WO2004109757A3 - Heat pipe with temperature control - Google Patents
Heat pipe with temperature control Download PDFInfo
- Publication number
- WO2004109757A3 WO2004109757A3 PCT/US2004/016495 US2004016495W WO2004109757A3 WO 2004109757 A3 WO2004109757 A3 WO 2004109757A3 US 2004016495 W US2004016495 W US 2004016495W WO 2004109757 A3 WO2004109757 A3 WO 2004109757A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat pipe
- temperature associated
- temperature control
- temperature
- fluid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Environmental & Geological Engineering (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04753338A EP1629246A2 (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
JP2006514959A JP2006526757A (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/455,004 US20040244963A1 (en) | 2003-06-05 | 2003-06-05 | Heat pipe with temperature control |
US10/455,004 | 2003-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004109757A2 WO2004109757A2 (en) | 2004-12-16 |
WO2004109757A3 true WO2004109757A3 (en) | 2005-03-31 |
Family
ID=33489837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/016495 WO2004109757A2 (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040244963A1 (en) |
EP (1) | EP1629246A2 (en) |
JP (1) | JP2006526757A (en) |
KR (1) | KR20060018879A (en) |
CN (1) | CN1798953A (en) |
TW (1) | TW200504893A (en) |
WO (1) | WO2004109757A2 (en) |
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US7174806B2 (en) * | 2001-09-13 | 2007-02-13 | Beacon Power Corporation | Flexible bearing damping system, energy storage system using such a system, and a method related thereto |
US6675887B2 (en) * | 2002-03-26 | 2004-01-13 | Thermal Corp. | Multiple temperature sensitive devices using two heat pipes |
US7288864B2 (en) * | 2004-03-31 | 2007-10-30 | Nikon Corporation | System and method for cooling motors of a lithographic tool |
CN1892206A (en) * | 2005-07-08 | 2007-01-10 | 鸿富锦精密工业(深圳)有限公司 | Heat-pipe measuring device |
US20070235161A1 (en) * | 2006-03-27 | 2007-10-11 | Eric Barger | Refrigerant based heat exchange system with compensating heat pipe technology |
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US20080073563A1 (en) * | 2006-07-01 | 2008-03-27 | Nikon Corporation | Exposure apparatus that includes a phase change circulation system for movers |
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JP2008147026A (en) * | 2006-12-11 | 2008-06-26 | Hitachi Ltd | Solid oxide fuel cell |
US8173989B2 (en) | 2007-05-30 | 2012-05-08 | Samsung Electronics Co., Ltd. | Resistive random access memory device and methods of manufacturing and operating the same |
TWM348267U (en) * | 2008-07-25 | 2009-01-01 | Micro Star Int Co Ltd | Heat conducting pipe and heat dissipation system using the same |
JP5355043B2 (en) * | 2008-11-10 | 2013-11-27 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
JPWO2010084717A1 (en) * | 2009-01-23 | 2012-07-12 | 日本電気株式会社 | Cooling system |
US20100218496A1 (en) * | 2009-03-02 | 2010-09-02 | Miles Mark W | Passive heat engine systems and components |
NL2006809A (en) | 2010-06-23 | 2011-12-27 | Asml Netherlands Bv | Lithographic apparatus and lithographic apparatus cooling method. |
US8877080B2 (en) | 2010-10-18 | 2014-11-04 | Tokyo Electron Limited | Using vacuum ultra-violet (VUV) data in microwave sources |
EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
US8723205B2 (en) | 2011-08-30 | 2014-05-13 | Abl Ip Holding Llc | Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism |
US8759843B2 (en) | 2011-08-30 | 2014-06-24 | Abl Ip Holding Llc | Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism |
US8710526B2 (en) | 2011-08-30 | 2014-04-29 | Abl Ip Holding Llc | Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism |
DE102011084324A1 (en) * | 2011-10-12 | 2013-04-18 | Siemens Aktiengesellschaft | Cooling device for a superconductor of a superconducting dynamoelectric synchronous machine |
KR20140140541A (en) | 2012-01-30 | 2014-12-09 | 에이에스엠엘 네델란즈 비.브이. | Lithographic apparatus with a metrology system for measuring a position of a substrate table |
JP6140191B2 (en) * | 2012-01-30 | 2017-05-31 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic apparatus and device manufacturing method |
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US20150068703A1 (en) * | 2013-09-06 | 2015-03-12 | Ge Aviation Systems Llc | Thermal management system and method of assembling the same |
US20160298915A1 (en) * | 2013-09-12 | 2016-10-13 | Renew Group Private Limited | System and Method of Using Graphene Enriched Products for Distributing Heat Energy |
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JP2017156465A (en) * | 2016-02-29 | 2017-09-07 | キヤノン株式会社 | Drive device, lithography device, cooling method, and method for manufacturing article |
CN107300334B (en) * | 2017-07-31 | 2018-10-02 | 大连碧蓝节能环保科技有限公司 | Adjust evaporating pressure formula heat pipe |
TWI791653B (en) * | 2017-11-06 | 2023-02-11 | 新加坡商碧綠威自動化股份有限公司 | Linear motor with heat dissipating capabilities and heat reducing considerations |
US10969841B2 (en) * | 2018-04-13 | 2021-04-06 | Dell Products L.P. | Information handling system housing integrated vapor chamber |
CN110379729B (en) * | 2018-04-13 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Heating base and semiconductor processing equipment |
US10936031B2 (en) * | 2018-04-13 | 2021-03-02 | Dell Products L.P. | Information handling system dynamic thermal transfer control |
KR102098867B1 (en) * | 2018-09-12 | 2020-04-09 | (주)아이테드 | Imprinting apparatus and imprinting method |
CN114829753A (en) * | 2019-11-29 | 2022-07-29 | 马尔科姆·巴里·詹姆斯 | Fluid phase change thermal management apparatus and method |
JP7182574B2 (en) * | 2020-02-28 | 2022-12-02 | 株式会社日立製作所 | Elevator control device and elevator control method |
CN112161501B (en) * | 2020-09-28 | 2022-02-25 | 北京空间飞行器总体设计部 | Controllable heat pipe |
US20230420394A1 (en) * | 2022-06-22 | 2023-12-28 | International Business Machines Corporation | Electromagnetic waveguiding through liquid cooling conduit |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517730A (en) * | 1967-03-15 | 1970-06-30 | Us Navy | Controllable heat pipe |
US3605878A (en) * | 1969-10-08 | 1971-09-20 | Sanders Associates Inc | Heat pipe with variable evaporator |
US3637007A (en) * | 1967-08-14 | 1972-01-25 | Trw Inc | Method of and means for regulating thermal energy transfer through a heat pipe |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4898231A (en) * | 1985-09-30 | 1990-02-06 | Kabushiki Kaisha Toshiba | Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system |
US4986348A (en) * | 1987-12-22 | 1991-01-22 | Kenji Okayasu | Heat conducting device |
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
US5911272A (en) * | 1996-09-11 | 1999-06-15 | Hughes Electronics Corporation | Mechanically pumped heat pipe |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US6229116B1 (en) * | 1998-02-03 | 2001-05-08 | Tokyo Electron Limited | Heat treatment apparatus |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3741289A (en) * | 1970-07-06 | 1973-06-26 | R Moore | Heat transfer apparatus with immiscible fluids |
JPS59180283A (en) * | 1983-03-29 | 1984-10-13 | Toshiba Corp | Variable conductance heat pipe |
US4573525A (en) * | 1985-03-28 | 1986-03-04 | Boyd Hermon A | Thermally actuated heat exchange method and system |
JPH0631702B2 (en) * | 1985-09-30 | 1994-04-27 | 株式会社東芝 | Two-phase fluid loop |
JPS62107271U (en) * | 1985-12-16 | 1987-07-09 | ||
JPH0285268U (en) * | 1988-12-07 | 1990-07-04 | ||
JP2622603B2 (en) * | 1989-01-13 | 1997-06-18 | 株式会社フジクラ | Heat pipe heat exchanger |
JP3475973B2 (en) * | 1994-12-14 | 2003-12-10 | 株式会社ニコン | Linear motor, stage device, and exposure device |
JP4131038B2 (en) * | 1998-06-26 | 2008-08-13 | 株式会社エクォス・リサーチ | Fuel cell system |
US6332723B1 (en) * | 1999-07-28 | 2001-12-25 | Tokyo Electron Limited | Substrate processing apparatus and method |
KR100629746B1 (en) * | 1999-07-28 | 2006-09-28 | 동경 엘렉트론 주식회사 | Developing apparatus and method thereof |
US6312171B1 (en) * | 1999-08-12 | 2001-11-06 | Tokyo Electron Limited | Developing apparatus and method thereof |
KR20010083206A (en) * | 2000-02-22 | 2001-08-31 | 히가시 데쓰로 | Treament apparatus |
-
2003
- 2003-06-05 US US10/455,004 patent/US20040244963A1/en not_active Abandoned
-
2004
- 2004-05-26 WO PCT/US2004/016495 patent/WO2004109757A2/en not_active Application Discontinuation
- 2004-05-26 KR KR1020057023381A patent/KR20060018879A/en not_active Application Discontinuation
- 2004-05-26 CN CNA2004800152920A patent/CN1798953A/en active Pending
- 2004-05-26 JP JP2006514959A patent/JP2006526757A/en active Pending
- 2004-05-26 EP EP04753338A patent/EP1629246A2/en not_active Withdrawn
- 2004-06-04 TW TW093116100A patent/TW200504893A/en unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517730A (en) * | 1967-03-15 | 1970-06-30 | Us Navy | Controllable heat pipe |
US3637007A (en) * | 1967-08-14 | 1972-01-25 | Trw Inc | Method of and means for regulating thermal energy transfer through a heat pipe |
US3605878A (en) * | 1969-10-08 | 1971-09-20 | Sanders Associates Inc | Heat pipe with variable evaporator |
US4898231A (en) * | 1985-09-30 | 1990-02-06 | Kabushiki Kaisha Toshiba | Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4986348A (en) * | 1987-12-22 | 1991-01-22 | Kenji Okayasu | Heat conducting device |
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
US5911272A (en) * | 1996-09-11 | 1999-06-15 | Hughes Electronics Corporation | Mechanically pumped heat pipe |
US6229116B1 (en) * | 1998-02-03 | 2001-05-08 | Tokyo Electron Limited | Heat treatment apparatus |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
Also Published As
Publication number | Publication date |
---|---|
WO2004109757A2 (en) | 2004-12-16 |
CN1798953A (en) | 2006-07-05 |
KR20060018879A (en) | 2006-03-02 |
JP2006526757A (en) | 2006-11-24 |
EP1629246A2 (en) | 2006-03-01 |
TW200504893A (en) | 2005-02-01 |
US20040244963A1 (en) | 2004-12-09 |
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