JP2005538571A - 平坦化するための窓を有する研磨パッド - Google Patents

平坦化するための窓を有する研磨パッド Download PDF

Info

Publication number
JP2005538571A
JP2005538571A JP2004539871A JP2004539871A JP2005538571A JP 2005538571 A JP2005538571 A JP 2005538571A JP 2004539871 A JP2004539871 A JP 2004539871A JP 2004539871 A JP2004539871 A JP 2004539871A JP 2005538571 A JP2005538571 A JP 2005538571A
Authority
JP
Japan
Prior art keywords
layer
polishing pad
partially
opening
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004539871A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005538571A5 (https=
Inventor
ロバート スウィッシャー，
ウィリアム シー． アリソン，
アラン イー． ワン，
Original Assignee
ピーピージー インダストリーズ オハイオ， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ピーピージー インダストリーズ オハイオ， インコーポレイテッド filed Critical ピーピージー インダストリーズ オハイオ， インコーポレイテッド
Publication of JP2005538571A publication Critical patent/JP2005538571A/ja
Publication of JP2005538571A5 publication Critical patent/JP2005538571A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)
JP2004539871A 2002-09-25 2003-09-18 平坦化するための窓を有する研磨パッド Pending JP2005538571A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41336702P 2002-09-25 2002-09-25
PCT/US2003/030139 WO2004028744A1 (en) 2002-09-25 2003-09-18 Polishing pad with window for planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008099836A Division JP2008229843A (ja) 2002-09-25 2008-04-07 平坦化するための窓を有する研磨パッド

Publications (2)

Publication Number Publication Date
JP2005538571A true JP2005538571A (ja) 2005-12-15
JP2005538571A5 JP2005538571A5 (https=) 2008-05-29

Family

ID=32043244

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004539871A Pending JP2005538571A (ja) 2002-09-25 2003-09-18 平坦化するための窓を有する研磨パッド
JP2008099836A Withdrawn JP2008229843A (ja) 2002-09-25 2008-04-07 平坦化するための窓を有する研磨パッド

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008099836A Withdrawn JP2008229843A (ja) 2002-09-25 2008-04-07 平坦化するための窓を有する研磨パッド

Country Status (8)

Country Link
US (1) US20040102141A1 (https=)
EP (1) EP1542832A1 (https=)
JP (2) JP2005538571A (https=)
KR (1) KR20050052513A (https=)
CN (1) CN100417493C (https=)
AU (1) AU2003275237A1 (https=)
TW (1) TWI287836B (https=)
WO (1) WO2004028744A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241775A (ja) * 2003-02-03 2004-08-26 Rodel Holdings Inc 研磨パッド窓のための散乱防止層
WO2012144388A1 (ja) * 2011-04-21 2012-10-26 東洋ゴム工業株式会社 積層研磨パッド
WO2012144458A1 (ja) * 2011-04-21 2012-10-26 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP2013515379A (ja) * 2009-12-22 2013-05-02 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びこれの製造方法
WO2014073344A1 (ja) * 2012-11-08 2014-05-15 東洋ゴム工業株式会社 積層研磨パッド

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US20060019417A1 (en) * 2004-07-26 2006-01-26 Atsushi Shigeta Substrate processing method and substrate processing apparatus
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
US7985121B2 (en) * 2007-11-30 2011-07-26 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
JP5233621B2 (ja) * 2008-12-02 2013-07-10 旭硝子株式会社 磁気ディスク用ガラス基板及びその製造方法。
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
CN111069994B (zh) * 2019-12-11 2021-11-16 江苏月生达机械制造有限公司 一种桥梁加固钢板精确加工设备
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3572232A (en) * 1968-04-01 1971-03-23 Itek Corp Photographic film processing material
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US6120860A (en) * 1990-08-23 2000-09-19 American National Can Company Multilayer film structure and packages therefrom for organics
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69624923T2 (de) * 1995-08-11 2003-08-21 Daikin Industries, Ltd. Silizium enthaltende organische fluorpolymere und ihre verwendung
JPH10156705A (ja) * 1996-11-29 1998-06-16 Sumitomo Metal Ind Ltd 研磨装置および研磨方法
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
TW377467B (en) * 1997-04-22 1999-12-21 Sony Corp Polishing system, polishing method, polishing pad, and method of forming polishing pad
JPH11277408A (ja) * 1998-01-29 1999-10-12 Shin Etsu Handotai Co Ltd 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6213845B1 (en) * 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6439968B1 (en) * 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
EP1229821B1 (en) * 1999-09-21 2006-09-13 Honeywell HomMed LLC In-home patient monitoring system
US6402591B1 (en) * 2000-03-31 2002-06-11 Lam Research Corporation Planarization system for chemical-mechanical polishing
US6561891B2 (en) * 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US20030094593A1 (en) * 2001-06-14 2003-05-22 Hellring Stuart D. Silica and a silica-based slurry
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US6722249B2 (en) * 2001-11-06 2004-04-20 Rodel Holdings, Inc Method of fabricating a polishing pad having an optical window
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
JP2005539398A (ja) * 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241775A (ja) * 2003-02-03 2004-08-26 Rodel Holdings Inc 研磨パッド窓のための散乱防止層
JP2013515379A (ja) * 2009-12-22 2013-05-02 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びこれの製造方法
WO2012144388A1 (ja) * 2011-04-21 2012-10-26 東洋ゴム工業株式会社 積層研磨パッド
WO2012144458A1 (ja) * 2011-04-21 2012-10-26 東洋ゴム工業株式会社 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP2012232404A (ja) * 2011-04-21 2012-11-29 Toyo Tire & Rubber Co Ltd 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層
JP2013066993A (ja) * 2011-04-21 2013-04-18 Toyo Tire & Rubber Co Ltd 積層研磨パッド
CN103492124A (zh) * 2011-04-21 2014-01-01 东洋橡胶工业株式会社 层叠研磨垫用热熔粘接剂片、及带有层叠研磨垫用粘接剂层的支持层
CN103492124B (zh) * 2011-04-21 2016-05-18 东洋橡胶工业株式会社 层叠研磨垫用热熔粘接剂片、及带有层叠研磨垫用粘接剂层的支持层
WO2014073344A1 (ja) * 2012-11-08 2014-05-15 東洋ゴム工業株式会社 積層研磨パッド

Also Published As

Publication number Publication date
CN1684798A (zh) 2005-10-19
CN100417493C (zh) 2008-09-10
EP1542832A1 (en) 2005-06-22
AU2003275237A1 (en) 2004-04-19
KR20050052513A (ko) 2005-06-02
JP2008229843A (ja) 2008-10-02
TWI287836B (en) 2007-10-01
TW200522185A (en) 2005-07-01
WO2004028744A1 (en) 2004-04-08
US20040102141A1 (en) 2004-05-27

Similar Documents

Publication Publication Date Title
JP2008229843A (ja) 平坦化するための窓を有する研磨パッド
US6905402B2 (en) Polishing pad for planarization
KR100794823B1 (ko) 윈도우를 갖는 폴리싱 패드
JP2005538571A5 (https=)
WO2008008593A1 (en) Polishing pad with window for planarization
EP2785496B1 (en) Polishing pad with foundation layer and polishing surface layer
JP3754436B2 (ja) 研磨パッドおよびそれを使用する半導体デバイスの製造方法
KR20180111553A (ko) 화학적 기계적 연마 패드
EP3996870A1 (en) Polishing pad employing polyamine and cyclohexanedimethanol curatives
JP4744087B2 (ja) 研磨パッド及び半導体デバイスの製造方法
JP2004189820A (ja) 研磨シート用高分子材料、研磨シート、及び研磨パッド
JP4514199B2 (ja) 研磨パッド及び半導体デバイスの製造方法
JP2006128563A (ja) 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法
JP2006346805A (ja) 積層研磨パッド
JP3497156B1 (ja) 研磨シート用発泡体、その製造方法、研磨シート、及び研磨パッド
JP2006346804A (ja) 積層研磨パッドの製造方法
JP2004115617A (ja) 研磨シート用ポリウレタン発泡体の製造方法、ポリウレタン発泡体、研磨シート、及び研磨パッド

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071205

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080229

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080307

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20080407

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080630