KR20040097149A - 연성 회로용 액정 중합체 - Google Patents
연성 회로용 액정 중합체 Download PDFInfo
- Publication number
- KR20040097149A KR20040097149A KR10-2004-7013901A KR20047013901A KR20040097149A KR 20040097149 A KR20040097149 A KR 20040097149A KR 20047013901 A KR20047013901 A KR 20047013901A KR 20040097149 A KR20040097149 A KR 20040097149A
- Authority
- KR
- South Korea
- Prior art keywords
- liquid crystal
- crystal polymer
- film
- etchant
- treated surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 197
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 191
- 229910052751 metal Inorganic materials 0.000 claims abstract description 124
- 239000002184 metal Substances 0.000 claims abstract description 124
- 238000000034 method Methods 0.000 claims abstract description 82
- 239000007864 aqueous solution Substances 0.000 claims abstract description 22
- 239000002904 solvent Substances 0.000 claims abstract description 20
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 58
- 239000011888 foil Substances 0.000 claims description 34
- 239000002131 composite material Substances 0.000 claims description 26
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- 239000002253 acid Substances 0.000 claims description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 13
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 81
- 239000000243 solution Substances 0.000 abstract description 63
- 239000000758 substrate Substances 0.000 abstract description 52
- 238000007747 plating Methods 0.000 abstract description 18
- 239000000853 adhesive Substances 0.000 abstract description 16
- 230000001070 adhesive effect Effects 0.000 abstract description 16
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 abstract description 6
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract description 5
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001771 vacuum deposition Methods 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 73
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 40
- 239000010949 copper Substances 0.000 description 40
- 229910052802 copper Inorganic materials 0.000 description 39
- 230000008569 process Effects 0.000 description 38
- 239000000463 material Substances 0.000 description 27
- 239000000203 mixture Substances 0.000 description 27
- 229920001721 polyimide Polymers 0.000 description 26
- 229920002120 photoresistant polymer Polymers 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 22
- 229910001220 stainless steel Inorganic materials 0.000 description 21
- 239000010935 stainless steel Substances 0.000 description 21
- 239000004642 Polyimide Substances 0.000 description 17
- 238000012545 processing Methods 0.000 description 17
- 238000011282 treatment Methods 0.000 description 17
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 16
- 238000012360 testing method Methods 0.000 description 16
- -1 alkali metal salts Chemical class 0.000 description 13
- 239000000725 suspension Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052783 alkali metal Inorganic materials 0.000 description 12
- 238000003486 chemical etching Methods 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 12
- 238000004381 surface treatment Methods 0.000 description 12
- 238000001465 metallisation Methods 0.000 description 10
- 229920006254 polymer film Polymers 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 230000000712 assembly Effects 0.000 description 9
- 238000000429 assembly Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 9
- 238000011161 development Methods 0.000 description 9
- 230000018109 developmental process Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000005553 drilling Methods 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 7
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000000053 physical method Methods 0.000 description 5
- 238000010998 test method Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 238000010923 batch production Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- SEPPVOUBHWNCAW-FNORWQNLSA-N (E)-4-oxonon-2-enal Chemical compound CCCCCC(=O)\C=C\C=O SEPPVOUBHWNCAW-FNORWQNLSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- LLBZPESJRQGYMB-UHFFFAOYSA-N 4-one Natural products O1C(C(=O)CC)CC(C)C11C2(C)CCC(C3(C)C(C(C)(CO)C(OC4C(C(O)C(O)C(COC5C(C(O)C(O)CO5)OC5C(C(OC6C(C(O)C(O)C(CO)O6)O)C(O)C(CO)O5)OC5C(C(O)C(O)C(C)O5)O)O4)O)CC3)CC3)=C3C2(C)CC1 LLBZPESJRQGYMB-UHFFFAOYSA-N 0.000 description 1
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229920013683 Celanese Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4853—Constructional details of the electrical connection between head and arm
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/55—Liquid crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
- B32B2429/02—Records or discs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/093,119 US6696163B2 (en) | 2000-07-18 | 2002-03-07 | Liquid crystal polymers for flexible circuits |
| US10/093,119 | 2002-03-07 | ||
| PCT/US2003/006423 WO2003077622A1 (en) | 2002-03-07 | 2003-03-04 | Liquid crystal polymers for flexible circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040097149A true KR20040097149A (ko) | 2004-11-17 |
Family
ID=27804196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2004-7013901A Ceased KR20040097149A (ko) | 2002-03-07 | 2003-03-04 | 연성 회로용 액정 중합체 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6696163B2 (enExample) |
| EP (1) | EP1481576A1 (enExample) |
| JP (1) | JP2005520273A (enExample) |
| KR (1) | KR20040097149A (enExample) |
| CN (1) | CN1640215A (enExample) |
| AU (1) | AU2003213681A1 (enExample) |
| WO (1) | WO2003077622A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867948B1 (en) * | 1999-01-22 | 2005-03-15 | Seagate Technology Llc | Disc drives having flexible circuits with liquid crystal polymer dielectric |
| US20040247921A1 (en) * | 2000-07-18 | 2004-12-09 | Dodsworth Robert S. | Etched dielectric film in hard disk drives |
| US20040258885A1 (en) * | 2002-09-05 | 2004-12-23 | Kreutter Nathan P. | Etched dielectric film in microfluidic devices |
| US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
| US6933013B2 (en) * | 2003-10-14 | 2005-08-23 | Photon Dynamics, Inc. | Vacuum deposition of dielectric coatings on volatile material |
| US7012017B2 (en) * | 2004-01-29 | 2006-03-14 | 3M Innovative Properties Company | Partially etched dielectric film with conductive features |
| US20050186404A1 (en) * | 2004-02-23 | 2005-08-25 | Guoping Mao | Etched polycarbonate films |
| JP4846711B2 (ja) * | 2004-04-08 | 2011-12-28 | フォトン・ダイナミクス・インコーポレーテッド | 変調器製造用の高分子分散型液晶製剤 |
| US7425276B2 (en) * | 2004-06-30 | 2008-09-16 | University Of South Florida | Method for etching microchannel networks within liquid crystal polymer substrates |
| US7343675B2 (en) * | 2004-11-12 | 2008-03-18 | Harris Corporation | Method of constructing a structural circuit |
| US7523549B1 (en) * | 2005-04-15 | 2009-04-28 | Magnecomp Corporation | Dimensionally stabilized flexible circuit fabrication method and product |
| US8553364B1 (en) | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
| US7829793B2 (en) * | 2005-09-09 | 2010-11-09 | Magnecomp Corporation | Additive disk drive suspension manufacturing using tie layers for vias and product thereof |
| US8395866B1 (en) | 2005-09-09 | 2013-03-12 | Magnecomp Corporation | Resilient flying lead and terminus for disk drive suspension |
| US7781679B1 (en) * | 2005-09-09 | 2010-08-24 | Magnecomp Corporation | Disk drive suspension via formation using a tie layer and product |
| US20070120089A1 (en) * | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| US8014167B2 (en) * | 2007-09-07 | 2011-09-06 | Seagate Technology Llc | Liquid crystal material sealed housing |
| US8213120B2 (en) * | 2007-09-10 | 2012-07-03 | International Business Machines Corporation | Flexible cable comprising liquid crystal polymer |
| US20110024160A1 (en) | 2009-07-31 | 2011-02-03 | Clifton Quan | Multi-layer microwave corrugated printed circuit board and method |
| US8043464B2 (en) * | 2009-11-17 | 2011-10-25 | Raytheon Company | Systems and methods for assembling lightweight RF antenna structures |
| US8362856B2 (en) * | 2009-11-17 | 2013-01-29 | Raytheon Company | RF transition with 3-dimensional molded RF structure |
| US8127432B2 (en) * | 2009-11-17 | 2012-03-06 | Raytheon Company | Process for fabricating an origami formed antenna radiating structure |
| US9072164B2 (en) * | 2009-11-17 | 2015-06-30 | Raytheon Company | Process for fabricating a three dimensional molded feed structure |
| JP5856071B2 (ja) | 2009-12-18 | 2016-02-09 | スリーエム イノベイティブ プロパティズ カンパニー | サーモトロピック液晶ポリマーの成形及びそこから作製される物品 |
| US8801964B2 (en) | 2010-12-22 | 2014-08-12 | Photon Dynamics, Inc. | Encapsulated polymer network liquid crystal material, device and applications |
| US9145469B2 (en) | 2012-09-27 | 2015-09-29 | Ticona Llc | Aromatic polyester containing a biphenyl chain disruptor |
| WO2016003588A1 (en) | 2014-07-01 | 2016-01-07 | Ticona Llc | Laser activatable polymer composition |
| JP6805397B1 (ja) * | 2019-04-03 | 2020-12-23 | 三菱製紙株式会社 | 液晶ポリマー用エッチング液及び液晶ポリマーのエッチング方法 |
| CN111499915A (zh) * | 2019-12-30 | 2020-08-07 | 瑞声科技(新加坡)有限公司 | 一种lcp薄膜的表面处理方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB979779A (en) | 1961-01-09 | 1965-01-06 | Photocircuits Corp | Method of making printed circuits |
| US3526504A (en) | 1966-07-07 | 1970-09-01 | Du Pont | Photocrosslinkable elements and processes |
| US3448098A (en) | 1966-09-27 | 1969-06-03 | Merck & Co Inc | Production of guanylic acid |
| US3469982A (en) | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
| US3867153A (en) | 1972-09-11 | 1975-02-18 | Du Pont | Photohardenable element |
| JPS61130046A (ja) | 1984-11-28 | 1986-06-17 | ポリプラスチックス株式会社 | ラミネ−トフイルムの製造法 |
| US5066545A (en) | 1987-02-24 | 1991-11-19 | Polyonics Corporation | Process for forming polyimide-metal laminates |
| EP0311232B2 (en) * | 1987-10-02 | 1999-08-04 | Polyplastics Co. Ltd. | Process for surface treatment of moldings of liquid-crystalline polyester resin |
| US4966807A (en) * | 1988-06-13 | 1990-10-30 | Foster Miller, Inc. | Multiaxially oriented thermotropic polymer films and method of preparation |
| US4975312A (en) | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
| US4995941A (en) | 1989-05-15 | 1991-02-26 | Rogers Corporation | Method of manufacture interconnect device |
| DE4028210A1 (de) | 1990-09-06 | 1992-03-12 | Basf Ag | Verfahren zur oberflaechenbehandlung von formkoerpern auf der basis von fluessigkristallinen polymeren |
| JP2768390B2 (ja) | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
| JP3245437B2 (ja) | 1991-04-05 | 2002-01-15 | 株式会社クラレ | 積層体の製造方法 |
| US5145553A (en) | 1991-05-06 | 1992-09-08 | International Business Machines Corporation | Method of making a flexible circuit member |
| US5227008A (en) | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| JPH0677648A (ja) | 1992-08-20 | 1994-03-18 | Polyplastics Co | 立体的多層導電回路を有する複合成形品及びその製造方法 |
| US5614114A (en) | 1994-07-18 | 1997-03-25 | Electro Scientific Industries, Inc. | Laser system and method for plating vias |
| JP2939477B2 (ja) | 1994-08-16 | 1999-08-25 | エイチエヌエイ・ホールディングス・インコーポレーテッド | 液晶重合体−金属積層品および該積層品の製造法 |
| US5891527A (en) | 1995-09-15 | 1999-04-06 | M/Wave | Printed circuit board process using plasma spraying of conductive metal |
| US5891795A (en) | 1996-03-18 | 1999-04-06 | Motorola, Inc. | High density interconnect substrate |
| US5701218A (en) | 1996-07-03 | 1997-12-23 | Seagate Technology, Inc. | Flex on suspension design minimizing sensitivities to environmental stresses |
| US6218022B1 (en) | 1996-09-20 | 2001-04-17 | Toray Engineering Co., Ltd. | Resin etching solution and process for etching polyimide resins |
| JP3999834B2 (ja) | 1996-12-12 | 2007-10-31 | 三共化成株式会社 | 成形回路部品などのめっき部品の製法 |
| US5956212A (en) | 1997-12-29 | 1999-09-21 | Headway Technologies, Inc. | Static attitude adjustment of a trace-suspension assembly |
| JP2002501986A (ja) | 1998-01-30 | 2002-01-22 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 液晶ポリマーのめっき方法およびそれに関連する組成物 |
| US6356414B1 (en) | 1998-10-22 | 2002-03-12 | World Properties, Inc. | Liquid crystal polymer disk drive suspension assembly |
| EP1069209B1 (en) | 1999-07-16 | 2004-10-06 | Enthone-OMI (Benelux) B.V. | Process for plating plastics using a catalytic filler |
| US6114492A (en) | 2000-01-14 | 2000-09-05 | Ticona Llc | Process for producing liquid crystal polymer |
| US20020081443A1 (en) | 2000-06-08 | 2002-06-27 | Connelly Susan M. | Method of manufacturing circuit laminates |
| US6629348B2 (en) * | 2001-05-01 | 2003-10-07 | Oak-Mitsui, Inc. | Substrate adhesion enhancement to film |
-
2002
- 2002-03-07 US US10/093,119 patent/US6696163B2/en not_active Expired - Fee Related
-
2003
- 2003-03-04 WO PCT/US2003/006423 patent/WO2003077622A1/en not_active Ceased
- 2003-03-04 KR KR10-2004-7013901A patent/KR20040097149A/ko not_active Ceased
- 2003-03-04 JP JP2003575683A patent/JP2005520273A/ja active Pending
- 2003-03-04 EP EP20030711368 patent/EP1481576A1/en not_active Withdrawn
- 2003-03-04 CN CNA038050064A patent/CN1640215A/zh active Pending
- 2003-03-04 AU AU2003213681A patent/AU2003213681A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US6696163B2 (en) | 2004-02-24 |
| CN1640215A (zh) | 2005-07-13 |
| US20020155280A1 (en) | 2002-10-24 |
| EP1481576A1 (en) | 2004-12-01 |
| AU2003213681A1 (en) | 2003-09-22 |
| JP2005520273A (ja) | 2005-07-07 |
| WO2003077622A1 (en) | 2003-09-18 |
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