KR20040076798A - 반도체 장치 및 그 제조 방법 - Google Patents
반도체 장치 및 그 제조 방법 Download PDFInfo
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- KR20040076798A KR20040076798A KR1020040012553A KR20040012553A KR20040076798A KR 20040076798 A KR20040076798 A KR 20040076798A KR 1020040012553 A KR1020040012553 A KR 1020040012553A KR 20040012553 A KR20040012553 A KR 20040012553A KR 20040076798 A KR20040076798 A KR 20040076798A
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- Prior art keywords
- metal
- layer
- layer region
- nitrogen
- concentration
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- 239000004065 semiconductor Substances 0.000 title abstract description 14
- 238000004519 manufacturing process Methods 0.000 title description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 125
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 81
- 239000010703 silicon Substances 0.000 claims abstract description 79
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 229910052914 metal silicate Inorganic materials 0.000 claims abstract description 37
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000001301 oxygen Substances 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 10
- 238000009826 distribution Methods 0.000 claims description 34
- 229910052726 zirconium Inorganic materials 0.000 claims description 22
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 5
- 239000000203 mixture Substances 0.000 description 31
- 238000010438 heat treatment Methods 0.000 description 21
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 21
- 238000009792 diffusion process Methods 0.000 description 15
- 239000012535 impurity Substances 0.000 description 10
- 229910044991 metal oxide Inorganic materials 0.000 description 10
- 150000004706 metal oxides Chemical class 0.000 description 10
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910007991 Si-N Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006294 Si—N Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 such as C Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28185—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the gate insulator and before the formation of the definitive gate conductor
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02321—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer
- H01L21/02329—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment introduction of substances into an already existing insulating layer introduction of nitrogen
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28202—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN
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- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- General Chemical & Material Sciences (AREA)
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- Insulated Gate Type Field-Effect Transistor (AREA)
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Abstract
Description
Claims (6)
- 실리콘 기판과,상기 실리콘 기판 상에 형성된, 실리콘, 산소, 질소, 및 금속을 함유하는 게이트 절연막으로서, 상기 실리콘 기판에 접하는 제1 층 영역과, 상기 게이트 절연막의 제1 층 영역과 반대측의 제2 층 영역과, 상기 제1 및 제 2 층 영역의 사이에 있는 제3 층 영역을 구비하고, 상기 제3 층 영역에서의 상기 금속의 최대 농도가 상기 제1 및 제2 층 영역에서의 상기 금속의 농도의 최소값보다 높고, 상기 제3 층 영역에서의 상기 질소의 최대 농도가 상기 제1 및 제2 층 영역에서의 상기 질소의 농도의 최소값보다 높은 상기 게이트 절연막과,상기 제2 층 영역에 접하는 게이트 전극과,상기 게이트 절연막의 양편에 형성된 한 쌍의 소스/드레인 영역을 구비하는 것을 특징으로 하는 반도체 장치.
- 실리콘 기판과,상기 실리콘 기판 상에 형성된, 산소, 질소, 및 금속을 함유하는 게이트 절연막으로서, 상기 실리콘 기판에 접하는 제1 층 영역과, 상기 게이트 절연막의 제1 층 영역과 반대측의 제2 층 영역과, 상기 제1 및 제2 층 영역의 사이에 있는 제3 층 영역을 구비하고, 상기 금속의 농도가 상기 제1, 제2 및 제3 층 영역에서 같고, 상기 제2 층 영역에서의 상기 질소의 최대 농도가 상기 제1 및 제3 층 영역에서의농도의 최소값보다 높은 상기 게이트 절연막과,상기 제2 층 영역에 접하는 게이트 전극과,상기 게이트 절연막의 양편에 형성된 한 쌍의 소스/드레인 영역을 구비하는 것을 특징으로 하는 반도체 장치.
- 제1항 또는 제2항에 있어서,상기 금속은 지르코늄, 하프늄, 티탄, 탄탈, 알루미늄, 이트륨, 또는 희토류 원소 중 어느 하나인 것을 특징으로 하는 반도체 장치.
- 실리콘 기판 상에, 실리콘, 산소, 질소 및 금속을 함유하는 금속 실리케이트막을 형성할 때에, 상기 금속 실리게이트막 내의 상기 질소의 농도를, 상기 실리콘 기판측의 제1 층 영역 및 상기 제1 층 영역과 반대측의 제2 층 영역보다, 상기 제1 및 제2 층 영역에 끼인 제3 층 영역에서 높게, 상기 실리콘 및 상기 금속의 농도를 상기 제1, 제2 및 제3 층 영역에 걸쳐 같은 금속 실리케이트막을 형성한 후에, 상기 금속 실리케이트막을 열처리하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제4항에 있어서,상기 금속 실리 게이트막 내의 질소의 농도 분포는, 상기 금속 실리케이트막을 퇴적하는 과정에서, 아르곤 가스, 질소 가스, 및 산소 가스의 유량비를 시간 변화시킴으로써 제어하는 것을 특징으로 하는 반도체 장치의 제조 방법.
- 제4항 또는 제5항에 있어서,상기 금속은 지르코늄, 하프늄, 티탄, 탄탈, 알루미늄, 이트륨, 또는 그 밖의 희토류 원소 중 어느 하나인 것을 특징으로 하는 반도체 장치의 제조 방법.
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KR100848226B1 (ko) * | 2004-01-21 | 2008-07-24 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법 및 기판 처리 장치 |
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JP2006013092A (ja) * | 2004-06-25 | 2006-01-12 | Rohm Co Ltd | 半導体装置及びその製造方法 |
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US8110469B2 (en) * | 2005-08-30 | 2012-02-07 | Micron Technology, Inc. | Graded dielectric layers |
JP2007096151A (ja) * | 2005-09-30 | 2007-04-12 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
JPWO2007040057A1 (ja) | 2005-10-04 | 2009-04-16 | 日本電気株式会社 | 半導体装置 |
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CN100485969C (zh) | 2009-05-06 |
US6849908B2 (en) | 2005-02-01 |
CN100356581C (zh) | 2007-12-19 |
US20040164329A1 (en) | 2004-08-26 |
CN1571166A (zh) | 2005-01-26 |
KR100687153B1 (ko) | 2007-02-27 |
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