synchronmaschine
US20150068703A1 (en) * 2013-09-06 2015-03-12 Ge Aviation Systems Llc Thermal management system and method of assembling the same
AU2014320060B2 (en) * 2013-09-12 2018-06-28 Renew Group Private Limited System and method of using graphene enriched products for distributing heat energy
TWI506261B (zh) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
CN105004232B (zh) * 2015-08-20 2017-06-06 安徽华茂纺织股份有限公司 一种千分尺读数放大装置
JP2017156465A (ja) * 2016-02-29 2017-09-07 キヤノン株式会社 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法
CN107300334B (zh) * 2017-07-31 2018-10-02 大连碧蓝节能环保科技有限公司 调节蒸发压力式热管
CN111566926A (zh) * 2017-11-06 2020-08-21 碧绿威自动化股份有限公司 具有散热能力及降热考虑的线性马达
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备
US10936031B2 (en) * 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10969841B2 (en) * 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
KR102098867B1 (ko) * 2018-09-12 2020-04-09 (주)아이테드 임프린팅 장치 및 임프린팅 방법
CA3141420A1 (en) * 2019-11-29 2021-06-03 Malcolm Barry James Fluid phase change thermal management arrangement and method
JP7182574B2 (ja) * 2020-02-28 2022-12-02 株式会社日立製作所 エレベーター制御装置およびエレベーター制御方法
CN112161501B (zh) * 2020-09-28 2022-02-25 北京空间飞行器总体设计部 可控热管
US12451448B2 (en) 2022-06-22 2025-10-21 International Business Machines Corporation Electromagnetic waveguiding through liquid cooling conduit
CN115779812A (zh) * 2022-11-15 2023-03-14 山东神驰石化有限公司 一种c3c4脱氢反应进料加热炉节能装置
CN115791882A (zh) * 2022-12-06 2023-03-14 东南大学 一种矸石山重力热管实验装置及实验方法
CN116538840A (zh) * 2023-05-05 2023-08-04 北京东方锐镭科技有限公司 一种自动补液的封闭式热管换热器

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517730A (en) * 1967-03-15 1970-06-30 Us Navy Controllable heat pipe
US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
JPS59180283A (ja) * 1983-03-29 1984-10-13 Toshiba Corp 可変コンダクタンスヒ−トパイプ
JPS6277594A (ja) * 1985-09-30 1987-04-09 Toshiba Corp 二相流体ル−プ
JPS62107271U (https=) * 1985-12-16 1987-07-09
JPH01167594A (ja) * 1987-12-22 1989-07-03 Kenji Okayasu 熱伝達装置
JPH0285268U (https=) * 1988-12-07 1990-07-04
JPH02187594A (ja) * 1989-01-13 1990-07-23 Fujikura Ltd ヒートパイプ式熱交換器
JPH06125188A (ja) * 1992-10-12 1994-05-06 Fujitsu Ltd 電子機器の冷却装置
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
JPH11219888A (ja) * 1998-02-03 1999-08-10 Tokyo Electron Ltd 熱処理装置
JP2000105088A (ja) * 1998-08-03 2000-04-11 Hewlett Packard Co <Hp> 熱伝達装置を有する電子装置

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US3637007A (en) * 1967-08-14 1972-01-25 Trw Inc Method of and means for regulating thermal energy transfer through a heat pipe
US3741289A (en) * 1970-07-06 1973-06-26 R Moore Heat transfer apparatus with immiscible fluids
US4573525A (en) * 1985-03-28 1986-03-04 Boyd Hermon A Thermally actuated heat exchange method and system
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
US4787843A (en) * 1987-06-22 1988-11-29 Thermo Electron Corporation Pressure balanced heat pipe
JP3475973B2 (ja) * 1994-12-14 2003-12-10 株式会社ニコン リニアモータ、ステージ装置、及び露光装置
JP4131038B2 (ja) * 1998-06-26 2008-08-13 株式会社エクォス・リサーチ 燃料電池システム
KR100629746B1 (ko) * 1999-07-28 2006-09-28 동경 엘렉트론 주식회사 현상장치 및 그 방법
KR100597287B1 (ko) * 1999-07-28 2006-07-04 동경 엘렉트론 주식회사 기판처리장치 및 그 방법
US6312171B1 (en) * 1999-08-12 2001-11-06 Tokyo Electron Limited Developing apparatus and method thereof
KR20010083206A (ko) * 2000-02-22 2001-08-31 히가시 데쓰로 처리장치
US6684941B1 (en) * 2002-06-04 2004-02-03 Yiding Cao Reciprocating-mechanism driven heat loop

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517730A (en) * 1967-03-15 1970-06-30 Us Navy Controllable heat pipe
US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
JPS59180283A (ja) * 1983-03-29 1984-10-13 Toshiba Corp 可変コンダクタンスヒ−トパイプ
JPS6277594A (ja) * 1985-09-30 1987-04-09 Toshiba Corp 二相流体ル−プ
JPS62107271U (https=) * 1985-12-16 1987-07-09
JPH01167594A (ja) * 1987-12-22 1989-07-03 Kenji Okayasu 熱伝達装置
JPH0285268U (https=) * 1988-12-07 1990-07-04
JPH02187594A (ja) * 1989-01-13 1990-07-23 Fujikura Ltd ヒートパイプ式熱交換器
JPH06125188A (ja) * 1992-10-12 1994-05-06 Fujitsu Ltd 電子機器の冷却装置
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
JPH11219888A (ja) * 1998-02-03 1999-08-10 Tokyo Electron Ltd 熱処理装置
JP2000105088A (ja) * 1998-08-03 2000-04-11 Hewlett Packard Co <Hp> 熱伝達装置を有する電子装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010114397A (ja) * 2008-11-10 2010-05-20 Canon Inc 露光装置およびデバイス製造方法
JP2015511398A (ja) * 2012-01-30 2015-04-16 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造方法
US9618859B2 (en) 2012-01-30 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9684249B2 (en) 2012-01-30 2017-06-20 Asml Netherlands B.V. Lithographic apparatus with a metrology system for measuring a position of a substrate table
JP2014103099A (ja) * 2012-11-21 2014-06-05 Hyundai Motor Company Co Ltd 燃料電池システムの圧縮空気冷却装置
US9859574B2 (en) 2012-11-21 2018-01-02 Hyundai Motor Company Compressed air cooling apparatus of fuel cell system

Also Published As

Publication number Publication date
KR20060018879A (ko) 2006-03-02
CN1798953A (zh) 2006-07-05
TW200504893A (en) 2005-02-01
WO2004109757A3 (en) 2005-03-31
US20040244963A1 (en) 2004-12-09
EP1629246A2 (en) 2006-03-01
WO2004109757A2 (en) 2004-12-16

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