TW200504893A - Heat pipe with temperature control - Google Patents
Heat pipe with temperature controlInfo
- Publication number
- TW200504893A TW200504893A TW093116100A TW93116100A TW200504893A TW 200504893 A TW200504893 A TW 200504893A TW 093116100 A TW093116100 A TW 093116100A TW 93116100 A TW93116100 A TW 93116100A TW 200504893 A TW200504893 A TW 200504893A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat pipe
- temperature associated
- temperature control
- temperature
- fluid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/455,004 US20040244963A1 (en) | 2003-06-05 | 2003-06-05 | Heat pipe with temperature control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200504893A true TW200504893A (en) | 2005-02-01 |
Family
ID=33489837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093116100A TW200504893A (en) | 2003-06-05 | 2004-06-04 | Heat pipe with temperature control |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20040244963A1 (https=) |
| EP (1) | EP1629246A2 (https=) |
| JP (1) | JP2006526757A (https=) |
| KR (1) | KR20060018879A (https=) |
| CN (1) | CN1798953A (https=) |
| TW (1) | TW200504893A (https=) |
| WO (1) | WO2004109757A2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI506261B (zh) * | 2014-01-27 | 2015-11-01 | Vacuum desorption device after sample gas concentration | |
| TWI791653B (zh) * | 2017-11-06 | 2023-02-11 | 新加坡商碧綠威自動化股份有限公司 | 具有散熱能力及降熱考量之線性馬達 |
| TWI845253B (zh) * | 2022-06-22 | 2024-06-11 | 美商萬國商業機器公司 | 穿過液體冷卻導管之電磁波導 |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7174806B2 (en) * | 2001-09-13 | 2007-02-13 | Beacon Power Corporation | Flexible bearing damping system, energy storage system using such a system, and a method related thereto |
| US6675887B2 (en) * | 2002-03-26 | 2004-01-13 | Thermal Corp. | Multiple temperature sensitive devices using two heat pipes |
| US7288864B2 (en) * | 2004-03-31 | 2007-10-30 | Nikon Corporation | System and method for cooling motors of a lithographic tool |
| CN1892206A (zh) * | 2005-07-08 | 2007-01-10 | 鸿富锦精密工业(深圳)有限公司 | 热管量测装置 |
| US20070235161A1 (en) * | 2006-03-27 | 2007-10-11 | Eric Barger | Refrigerant based heat exchange system with compensating heat pipe technology |
| KR101239962B1 (ko) | 2006-05-04 | 2013-03-06 | 삼성전자주식회사 | 하부 전극 상에 형성된 버퍼층을 포함하는 가변 저항메모리 소자 |
| US20080073563A1 (en) * | 2006-07-01 | 2008-03-27 | Nikon Corporation | Exposure apparatus that includes a phase change circulation system for movers |
| KR101206036B1 (ko) | 2006-11-16 | 2012-11-28 | 삼성전자주식회사 | 전이 금속 고용체를 포함하는 저항성 메모리 소자 및 그제조 방법 |
| JP2008147026A (ja) * | 2006-12-11 | 2008-06-26 | Hitachi Ltd | 固体酸化物形燃料電池 |
| US8173989B2 (en) | 2007-05-30 | 2012-05-08 | Samsung Electronics Co., Ltd. | Resistive random access memory device and methods of manufacturing and operating the same |
| TWM348267U (en) * | 2008-07-25 | 2009-01-01 | Micro Star Int Co Ltd | Heat conducting pipe and heat dissipation system using the same |
| JP5355043B2 (ja) * | 2008-11-10 | 2013-11-27 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| US8593810B2 (en) * | 2009-01-23 | 2013-11-26 | Nec Corporation | Cooling device |
| US20100218496A1 (en) * | 2009-03-02 | 2010-09-02 | Miles Mark W | Passive heat engine systems and components |
| NL2006809A (en) * | 2010-06-23 | 2011-12-27 | Asml Netherlands Bv | Lithographic apparatus and lithographic apparatus cooling method. |
| US8883024B2 (en) | 2010-10-18 | 2014-11-11 | Tokyo Electron Limited | Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources |
| EP2515170B1 (en) * | 2011-04-20 | 2020-02-19 | ASML Netherlands BV | Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method |
| US8710526B2 (en) | 2011-08-30 | 2014-04-29 | Abl Ip Holding Llc | Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism |
| US8723205B2 (en) | 2011-08-30 | 2014-05-13 | Abl Ip Holding Llc | Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism |
| US8759843B2 (en) | 2011-08-30 | 2014-06-24 | Abl Ip Holding Llc | Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism |
| DE102011084324A1 (de) * | 2011-10-12 | 2013-04-18 | Siemens Aktiengesellschaft | Kühleinrichtung für einen Supraleiter einer supraleitenden dynamoelektrischen Synchronmaschine |
| NL2010185A (en) * | 2012-01-30 | 2013-08-01 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| KR20140140541A (ko) | 2012-01-30 | 2014-12-09 | 에이에스엠엘 네델란즈 비.브이. | 기판 테이블의 위치를 측정하기 위한 메트롤로지 시스템을 갖는 리소그래피 장치 |
| KR101427924B1 (ko) | 2012-11-21 | 2014-08-11 | 현대자동차 주식회사 | 연료 전지 시스템의 압축 공기 냉각 장치 |
| US20150068703A1 (en) * | 2013-09-06 | 2015-03-12 | Ge Aviation Systems Llc | Thermal management system and method of assembling the same |
| AU2014320060B2 (en) * | 2013-09-12 | 2018-06-28 | Renew Group Private Limited | System and method of using graphene enriched products for distributing heat energy |
| CN105004232B (zh) * | 2015-08-20 | 2017-06-06 | 安徽华茂纺织股份有限公司 | 一种千分尺读数放大装置 |
| JP2017156465A (ja) * | 2016-02-29 | 2017-09-07 | キヤノン株式会社 | 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法 |
| CN107300334B (zh) * | 2017-07-31 | 2018-10-02 | 大连碧蓝节能环保科技有限公司 | 调节蒸发压力式热管 |
| CN110379729B (zh) * | 2018-04-13 | 2022-10-21 | 北京北方华创微电子装备有限公司 | 加热基座及半导体加工设备 |
| US10936031B2 (en) * | 2018-04-13 | 2021-03-02 | Dell Products L.P. | Information handling system dynamic thermal transfer control |
| US10969841B2 (en) * | 2018-04-13 | 2021-04-06 | Dell Products L.P. | Information handling system housing integrated vapor chamber |
| KR102098867B1 (ko) * | 2018-09-12 | 2020-04-09 | (주)아이테드 | 임프린팅 장치 및 임프린팅 방법 |
| CA3141420A1 (en) * | 2019-11-29 | 2021-06-03 | Malcolm Barry James | Fluid phase change thermal management arrangement and method |
| JP7182574B2 (ja) * | 2020-02-28 | 2022-12-02 | 株式会社日立製作所 | エレベーター制御装置およびエレベーター制御方法 |
| CN112161501B (zh) * | 2020-09-28 | 2022-02-25 | 北京空间飞行器总体设计部 | 可控热管 |
| CN115779812A (zh) * | 2022-11-15 | 2023-03-14 | 山东神驰石化有限公司 | 一种c3c4脱氢反应进料加热炉节能装置 |
| CN115791882A (zh) * | 2022-12-06 | 2023-03-14 | 东南大学 | 一种矸石山重力热管实验装置及实验方法 |
| CN116538840A (zh) * | 2023-05-05 | 2023-08-04 | 北京东方锐镭科技有限公司 | 一种自动补液的封闭式热管换热器 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3517730A (en) * | 1967-03-15 | 1970-06-30 | Us Navy | Controllable heat pipe |
| US3637007A (en) * | 1967-08-14 | 1972-01-25 | Trw Inc | Method of and means for regulating thermal energy transfer through a heat pipe |
| US3605878A (en) * | 1969-10-08 | 1971-09-20 | Sanders Associates Inc | Heat pipe with variable evaporator |
| US3741289A (en) * | 1970-07-06 | 1973-06-26 | R Moore | Heat transfer apparatus with immiscible fluids |
| JPS59180283A (ja) * | 1983-03-29 | 1984-10-13 | Toshiba Corp | 可変コンダクタンスヒ−トパイプ |
| US4573525A (en) * | 1985-03-28 | 1986-03-04 | Boyd Hermon A | Thermally actuated heat exchange method and system |
| JPH0631702B2 (ja) * | 1985-09-30 | 1994-04-27 | 株式会社東芝 | 二相流体ル−プ |
| US4898231A (en) * | 1985-09-30 | 1990-02-06 | Kabushiki Kaisha Toshiba | Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system |
| JPS62107271U (https=) * | 1985-12-16 | 1987-07-09 | ||
| US4787843A (en) * | 1987-06-22 | 1988-11-29 | Thermo Electron Corporation | Pressure balanced heat pipe |
| JP2657809B2 (ja) * | 1987-12-22 | 1997-09-30 | 謙治 岡安 | 熱伝達装置 |
| JPH0285268U (https=) * | 1988-12-07 | 1990-07-04 | ||
| JP2622603B2 (ja) * | 1989-01-13 | 1997-06-18 | 株式会社フジクラ | ヒートパイプ式熱交換器 |
| JP2801998B2 (ja) * | 1992-10-12 | 1998-09-21 | 富士通株式会社 | 電子機器の冷却装置 |
| JP3475973B2 (ja) * | 1994-12-14 | 2003-12-10 | 株式会社ニコン | リニアモータ、ステージ装置、及び露光装置 |
| US5911272A (en) * | 1996-09-11 | 1999-06-15 | Hughes Electronics Corporation | Mechanically pumped heat pipe |
| JP3246891B2 (ja) * | 1998-02-03 | 2002-01-15 | 東京エレクトロン株式会社 | 熱処理装置 |
| JP4131038B2 (ja) * | 1998-06-26 | 2008-08-13 | 株式会社エクォス・リサーチ | 燃料電池システム |
| US6047766A (en) * | 1998-08-03 | 2000-04-11 | Hewlett-Packard Company | Multi-mode heat transfer using a thermal heat pipe valve |
| KR100629746B1 (ko) * | 1999-07-28 | 2006-09-28 | 동경 엘렉트론 주식회사 | 현상장치 및 그 방법 |
| KR100597287B1 (ko) * | 1999-07-28 | 2006-07-04 | 동경 엘렉트론 주식회사 | 기판처리장치 및 그 방법 |
| US6312171B1 (en) * | 1999-08-12 | 2001-11-06 | Tokyo Electron Limited | Developing apparatus and method thereof |
| KR20010083206A (ko) * | 2000-02-22 | 2001-08-31 | 히가시 데쓰로 | 처리장치 |
| US6684941B1 (en) * | 2002-06-04 | 2004-02-03 | Yiding Cao | Reciprocating-mechanism driven heat loop |
-
2003
- 2003-06-05 US US10/455,004 patent/US20040244963A1/en not_active Abandoned
-
2004
- 2004-05-26 KR KR1020057023381A patent/KR20060018879A/ko not_active Withdrawn
- 2004-05-26 JP JP2006514959A patent/JP2006526757A/ja active Pending
- 2004-05-26 WO PCT/US2004/016495 patent/WO2004109757A2/en not_active Ceased
- 2004-05-26 EP EP04753338A patent/EP1629246A2/en not_active Withdrawn
- 2004-05-26 CN CNA2004800152920A patent/CN1798953A/zh active Pending
- 2004-06-04 TW TW093116100A patent/TW200504893A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI506261B (zh) * | 2014-01-27 | 2015-11-01 | Vacuum desorption device after sample gas concentration | |
| TWI791653B (zh) * | 2017-11-06 | 2023-02-11 | 新加坡商碧綠威自動化股份有限公司 | 具有散熱能力及降熱考量之線性馬達 |
| TWI845253B (zh) * | 2022-06-22 | 2024-06-11 | 美商萬國商業機器公司 | 穿過液體冷卻導管之電磁波導 |
| US12451448B2 (en) | 2022-06-22 | 2025-10-21 | International Business Machines Corporation | Electromagnetic waveguiding through liquid cooling conduit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060018879A (ko) | 2006-03-02 |
| CN1798953A (zh) | 2006-07-05 |
| WO2004109757A3 (en) | 2005-03-31 |
| US20040244963A1 (en) | 2004-12-09 |
| EP1629246A2 (en) | 2006-03-01 |
| JP2006526757A (ja) | 2006-11-24 |
| WO2004109757A2 (en) | 2004-12-16 |
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