KR20040101261A - 기판의 박막증착장치 - Google Patents

기판의 박막증착장치 Download PDF

Info

Publication number
KR20040101261A
KR20040101261A KR10-2004-7013660A KR20047013660A KR20040101261A KR 20040101261 A KR20040101261 A KR 20040101261A KR 20047013660 A KR20047013660 A KR 20047013660A KR 20040101261 A KR20040101261 A KR 20040101261A
Authority
KR
South Korea
Prior art keywords
gas
process chamber
gas discharge
plate
susceptor
Prior art date
Application number
KR10-2004-7013660A
Other languages
English (en)
Korean (ko)
Inventor
위르겐센홀거
스트라우치게르트
Original Assignee
아익스트론 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아익스트론 아게 filed Critical 아익스트론 아게
Publication of KR20040101261A publication Critical patent/KR20040101261A/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45568Porous nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45572Cooled nozzles

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
KR10-2004-7013660A 2002-03-15 2003-03-13 기판의 박막증착장치 KR20040101261A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10211442A DE10211442A1 (de) 2002-03-15 2002-03-15 Vorrichtung zum Abscheiden von dünnen Schichten auf einem Substrat
DE?10211442.0? 2002-03-15
PCT/EP2003/002608 WO2003078681A1 (de) 2002-03-15 2003-03-13 Vorrichtung zum abscheiden von dünnen schichten auf einem substrat

Publications (1)

Publication Number Publication Date
KR20040101261A true KR20040101261A (ko) 2004-12-02

Family

ID=27771333

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2004-7013660A KR20040101261A (ko) 2002-03-15 2003-03-13 기판의 박막증착장치

Country Status (7)

Country Link
EP (1) EP1485518A1 (de)
JP (1) JP2005520932A (de)
KR (1) KR20040101261A (de)
AU (1) AU2003212349A1 (de)
DE (1) DE10211442A1 (de)
TW (1) TW200305658A (de)
WO (1) WO2003078681A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065747B1 (ko) * 2009-06-22 2011-09-19 주식회사 티지솔라 균일한 가스 공급수단을 구비하는 플라즈마 장치

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004035971A (ja) * 2002-07-05 2004-02-05 Ulvac Japan Ltd 薄膜製造装置
US8083853B2 (en) 2004-05-12 2011-12-27 Applied Materials, Inc. Plasma uniformity control by gas diffuser hole design
JP5046334B2 (ja) * 2004-10-11 2012-10-10 ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ 長型ガス分配システム
DE102006018515A1 (de) 2006-04-21 2007-10-25 Aixtron Ag CVD-Reaktor mit absenkbarer Prozesskammerdecke
DE102007024798A1 (de) 2007-05-25 2008-11-27 Aixtron Ag Vorrichtung zum Abscheiden von GaN mittels GaCI mit einem molybdänmaskierten Quarzteil, insbesondere Gaseinlassorgan
US20080317973A1 (en) 2007-06-22 2008-12-25 White John M Diffuser support
DE102009043840A1 (de) * 2009-08-24 2011-03-03 Aixtron Ag CVD-Reaktor mit streifenförmig verlaufenden Gaseintrittszonen sowie Verfahren zum Abscheiden einer Schicht auf einem Substrat in einem derartigen CVD-Reaktor
CN102766902B (zh) * 2011-05-05 2015-12-02 北京北方微电子基地设备工艺研究中心有限责任公司 工艺腔室装置和具有该工艺腔室装置的基片处理设备
DE102011107894A1 (de) 2011-07-18 2013-01-24 Creaphys Gmbh Beschichtungseinrichtung, insbesondere für die Innenbeschichtung von Hohlkörpern, und Beschichtungsverfahren
DE102012110125A1 (de) 2012-10-24 2014-04-24 Aixtron Se Vorrichtung zum Behandeln von Substraten mit einer auswechselbaren Deckenplatte sowie Verfahren zum Auswechseln einer derartigen Deckenplatte
DE102014118704A1 (de) 2014-01-10 2015-07-16 Aixtron Se Gaseinlassorgan eines CVD-Reaktors mit gewichtsverminderter Gasaustrittsplatte
CN117004928B (zh) * 2023-09-21 2023-12-26 上海谙邦半导体设备有限公司 一种化学气相沉积晶圆保护系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3927133A1 (de) * 1989-08-17 1991-02-21 Philips Patentverwaltung Verfahren zur abscheidung mikrokristalliner festkoerperpartikel aus der gasphase mittels chemical vapour deposition
GB2241250A (en) * 1990-01-26 1991-08-28 Fuji Electric Co Ltd RF plasma CVD employing an electrode with a shower supply surface
JP2837993B2 (ja) * 1992-06-19 1998-12-16 松下電工株式会社 プラズマ処理方法およびその装置
US5595602A (en) * 1995-08-14 1997-01-21 Motorola, Inc. Diffuser for uniform gas distribution in semiconductor processing and method for using the same
JP3310171B2 (ja) * 1996-07-17 2002-07-29 松下電器産業株式会社 プラズマ処理装置
JP4422295B2 (ja) * 2000-05-17 2010-02-24 キヤノンアネルバ株式会社 Cvd装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101065747B1 (ko) * 2009-06-22 2011-09-19 주식회사 티지솔라 균일한 가스 공급수단을 구비하는 플라즈마 장치

Also Published As

Publication number Publication date
AU2003212349A1 (en) 2003-09-29
TW200305658A (en) 2003-11-01
WO2003078681A1 (de) 2003-09-25
EP1485518A1 (de) 2004-12-15
JP2005520932A (ja) 2005-07-14
DE10211442A1 (de) 2003-09-25

Similar Documents

Publication Publication Date Title
KR100780143B1 (ko) 기재상에 하나 이상의 층을 증착하기 위한 장치와 방법
KR20040101261A (ko) 기판의 박막증착장치
KR100770461B1 (ko) 가스 처리 장치 및 성막 장치
KR100688836B1 (ko) 촉매 화학기상증착장치
JP5270057B2 (ja) シャワーヘッド
TWI482205B (zh) 具圓柱形進氣機構之mocvd反應器
KR101165615B1 (ko) 복수기판 처리장치
KR20150050638A (ko) 증착 장치
US20050081788A1 (en) Device for depositing thin layers on a substrate
KR20000073376A (ko) 온도가변 가스 분사 장치
US11939675B2 (en) Apparatus and methods for improving thermal chemical vapor deposition (CVD) uniformity
KR20120066643A (ko) Cvd 방법 및 cvd 반응기
CN112242324A (zh) 用于半导体处理系统的喷淋头装置
JP3980840B2 (ja) 気相成長装置および気相成長膜形成方法
CN113169023B (zh) 用于cvd反应器的屏蔽板
KR20090131384A (ko) 가스분사조립체 및 이를 이용한 박막증착장치
KR20030068560A (ko) 결정층 증착방법
EP1226292A1 (de) Vorrichtung zur herstellung von schichten auf scheiben
US5188058A (en) Uniform gas flow CVD apparatus
KR20060107683A (ko) 화학 기상 증착 장치
KR100626474B1 (ko) 화학 기상 증착 반응기 및 그의 사용방법
KR100686724B1 (ko) 화학기상증착장치
KR100765390B1 (ko) 돔 형태의 샤워헤드를 이용한 박막 증착 장치
WO1999065057A1 (en) Gas distribution system
JPH06151411A (ja) プラズマcvd装置

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid