WO2004109757A2 - Heat pipe with temperature control - Google Patents
Heat pipe with temperature control Download PDFInfo
- Publication number
- WO2004109757A2 WO2004109757A2 PCT/US2004/016495 US2004016495W WO2004109757A2 WO 2004109757 A2 WO2004109757 A2 WO 2004109757A2 US 2004016495 W US2004016495 W US 2004016495W WO 2004109757 A2 WO2004109757 A2 WO 2004109757A2
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- WO
- WIPO (PCT)
- Prior art keywords
- heat pipe
- temperature
- heat
- pressure
- flow passage
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
Definitions
- the present invention relates generally to semiconductor processing equipment. More particularly, the present invention relates to a heat pipe with an internal temperature that may be readily controlled by changing the pressure within the heat pipe.
- Scanning stages such as wafer scanning stages and reticle scanning stages are often used in semiconductor fabrication processes, and may be included in various photolithography and exposure apparatuses.
- Wafer scanning stages are generally used to position a semiconductor wafer such that portions of the wafer may be exposed as appropriate for masking or etching.
- Reticle scanning stages are generally used to accurately position a reticle or reticles for exposure over the semiconductor wafer. Patterns are generally resident on a reticle, which effectively serves as a mask or a negative for a wafer.
- a beam of light or a relatively broad beam of electrons may be collimated through a reduction lens, and provided to the reticle on which a thin metal pattern is placed. Portions of a light beam, for example, may be absorbed by the reticle while other portions pass through the reticle and are focused onto the wafer.
- a stage such as a wafer scanning stage or a reticle scanning stage is typically supported by a base structure such that the stage may move in a linear direction.
- the base structure often includes or houses various sensors and actuators which serve to control the motion of the stage and a table, e.g., a wafer table, which is a part of an overall stage apparatus.
- Such actuators are often arranged to control a coarse stage of an overall wafer stage, and include coils which generate heat.
- the heat generated by the coils may be relatively significant, e.g., significant enough to affect an exposure process performed using the overall wafer stage.
- the heat generated may be, for example, in the range of approximately 10 degrees Celsius to approximately 20 degrees Celsius higher than a desired ambient temperature.
- the generated heat is generally carried away or otherwise removed from the vicinity of relatively critical components of the overall wafer stage. Carrying heat away from relatively critical components, as for example a wafer, reduces the effect of excessive heat on the critical components.
- a heat pipe For example, a heat source such as a linear motor within a stage device may be substantially in contact with a heat pipe which is arranged to remove heat from the heat source and to transfer the heat to a heat sink.
- Fig. 1 is a diagrammatic representation of a conventional heat pipe.
- a heat pipe 100 includes an evaporator end 102 and a condenser end 104.
- Heat pipe 100 may generally be configured as a hollow cylindrical tube that is substantially lined with wicking material 112, e.g., a cotton sleeve.
- heat pipe 100 When heat is generated by a heat source 106, a fluid in liquid form that is contained within heat pipe 100 may be heated to its boiling point by heat source 106 at evaporator end 102.
- the fluid is typically a fluid which takes on a gaseous or vapor state when heated, and a liquid state when cooled.
- the fluid When heated at evaporator end 102, the fluid may be conducted towards a heat sink 107 positioned near condenser end 104, as indicated by arrows 108.
- heat sink 107 may be the environment around heat pipe 100, and may not necessarily be a physical component.
- Heat sink 107 is arranged to remove the heat from the fluid and, as a result, allows the fluid to be cooled. That is, fluid at condenser end 104 condenses and transfers its latent heat of vaporization to heat sink 107. Cooled fluid may be returned through heat pipe 100 to heat source 102 when the condensed fluid enters wicking material 112 which is located within heat pipe 100. Capillary action then forces the condensed fluid through wicking material 1 12 back to evaporator end 102, as indicated by arrows 110.
- the ability to control the boiling temperature of fluid within a heat pipe may be needed such that the temperature of a heat source such as heat source 106 of Fig. 1 may be controlled.
- Controlling the temperature of a heat source may be critical, as many systems may require that the temperature of a heat source, e.g., the surface temperature of a coil of a linear motor, be maintained as close to an ambient temperature such as room temperature as possible.
- the boiling temperature associated with a fluid contained within a heat pipe may be controlled.
- a heat pipe may be "charged" to alter the boiling temperature of fluid contained within the heat pipe to lower it to a level which enables the surface temperature of a coil of a linear motor to be maintained at a desired level.
- Charging a heat pipe generally includes adding a fluid such as water inside a heat pipe, or removing a fluid from a heat pipe, to alter the boiling temperature of the heat pipe. As shown in Fig. 2, additional fluid 230 may be added to an evaporator end 202 of a heat pipe 200 when it is desired for the boiling temperature associated with heat pipe 200 to be altered.
- a process of charging heat pipe 200 may be effective in altering the boiling temperature associated with heat pipe 200 and, hence the temperature associated with evaporator end 202, it is generally difficult to charge heat pipe 200 except at one time during the manufacturing process. Thus, the boiling temperature remains effectively constant during the use of heat pipe 200.
- FIGs. 3a and 3b are diagrammatic representations of a gas-loaded, variable conductance heat pipe.
- a heat pipe 300 which has an evaporator end 302 and a condenser end 304, includes a gas reservoir 340 at condenser end 304.
- Gas contained within reservoir 340 has a gas front 342 which moves depending upon the temperature of vapor contained within heat pipe 300. As gas front 342 moves, the surface area of condenser end 304 varies. For instance, as shown in Fig. 3b, when gas front 342 moves into condenser end 304, the surface area of condenser end 304 is decreased from the surface area of condenser end 304 as shown in Fig. 3a.
- the thermal conductance of heat pipe 300 also varies as a function of the position of gas front 342.
- the surface area of condenser end 304 increases, thermal conductance increases, and when the surface area of condenser end 304 decreases, thermal conductance decreases.
- a temperature drop across evaporator end 302 and condenser end 304 is effectively controllable by moving gas front 342. While the temperature drop within heat pipe 300 may be controlled such that the temperature within heat pipe 300 may be maintained at a substantially constant temperature, the use of heat pipe 300 generally does not enable the temperature at evaporator end 302 to be controlled.
- heat pipes While the use of a heat pipe to transfer heat away from critical components of an overall wafer stage system is typically effective, heat pipes generally are not able to be used to readily and efficiently allow the temperatures of heat sources to be controlled. As discussed above, although charging a heat pipe may enable a desired boiling temperature to be obtained within the heat pipe, it is typically difficult to charge heat pipes except at one time during a manufacturing process. Hence, the boiling temperature within a heat pipe generally remains substantially constant during the use of the heat pipe. As a result, the boiling temperature achieved within a heat pipe may not be sufficient to maintain a surface of a heat source at a desired temperature, since the boiling temperature of the fluid in the heat pipe effectively determines the constant temperature at which the evaporator end of the heat pipe which typically contacts the heat source may be held.
- the present invention relates to a heat pipe within which the boiling temperature of a fluid may be adjusted.
- a method for controlling a temperature associated with a heat pipe that contains a fluid and has an evaporator end includes measuring the temperature associated with the heat pipe and determining when the temperature associated with the heat pipe is at a desired level. The method also includes changing a pressure within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level. Changing the pressure within the heat pipe causes the temperature associated with the heat pipe to change.
- the heat pipe includes a pressure control mechanism, and changing the pressure within the heat pipe includes operating the pressure control mechanism.
- the pressure control mechanism may include a piston assembly, and changing the pressure within the heat pipe may include applying a controlled pressure using the piston assembly.
- Controlling the temperature within a heat pipe effectively allows the temperature at which heat is removed from a heat source that is cooled by the heat pipe to be controlled.
- the temperature of the fluid may be controlled by substantially controlling the pressure within the heat pipe.
- the temperature at which heat is removed from a heat source e.g., a coil of a linear motor, may be substantially controlled by adjusting the pressure within the heat pipe. Controlling the temperature at which heat is removed from the heat source enables the surface temperature of the heat source to be more readily maintained at a constant level, which enhances the performance of an overall system, e.g., a stage apparatus, which includes the heat source.
- a heat pipe includes an evaporator end, a fluid, and a pressure control mechanism.
- the pressure control mechanism is arranged to change a pressure within the heat pipe such that a boiling temperature of the fluid is changed.
- the pressure control mechanism is arranged to change the pressure by increasing the pressure such that the boiling temperature of the fluid is increased.
- the pressure control mechanism includes a piston arrangement that applies a control pressure to change the pressure within the heat pipe.
- a method for controlling a temperature of an actuator within a stage apparatus that is in communication with an evaporator end of a heat pipe includes determining a desired temperature for the actuator, determining a corresponding desired temperature for the evaporator end using the desired temperature for the actuator, and adjusting a mechanism within the heat pipe to achieve the desired temperature for the evaporator end. Adjusting the pressure causes a boiling temperature of a fluid within the heat pipe to be adjusted such that a temperature of the evaporator end is adjusted.
- adjusting the pressure within the heat pipe includes applying a control force of a first amount to a piston arrangement of the heat pipe. The control force of the first amount is arranged to cause the piston arrangement to change the pressure within the heat pipe.
- the method may also include determining when the temperature of the evaporator end is the desired temperature for the evaporator end. When the temperature of the evaporator end is the desired temperature for the evaporator end, the control force is maintained at the first amount. Alternatively, when the temperature of the evaporator end is not the desired temperature for the evaporator end, the pressure within the heat pipe may be adjusted to achieve the desired temperature for the evaporator end by applying a control force of a second amount to the piston arrangement.
- a heat transfer apparatus includes a flow passage and at least one heat receiving section where heat is transferred from a heat source.
- the heat receiving section is disposed on the way of the flow passage.
- a heat transfer medium filled within the flow passage is circulated within the flow passage, and a temperature setting device connected to the flow passage changes a state-shift temperature of the heat transfer medium.
- the temperature setting device changes a boiling temperature of the heat transfer medium.
- the temperature setting device changes a pressure within the flow passage.
- a heat transfer apparatus includes a flow passage, at least one heat receiving section where heat is transferred from a heat source, and a heat transfer medium filled within the flow passage.
- a method for controlling a temperature associated with a heat transfer apparatus includes circulating a heat transfer medium within a flow passage that includes at least one heat receiving section where heat is transferred from a heat source, and changing a state-shift temperature of the heat transfer medium circulating within the flow passage.
- changing a state-shift temperature includes changing a boiling temperature of the heat transfer medium.
- changing a state-shift temperature includes changing a pressure within the flow passage.
- a method for controlling a temperature associated with a heat transfer apparatus includes filling a heat transfer medium within a flow passage and circulating the heat transfer medium within the flow passage.
- the flow passage includes a heat source.
- Fig. 1 is a diagrammatic representation of a conventional heat pipe.
- Fig. 2 is a diagrammatic representation of a conventional heat pipe which is chargeable.
- Fig. 3a is a diagrammatic representation of a gas-loaded, variable conductance heat pipe.
- Fig. 3b is a diagrammatic representation of a gas-loaded, variable conductance heat pipe, e.g., heat pipe 300 of Fig. 3a, with gas from a reservoir present in a condenser section.
- a gas-loaded, variable conductance heat pipe e.g., heat pipe 300 of Fig. 3a
- Fig. 4 is a diagrammatic representation of a heat pipe within which pressure may be controlled in accordance with an embodiment of the present invention.
- Fig. 5 is a diagrammatic representation of a heat pipe within which pressure may be controlled using a piston arrangement in accordance with an embodiment of the present invention.
- Fig. 6 is a block diagram representation of actions which occur when a piston of a heat pipe assembly is moved in accordance with an embodiment of the present invention.
- Fig. 7 is a diagrammatic representation of a heat pipe with a piston which serves as a pressure controller and an internal temperature sensor in accordance with an embodiment of the present invention.
- Fig. 8 is a diagrammatic representation of a control loop which may be used to control the temperature within a heat pipe in accordance with an embodiment of the present invention.
- Fig. 9 is a process flow diagram which illustrates one method of controlling the temperature in a heat pipe by adjusting the pressure in the heat pipe in accordance with an embodiment of the present invention.
- Fig. 10a is a diagrammatic representation of a piston which is actuated by a voice coil motor in accordance with an embodiment of the present invention.
- Fig. 10b is a diagrammatic representation of a piston which is actuated by an air bellows in accordance with an embodiment of the present invention.
- Fig. 1 1 is a diagrammatic representation of a photolithography apparatus in accordance with an embodiment of the present invention.
- Fig. 12 is a process flow diagram which illustrates the steps associated with fabricating a semiconductor device in accordance with an embodiment of the present invention.
- Fig. 13 is a process flow diagram which illustrates the steps associated with processing a wafer, i.e., step 1304 of Fig. 12, in accordance with an embodiment of the present invention.
- an overall precision stage device e.g. , an overall wafer stage device
- the performance of the stage device may be compromised.
- errors or inconsistencies may arise during a wafer exposure process that is performed using the stage device when the ambient temperature is raised, as for example from a desired temperature in the range of approximately 20 to approximately 25 degrees Celsius to a temperature in the range of approximately 30 to approximately 40 degrees Celsius.
- heat which is generated by actuators associated with a stage device causes the ambient temperature to be raised.
- the actuators as above comprise a first part (heat source) that has a coil (conductor) and generates heat and a second part that cooperates with the first part to generate force.
- heat pipes a heat transfer apparatus
- heat pipes are used to enable the surface temperature of a coil, e.g., a coil of a linear motor, to be maintained at a particular temperature such as room temperature.
- a heat pipe is generally effective in carrying heat away from the coil, when the temperature at which a heat pipe operates to transfer heat away from the coil is too high, the coil may not be cooled sufficiently, and convection in the air surrounding the coil may cause the air to be heated up and, hence, interfere with the measurements made by sensors such as interferometers.
- the temperature at which heat is removed from a heat source such as an actuator may be controlled.
- the temperature of the heat transfer medium particularly at an evaporator end of a heat pipe, may be controlled by substantially controlling the pressure within the heat pipe. Controlling the pressure within the heat pipe enables the boiling temperature of fluid within the heat pipe to be controlled, which effectively enables the temperature of the evaporator end of the heat pipe to be controlled.
- the temperature at which heat is removed from a heat source e.g., a coil of a linear motor, may be substantially controlled by adjusting the pressure within the heat pipe.
- Controlling the temperature at which heat is removed from the heat source enables the surface temperature of the heat source to be more readily maintained at a constant level.
- the structure of a heat transfer apparatus such as a heat pipe disclosed in the embodiments is varied.
- the apparatus may be used in an arrangement such as described in U.S. Patent No. 3,605,878 and U.S. Patent No. 6,684,941.
- the disclosures in the above U.S. Patents are incorporated herein by reference as long as the national laws in designated states or elected states, to which this international application is applied, permit.
- FIG. 4 is a diagrammatic representation of a heat pipe within which pressure may be controlled in accordance with an embodiment of the present invention.
- a heat pipe 404 may be arranged between a heat source 416, e.g., heat generating coils of an actuator, and a heat sink 420, e.g., the environment surrounding heat pipe 404.
- heat source 416 is positioned at an evaporator end 408 of heat pipe 404
- heat sink 420 is positioned at a condenser end 412 of heat pipe 404.
- a pressure control mechanism 424 which is effectively a part of heat pipe 404, is arranged to enable the pressure within heat pipe 404 to be varied.
- Pressure control mechanism 424 may generally be positioned substantially anywhere with respect to heat pipe 404.
- pressure control mechanism 424 may be a piston which is subjected to a control force, as will be described below with respect to Fig. 5. It should be appreciated, however, that pressure control mechanism 424 may generally be substantially any mechanism which enables the pressure within heat pipe 404 to be varied.
- heat source 416 may be positioned within heat pipe (heat transfer apparatus) 404. Alternately, heat source 416 may be positioned out of heat pipe (heat transfer apparatus) 404.
- the boiling temperature of a fluid which is either in a liquid state or a gas-liquid state may be increased.
- the boiling temperature of the fluid which is either in a liquid state or a gas-liquid state may be lowered.
- the temperature at evaporator end 408 which generally contains the fluid in a liquid state changes.
- changing the boiling temperature of the fluid changes the temperature of evaporator end 408 and, hence, the temperature at which heat source 416 may be maintained may effectively be changed, since heat source 416 is generally in communication with evaporator end 408.
- heat generated by heat source 416 may be substantially dissipated by heat pipe 404 at a higher temperature.
- pressure control mechanism 424 allows the temperature associated with evaporator end 408 and the temperature of heat source 416 to be controlled.
- one suitable pressure control mechanism 424 is a piston mechanism.
- a heat pipe 504 which includes an evaporator end 508 and a condenser end 512 is positioned between a heat source 516 and a heat sink 520 such that heat source 516 is located at evaporator end 508 and heat sink 520 is located at condenser end 512.
- a piston 514 is positioned with respect to heat pipe 504 such that when a control force 530, which may be applied through an actuator that is controlled by a control mechanism, is applied to piston 514, piston 514 may cause a pressure within heat pipe 504, i.e., an internal pressure of heat pipe 504, to change. Piston 514 may cause the pressure within heat pipe 504 to change by effectively applying a control pressure within heat pipe 504.
- a diaphragm (not shown) may be used in one embodiment to effectively create a seal that prevents fluid from leaking out from heat pipe 504 through any gaps which are present between piston 514 and heat pipe 504.
- Piston 514 generally has an associated surface area which effectively comes into contact with an interior of heat pipe 504.
- the control pressure applied by piston 514 may be expressed as a function of control force 530 and the contact area of piston 514.
- the control pressure applied by piston 514 may be increased, and the pressure within heat pipe 504 may rise.
- piston 514 moves in negative y-direction 540 and causes the pressure within heat pipe 504 to increase.
- piston moves in positive y-direction 540 and typically causes the pressure within heat pipe 504 to decrease.
- a piston of a heat pipe assembly When the force applied to a piston of a heat pipe, e.g., piston 514 of Fig. 5, is adjusted in action 610, the pressure within the heat pipe changes in action 614.
- the pressure within the heat pipe may increase.
- a change in pressure within the heat pipe causes the boiling temperature of the fluid in the heat pipe to change in action 618.
- changing the pressure within the heat pipe changes the boiling temperature of the fluid, as will be appreciated by those skilled in the art.
- the boiling temperature of the fluid in the heat pipe typically increases.
- the temperature at the evaporator end of the heat pipe changes in action 622. Since the evaporator end of the heat pipe is generally in the vicinity of a heat source, by changing the temperature at the evaporator end of the heat pipe, the temperature at which heat is removed from the heat source is also changed.
- a temperature sensor may be positioned within the heat pipe.
- a heat pipe 602 includes a piston 614 which is controlled by a force 618.
- a temperature sensor 640 may be positioned at an evaporator end 606 of heat pipe 602. Temperature sensor 640 may generally be used to measure a temperature of fluid within heat pipe 602, and may be substantially any suitable temperature sensor 640.
- Suitable temperature sensors or transducers may include, but are not limited to, thermometers such as thermocouple thermometers, and thermistor thermometers, as well as thermoelectric sensors and resistive temperature sensors.
- Output from temperature sensor 640 may be provided to a controller which provides force 618 such that the magnitude of force 618 may be adjusted as appropriate to create a pressure within heat pipe 602 which is suitable for causing a temperature within heat pipe 602 to be raised or lowered.
- Fig. 8 which is a diagrammatic block diagram representation of one suitable control loop which may be used to control the temperature within a heat pipe such as heat pipe 602, a desired temperature 802 for an evaporator end of a heat pipe is provided as a control input in a control loop 800.
- the desired temperature 802 is provided to a controller 806, e.g., by a user who specifies desired parameters of the heat pipe, which controls an actuator 808 that provides a control force to a piston of the heat pipe.
- actuator 808 may be a voice coil motor, a linear motor, or substantially any electromagnetic actuator.
- a measured temperature 810 which may be provided by a temperature sensor within the heat pipe, is also provided as an input to controller 806.
- controller 806 may determine an appropriate amount, or level, of force to be exerted by actuator 808 on a piston of the heat pipe to enable measured temperature 810 to be approximately the same as desired temperature 802. It should be appreciated that controller 806 may substantially continuously adjust actuator 808 as necessary and, hence, the pressure within the heat pipe, as needed to effectively maintain measured temperature 810 at a level that is approximately the same as desired temperature 802.
- Fig. 9 one method of controlling the temperature in a heat pipe by adjusting the pressure in the heat pipe will be described in accordance with an embodiment of the present invention.
- a process 900 of controlling the temperature in a heat pipe begins at step 902 in which a determination is made regarding what the desired temperature for the evaporator end of the heat pipe is. Determining what the desired temperature is may include obtaining a desired temperature from a user of the heat pipe, or determining a desired temperature based upon the requirements of an overall stage apparatus which uses the heat pipe. For example, a desired surface temperature for an actuator which is being cooled using the heat pipe may be used to determine a corresponding desired temperature for the evaporator end of the heat pipe. It should be appreciated that although the desired temperature for the evaporator end of the heat pipe may be the same as the desired temperature for the actuator, the two desired temperatures may also vary.
- the temperature at an evaporator end of the heat pipe may be measured in step 906.
- the temperature is typically measured within the heat pipe at an evaporator end to enable a desired temperature to be maintained at the evaporator end, it should be appreciated that the temperature within the heat pipe may be measured substantially anywhere within the heat pipe.
- the temperature of the actuator, some other temperature, or a performance parameter related to the temperature of the actuator, e.g., air turbulence or sensor noise may be measured.
- step 912 the current control force applied to the piston of the heat pipe is maintained at it current level. That is, the actuator which causes the control force to be applied to the piston effectively does not change the amount of control force that is applied to the piston. From step 912, process flow returns to step 906 in which the temperature at the evaporator end of the heat pipe is measured.
- step 908 if it is determined that the temperature at the evaporator end of the heat pipe is not as desired, then the implication may be that the pressure within the heat pipe is either too high or too low for the desired temperature to be achieved. For example, if the temperature at the evaporator end of the heat pipe is too high, then the pressure in the heat pipe is likely to be too high to enable the desired temperature at the evaporator end to be achieved. As such, from step 908, process flow moves to step 910 in which the control force applied to the piston of the heat pipe, e.g., using an actuator, is adjusted to adjust the pressure within the heat pipe.
- the control force applied to the piston of the heat pipe e.g., using an actuator
- the adjustment made to the control force is arranged to be sufficient to alter the pressure within the heat by an amount that is sufficient to achieve the desired temperature at the evaporator end of the heat pipe.
- an actuator used to vary the force applied to a piston of a heat pipe may be substantially any suitable actuator that may be controlled, as for example by a controller which sends signals to the actuator to alter the force generated by the actuator.
- an actuator which is coupled to the piston of the heat pipe may be a motor such as a voice coil motor (VCM).
- VCM voice coil motor
- Fig. 10a is a diagrammatic representation of a piston which is actuated by a VCM in accordance with an embodiment of the present invention.
- a heat pipe 950 includes a piston 944 which is coupled to a VCM 930.
- a body 934 of VCM 930 is coupled to piston 944 such that magnets 936 in cooperation with a coil 932 cause body 934 to move and create a force on piston 944.
- forces on piston 944 created by VCM 930 may either cause piston 944 to be moved in a positive y-direction 948, or in a negative y-direction 948.
- a diaphragm 940 or similar mechanism may be arranged to prevent fluid contained in an interior 954 of heat pipe 950 from leaking around piston 944 and out of heat pipe 950. As piston 944 moves, the pressure within interior 954 may change as a function of the force applied by VCM 930 on piston 944 and the area of piston 944.
- FIG. 10b is a diagrammatic representation of a piston which is actuated by an air bellows in accordance with an embodiment of the present invention.
- a heat pipe 980 includes a piston 974 which may be sealed using a diaphragm 970 to prevent leakage of fluid contained in an interior 984 of heat pipe 980.
- Piston 974 may be coupled to an air bellows 960 which may be used to alter a control force applied to piston 974 and, hence, the pressure within interior 984.
- the amount of force applied by air bellows 960 onto piston 974 may be varied by altering the air pressure within bellows 960.
- movement of piston 974 in a y-direction 968 may be controlled by controlling the air pressure within bellows 960.
- a heat pipe with a controllable internal temperature may generally be incorporated as part of an apparatus such as a photolithography apparatus.
- a heat pipe (a heat transfer apparatus) with temperature control may be applied to a coil of an electromagnetic actuator in a photolithography apparatus, or a heat pipe (a heat transfer apparatus) with temperature control may be connected to a linear motor within the photolithography apparatus.
- a photolithography apparatus which may include a heat pipe with temperature control will be described in accordance with an embodiment of the present invention.
- a photolithography apparatus (exposure apparatus) 40 includes a wafer positioning stage 52 that may be driven by a planar motor (not shown), as well as a wafer table 51 that is magnetically coupled to wafer positioning stage 52 by utilizing an El-core actuator.
- the planar motor which drives wafer positioning stage 52 generally uses an electromagnetic force generated by magnets and corresponding armature coils arranged in two dimensions.
- a wafer 64 is held in place on a wafer holder or chuck 74 which is coupled to wafer table 51.
- Wafer positioning stage 52 is arranged to move in multiple degrees of freedom, e.g. , between three to six degrees of freedom, under the control of a control unit 60 and a system controller 62.
- wafer positioning stage 52 allows wafer 64 to be positioned at a desired position and orientation relative to a projection optical system 46.
- Heat generated during the movement of wafer positioning stage 52 may be stored by a heat pipe (not shown) that is coupled to wafer positioning stage 52.
- Wafer table 51 may be levitated in a z-direction 10b by any number of voice coil motors (not shown), e.g., three voice coil motors. In the described embodiment, at least three magnetic bearings (not shown) couple and move wafer table 51 along a y-axis 10a.
- the motor array of wafer positioning stage 52 is typically supported by a base 70. Base 70 is supported to a ground via isolators 54. Reaction forces generated by motion of wafer stage 52 may be mechanically released to a ground surface through a frame 66.
- One suitable frame 66 is described in JP Hei 8-166475 and U.S. Patent No. 5,528,118, which are each herein incorporated by reference in their entireties.
- An illumination system 42 is supported by a frame 72.
- Frame 72 is supported to the ground via isolators 54.
- Illumination system 42 includes an illumination source, and is arranged to project a radiant energy, e.g., light, through a mask pattern on a reticle 68 that is supported by and scanned using a reticle stage which includes a coarse stage and a fine stage.
- the radiant energy is focused through projection optical system 46, which is supported on a projection optics frame 50 and may be supported the ground through isolators 54.
- Suitable isolators 54 include those described in JP Hei 8-330224 and U.S. Patent No. 5,874,820, which are each incorporated herein by reference in their entireties.
- a first interferometer 56 is supported on projection optics frame 50, and functions to detect the position of wafer table 51. Interferometer 56 outputs information on the position of wafer table 51 to system controller 62. In one embodiment, wafer table 51 has a force damper which reduces vibrations associated with wafer table 51 such that interferometer 56 may accurately detect the position of wafer table 51.
- a second interferometer 58 is supported on projection optical system 46, and detects the position of reticle stage 44 which supports a reticle 68. Interferometer 58 also outputs position information to system controller 62.
- photolithography apparatus 40 or an exposure apparatus, may be used as a scanning type photolithography system which exposes the pattern from reticle 68 onto wafer 64 with reticle 68 and wafer 64 moving substantially synchronously.
- reticle 68 is moved perpendicularly with respect to an optical axis of a lens assembly (projection optical system 46) or illumination system 42 by reticle stage 44.
- Wafer 64 is moved perpendicularly to the optical axis of projection optical system 46 by a wafer stage 52. Scanning of reticle 68 and wafer 64 generally occurs while reticle 68 and wafer 64 are moving substantially synchronously.
- photolithography apparatus or exposure apparatus 40 may be a step- and-repeat type photolithography system that exposes reticle 68 while reticle 68 and wafer 64 are stationary.
- wafer 64 is in a substantially constant position relative to reticle 68 and projection optical system 46 during the exposure of an individual field.
- wafer 64 is consecutively moved by wafer positioning stage 52 perpendicularly to the optical axis of projection optical system 46 and reticle 68 for exposure.
- the images on reticle 68 may be sequentially exposed onto the fields of wafer 64 so that the next field of semiconductor wafer 64 is brought into position relative to illumination system 42, reticle 68, and projection optical system 46.
- photolithography apparatus 40 is not limited to being used in a photolithography system for semiconductor manufacturing.
- photolithography apparatus 40 may be used as a part of a liquid crystal display (LCD) photolithography system that exposes an LCD device pattern onto a rectangular glass plate or a photolithography system for manufacturing a thin film magnetic head.
- LCD liquid crystal display
- the illumination source of illumination system 42 may be g-line (436 nanometers (ran)), i-line (365 nm), a KrF excimer laser (248 nm), an ArF excimer laser (193 nm), and an F 2 -type laser (157 nm).
- illumination system 42 may also use charged particle beams such as x-ray and electron beams.
- charged particle beams such as x-ray and electron beams.
- thermionic emission type lanthanum hexaboride (LaB 6 ) or tantalum (Ta) may be used as an electron gun.
- the structure may be such that either a mask is used or a pattern may be directly formed on a substrate without the use of a mask.
- projection optical system 46 when far ultra-violet rays such as an excimer laser is used, glass materials such as quartz and fluorite that transmit far ultraviolet rays is preferably used.
- projection optical system 46 may be either catadioptric or refractive (a reticle may be of a corresponding reflective type), and when an electron beam is used, electron optics may comprise electron lenses and deflectors.
- the optical path for the electron beams is generally in a vacuum.
- a catadioptric type optical system may be considered.
- a catadioptric type of optical system include, but are not limited to, those described in Japan Patent Application Disclosure No. 8-171054 published in the Official gazette for Laid-Open Patent Applications and its counterpart U.S. Patent No. 5,668,672, as well as in Japan Patent Application Disclosure No. 10-20195 and its counterpart U.S. Patent No. 5,835,275, which are all incorporated herein by reference in their entireties.
- the reflecting optical device may be a catadioptric optical system incorporating a beam splitter and a concave mirror.
- These examples describe a reflecting-refracting type of optical system that incorporates a concave mirror, but without a beam splitter, and may also be suitable for use with the present invention.
- linear motors when linear motors (see U.S. Patent Nos. 5,623,853 or 5,528,118, which are each incorporated herein by reference in their entireties) are used in a wafer stage or a reticle stage, the linear motors may be either an air levitation type that employs air bearings or a magnetic levitation type that uses Lorentz forces or reactance forces. Additionally, the stage may also move along a guide, or may be a guideless type stage which uses no guide.
- a wafer stage or a reticle stage may be driven by a planar motor which drives a stage through the use of electromagnetic forces generated by a magnet unit that has magnets arranged in two dimensions and an armature coil unit that has coil in facing positions in two dimensions.
- a magnet unit that has magnets arranged in two dimensions
- an armature coil unit that has coil in facing positions in two dimensions.
- reaction forces generated by the wafer (substrate) stage motion may be mechanically released to the floor or ground by use of a frame member as described above, as well as in U.S. Patent No. 5,528,1 18 and published Japanese Patent Application Disclosure No. 8-166475. Additionally, reaction forces generated by the reticle (mask) stage motion may be mechanically released to the floor (ground) by use of a frame member as described in U.S. Patent No. 5,874,820 and published Japanese Patent Application Disclosure No. 8-330224, which are each incorporated herein by reference in their entireties. Isolaters such as isolators 54 may generally be associated with an active vibration isolation system (AVIS).
- AVIS active vibration isolation system
- An AVIS generally controls vibrations associated with forces 112, i.e., vibrational forces, which are experienced by a stage assembly or, more generally, by a photolithography machine such as photolithography apparatus 40 which includes a stage assembly.
- a photolithography system e.g., a photolithography apparatus which may include one or more heat pipes (heat transfer apparatuses), may be built by assembling various subsystems in such a manner that prescribed mechanical accuracy, electrical accuracy, and optical accuracy are maintained.
- substantially every optical system may be adjusted to achieve its optical accuracy.
- substantially every mechanical system and substantially every electrical system may be adjusted to achieve their respective desired mechanical and electrical accuracies.
- the process of assembling each subsystem into a photolithography system includes, but is not limited to, developing mechanical interfaces, electrical circuit wiring connections, and air pressure plumbing connections between each subsystem. There is also a process where each subsystem is assembled prior to assembling a photolithography system from the various subsystems. Once a photolithography system is assembled using the various subsystems, an overall adjustment is generally performed to ensure that substantially every desired accuracy is maintained within the overall photolithography system. Additionally, it may be desirable to manufacture an exposure system in a clean room where the temperature and humidity are controlled.
- semiconductor devices may be fabricated using systems described above, as will be discussed with reference to Fig. 12.
- the process begins at step 1301 in which the function and performance characteristics of a semiconductor device are designed or otherwise determined.
- a reticle (mask) in which has a pattern is designed based upon the design of the semiconductor device.
- a wafer is made from a silicon material.
- the mask pattern designed in step 1302 is exposed onto the wafer fabricated in step 1303 in step 1304 by a photolithography system.
- One process of exposing a mask pattern onto a wafer will be described below with respect to Fig. 13.
- the semiconductor device is assembled.
- Fig. 13 is a process flow diagram which illustrates the steps associated with wafer processing in the case of fabricating semiconductor devices in accordance with an embodiment of the present invention.
- step 1311 the surface of a wafer is oxidized.
- step 1312 which is a chemical vapor deposition (CVD) step
- an insulation film may be formed on the wafer surface.
- step 1313 electrodes are formed on the wafer by vapor deposition.
- ions may be implanted in the wafer using substantially any suitable method in step 1314.
- steps 1311-1314 are generally considered to be preprocessing steps for wafers during wafer processing. Further, it should be understood that selections made in each step, e.g., the concentration of various chemicals to use in forming an insulation film in step 1312, may be made based upon processing requirements.
- post-processing steps may be implemented. During post-processing, initially, in step 1315, photoresist is applied to a wafer. Then, in step 1316, an exposure device may be used to transfer the circuit pattern of a reticle to a wafer. Transferring the circuit pattern of the reticle of the wafer generally includes scanning a reticle scanning stage which may, in one embodiment, include a force damper to dampen vibrations.
- the exposed wafer is developed in step 1317. Once the exposed wafer is developed, parts other than residual photoresist, e.g., the exposed material surface, may be removed by etching. Finally, in step 1319, any unnecessary photoresist that remains after etching may be removed. As will be appreciated by those skilled in the art, multiple circuit patterns may be formed through the repetition of the preprocessing and post-processing steps.
- a heat pipe heat transfer apparatus
- a pressure controller which is a piston
- a pressure controller may be substantially any mechanism which enables pressure within the heat pipe to be controlled.
- a pressure controller on a heat pipe heat transfer apparatus
- a heat pipe with an internal temperature which may be controlled by controlling the pressure within the heat pipe may be used for a variety of different application.
- a heat pipe (heat transfer apparatus) with an internal temperature which is controllable may be used within a photolithography apparatus to cool linear motors, voice coil motors, or substantially any other electromagnetic actuator. It should be appreciated, however, that such a heat pipe (heat transfer apparatus) may generally be used to cool substantially any mechanism or device which would benefit from being cooled.
- a pressure control mechanism such as a piston has been shown as being positioned near a condenser end of a heat pipe (heat transfer apparatus), a pressure control mechanism may generally be positioned substantially anywhere with respect to the heat pipe. Positioning the pressure control mechanism closer to a condenser end of the heat pipe, which contains mostly gas or vapors, may enable the pressure control mechanism to be more readily actuated. However, the pressure control mechanism may instead be located near a middle portion of a heat pipe, or closer to an evaporator end of the heat pipe in some embodiments.
- Changing the pressure within a heat pipe may, in some cases, cause an appreciable change in the interior volume of the heat pipe. Conversely, changing the interior volume of a heat pipe may lead to a change in pressure within the heat pipe. As such, it should be appreciated that the internal volume of the heat pipe may effectively be changed, e.g., by displacing a piston of the heat pipe, to cause a change in pressure within the heat pipe that leads to a change in the boiling temperature of fluid in the heat pipe.
- a process of controlling the temperature within a heat pipe may include at least periodically determining a desired temperature within the heat pipe. Periodically determining a desired temperature within the heat pipe (heat transfer apparatus) enables changes to requirements associated with an overall stage apparatus to be accounted for, as the control force applied to a piston of a heat pipe (heat transfer apparatus) may be adjusted to compensate for any change to a desired temperature. Therefore, the present examples are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details given herein, but may be modified within the scope of the appended claims.
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Abstract
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Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04753338A EP1629246A2 (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
JP2006514959A JP2006526757A (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/455,004 US20040244963A1 (en) | 2003-06-05 | 2003-06-05 | Heat pipe with temperature control |
US10/455,004 | 2003-06-05 |
Publications (2)
Publication Number | Publication Date |
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WO2004109757A2 true WO2004109757A2 (en) | 2004-12-16 |
WO2004109757A3 WO2004109757A3 (en) | 2005-03-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2004/016495 WO2004109757A2 (en) | 2003-06-05 | 2004-05-26 | Heat pipe with temperature control |
Country Status (7)
Country | Link |
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US (1) | US20040244963A1 (en) |
EP (1) | EP1629246A2 (en) |
JP (1) | JP2006526757A (en) |
KR (1) | KR20060018879A (en) |
CN (1) | CN1798953A (en) |
TW (1) | TW200504893A (en) |
WO (1) | WO2004109757A2 (en) |
Cited By (1)
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US8976333B2 (en) | 2010-06-23 | 2015-03-10 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cooling method |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
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Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517730A (en) * | 1967-03-15 | 1970-06-30 | Us Navy | Controllable heat pipe |
US3605878A (en) * | 1969-10-08 | 1971-09-20 | Sanders Associates Inc | Heat pipe with variable evaporator |
US3637007A (en) * | 1967-08-14 | 1972-01-25 | Trw Inc | Method of and means for regulating thermal energy transfer through a heat pipe |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4898231A (en) * | 1985-09-30 | 1990-02-06 | Kabushiki Kaisha Toshiba | Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system |
US4986348A (en) * | 1987-12-22 | 1991-01-22 | Kenji Okayasu | Heat conducting device |
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
US5911272A (en) * | 1996-09-11 | 1999-06-15 | Hughes Electronics Corporation | Mechanically pumped heat pipe |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US6229116B1 (en) * | 1998-02-03 | 2001-05-08 | Tokyo Electron Limited | Heat treatment apparatus |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3741289A (en) * | 1970-07-06 | 1973-06-26 | R Moore | Heat transfer apparatus with immiscible fluids |
JPS59180283A (en) * | 1983-03-29 | 1984-10-13 | Toshiba Corp | Variable conductance heat pipe |
US4573525A (en) * | 1985-03-28 | 1986-03-04 | Boyd Hermon A | Thermally actuated heat exchange method and system |
JPH0631702B2 (en) * | 1985-09-30 | 1994-04-27 | 株式会社東芝 | Two-phase fluid loop |
JPS62107271U (en) * | 1985-12-16 | 1987-07-09 | ||
JPH0285268U (en) * | 1988-12-07 | 1990-07-04 | ||
JP2622603B2 (en) * | 1989-01-13 | 1997-06-18 | 株式会社フジクラ | Heat pipe heat exchanger |
JP3475973B2 (en) * | 1994-12-14 | 2003-12-10 | 株式会社ニコン | Linear motor, stage device, and exposure device |
JP4131038B2 (en) * | 1998-06-26 | 2008-08-13 | 株式会社エクォス・リサーチ | Fuel cell system |
KR100629746B1 (en) * | 1999-07-28 | 2006-09-28 | 동경 엘렉트론 주식회사 | Developing apparatus and method thereof |
KR100597287B1 (en) * | 1999-07-28 | 2006-07-04 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and method |
US6312171B1 (en) * | 1999-08-12 | 2001-11-06 | Tokyo Electron Limited | Developing apparatus and method thereof |
SG89379A1 (en) * | 2000-02-22 | 2002-06-18 | Tokyo Electron Ltd | Treatment apparatus |
-
2003
- 2003-06-05 US US10/455,004 patent/US20040244963A1/en not_active Abandoned
-
2004
- 2004-05-26 CN CNA2004800152920A patent/CN1798953A/en active Pending
- 2004-05-26 WO PCT/US2004/016495 patent/WO2004109757A2/en not_active Application Discontinuation
- 2004-05-26 KR KR1020057023381A patent/KR20060018879A/en not_active Application Discontinuation
- 2004-05-26 JP JP2006514959A patent/JP2006526757A/en active Pending
- 2004-05-26 EP EP04753338A patent/EP1629246A2/en not_active Withdrawn
- 2004-06-04 TW TW093116100A patent/TW200504893A/en unknown
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3517730A (en) * | 1967-03-15 | 1970-06-30 | Us Navy | Controllable heat pipe |
US3637007A (en) * | 1967-08-14 | 1972-01-25 | Trw Inc | Method of and means for regulating thermal energy transfer through a heat pipe |
US3605878A (en) * | 1969-10-08 | 1971-09-20 | Sanders Associates Inc | Heat pipe with variable evaporator |
US4898231A (en) * | 1985-09-30 | 1990-02-06 | Kabushiki Kaisha Toshiba | Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system |
US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
US4986348A (en) * | 1987-12-22 | 1991-01-22 | Kenji Okayasu | Heat conducting device |
US5535818A (en) * | 1992-10-12 | 1996-07-16 | Fujitsu Limited | Cooling system for electronic device |
US5911272A (en) * | 1996-09-11 | 1999-06-15 | Hughes Electronics Corporation | Mechanically pumped heat pipe |
US6229116B1 (en) * | 1998-02-03 | 2001-05-08 | Tokyo Electron Limited | Heat treatment apparatus |
US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8976333B2 (en) | 2010-06-23 | 2015-03-10 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cooling method |
Also Published As
Publication number | Publication date |
---|---|
CN1798953A (en) | 2006-07-05 |
WO2004109757A3 (en) | 2005-03-31 |
JP2006526757A (en) | 2006-11-24 |
KR20060018879A (en) | 2006-03-02 |
US20040244963A1 (en) | 2004-12-09 |
TW200504893A (en) | 2005-02-01 |
EP1629246A2 (en) | 2006-03-01 |
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