KR20050052513A - 평탄화를 위한 윈도를 가진 연마 패드 - Google Patents

평탄화를 위한 윈도를 가진 연마 패드 Download PDF

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Publication number
KR20050052513A
KR20050052513A KR1020057005045A KR20057005045A KR20050052513A KR 20050052513 A KR20050052513 A KR 20050052513A KR 1020057005045 A KR1020057005045 A KR 1020057005045A KR 20057005045 A KR20057005045 A KR 20057005045A KR 20050052513 A KR20050052513 A KR 20050052513A
Authority
KR
South Korea
Prior art keywords
layer
polishing pad
partially
opening
adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020057005045A
Other languages
English (en)
Korean (ko)
Inventor
로버트 스위쉬어
윌리엄 씨 앨리슨
알렌 이 왕
Original Assignee
피피지 인더스트리즈 오하이오 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 피피지 인더스트리즈 오하이오 인코포레이티드 filed Critical 피피지 인더스트리즈 오하이오 인코포레이티드
Publication of KR20050052513A publication Critical patent/KR20050052513A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)
KR1020057005045A 2002-09-25 2003-09-18 평탄화를 위한 윈도를 가진 연마 패드 Abandoned KR20050052513A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41336702P 2002-09-25 2002-09-25
US60/413,367 2002-09-25

Publications (1)

Publication Number Publication Date
KR20050052513A true KR20050052513A (ko) 2005-06-02

Family

ID=32043244

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057005045A Abandoned KR20050052513A (ko) 2002-09-25 2003-09-18 평탄화를 위한 윈도를 가진 연마 패드

Country Status (8)

Country Link
US (1) US20040102141A1 (https=)
EP (1) EP1542832A1 (https=)
JP (2) JP2005538571A (https=)
KR (1) KR20050052513A (https=)
CN (1) CN100417493C (https=)
AU (1) AU2003275237A1 (https=)
TW (1) TWI287836B (https=)
WO (1) WO2004028744A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140065932A1 (en) * 2011-04-21 2014-03-06 Toyo Tire & Rubber Co., Ltd. Laminated polishing pad

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US6676483B1 (en) * 2003-02-03 2004-01-13 Rodel Holdings, Inc. Anti-scattering layer for polishing pad windows
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
US7985121B2 (en) * 2007-11-30 2011-07-26 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
JP5233621B2 (ja) * 2008-12-02 2013-07-10 旭硝子株式会社 磁気ディスク用ガラス基板及びその製造方法。
JP5728026B2 (ja) * 2009-12-22 2015-06-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びこれの製造方法
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
JP5858576B2 (ja) * 2011-04-21 2016-02-10 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP2014094424A (ja) * 2012-11-08 2014-05-22 Toyo Tire & Rubber Co Ltd 積層研磨パッド
CN111069994B (zh) * 2019-12-11 2021-11-16 江苏月生达机械制造有限公司 一种桥梁加固钢板精确加工设备
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3572232A (en) * 1968-04-01 1971-03-23 Itek Corp Photographic film processing material
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US6120860A (en) * 1990-08-23 2000-09-19 American National Can Company Multilayer film structure and packages therefrom for organics
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69624923T2 (de) * 1995-08-11 2003-08-21 Daikin Industries, Ltd. Silizium enthaltende organische fluorpolymere und ihre verwendung
JPH10156705A (ja) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
TW377467B (en) * 1997-04-22 1999-12-21 Sony Corp Polishing system, polishing method, polishing pad, and method of forming polishing pad
JPH11277408A (ja) * 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
EP1229821B1 (en) * 1999-09-21 2006-09-13 Honeywell HomMed LLC In-home patient monitoring system
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6561891B2 (en) * 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US20030094593A1 (en) * 2001-06-14 2003-05-22 Hellring Stuart D. Silica and a silica-based slurry
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US6722249B2 (en) * 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140065932A1 (en) * 2011-04-21 2014-03-06 Toyo Tire & Rubber Co., Ltd. Laminated polishing pad

Also Published As

Publication number Publication date
CN1684798A (zh) 2005-10-19
CN100417493C (zh) 2008-09-10
JP2005538571A (ja) 2005-12-15
EP1542832A1 (en) 2005-06-22
AU2003275237A1 (en) 2004-04-19
JP2008229843A (ja) 2008-10-02
TWI287836B (en) 2007-10-01
TW200522185A (en) 2005-07-01
WO2004028744A1 (en) 2004-04-08
US20040102141A1 (en) 2004-05-27

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