KR20040078108A - 전자파 간섭 차폐 방법 및 장치 - Google Patents
전자파 간섭 차폐 방법 및 장치 Download PDFInfo
- Publication number
- KR20040078108A KR20040078108A KR10-2004-7008645A KR20047008645A KR20040078108A KR 20040078108 A KR20040078108 A KR 20040078108A KR 20047008645 A KR20047008645 A KR 20047008645A KR 20040078108 A KR20040078108 A KR 20040078108A
- Authority
- KR
- South Korea
- Prior art keywords
- panel
- insulating
- ventilation
- conductive
- honeycomb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 20
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000009423 ventilation Methods 0.000 claims description 43
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- 238000009413 insulation Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000007772 electroless plating Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 8
- -1 polypropylene Polymers 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052793 cadmium Inorganic materials 0.000 claims description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000011133 lead Substances 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 238000005229 chemical vapour deposition Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims description 2
- 238000005289 physical deposition Methods 0.000 claims 2
- 229920003023 plastic Polymers 0.000 abstract description 7
- 239000004033 plastic Substances 0.000 abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000005489 elastic deformation Effects 0.000 abstract 1
- 241000264877 Hippospongia communis Species 0.000 description 146
- 239000010410 layer Substances 0.000 description 44
- 238000010586 diagram Methods 0.000 description 32
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000006260 foam Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 229920002492 poly(sulfone) Polymers 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- BNPSSFBOAGDEEL-UHFFFAOYSA-N albuterol sulfate Chemical compound OS(O)(=O)=O.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1.CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1 BNPSSFBOAGDEEL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000010888 cage effect Methods 0.000 description 1
- 230000003047 cage effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000007706 flame test Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- BBKFSSMUWOMYPI-UHFFFAOYSA-N gold palladium Chemical compound [Pd].[Au] BBKFSSMUWOMYPI-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 235000008409 marco Nutrition 0.000 description 1
- 244000078446 marco Species 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0041—Ventilation panels having provisions for screening
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacturing Of Electric Cables (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33660901P | 2001-12-04 | 2001-12-04 | |
| US60/336,609 | 2001-12-04 | ||
| US37888602P | 2002-05-08 | 2002-05-08 | |
| US60/378,886 | 2002-05-08 | ||
| PCT/US2002/038605 WO2003049521A1 (en) | 2001-12-04 | 2002-12-04 | Methods and apparatus for emi shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040078108A true KR20040078108A (ko) | 2004-09-08 |
Family
ID=26990293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2004-7008645A Ceased KR20040078108A (ko) | 2001-12-04 | 2002-12-04 | 전자파 간섭 차폐 방법 및 장치 |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US6870092B2 (enExample) |
| EP (2) | EP1799023B1 (enExample) |
| JP (1) | JP2005512336A (enExample) |
| KR (1) | KR20040078108A (enExample) |
| CN (1) | CN100502630C (enExample) |
| AT (2) | ATE360351T1 (enExample) |
| AU (1) | AU2002365840A1 (enExample) |
| DE (2) | DE60229893D1 (enExample) |
| TW (1) | TWI258771B (enExample) |
| WO (1) | WO2003049521A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102034508B1 (ko) * | 2018-10-02 | 2019-10-21 | 윤대식 | 허니콤 구조를 갖는 골판지 |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7051489B1 (en) * | 1999-08-12 | 2006-05-30 | Hunter Douglas Inc. | Ceiling system with replacement panels |
| US7377084B2 (en) | 2000-04-24 | 2008-05-27 | Hunter Douglas Inc. | Compressible structural panel |
| TWI258771B (en) | 2001-12-04 | 2006-07-21 | Laird Technologies Inc | Methods and apparatus for EMI shielding |
| US7303641B2 (en) * | 2002-12-03 | 2007-12-04 | Hunter Douglas Inc. | Method for fabricating cellular structural panels |
| US7338547B2 (en) * | 2003-10-02 | 2008-03-04 | Laird Technologies, Inc. | EMI-absorbing air filter |
| KR100589370B1 (ko) * | 2003-11-26 | 2006-06-14 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
| US7064265B2 (en) * | 2004-03-19 | 2006-06-20 | Stealthdrive Llc | Reduced-gasket EMI-shielding solutions for hard disk drives and other computer components |
| US7183500B2 (en) * | 2004-06-30 | 2007-02-27 | Intel Corporation | Electromagnetic interference (EMI) filter with passive noise cancellation |
| US20060086520A1 (en) * | 2004-10-08 | 2006-04-27 | Parker Hannifin Corp. | Electromagnetic interference shielding enclosure molded from fiber reinforced thermoplastic |
| US7173822B2 (en) * | 2004-10-28 | 2007-02-06 | Cisco Technology, Inc. | Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes |
| US7214874B2 (en) * | 2004-11-04 | 2007-05-08 | International Business Machines Corporation | Venting device for tamper resistant electronic modules |
| DE202004017988U1 (de) * | 2004-11-19 | 2005-01-13 | Knürr AG | Befestigungssystem |
| JP2006245112A (ja) * | 2005-03-01 | 2006-09-14 | Fujitsu Ltd | 通気口用格子および電子機器 |
| SE528689C2 (sv) * | 2005-05-30 | 2007-01-23 | Roxtec Ab | Ram med avskärmning vid kabel- och/eller rörgenomföringar i en vägg eller annan skiljedel |
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| KR101175728B1 (ko) * | 2006-01-20 | 2012-08-22 | 삼성전자주식회사 | 디스플레이 모듈의 전자파 차폐장치 및 그 제조방법 |
| US7492610B2 (en) * | 2006-06-23 | 2009-02-17 | International Business Machines Corporation | Apparatus for improving server electromagnetic shielding |
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| JP4982171B2 (ja) * | 2006-12-26 | 2012-07-25 | 株式会社竹中工務店 | 磁気シールド体及び磁気シールドルーム |
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| JP5170078B2 (ja) * | 2008-06-03 | 2013-03-27 | 日本軽金属株式会社 | 電子機器用試験装置 |
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| US8642900B2 (en) * | 2009-10-16 | 2014-02-04 | Emprimus, Llc | Modular electromagnetically shielded enclosure |
| US10371411B2 (en) * | 2009-10-22 | 2019-08-06 | Nortek Air Solutions, Llc | Ceiling system with integrated equipment support structure |
| US8760859B2 (en) | 2010-05-03 | 2014-06-24 | Emprimus, Llc | Electromagnetically-shielded portable storage device |
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| US9420219B2 (en) * | 2010-12-20 | 2016-08-16 | Emprimus, Llc | Integrated security video and electromagnetic pulse detector |
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| RU2655118C1 (ru) * | 2017-06-06 | 2018-05-23 | Общество с ограниченной ответственностью "Группа Компаний "ЗАИН" | Способ изготовления вентиляционной панели, экранирующей электромагнитное излучение |
| US10995509B2 (en) * | 2017-07-31 | 2021-05-04 | Marc Cordes | Methods and systems for providing lightweight acoustically shielded enclosures |
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| CN108834389B (zh) * | 2018-07-09 | 2020-04-21 | 安徽理工大学 | 一种双金属有机框架衍生多孔碳/多壁碳纳米管纳米复合吸波材料的制备方法 |
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2002
- 2002-12-03 TW TW091135216A patent/TWI258771B/zh not_active IP Right Cessation
- 2002-12-04 DE DE60229893T patent/DE60229893D1/de not_active Expired - Lifetime
- 2002-12-04 CN CNB028268385A patent/CN100502630C/zh not_active Expired - Fee Related
- 2002-12-04 AT AT02791361T patent/ATE360351T1/de not_active IP Right Cessation
- 2002-12-04 DE DE60219675T patent/DE60219675T2/de not_active Expired - Lifetime
- 2002-12-04 US US10/310,107 patent/US6870092B2/en not_active Ceased
- 2002-12-04 JP JP2003550576A patent/JP2005512336A/ja active Pending
- 2002-12-04 EP EP07003100A patent/EP1799023B1/en not_active Expired - Lifetime
- 2002-12-04 AT AT07003100T patent/ATE414404T1/de not_active IP Right Cessation
- 2002-12-04 WO PCT/US2002/038605 patent/WO2003049521A1/en not_active Ceased
- 2002-12-04 EP EP02791361A patent/EP1452080B1/en not_active Expired - Lifetime
- 2002-12-04 KR KR10-2004-7008645A patent/KR20040078108A/ko not_active Ceased
- 2002-12-04 AU AU2002365840A patent/AU2002365840A1/en not_active Abandoned
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2006
- 2006-09-05 US US11/516,803 patent/USRE41594E1/en not_active Expired - Lifetime
-
2008
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102034508B1 (ko) * | 2018-10-02 | 2019-10-21 | 윤대식 | 허니콤 구조를 갖는 골판지 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1452080B1 (en) | 2007-04-18 |
| EP1799023A1 (en) | 2007-06-20 |
| AU2002365840A1 (en) | 2003-06-17 |
| CN100502630C (zh) | 2009-06-17 |
| USRE42512E1 (en) | 2011-07-05 |
| ATE360351T1 (de) | 2007-05-15 |
| TWI258771B (en) | 2006-07-21 |
| ATE414404T1 (de) | 2008-11-15 |
| WO2003049521A1 (en) | 2003-06-12 |
| CN1613281A (zh) | 2005-05-04 |
| JP2005512336A (ja) | 2005-04-28 |
| EP1452080A1 (en) | 2004-09-01 |
| DE60219675D1 (de) | 2007-05-31 |
| US20030192715A1 (en) | 2003-10-16 |
| EP1799023B1 (en) | 2008-11-12 |
| TW200306586A (en) | 2003-11-16 |
| US6870092B2 (en) | 2005-03-22 |
| DE60219675T2 (de) | 2007-12-27 |
| USRE41594E1 (en) | 2010-08-31 |
| DE60229893D1 (de) | 2008-12-24 |
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