JP4975066B2 - 振動絶縁支持デバイス - Google Patents
振動絶縁支持デバイス Download PDFInfo
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- JP4975066B2 JP4975066B2 JP2009163911A JP2009163911A JP4975066B2 JP 4975066 B2 JP4975066 B2 JP 4975066B2 JP 2009163911 A JP2009163911 A JP 2009163911A JP 2009163911 A JP2009163911 A JP 2009163911A JP 4975066 B2 JP4975066 B2 JP 4975066B2
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- vibration isolation
- support device
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/023—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means
- F16F15/0232—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means with at least one gas spring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/023—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means
- F16F15/027—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using fluid means comprising control arrangements
- F16F15/0275—Control of stiffness
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F9/00—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
- F16F9/003—Dampers characterised by having pressure absorbing means other than gas, e.g. sponge rubber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F9/00—Springs, vibration-dampers, shock-absorbers, or similarly-constructed movement-dampers using a fluid or the equivalent as damping medium
- F16F9/32—Details
- F16F9/3207—Constructional features
- F16F9/3235—Constructional features of cylinders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- General Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Vibration Prevention Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Fluid-Damping Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
1.ステップ・モード:マスク・テーブル即ちパターン化デバイス・サポートMT及び基板テーブル即ち基板サポートWTが基本的に静止状態に維持され、放射ビームに付与されたパターン全体が目標部分Cに1回で投影される(即ち単一静止露光)。次に、基板テーブル即ち基板サポートWTがX及び/又はY方向にシフトされ、異なる目標部分Cが露光される。ステップ・モードでは、露光視野の最大サイズによって、単一静止露光で画像化される目標部分Cのサイズが制限される。
2.走査モード:放射ビームに付与されたパターンが目標部分Cに投影されている間、マスク・テーブル即ちパターン化デバイス・サポートMT及び基板テーブル即ち基板サポートWTが同期走査される(即ち単一動的露光)。マスク・テーブル即ちパターン化デバイス・サポートMTに対する基板テーブル即ち基板サポートWTの速度及び方向は、投影システムPSの倍率(縮小率)及び画像反転特性によって決まる。走査モードでは、露光視野の最大サイズによって、単一動的露光における目標部分の幅(非走査方向の幅)が制限され、また、走査運動の長さによって目標部分の高さ(走査方向の高さ)が決まる。
3.その他のモード:プログラム可能パターン化デバイスを保持するべくマスク・テーブル即ちパターン化デバイス・サポートMTが基本的に静止状態に維持され、放射ビームに付与されたパターンが目標部分Cに投影されている間、基板テーブル即ち基板サポートWTが移動若しくは走査される。このモードでは、通常、パルス放射源が使用され、走査中、基板テーブル即ち基板サポートWTが移動する毎に、或いは連続する放射パルスと放射パルスの間に、必要に応じてプログラム可能パターン化デバイスが更新される。この動作モードは、上で参照したタイプのプログラム可能ミラー・アレイなどのプログラム可能パターン化デバイスを利用しているマスクレス・リソグラフィに容易に適用することができる。
B 放射ビーム
BD ビーム引渡しシステム
C 基板の目標部分
CO コンデンサ
IF 位置センサ
IL 照明システム(イルミネータ)
IN インテグレータ
MA パターン化デバイス(マスク)
MT 支持構造即ちパターン化デバイス・サポート(マスク・テーブル)
M1、M2 マスク・アライメント・マーク
PM 第1のポジショナ
PS 投影システム
PW 第2のポジショナ
P1、P2 基板アライメント・マーク
SO 放射源
W 基板
WT 基板テーブル即ち基板サポート
2、20、40、50、60 エアマウント
4 対象
6 床
8 ガス
10 ガス・チャンバ壁
12 可動部材
42 飽和液体ダンプ
44 液体
52 センサ
54 センサとアクチュエータ・システムの間の接続
56、62 アクチュエータ・システム
Claims (7)
- ガス・チャンバと圧力コントローラとを備えたガス・チャンバ・アセンブリを備えた、対象物を支持するための振動絶縁支持デバイスであって、
前記ガス・チャンバが支持力を提供するための一定量の加圧ガスを収容するようになされ、
前記圧力コントローラが、前記ガス・チャンバの体積変化による前記ガス・チャンバ内のガスの圧力変化を小さくするように機能し、
前記圧力コントローラが、
前記ガス・チャンバを少なくとも部分的に充填する液体を備え、前記ガス・チャンバが対応する飽和液体ダンプと、
前記ガス・チャンバ内に配置されたスポンジと、
を備え、
前記液体が前記ガスを含有可能になっており、
前記圧力変化に伴って前記ガスと前記液体との間で相転移が生じることにより前記ガス・チャンバ内の前記圧力変化を減少させる、
振動絶縁支持デバイス。 - 前記圧力コントローラが、前記ガス・チャンバ内の圧力を能動的に制御するようになされたフィードバック制御ループを有する制御システムを備えた、請求項1に記載の振動絶縁支持デバイス。
- 前記ガス・チャンバの体積を決定し、且つ、対応するセンサ信号を出力するようになされたセンサをさらに備え、前記フィードバック制御ループが前記センサ信号に応答して前記ガス・チャンバの体積を制御するようになされた、請求項2に記載の振動絶縁支持デバイス。
- 前記ガス・チャンバ内の圧力を決定し、且つ、対応するセンサ信号を出力するようになされた圧力センサをさらに備え、前記フィードバック制御ループが前記ガス・チャンバ内の圧力を制御するようになされた、請求項2に記載の振動絶縁支持デバイス。
- 前記ガス・チャンバ内に収容されている前記ガスの温度を制御することによって前記ガス・チャンバ内の圧力が制御される、請求項4に記載の振動絶縁支持デバイス。
- 前記ガス・チャンバが、比較的熱伝達係数の大きい材料を含んだ、前記ガス・チャンバの外部と熱接触している構造体を備えた、請求項1に記載の振動絶縁支持デバイス。
- 前記ガス・チャンバが比較的熱容量の大きい材料を含んだ構造体を備えた、請求項1に記載の振動絶縁支持デバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/009,549 US7170582B2 (en) | 2004-12-13 | 2004-12-13 | Support device and lightographic apparatus |
US11/009,549 | 2004-12-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005357356A Division JP2006191019A (ja) | 2004-12-13 | 2005-12-12 | 支持デバイス及びリソグラフィ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009299896A JP2009299896A (ja) | 2009-12-24 |
JP4975066B2 true JP4975066B2 (ja) | 2012-07-11 |
Family
ID=36583387
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005357356A Pending JP2006191019A (ja) | 2004-12-13 | 2005-12-12 | 支持デバイス及びリソグラフィ装置 |
JP2009163911A Active JP4975066B2 (ja) | 2004-12-13 | 2009-07-10 | 振動絶縁支持デバイス |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005357356A Pending JP2006191019A (ja) | 2004-12-13 | 2005-12-12 | 支持デバイス及びリソグラフィ装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7170582B2 (ja) |
JP (2) | JP2006191019A (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4936439B2 (ja) * | 2006-10-11 | 2012-05-23 | 国立大学法人東京工業大学 | 圧力レギュレータ及び除振装置 |
JP4528338B2 (ja) * | 2008-03-04 | 2010-08-18 | キヤノン株式会社 | 制振装置、露光装置及びデバイス製造方法 |
JP5001343B2 (ja) * | 2008-12-11 | 2012-08-15 | エーエスエムエル ネザーランズ ビー.ブイ. | 流体抽出システム、液浸リソグラフィ装置、及び液浸リソグラフィ装置で使用される液浸液の圧力変動を低減する方法 |
NL2005735A (en) * | 2009-12-23 | 2011-06-27 | Asml Netherlands Bv | Imprint lithographic apparatus and imprint lithographic method. |
CN102486215B (zh) * | 2010-12-02 | 2014-02-19 | 上海微电子装备有限公司 | 一种重力补偿装置 |
NL2008186A (en) * | 2011-03-14 | 2012-09-17 | Asml Netherlands Bv | Projection system, lithographic apparatus and device manufacturing method. |
NL2014008A (en) | 2014-01-17 | 2015-07-20 | Asml Netherlands Bv | Support device, lithographic apparatus and device manufacturing method. |
WO2016034348A1 (en) * | 2014-09-05 | 2016-03-10 | Asml Netherlands B.V. | A vibration isolation system to support a structure, a lithographic apparatus and device manufacturing method |
CN107060130B (zh) * | 2017-06-15 | 2022-04-22 | 金陵科技学院 | 一种气体隔震支座 |
US20230332668A1 (en) * | 2022-04-15 | 2023-10-19 | Newport Corporation | Vibration Isolation Apparatus with Thermally Conductive Pneumatic Chamber, and Method of Manufacture |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100351049B1 (ko) * | 1999-07-26 | 2002-09-09 | 삼성전자 주식회사 | 웨이퍼 가열 방법 및 이를 적용한 장치 |
JP2003058254A (ja) * | 2001-08-13 | 2003-02-28 | Canon Inc | 位置・姿勢制御装置 |
TWI307526B (en) * | 2002-08-06 | 2009-03-11 | Nikon Corp | Supporting device and the mamufacturing method thereof, stage device and exposure device |
US6953109B2 (en) * | 2002-10-08 | 2005-10-11 | Nikon Corporation | Vibration isolator with low lateral stiffness |
-
2004
- 2004-12-13 US US11/009,549 patent/US7170582B2/en active Active
-
2005
- 2005-12-12 JP JP2005357356A patent/JP2006191019A/ja active Pending
-
2009
- 2009-07-10 JP JP2009163911A patent/JP4975066B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US7170582B2 (en) | 2007-01-30 |
US20060126040A1 (en) | 2006-06-15 |
JP2006191019A (ja) | 2006-07-20 |
JP2009299896A (ja) | 2009-12-24 |
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