CN1798953A - Heat pipe with temperature control - Google Patents
Heat pipe with temperature control Download PDFInfo
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- CN1798953A CN1798953A CNA2004800152920A CN200480015292A CN1798953A CN 1798953 A CN1798953 A CN 1798953A CN A2004800152920 A CNA2004800152920 A CN A2004800152920A CN 200480015292 A CN200480015292 A CN 200480015292A CN 1798953 A CN1798953 A CN 1798953A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that contains a fluid and has an evaporator end includes measuring the temperature associated with the heat pipe and determining when the temperature associated with the heat pipe is at a desired level. The method also includes changing a pressure within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level. Changing the pressure within the heat pipe causes the temperature associated with the heat pipe to change.
Description
Technical field
The present invention relates generally to semiconductor processing equipment.More particularly, the present invention relates to by changing the pressure in the heat pipe, the heat pipe that internal temperature is easy to control.
Background technology
For the precision instrument such as litho machine that uses in the semiconductor machining, must study the performance that influences this precision instrument, factors of accuracy for example, and eliminate described factor as much as possible.When the performance of precision instrument affects adversely, the power that for example is disturbed or when being subjected to overheated the influence, the product that utilizes precision instrument to produce may not correctly form, from but defective.For example, the litho machine of the power that is disturbed effect may cause the litho machine image projected to move, thereby, on the projection surface such as semiconductor wafer surface, correctly do not aimed at.
Scan table (scanning stage), and can be included in various photoetching and the exposure sources in being commonly used in semiconducter process such as wafer scan platform and light shield (reticle) scan table.The wafer scan platform generally is used to determine the position of semiconductor wafer, makes that the various piece of wafer can suitably be exposed so that shelter or etching.The light shield scan table is for general on the semiconductor wafer top, determines the position of exposure light cover exactly.Pattern generally is present on the light shield, and in fact it be used as the mask or the negative film of wafer.When light shield being placed on wafer when top as required, a Ray Of Light or beam electrons of broad can be collimated by reduction lenses relatively, and be provided for and place the light shield that approaches metal pattern it on.A plurality of parts of light beam can be absorbed by light shield, and other parts see through light shield and gather on the wafer.
Platform such as wafer scan platform or light shield is generally by the pedestal support, but makes the platform straight line move.Pedestal generally includes or holds and is used to control platform and workbench, for example various sensors and the actuator of the motion of wafer table, and described workbench is the part of whole platform device.Such actuator is arranged to control the grand platform (coarse stage) of entire wafer platform usually, and comprises the coil that produces heat.The heat that coil produces may be quite big, for example the exposure technology of utilizing the entire wafer platform to carry out even as big as influence.The heat that produces can be in high about 10 ℃-20 ℃ scope than required environment temperature.Because by disturbing the work of sensor such as interferometer, the heat that coil produces may influence the performance of entire wafer platform unfriendly, therefore generally the heat that produces is taken away or is otherwise removed near the important relatively assembly of entire wafer platform.From important relatively assembly, for example wafer is taken away heat and has been reduced overheated influence to significant components.
A kind of device that can be used for taking away from important relatively assembly heat is a heat pipe.For example, the thermal source the linear motor in platform device can fully contact with heat pipe, and heat pipe is arranged to take away heat from thermal source, and heat is passed to radiator.Fig. 1 is the schematic diagram of conventional heat pipe.Heat pipe 100 comprises evaporator section 102 and condensation segment 104.Heat pipe 100 generally can be constituted as lining with tube core (wicking) material 112, for example hollow cylindrical tube of cotton yarn sleeve pipe.When thermal source 106 produced heat, the fluid that is included in the liquid form in the heat pipe 100 can be heated to its boiling point by thermal source 106 at evaporator section 102.Described fluid generally is to present gaseous state or steam-like when being heated, and presents liquid fluid when being cooled.When evaporator section 102 is heated, fluid can be directed near the radiator 107 that is placed on the condensation segment 104, shown in arrow 108.Should understand that radiator 107 can be the environment around the heat pipe 100, not necessarily a physical assemblies.
In some cases, need the ability of the boiling temperature of control heat pipe inner fluid, so that the controlled source that heats, for example temperature of the thermal source 106 of Fig. 1.The temperature of control thermal source is crucial, because many system requirements make the temperature of thermal source, for example the surface temperature of the coil of linear motor keeps as far as possible near environment temperature, for example room temperature.In order to control the temperature of thermal source, the boiling temperature relevant with fluid in being included in heat pipe can be controlled.For example, heat pipe can be included in the boiling temperature of the fluid in the heat pipe with change by " topping up ", thereby the surface temperature that makes it to drop to the coil that makes linear motor can be maintained at the degree of desired level.The opposite heat tube topping up generally comprises the fluid that adds such as water in heat pipe, perhaps remove fluid from heat pipe, so that change the boiling temperature of heat pipe.As shown in Figure 2, when the relevant boiling temperature of hope change and heat pipe 200, can add extra fluid 230 to heat pipe 200 evaporator sections 202.Though the processing of opposite heat tube 200 topping ups can change the boiling temperature relevant with heat pipe 200 effectively, thereby change the temperature relevant, except a period of time in the mill, generally be difficult to opposite heat tube 200 topping ups with evaporator section 202.Thereby in the use of heat pipe 200, it is constant that in fact boiling temperature keeps.
Some heat pipes have been designed, so that the temperature relevant with heat pipe can be controlled, even the boiling temperature relevant with heat pipe is uncontrolled in fact.For example can use gas to carry variable thermal-conductance rate heat pipe under the certain situation, so that the temperature in the heat pipe can keep quite stable.Make the temperature in the heat pipe keep quite stable that heat pipe is more effectively worked, though the temperature of the evaporator section of this heat pipe is generally immutable.Fig. 3 a and 3b are the schematic diagrames that gas carries variable thermal-conductance rate heat pipe.Heat pipe 300 with evaporator section 302 and condensation segment 304 comprises the gas reservoir 340 that is positioned at condensation segment 304.Being included in gases in the holder 340 has and depends on the temperature that is included in the steam in the heat pipe 300 and (gas front) 342 before the mobile gas peak.When before the gas peak 342 when moving, the surface area of condensation segment 304 changes.For example, as shown in Fig. 3 b, when before the gas peak 342 when moving when the condensation segment 304, compare with the surface area of condensation segment 304 as shown in Fig. 3 a, the surface area of condensation segment 304 reduces to some extent.
Because when gas peak preceding 342 moves, the variation of the surface area of condensation segment 304, so the thermal conductivity of heat pipe 300 also changes along with the change of 342 position before the gas peak.When the surface area of condensation segment 304 increased, thermal conductivity increased, and when the surface area of condensation segment 304 reduced, thermal conductivity reduced.Thereby,, can control the temperature drop between evaporator section 302 and the condensation segment 304 effectively by before the mobile gas peak 342.Though the temperature drop in the heat pipe 300 can be controlled, make that the temperature in the heat pipe 300 can be maintained at substantially invariable temperature, the use of heat pipe 300 generally can not make the temperature of evaporator section 302 be controlled.
Though in general use heat pipe to take away heat from the significant components of entire wafer platform is that effectively heat pipe generally can not be used to make easily and effectively the temperature of thermal source to be controlled.As mentioned above, though the opposite heat tube topping up can obtain required boiling temperature in heat pipe, except a period of time during fabrication, generally be difficult to the opposite heat tube topping up.Thereby between the operating period of heat pipe, the boiling temperature in the heat pipe keeps substantially constant usually.Thereby the boiling temperature possibility deficiency that reaches in heat pipe is so that the surface of thermal source remains on required temperature, because in fact the boiling temperature of the fluid in the heat pipe determines the retainable steady temperature of evaporator section of the heat pipe of general contact thermal source.
So a kind of temperature of the fluid boiling in the heat pipe that can make of needs can controlled method and apparatus.More particularly, need a kind of control of controlling the evaporator section of heat pipe, make it possible to control effectively the method for temperature and the equipment of thermal source.
Summary of the invention
The present invention relates to a kind of heat pipe that wherein can regulate the boiling temperature of fluid.According to an aspect of the present invention, control with comprising fluid and have the relevant method of temperature of the heat pipe of evaporator section and comprise and measure the temperature relevant when be in required level with definite temperature relevant with heat pipe with heat pipe.This method also comprises when determining the temperature relevant with heat pipe not at desired level, changes the interior pressure of heat pipe.The pressure that changes in the heat pipe causes the temperature relevant with heat pipe to change.
In one embodiment, heat pipe comprises pressure control mechanism, and the pressure that changes in the heat pipe comprises the manipulation pressure control mechanism.In such embodiments, pressure control mechanism can comprise a piston assembly, changes pressure in the heat pipe and comprises and utilize piston assembly to apply controllable pressure.
Temperature in the control heat pipe makes effectively can be controlled from the temperature of being taken away heat by the thermal source of heat pipe cooling.Specifically, by the pressure in the control heat pipe, the temperature of controllable flow body.When the boiling temperature of the fluid in the heat pipe was controlled, the temperature of the evaporator section of heat pipe was controlled in fact.Thereby, by regulating the pressure in the heat pipe, can control from thermal source, for example the coil of linear motor is taken away the temperature of heat.The temperature that control is taken away heat from thermal source makes it possible to more easily the surface temperature of thermal source be remained on constant level, and this has improved the whole system that comprises thermal source, for example the performance of platform device.
According to a further aspect in the invention, heat pipe comprises evaporator section, fluid and pressure control mechanism.Pressure control mechanism is arranged to change the pressure in the heat pipe, makes the boiling temperature of fluid be changed.In one embodiment, pressure control mechanism is arranged to change pressure by increasing pressure, makes the boiling temperature of fluid be increased.In another embodiment, pressure control mechanism comprises and applies controlled pressure, thereby changes the piston apparatus (piston arrangement) of the pressure in the heat pipe.
According to a further aspect in the invention, the method of temperature of the actuator in the platform device that control is communicated with the evaporator section of heat pipe comprises determines the temperature required of actuator, utilize the temperature required of actuator, determine the corresponding temperature required of evaporator section, regulate the interior mechanism of heat pipe so that reach the temperature required of evaporator section.Regulate pressure and cause the boiling temperature of heat pipe inner fluid to be conditioned, make the temperature of evaporator section be conditioned.
In one embodiment, the pressure of regulating in the heat pipe comprises that the piston apparatus of opposite heat tube applies the control of first size.The control of first size is arranged to make piston apparatus to change the interior pressure of heat pipe.In such embodiments, this method comprises that also the temperature that determines when evaporator section is the temperature required of evaporator section.When the temperature of evaporator section was evaporator section temperature required, control was maintained at described first size.On the other hand, when the temperature of evaporator section is not evaporator section temperature required, can regulate the pressure in the heat pipe, so that reach the temperature required of evaporator section by piston apparatus being applied the control of second size.
According to a further aspect in the invention, heat-transfer equipment comprises runner and takes away at least one heat absorbing part of heat from thermal source.Heat absorbing part is disposed on the route of runner.The heat transfer medium that is filled in the runner circulates in runner, and the temperature setting device that is connected with runner changes the state-shift of heat transfer medium.In one embodiment, temperature setting device changes the boiling temperature of heat transfer medium.In another embodiment, temperature setting device changes the pressure in the runner.
According to a further aspect in the invention, heat-transfer equipment comprises runner, takes away at least one heat absorbing part of heat and is filled in the interior heat transfer medium of runner from thermal source.Heat absorbing part is disposed on the route of runner, and thermal source is disposed in the runner.Heat transfer medium circulates in runner.
According to a further aspect in the invention, the control method of temperature relevant with heat-transfer equipment is included in circulation heat transfer medium in the runner, described runner comprises the state-shift of taking away at least one heat absorbing part and the heat transfer medium that change circulates of heat from thermal source in runner.In one embodiment, change state-shift and comprise the boiling temperature that changes heat transfer medium.In another embodiment, change state-shift and comprise the pressure that changes in the runner.
According to a further aspect in the invention, the control method of temperature relevant with heat-transfer equipment is included in and is full of heat transfer medium in the runner and the heat transfer medium that circulates in runner.Runner comprises thermal source.
When reading following detailed description, and during each figure in the research accompanying drawing, these and other advantage of the present invention will become apparent.
Description of drawings
In conjunction with the accompanying drawings,, can understand the present invention better with reference to following explanation, wherein:
Fig. 1 is the schematic diagram of conventional heat pipe.
But Fig. 2 is the schematic diagram of the conventional heat pipe of topping up.
Fig. 3 a is the schematic diagram that gas carries variable thermal-conductance rate heat pipe.
Fig. 3 b carries variable thermal-conductance rate heat pipe at the gas that the gas from holder is present under the situation of condensation segment, for example the schematic diagram of the heat pipe 300 of Fig. 3 a.
Fig. 4 is the schematic diagram that wherein pressure according to an embodiment of the invention can controlled heat pipe.
Fig. 5 is the schematic diagram that utilizes the heat pipe of piston apparatus control pressure wherein according to an embodiment of the invention.
Fig. 6 is according to one embodiment of present invention, the block diagram of the action that takes place when the piston of mobile heat pipe heat component.
Fig. 7 is according to one embodiment of present invention, has the schematic diagram as the heat pipe of the piston of pressure controller.
Fig. 8 is according to one embodiment of present invention, can be used for controlling the schematic diagram of the temperature controlling ring in the heat pipe.
Fig. 9 illustrates according to one embodiment of present invention, by regulating the pressure in the heat pipe, the process chart of a kind of method of the temperature in the control heat pipe.
Figure 10 a is according to one embodiment of present invention, the schematic diagram of the piston that is activated by voice coil motor.
Figure 10 b is according to one embodiment of present invention, the schematic diagram of the piston that is activated by bellows.
Figure 11 is the schematic diagram of lithographic equipment according to an embodiment of the invention.
Figure 12 illustrates according to one embodiment of present invention, the process chart of the step relevant with the preparation semiconductor devices.
Figure 13 illustrates according to one embodiment of present invention, with processed wafer, i.e. and the process chart of the step that the step 1304 of Figure 12 is relevant.
The specific embodiment
When in wafer exposure is handled, whole precision surface plate equipment, when for example the environment temperature around the entire wafer platform device was raised, the performance of platform device can be affected.Thereby, when environment temperature is raised, for example when the ideal temperature about 20 ℃ of-25 ℃ of scopes is elevated to temperature in about 30 ℃ of-40 ℃ of scopes, in the wafer exposure of utilizing platform device to carry out is handled, error or inconsistent can appear.Usually, the heat of the actuator generation relevant with platform device causes environment temperature to raise.Aforesaid actuator comprise have coil (conductor) and produce heat first's (thermal source) thus and the second portion of the generation active force of cooperate with first.In order to reduce, can use heat pipe (heat-transfer equipment) to come heat is carried away to the radiator that absorbs heat from actuator by such as linear motor or have the environment temperature rise that the actuator the motor of solenoid causes.
Generally, heat pipe (heat-transfer equipment) is used to make coil, and for example the surface temperature of the coil of linear motor can remain on specific temperature, such as room temperature.Though heat pipe usually take away from coil aspect the heat effective, but when heat pipe carries out work so that move away the temperature of heat when too high from coil, coil may not be sufficiently cooled, cause air to be heated to failing to be convened for lack of a quorum in the coil surrounding air, thus the measurement of disturbing the sensor such as interferometer to carry out.
By the heat transfer medium in the control heat pipe (heat-transfer equipment), for example the temperature of fluid can be controlled the temperature of taking away heat from thermal source such as actuator.In one embodiment,, can control heat transfer medium, especially be positioned at the temperature of heat transfer medium of the evaporator section of heat pipe by controlling the pressure in the heat pipe in fact.The pressure of control in the heat pipe makes the boiling temperature of heat pipe inner fluid can be controlled, and in fact this make the temperature of heat pipe evaporator section can be controlled.Thereby, by regulating the pressure in the heat pipe, can control in fact from thermal source, for example the coil of linear motor is taken away the temperature of heat.The temperature that control is taken away heat from thermal source makes the surface temperature of thermal source can more easily remain on constant level.Heat-transfer equipment, for example the structure of disclosed heat pipe is changed in an embodiment.This equipment can be used in the scheme of for example describing in U.S. Patent No. 3605878 and U.S. Patent No. 6684941.Disclosure in the above-mentioned United States Patent (USP) is drawn at this and is reference, as long as apply for that to it appointment country of this international patent application or internal law of selected country allow.
Fig. 4 is according to one embodiment of present invention, the schematic diagram that pressure wherein can controlled heat pipe.Heat pipe 404 can be arranged at thermal source 416, and for example heat coil of actuator and radiator 420 are for example between the environment around the heat pipe 404.Specifically, thermal source 416 is disposed in the evaporator section 408 of heat pipe 404, and radiator 420 is disposed in the condensation segment 412 of heat pipe 404.The pressure control mechanism 424 that is actually the part of heat pipe 404 is arranged to make the pressure in the heat pipe 404 to be changed.Pressure control mechanism 424 can be disposed in Anywhere with respect to heat pipe 404 usually.In one embodiment, pressure control mechanism 424 can be the piston that is controlled the power effect, and is following described with reference to figure 5.It should be understood that pressure control mechanism 424 generally can be to make the pressure in the heat pipe 404 can reformed any mechanism.In addition, thermal source 416 can be disposed in the heat pipe (heat-transfer equipment) 404.On the other hand, thermal source 416 can be disposed in outside the heat pipe (heat-transfer equipment) 404.
In general, by increasing the pressure in the heat pipe 404, the boiling temperature that is in the fluid of liquid state or gas-liquid attitude can be increased.On the other hand, by reducing the pressure in the heat pipe 404, the boiling temperature that is in the fluid of liquid state or gas-liquid attitude can be lowered.When the boiling point of the fluid in the heat pipe 404 or variations in temperature, the temperature that so generally comprises the evaporator section 408 of the fluid that is in a liquid state changes.Thereby the boiling temperature that changes fluid can change the temperature of evaporator section 408, thereby, can change the temperature that thermal source 416 is kept effectively, because thermal source 416 general be communicated with evaporator section 408 (in communication).For instance, pressure in heat pipe 404 increases, and the boiling temperature of the fluid in the heat pipe 404 is when increasing, and the heat that thermal source 416 produces can fully be left by heat pipe 404 under higher temperature.Thereby, allow to utilize pressure control mechanism 424 fully the boiling temperatures of the fluid in the control heat pipes 404 can make the temperature relevant with evaporator section 408, thereby the temperature of thermal source 416 is controlled.
As mentioned above, a kind of suitable pressure control mechanism 424 is piston mechanisms.Referring to Fig. 5, will be according to one embodiment of present invention, explanation can utilize an embodiment of the heat pipe of piston control pressure wherein.The heat pipe 504 that comprises evaporator section 508 and condensation segment 512 is disposed between thermal source 516 and the radiator 520, makes thermal source 516 be positioned at evaporator section 508, and radiator 520 is positioned at condensation segment 512.Arrange piston 514 with respect to heat pipe 504, make that piston 14 can cause the pressure in the heat pipe 504 when piston 514 is used the control 530 that can apply by the actuator of controlled mechanism controls, promptly the internal pressure of heat pipe 504 changes.By apply controlled pressure effectively in heat pipe 504, piston 514 can cause the pressure in the heat pipe 504 to change.In order to prevent that fluid from spilling from heat pipe 504, can use the diaphragm (not shown) to form sealing effectively in one embodiment, described sealing prevents that fluid from by being present in any slit between piston 514 and the heat pipe 504, spilling from heat pipe 504.Will be appreciated that applying controlled pressure in heat pipe 504 also can cause slight at least volume-variation in heat pipe 504.
Piston 54 has relevant surface area usually, and described surface area contacts the inside of heat pipe 504 effectively.Thereby the controlled pressure that piston 514 applies can be stated as the function of the contact area of control 530 and piston 514.Thereby by increasing control 530, the controlled pressure that piston 514 applies can be increased, and the pressure in the heat pipe 504 can raise.Usually, when applying control 530 along negative y direction 540, piston 514 moves along negative y direction 540, causes the pressure in the heat pipe 504 to increase.On the other hand, when applying control 530 along positive y direction 540, piston moves along positive y direction 540, generally causes the pressure in the heat pipe 504 to reduce.
Referring to Fig. 6, according to one embodiment of present invention, the action that takes place is discussed when the piston of heat pipe heat component moves.When the piston of in action 610, regulating opposite heat tube, for example the piston 514 of Fig. 5 apply active force the time, in action 614, the pressure in the heat pipe changes.For instance, when the active force that piston is applied was increased, the pressure in the heat pipe can increase.In action 618, the variation of the pressure in the heat pipe causes the boiling temperature of the fluid in the heat pipe to change.Under setting pressure, when the fluid in the heat pipe is in the solution-air attitude, it will be understood by those skilled in the art that the pressure that changes in the heat pipe can change the boiling temperature of fluid.For the embodiment that the pressure in the heat pipe wherein is increased, the boiling temperature of the fluid in the heat pipe generally can increase.
In case the boiling temperature of the fluid in the heat pipe changes, in action 622, the temperature of the evaporator section of heat pipe just changes.Since the evaporator section of heat pipe generally be positioned at thermal source near, the therefore temperature of the evaporator section by changing heat pipe, the temperature of taking away heat from thermal source also is changed.
In order to monitor the temperature of the fluid in the heat pipe, perhaps more particularly, for the temperature of the evaporator section that monitors heat pipe, so that determine that the boiling temperature of the fluid in the heat pipe is to be in desired level, still need be changed so that reach desired level, can in heat pipe, place a temperature sensor.Fig. 7 is according to one embodiment of present invention, has the schematic diagram as the heat pipe of the piston of pressure controller and internal temperature sensor.Heat pipe 602 comprises the piston 614 by active force 618 controls.In order to determine to be applied to piston 614,, can place a temperature sensor 640 at the evaporator section 606 of heat pipe 602 so that in heat pipe 602, reach the suitable value of the active force 618 of required boiling temperature.Temperature sensor 640 generally can be used for measuring the temperature of the fluid in the heat pipe 602, and can be in fact any suitable temperature sensor 640.Suitable temperature sensor or transducer can include, but is not limited to thermometer, for example thermocouple thermometer and compensation by thermistor, and thermoelectric transducer and RTD.
The output of temperature sensor 640 can be provided for controller, and described controller provides active force 618, makes it possible to the suitably size of regulating action power 618, thereby produces the pressure that is suitable for making the temperature in the heat pipe 602 to be raised or to reduce in heat pipe 602.As shown in Figure 8, Fig. 8 can be used to control heat pipe, such as the schematic block diagram of a kind of suitable control loop of the temperature in the heat pipe 602, with the form of the input of the control in the control loop 800, provide heat pipe evaporator section temperature required 802.The temperature required 802 temperature required users by the appointment heat pipe offer controller 806, and controller 806 controls provide the actuator 808 of control to the piston of heat pipe.In one embodiment, actuator 808 can be a voice coil motor, linear motor or any electromagnetic actuators.
The measurement temperature 810 that can be provided by the temperature sensor in the heat pipe also is provided for controller 806 as input.Utilize temperature required 802 and measure temperature 810, controller 806 can be determined the suitable size or the level of the active force that actuator 808 will apply to the piston of heat pipe, so that it is approximate identical with temperature required 802 to measure temperature 810.Will be appreciated that controller 806 can be as required control actuator 808 continuously, thereby regulate pressure in the heat pipe as required continuously measure temperature 810 and remain on approximate and temperature required 802 identical levels so that make effectively.
Referring to Fig. 9, according to one embodiment of present invention, illustrate by regulating the pressure in the heat pipe, a method of the temperature in the control heat pipe.The process 900 of the temperature in the control heat pipe starts from step 902, in step 902, determines how many temperature required of evaporator section of heat pipe be.Determine that temperature required what are can comprise obtains temperature requiredly from the user of heat pipe, perhaps, determine temperature required according to the requirement of the whole platform device that uses heat pipe.For example, utilizing the required surface temperature of the actuator of heat pipe cooling can be used to determine evaporator section corresponding temperature required of heat pipe.Though will be appreciated that temperature required identical that evaporator section temperature required of heat pipe can be with actuator, these two temperature required also can be different.
Determine temperature required after, in step 906, can measure the temperature of the evaporator section of heat pipe.Though generally in heat pipe, measure this temperature at evaporator section so that can keep temperature required at evaporator section, will be appreciated that in fact can be in heat pipe measure temperature in the heat pipe Anywhere.On the other hand, can measure the temperature of actuator, a certain other temperature, perhaps with a certain performance parameter of the temperature correlation of actuator, for example air turbulence or sensor noise.In case measured the temperature in the heat pipe, just in step 908 temperature of the evaporator section of definite heat pipe whether with temperature required identical.If the temperature of the evaporator section of definite heat pipe with temperature required identical, indicates the pressure in the heat pipe to be enough to remain on the boiling point of the liquid in the heat pipe temperature required so.Therefore, in step 912, the current control that puts on the piston of heat pipe is maintained on its present level.That is, the actuator that control is applied on the piston does not change the size that puts on the control on the piston.Handling process is from the step 906 of the temperature of the evaporator section of step 912 return measurement heat pipe.
Return step 908, temperature required if the temperature of the evaporator section of definite heat pipe with temperature required different, is indicated so for what will reach, the pressure in the heat pipe or too high or low excessively.For example, if the temperature of the evaporator section of heat pipe is too high, the pressure in the heat pipe is too high probably so, makes to reach the temperature required of evaporator section.Like this, handling process forwards step 910 to from step 908, in step 910, regulates and for example utilizes actuator to put on the control of the piston of heat pipe, so that regulate the pressure in the heat pipe.Generally, the adjusting that control is carried out is arranged to be enough to the pressure change in the heat pipe is enough to reach the temperature required a certain quantity of the evaporator section of heat pipe.In case control is conditioned, handling process is with regard to the step 906 of the temperature of the evaporator section of return measurement heat pipe.
Usually, the actuator that is used to change the active force of the piston that puts on heat pipe can come down to can be by any suitable actuator of controller control, and for example described controller sends signal to actuator, so that change the active force that actuator produces.For instance, the actuator that couples with the piston of heat pipe can be the motor such as voice coil motor (VCM).Figure 10 a is the schematic diagram of the piston that is activated by VCM according to an embodiment of the invention.Heat pipe 950 comprises the piston 944 that couples with VCM 930.As shown in the figure, body 934 and the piston 944 of VCM 930 couple, and make the magnet 936 of cooperating with coil 932 cause body 934 to move, and produce active force on piston 944.Usually, the active force on the piston 944 that VCM 930 produces can cause piston 944 or move along positive y direction 948, perhaps moves along negative y direction 948.The fluid that can arrange diaphragm 940 or similar means to prevent to be included in the inside 954 of heat pipe 950 leaks and spills heat pipe 950 around piston 944.When piston 944 moves, the function of the active force that applies as VCM 930 on the piston 944 and the area of piston 944, the pressure in inner 954 can change.
The actuator that another piston that can be used to opposite heat tube applies active force is bellows.Figure 10 b is according to one embodiment of present invention, the schematic diagram of the piston that is activated by bellows.Heat pipe 980 comprises and can utilize diaphragm 970 to seal, the piston 974 that leaks with the fluid in the inside 984 that prevents to be included in heat pipe 980.Piston 974 can couple with bellows 960, and bellows 960 can be used to change the control that puts on piston 974, thereby changes the pressure in inner 984.Usually, by changing the air pressure in the bellows 960, can change the size that bellows 960 are applied to the active force on the piston 974.Thereby, by the air pressure in the control bellows 960, can control piston 974 moving along y direction 968.
The controlled heat pipe of internal temperature generally can be included as the part such as the kind equipment of lithographic equipment.For instance, have the coil that temperature controlled heat pipe (heat-transfer equipment) can be applied to the electromagnetic actuators in the lithographic equipment, perhaps having temperature controlled heat pipe (heat-transfer equipment) can be connected with the linear motor in the lithographic equipment.Referring to Figure 11, according to one embodiment of present invention, explanation can comprise the lithographic equipment with temperature controlled heat pipe.Lithographic equipment (exposure sources) 40 comprises the wafer orientation platform 52 that can be driven by the planar motor (not shown), and by utilizing EI core actuator and wafer orientation platform 52 magnetic-coupled wafer tables 51.The planar motor that drives wafer orientation platform 52 is general to be used by the magnet of two-dimensional arrangements and the electromagnetic force of corresponding armature coil generation.Wafer 64 is secured in place on wafer holder that couples with wafer table 51 or chuck 74.Wafer orientation platform 52 is arranged to move under the control of control module 60 and system controller 62 multiple degrees of freedom, for example between 3 to 6 frees degree.The mobile permission wafer 64 of wafer orientation platform 52 is disposed in desired position and orientation with respect to projection optics system 46.The heat that produces during wafer orientation platform 52 moves can be by the heat pipe (not shown) storage that couples with wafer orientation platform 52.
Wafer table 51 can be by a plurality of voice coil motor (not shown), and for example 3 voice coil motors rise gently along z direction 10b.In described embodiment, at least three magnetic bearing (not shown) couple and move wafer table 51 along y axle 10a.The motor array of wafer orientation platform 52 is generally supported by pedestal 70.Pedestal 70 is bearing on the ground by slider 54.The reaction force that motion produced of wafer platform 52 can be discharged into ground by framework 66 machineries.In all as JP Hei 8-166475 that is contained in this with reference to integral body and U.S. Patent No. 5528118, a kind of suitable framework has been described.
Will be appreciated that and have many dissimilar lithographic equipments or device.For example, lithographic equipment 40 or exposure sources can be used as the sweep type etching system, and under light shield 68 and wafer 64 synchronization-moving situations, described sweep type etching system exposes pattern to wafer 64 from light shield 68.In the sweep type flat plate printing apparatus, light shield platform 44 moves light shield 68 perpendicular to the optical axis of lens assembly (projection optics system) 46 or irradiation system 42.Wafer platform 52 moves wafer 64 perpendicular to the optical axis of projection optics system 46.Usually when light shield 68 and wafer 64 are synchronization-moving, the scanning of light shield 68 and wafer 64 takes place.
On the other hand, lithographic equipment or exposure sources 40 can be when light shield 68 and wafer 64 are fixed, the stepping repeat type photolithography system of exposure light shield 68.In a kind of stepping iterative process, in the exposure process of single visual field, wafer 64 is in respect to light shield 68 and the constant substantially position of projection optics system 46.Thereby, between continuous step of exposure, wafer orientation platform 52 perpendicular to the continuous mobile wafer 64 of the optical axis of projection optics system 46 and light shield 68 so as the exposure.According to this technology, the image on the light shield 68 can be exposed to the scanning field of wafer 64 successively, makes next scanning field of semiconductor wafer 64 in place with respect to irradiation system 42, light shield 68 and projection optics system 46.
The application that should understand aforesaid lithographic equipment or exposure sources 40 is not limited to be used in the etching system that is used for the semiconductor manufacturing.For example, lithographic equipment 40 can be used as expose LCD (LCD) etching system on rectangular glass of LCD device pattern, perhaps makes the part of the etching system of film magnetic head.
The irradiation source of irradiation system 42 can be g line (436 nanometers (nm)), i line (365nm), KrF PRK (248nm), ArF PRK (193nm) and F
2Type laser (157nm).On the other hand, irradiation system 42 also can use the charged particle beam such as x ray and electron beam.For example, under the situation of using electron beam, thermionic emission type lanthanum hexaboride (LaB
6) or tantalum (Ta) can be used as electron gun.In addition, using under the situation of electron beam, structure can be such, promptly or use mask, perhaps under the situation of not using mask, can directly form pattern on substrate.
With regard to projection optics system 46, when using ultraviolet such as PRK, preferably use the glass material of transmitting UV, such as quartz and fluorite.When using F
2When type laser or x ray, projection optics system 46 can be catadioptric or (light shield can be corresponding reflection-type light shield) refraction, and when using electron beam, electro-optical device can comprise electron lens and deflector.The light path that it will be understood by those skilled in the art that electron beam generally is in vacuum state.
In addition, be about the exposure device of 200nm or littler vacuum ultraviolet (VUV) radiation, can consider to use the reflection-refraction type optical system with regard to adopting wavelength.The example of reflection-refraction type optical system includes, but is not limited in the Japanese Patent Application Publication No.8-171054 that announces in the laid-open patent application publication and the corresponding U.S. Patent No. 5668672 thereof that all are contained in this as reference integral body, and those reflection-refraction type optical systems of describing in Japanese Patent Application Publication No.10-20195 and corresponding U.S. Patent No. 5835275 thereof.In these examples, reflective optical device can be the reflection and refraction optical system that comprises beam splitter and concavees lens.The Japanese Patent Application Publication of in the laid-open patent application publication, announcing (Hei) No.8-334695 and corresponding U.S. Patent No. 5689377 thereof, and in Japanese Patent Application Publication No.10-3039 and corresponding U.S. Patent No. 5892117 thereof, all these patent documentations all are contained in this as reference integral body.These examples are described and are comprised concavees lens, but do not have beam splitter, also can be suitable for the reflection-refractive optical system for the present invention's usefulness.
In addition, in etching system, when using linear motor (referring to as the U.S. Patent No. 5623853 or 5528118 that is contained in this with reference to integral body) in wafer platform or light shield platform, linear motor can be the floating type motor of magnetic that adopts the air supporting type motor of air bearing or use Lorentz force or reactance power.In addition, platform also can move along guide rail, perhaps can be the trackless type platform that does not use guide rail.
On the other hand, wafer platform or light shield platform can be driven by planar motor, described planar motor drives platform by using the electromagnetic force that is produced by magnet unit and armature coil unit, described magnet unit has the magnet of two-dimensional arrangements, and described armature coil unit has the coil of facing the position that is in of two dimension.With regard to this drive system, one of magnet unit or armature coil unit are connected with platform, and another is installed in plane of motion one side of platform.
The mobile generation of aforesaid platform can influence the reaction force of the performance of overall optical etching system.By use as mentioned above, and the frame element of in the Japanese Patent Application Publication No.8-166475 of U.S. Patent No. 5528118 and announcement, describing, the reaction force that wafer (substrate) platform motion produces can be discharged into floor or ground by machinery.In addition, by use the frame element of describing in all as the Japanese Patent Application Publication No.8-330224 that is contained in this U.S. Patent No. 5874820 with reference to integral body and announces, light shield (mask) reaction force that platform motion produced can be discharged into floor (ground) by machinery.
Isolator such as isolator 54 is general relevant with active vibration isolation system (AVIS).AVIS usually control with by the platform sub-assembly, perhaps more generally, by the active force 112 of the experience of the litho machine such as the lithographic equipment 40 that comprises the platform sub-assembly, i.e. the relevant vibration of vibration force.
By the mechanical precision according to the maintenance regulation, the mode of electricity precision and optical accuracy is assembled each subsystem, can set up the etching system according to the foregoing description, for example can comprise the lithographic equipment of one or more heat pipes (heat-transfer equipment).In order to keep various precision, before assembling and after the assembling, can regulate each optical system so that reach its optical accuracy.Similarly, can regulate each mechanical system and each electricity system, to reach their required mechanical precision and electricity precision separately.The process that each subsystem is assembled into etching system includes, but is not limited to form mechanical interface between each subsystem, and wiring connects, and installs with pneumatic tube system to be connected.Before with each subsystem assembling etching system, also there is the process of each subsystem of assembling.In case utilize each subsystem to assemble etching system, just carry out usually integrally-regulated so that guarantee in the overall optical etching system to keep each required precision.In addition, be preferably in the controlled clean room of temperature and humidity and make exposure system.
In addition, following described with reference to Figure 12, can utilize said system to prepare semiconductor devices.This process starts from step 1301, in step 1301, designs or otherwise determine the function and the performance characteristic of semiconductor devices.Subsequently, in step 1302, according to the design of semiconductor devices, design wherein has the light shield (mask) of pattern.Will be appreciated that in parallel step 1303, make wafer with silicon materials.In step 1304, the mask pattern of design in step 1302 is exposed to the wafer of preparation in step 1303 with etching system.The back will be with reference to Figure 13 explanation expose a kind of technology to wafer of mask pattern.In step 1305, the assembling semiconductor devices.The assembling of semiconductor devices generally comprises (but being not limited to) wafer cutting technique, technique for sticking, and packaging technology.At last, the device that in step 1306, has checked.
Figure 13 is according to one embodiment of present invention, illustrate with prepare the semiconductor devices situation under the process chart of the relevant step of processing of wafers.In step 1311, the surface of oxidation wafer.In step 1312 (it is the chemical vapor deposition (CVD) step), form insulation film subsequently in wafer surface.In case formed insulation film, in step 1313, just on wafer, formed electrode by vapour deposition.Subsequently, in step 1314,, can inject wafer to ion by utilizing any suitable method.It will be understood by those skilled in the art that the wafer pre-treatment step during step 1311-1314 is generally considered to be wafer process.In addition, should understand can be according to processing request, realizes the selection carried out in each step, for example is used to form the selection of concentration of the various chemical substances of insulation film in the step 1312.
In each stage of wafer process, when having finished pre-treatment step, can realize post-processing step.During post processing, at first, in step 1315, wafer is applied photoresist.In step 1316, can use exposure device that the circuit pattern of light shield is transferred on the wafer subsequently.The circuit pattern of the transfer light shield of wafer generally comprises scanning light shield scanning platform, and in one embodiment, the light shield scanning platform can comprise the damper of eliminating vibration.
After circuit pattern on light shield is transferred on the wafer, the wafer of exposure is developed.In case the wafer of exposure is developed,, can removes and remove residual light glue at quarter part afterwards, for example Bao Guang material surface so by etching.In step 1319, can remove etching remaining any unnecessary photoresist afterwards at last.It will be understood by those skilled in the art that repetition, can form a plurality of circuit patterns by pre-treatment step and post-processing step.
Though several embodiments of the present invention only have been described, but should have understood under the situation that does not break away from the spirit or scope of the present invention that the present invention of many other specific forms imbodies can be arranged.For example, though heat pipe (heat-transfer equipment) is described as the pressure controller that is included as piston, but pressure controller can come down to make the pressure in the heat pipe can controlled any mechanism.In other words, the piston not necessarily of the pressure controller on the heat pipe (heat-transfer equipment).
By the pressure in the control heat pipe, the controlled heat pipe of internal temperature can be used to various application.For example, as mentioned above, the controlled heat pipe (heat-transfer equipment) of internal temperature can be used on and cools off linear motor in the lithographic equipment, voice coil motor, perhaps any other electromagnetic actuators.But it should be understood that such heat pipe (heat-transfer equipment) can be used to cool off any mechanism or the device that cooling is benefited from any meeting usually.
Though the pressure control mechanism such as piston is expressed as being arranged near the condensation segment of heat pipe (heat-transfer equipment), but pressure control mechanism generally can be disposed in Anywhere with respect to heat pipe.More approach to comprise the condensation segment of the heat pipe of most of gas or steam and arrange that pressure control mechanism makes pressure control mechanism more easily to activated.But in certain embodiments, pressure control mechanism can change near the middle part that is positioned at heat pipe, perhaps more approaches the evaporator section of heat pipe.
In some cases, change the variation that the interior pressure of heat pipe (heat-transfer equipment) can cause appreciable inside heat pipe volume.On the contrary, the internal capacity of change heat pipe can cause the variation of heat pipe internal pressure.Like this, will be appreciated that the position of piston by for example mobile heat pipe, can change the internal capacity of heat pipe effectively, thereby cause the variation of heat pipe internal pressure, the variation of heat pipe internal pressure causes the variation of the boiling temperature of fluid in the heat pipe.
In general, relevant with method of the present invention step can extensively change.Under the situation that does not break away from the spirit or scope of the present invention, step can be increased, removes, changes and resequence.For example, the process of the temperature in control heat pipe (heat-transfer equipment) can comprise at least and regularly determines temperature required in the heat pipe.Regularly determine temperature required the making in the heat pipe (heat-transfer equipment),, can consider the variation of the requirement relevant with whole platform device so that when compensating temperature required any variation when the control of regulating the piston that puts on heat pipe (heat-transfer equipment).So these examples should be counted as illustrative, rather than restricted, the present invention is not limited to details given here, can be modified in the scope of accessory claim on the contrary.
Claims (72)
1, a kind of control method of temperature relevant with heat pipe, described heat pipe comprises fluid, described heat pipe has evaporator section, described evaporator section be arranged at thermal source near, described method comprises:
Measure the temperature relevant with heat pipe;
Determine when the temperature relevant with heat pipe is in desired level; With
When definite temperature relevant with heat pipe is not in desired level, change the pressure in the heat pipe, the pressure that wherein changes in the heat pipe causes the variations in temperature relevant with heat pipe.
2, in accordance with the method for claim 1, the pressure that wherein changes in the heat pipe comprises the pressure that increases in the heat pipe, and the temperature relevant with heat pipe is raised.
3, in accordance with the method for claim 1, wherein heat pipe comprises pressure control mechanism, and the pressure that changes in the heat pipe comprises the described pressure control mechanism of manipulation.
4, in accordance with the method for claim 3, wherein pressure control mechanism comprises piston assembly, changes pressure in the heat pipe and comprises and utilize described piston assembly to apply controlled pressure.
5, in accordance with the method for claim 4, wherein said piston assembly is activated by electromagnetic actuators, changes pressure in the heat pipe and comprises and utilize electromagnetic actuators, and piston assembly is applied controlled active force.
6, in accordance with the method for claim 4, wherein said piston assembly is activated by bellows, changes pressure in the heat pipe and comprises and utilize bellows, and piston assembly is applied controlled active force.
7, in accordance with the method for claim 1, wherein measure the temperature relevant and comprise the temperature of measuring evaporator section with heat pipe.
8, in accordance with the method for claim 7, the temperature that wherein records at evaporator section is the boiling temperature of fluid.
9, a kind of exposure sources method of operating that comprises according to the described temperature-controlled process of claim 1.
10, a kind of article production method that comprises photoetching process at least, wherein said photoetching process utilization is according to the described exposure sources method of operating of claim 9.
11, a kind of method of producing wafer of utilizing according to the described exposure sources method of operating of claim 9.
12, a kind of heat pipe, it comprises:
Evaporator section;
Fluid; With
Pressure control mechanism, wherein pressure control mechanism is arranged to change the pressure in the heat pipe, makes the boiling temperature of fluid be changed.
13, according to the described heat pipe of claim 12, wherein pressure control mechanism is arranged to change pressure by increasing pressure, makes the boiling temperature of fluid be increased.
14, according to the described heat pipe of claim 12, wherein pressure control mechanism comprises a piston apparatus, and described piston apparatus is arranged to apply controlled pressure, thereby changes the pressure in the heat pipe.
15, according to the described heat pipe of claim 14, wherein pressure control mechanism also comprises an actuator, and described actuator is arranged to piston apparatus is applied control, makes piston apparatus apply controlled pressure, thereby changes the pressure in the heat pipe.
16, according to the described heat pipe of claim 14, wherein pressure control mechanism also comprises bellows, and described bellows are arranged to make described piston apparatus to apply control, thereby changes the pressure in the heat pipe.
17, according to the described heat pipe of claim 14, also comprise:
A temperature sensor, described temperature sensor is arranged to measure the boiling temperature of fluid.
18, according to the described heat pipe of claim 17, the boiling temperature that wherein records is provided for pressure control mechanism, and pressure control mechanism is arranged to utilize the boiling temperature that records to change pressure.
19, according to the described heat pipe of claim 17, wherein said temperature sensor is arranged at evaporator section.
20, according to the described heat pipe of claim 12, also comprise:
A condensation segment, wherein pressure control mechanism is disposed near the condensation segment of heat pipe.
21, according to the described heat pipe of claim 12, wherein evaporator section is disposed near the external heat source.
22, according to the described heat pipe of claim 21, wherein external heat source is the coil of the linear motor in the platform device.
23, a kind of exposure sources that comprises the platform device of claim 22.
24, a kind of device that utilizes the exposure sources manufacturing of claim 23.
25, a kind of exposure sources that utilizes claim 23 forms the wafer of image thereon.
26, a kind of method of temperature of controlling the actuator in the platform device, described platform device is communicated with the evaporator section of heat pipe, and described method comprises:
Determine the temperature required of actuator; With
Regulate the mechanism in the heat pipe so that reach certain part corresponding temperature required of heat pipe, wherein regulate described mechanism and cause the boiling temperature of heat pipe inner fluid to be conditioned, make the temperature of described part be conditioned.
27, in accordance with the method for claim 26, also comprise:
Utilize the temperature required of actuator, determine the corresponding temperature required of described part.
28, in accordance with the method for claim 26, the pressure of wherein regulating in the heat pipe comprises that the piston apparatus of opposite heat tube applies the control of first size, and wherein the control of first size is arranged to make piston apparatus to change the interior pressure of heat pipe.
29, in accordance with the method for claim 28, also comprise:
The temperature that determines when described part is temperature required for this part, and wherein when the temperature of definite described part was this part temperature required, described control was maintained at described first size.
30, in accordance with the method for claim 29, wherein when the temperature of determining described part is not this part temperature required, regulate the pressure in the heat pipe, so that reach the temperature required control that piston apparatus is applied second size that comprises of described part, wherein the control of second size is arranged to make piston apparatus to change the interior pressure of heat pipe, and described second size is different from described first size.
31, in accordance with the method for claim 26, wherein said part is an evaporator section.
32, a kind of exposure sources method of operating that comprises according to the described temperature-controlled process of claim 26.
33, a kind of article production method that comprises photoetching process at least, wherein said photoetching process utilization is according to the described exposure sources method of operating of claim 32.
34, a kind of method of producing wafer of utilizing according to the described exposure sources method of operating of claim 32.
35, a kind of method of temperature of controlling the actuator in the platform device, described platform device is communicated with the evaporator section of heat pipe, and described heat pipe comprises a piston apparatus, and described method comprises:
Determine the temperature required of actuator; With
The regulating piston device is so that reach certain part temperature required of heat pipe, and wherein the regulating piston device causes the boiling temperature of heat pipe inner fluid to be changed, and makes the temperature of described part be changed.
36, according to the described method of claim 35, also comprise:
Utilize the temperature required of actuator, determine the corresponding temperature required of described part.
37, according to the described method of claim 35, wherein the regulating piston device comprises the internal pressure of regulating heat pipe, so that change the temperature of described part.
38, according to the described method of claim 35, wherein the regulating piston device comprises the internal capacity of regulating heat pipe, so that change the temperature of described part.
39, according to the described method of claim 35, wherein the regulating piston device comprises piston apparatus is applied control.
40, according to the described method of claim 39, wherein piston apparatus is applied control and cause utilizing piston apparatus to apply controlled pressure, described controlled pressure is arranged to make the boiling temperature of fluid to be changed.
41, according to the described method of claim 35, wherein said part is an evaporator section.
42, a kind of exposure sources method of operating that comprises according to the described temperature-controlled process of claim 35.
43, a kind of article production method that comprises photoetching process at least, wherein said photoetching process utilization is according to the described exposure sources method of operating of claim 42.
44, a kind of method of producing wafer of utilizing according to the described exposure sources method of operating of claim 42.
45, a kind of cooling device comprises:
Has the heat pipe that is arranged near the end of thermal source;
Be included in the fluid in the heat pipe; With
The pressure control mechanism that is connected with heat pipe, described pressure control mechanism are arranged to change the pressure in the heat pipe, make the boiling temperature of fluid be changed.
46, according to the described cooling device of claim 45, wherein heat pipe has evaporator section and condensation segment, and described evaporator section is positioned at described end.
47, a kind of heat-transfer equipment comprises:
Runner;
Take away at least one heat absorbing part of heat from thermal source, described at least one heat absorbing part is disposed on the route of runner;
Be filled in the heat transfer medium in the described runner, described heat transfer medium circulates in runner; With
The temperature setting device that is connected with runner, described temperature setting device changes the state-shift of heat transfer medium.
48, according to the described heat-transfer equipment of claim 47, wherein said temperature setting device changes the boiling temperature of heat transfer medium.
49, according to the described heat-transfer equipment of claim 47, wherein said temperature setting device changes the pressure in the runner.
50, according to the described heat-transfer equipment of claim 47, wherein thermal source is the part of the actuator in the platform device.
51, a kind of exposure sources that comprises the platform device of claim 50.
52, a kind of heat-transfer equipment comprises:
Runner;
Take away at least one heat absorbing part of heat from thermal source, described at least one heat absorbing part is disposed on the route of runner, and thermal source is disposed in the runner; With
Be filled in the heat transfer medium in the described runner, described heat transfer medium circulates in runner.
53, according to the described heat-transfer equipment of claim 52, also comprise the temperature setting device that is connected with runner, described temperature setting device changes the state-shift of heat transfer medium.
54, according to the described heat-transfer equipment of claim 52, wherein said temperature setting device changes the boiling temperature of heat transfer medium.
55, according to the described heat-transfer equipment of claim 52, wherein said temperature setting device changes the pressure in the runner.
56, according to the described heat-transfer equipment of claim 55, wherein thermal source is the part of the actuator in the platform device.
57, a kind of exposure sources that comprises the platform device of claim 56.
58, a kind of control method of temperature relevant with heat-transfer equipment, described method comprises:
The heat transfer medium that in runner, circulates, described runner comprises at least one heat absorbing part of taking away heat from thermal source; With
The state-shift of the heat transfer medium that change circulates in runner.
59,, wherein change state-shift and comprise the boiling temperature that changes heat transfer medium according to the described method of claim 58.
60,, wherein change state-shift and comprise the pressure that changes in the runner according to the described method of claim 58.
61, a kind of platform device method of operating that comprises according to the described temperature-controlled process of claim 58.
62, a kind of exposure sources method of operating that comprises according to the described temperature-controlled process of claim 58.
63, a kind of article production method that comprises photoetching process at least, wherein said photoetching process utilization is according to the described exposure sources method of operating of claim 62.
64, a kind of method of producing wafer of utilizing according to the described exposure sources method of operating of claim 62.
65, a kind of control method of temperature relevant with heat-transfer equipment, described method comprises:
Be full of heat transfer medium in runner, described runner comprises thermal source; With
Heat transfer medium circulates in runner.
66,, also comprise the state-shift of the heat transfer medium that change circulates in runner according to the described method of claim 65.
67,, wherein change state-shift and comprise the boiling temperature that changes heat transfer medium according to the described method of claim 66.
68,, wherein change state-shift and comprise the pressure that changes in the runner according to the described method of claim 66.
69, a kind of platform device method of operating that comprises according to the described temperature-controlled process of claim 65.
70, a kind of exposure sources method of operating that comprises according to the described temperature-controlled process of claim 69.
71, a kind of article production method that comprises photoetching process at least, wherein said photoetching process utilization is according to the described exposure sources method of operating of claim 70.
72, a kind of method of producing wafer of utilizing according to the described exposure sources method of operating of claim 70.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/455,004 US20040244963A1 (en) | 2003-06-05 | 2003-06-05 | Heat pipe with temperature control |
| US10/455,004 | 2003-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1798953A true CN1798953A (en) | 2006-07-05 |
Family
ID=33489837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004800152920A Pending CN1798953A (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20040244963A1 (en) |
| EP (1) | EP1629246A2 (en) |
| JP (1) | JP2006526757A (en) |
| KR (1) | KR20060018879A (en) |
| CN (1) | CN1798953A (en) |
| TW (1) | TW200504893A (en) |
| WO (1) | WO2004109757A2 (en) |
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- 2004-05-26 WO PCT/US2004/016495 patent/WO2004109757A2/en not_active Application Discontinuation
- 2004-05-26 CN CNA2004800152920A patent/CN1798953A/en active Pending
- 2004-05-26 EP EP04753338A patent/EP1629246A2/en not_active Withdrawn
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| CN112161501B (en) * | 2020-09-28 | 2022-02-25 | 北京空间飞行器总体设计部 | Controllable heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006526757A (en) | 2006-11-24 |
| WO2004109757A2 (en) | 2004-12-16 |
| KR20060018879A (en) | 2006-03-02 |
| EP1629246A2 (en) | 2006-03-01 |
| WO2004109757A3 (en) | 2005-03-31 |
| US20040244963A1 (en) | 2004-12-09 |
| TW200504893A (en) | 2005-02-01 |
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