JP2006344837A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP2006344837A JP2006344837A JP2005170210A JP2005170210A JP2006344837A JP 2006344837 A JP2006344837 A JP 2006344837A JP 2005170210 A JP2005170210 A JP 2005170210A JP 2005170210 A JP2005170210 A JP 2005170210A JP 2006344837 A JP2006344837 A JP 2006344837A
- Authority
- JP
- Japan
- Prior art keywords
- gate insulating
- insulating film
- film
- phase
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 16
- 229920005591 polysilicon Polymers 0.000 claims abstract description 16
- 239000010408 film Substances 0.000 claims description 420
- 238000000034 method Methods 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 229910052735 hafnium Inorganic materials 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 23
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 22
- 229910045601 alloy Inorganic materials 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 21
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- 239000003989 dielectric material Substances 0.000 claims description 12
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- 238000005121 nitriding Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000231 atomic layer deposition Methods 0.000 claims description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 3
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005289 physical deposition Methods 0.000 claims description 3
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 3
- 150000002910 rare earth metals Chemical class 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract description 103
- 150000004706 metal oxides Chemical class 0.000 abstract description 101
- 230000006866 deterioration Effects 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 21
- 238000009413 insulation Methods 0.000 abstract description 9
- 239000000969 carrier Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 72
- 230000000052 comparative effect Effects 0.000 description 48
- 230000015572 biosynthetic process Effects 0.000 description 31
- 238000005191 phase separation Methods 0.000 description 29
- 230000008569 process Effects 0.000 description 27
- 239000002184 metal Substances 0.000 description 25
- 239000012298 atmosphere Substances 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052814 silicon oxide Inorganic materials 0.000 description 16
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 14
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 125000004429 atom Chemical group 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000010587 phase diagram Methods 0.000 description 8
- 229910021529 ammonia Inorganic materials 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 7
- 238000002955 isolation Methods 0.000 description 7
- 239000013077 target material Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 239000012159 carrier gas Substances 0.000 description 5
- 239000007772 electrode material Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- -1 hafnium nitride Chemical class 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000003917 TEM image Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000002484 cyclic voltammetry Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- PDPJQWYGJJBYLF-UHFFFAOYSA-J hafnium tetrachloride Chemical compound Cl[Hf](Cl)(Cl)Cl PDPJQWYGJJBYLF-UHFFFAOYSA-J 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical group O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28229—Making the insulator by deposition of a layer, e.g. metal, metal compound or poysilicon, followed by transformation thereof into an insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
- H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823857—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Abstract
【解決手段】半導体装置は、基板101と、基板101の上に形成され、基板の主面に対して垂直な方向で且つ複数層に相分離した高誘電体からなるゲート絶縁膜105と、該ゲート絶縁膜105の上に形成されたポリシリコンからなるゲート電極106とを有している。ゲート絶縁膜105は、基板側から、低誘電率安定相からなる第1金属酸化膜105a、高誘電率安定相からなる第2金属酸化膜105b及び低誘電率安定相からなる第3金属酸化膜105cに相分離している。
【選択図】 図2
Description
M. Hiratani, S. Saito, Y. Shimamoto, and K. Torii, "Effective Electron Mobility Reduced by Remote Charge Scattering in High-κ Gate Stacks", Jpn. J. Appl. Phys., Part 1 84, 4521-4522 (2002). C. Hobbs, L. Fonseca, V. Dhandapani, S. Samavedam, B. Taylor, J. Grant, L. Dip, D. Triyoso, R. Hegde, D. Gilmer, R. Garcia, D. Roan, L. Lovejoy, R. Rai, L. Hebert, H. Tseng, B. White, and P. Tobin, "Fermi level pinning at the polySi/metal oxide interface", Proceedings of the 2003 Symposium on VLSI Technology, (2003),p.9-10. 平谷正彦、鳥居和功、嶋本泰洋、"High-kゲート絶縁膜のスケーリング限界", 半導体集積回路シンポジウム, 12月13-14日, (2001), p.79-84. V.N.Parfenekov, R.G.Grebenschcikov and N.A.Torpov, Dokl.Akad. Nauk SSSR, 185[4]840 (1969). N.A.Torpov and I.A.Bonder, Izv.Akad.Nauk SSSR, Otd. Khim. Nauk 4, 547 (1961).
第3の半導体装置の製造方法は、ゲート絶縁膜を形成する工程において、酸化処理の温度を高誘電体薄膜に非晶質状態が維持される温度とし、ゲート電極を形成する工程よりも前に、ゲート絶縁膜に対して、該ゲート絶縁膜が複数の安定層に相分離する温度で熱処理を行なう工程とをさらに備えていることが好ましい。このようにすると、酸化処理とそれに続く高温の熱処理の際に自己整合的に膜厚方向に相分離する。
本発明の各実施形態に対する比較例として、高誘電体からなる金属酸化膜を用いた従来のゲート絶縁膜の形成方法について図15を参照しながら説明する。
本発明の第1の実施形態に係る半導体装置であって、高誘電体金属酸化物からなるゲート絶縁膜を含むMOSFETについて図1及び図2を参照しながら説明する。
以下、本発明の第2の実施形態に係る半導体装置であって、高誘電体金属酸化物からなるゲート絶縁膜を含むMOSFETについて図5及び図6を参照しながら説明する。図5及び図6において、図1に示す構成部材と同一の構成部材には同一の符号を付すことにより説明を省略する。
以下、本発明の第3の実施形態に係る半導体装置であって、高誘電体金属酸化物からなるゲート絶縁膜を含むMOSFETについて図7及び図8を参照しながら説明する。図7及び図8において、図1に示す構成部材と同一の構成部材には同一の符号を付すことにより説明を省略する。
41 Hf原子
50 第2のターゲット材(Si)
51 Si原子
60 酸素原子(分子)
61 酸素ラジカル
101 基板
102 素子分離膜
103 ウエル
104 下地膜
105 ゲート絶縁膜
105a 第1金属酸化膜(低誘電率安定相)
105b 第2金属酸化膜(高誘電率安定相)
105c 第3金属酸化膜(低誘電率安定相)
105A 金属酸化膜
106 ゲート電極
106A ゲート電極形成膜
107 ハードマスク
107A ハードマスク形成膜
108 レジストマスク
109 サイドウォール
110 ソース・ドレイン領域
205 ゲート絶縁膜
205a 第1金属酸化膜(低誘電率安定相)
205b 第2金属酸化膜(高誘電率安定相)
205c 第3金属酸化膜(低誘電率安定相)
305 ゲート絶縁膜
305a 第1金属酸化膜(低誘電率安定相)
305b 第2金属酸化膜(高誘電率安定相)
305c 第3金属酸化膜(低誘電率安定相)
305A 金属酸化膜
305B 合金膜
Claims (12)
- 半導体基板と、
前記半導体基板の上に形成され、前記半導体基板の主面に対して垂直な方向で且つ複数層に相分離した高誘電体からなるゲート絶縁膜と、
前記ゲート絶縁膜の上に形成されたゲート電極とを備えていることを特徴とする半導体装置。 - 前記ゲート絶縁膜は、相分離した前記複数層のうち誘電率が低い第1安定相を前記半導体基板側に有していることを特徴とする請求項1に記載の半導体装置。
- 前記ゲート絶縁膜は、相分離した前記複数層のうち誘電率が低い第1安定相を前記ゲート電極側に有していることを特徴とする請求項1に記載の半導体装置。
- 前記ゲート電極はポリシリコンからなり、
前記高誘電体は、シリコン、ゲルマニウム、ハフニウム、ジルコニウム、チタン、タンタル、アルミニウム及び希土類金属の群のうちの少なくとも1つを含むことを特徴とする請求項1〜3のいずれか1項に記載の半導体装置。 - 前記高誘電体は、ハフニウムシリケート(HfxSi1-xO4 )からなり、
前記ゲート絶縁膜において、前記第1安定相のHf濃度xは、0.1<x<0.4であり、前記第1安定相を除く領域からなる第2安定相のHf濃度xは0.5又は1.0であることを特徴とする請求項4に記載の半導体装置。 - 化学的気相堆積法により、半導体基板の上に、熱力学的に安定な相からなり且つ互いに誘電率が異なる複数の高誘電体薄膜からなるゲート絶縁膜を形成する工程と、
前記ゲート絶縁膜の上に、ゲート電極を形成する工程とを備え、
前記ゲート絶縁膜は、前記半導体基板の主面に対して垂直な方向に相分離していることを特徴とする半導体装置の製造方法。 - 原子層堆積法により、半導体基板の上に、熱力学的に安定な原子層比を持ち且つ互いに誘電率が異なる複数の高誘電体薄膜からなるゲート絶縁膜を形成する工程と、
前記ゲート絶縁膜の上に、ゲート電極を形成する工程とを備え、
前記ゲート絶縁膜は、前記半導体基板の主面に対して垂直な方向に相分離していることを特徴とする半導体装置の製造方法。 - 前記ゲート絶縁膜を形成する工程において、前記高誘電体薄膜の成膜温度を該高誘電体薄膜に非晶質状態が維持される温度とし、
前記ゲート電極を形成する工程よりも前に、前記ゲート絶縁膜に対して、該ゲート絶縁膜が複数の安定層に相分離する温度で熱処理を行なう工程とをさらに備えていることを特徴とする請求項6又は7に記載の半導体装置の製造方法。 - 物理的堆積法により、半導体基板の上に、少なくとも2種類の金属元素を含む合金膜を堆積する工程と、
堆積した前記合金膜に対して酸化処理を施すことにより、互いに誘電率が異なる複数の高誘電体薄膜からなるゲート絶縁膜を形成する工程と、
前記ゲート絶縁膜の上に、ゲート電極を形成する工程とを備え、
前記ゲート絶縁膜は、前記半導体基板の主面に対して垂直な方向に相分離していることを特徴とする半導体装置の製造方法。 - 前記合金膜を堆積する工程において、前記合金膜をその膜厚方向に組成変調することを特徴とする請求項9に記載の半導体装置の製造方法。
- 前記ゲート絶縁膜を形成する工程において、前記酸化処理の温度を前記高誘電体薄膜に非晶質状態が維持される温度とし、
前記ゲート電極を形成する工程よりも前に、前記ゲート絶縁膜に対して、該ゲート絶縁膜が複数の安定層に相分離する温度で熱処理を行なう工程とをさらに備えていることを特徴とする請求項9又は10に記載の半導体装置の製造方法。 - 前記安定層に相分離する温度で熱処理を行なう工程と、前記ゲート電極を形成する工程との間に、前記ゲート絶縁膜に対して窒化処理を施す工程をさらに備えていることを特徴とする請求項8又は11に記載の半導体装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005170210A JP2006344837A (ja) | 2005-06-09 | 2005-06-09 | 半導体装置及びその製造方法 |
EP06006437A EP1739754A3 (en) | 2005-06-09 | 2006-03-28 | Semiconductor device and method for fabricating the same |
US11/411,932 US7465618B2 (en) | 2005-06-09 | 2006-04-27 | Semiconductor device and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005170210A JP2006344837A (ja) | 2005-06-09 | 2005-06-09 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006344837A true JP2006344837A (ja) | 2006-12-21 |
JP2006344837A5 JP2006344837A5 (ja) | 2008-03-27 |
Family
ID=36888986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005170210A Pending JP2006344837A (ja) | 2005-06-09 | 2005-06-09 | 半導体装置及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7465618B2 (ja) |
EP (1) | EP1739754A3 (ja) |
JP (1) | JP2006344837A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177161A (ja) * | 2007-12-27 | 2009-08-06 | Canon Inc | 絶縁膜の形成方法 |
CN103632966A (zh) * | 2012-08-21 | 2014-03-12 | 中芯国际集成电路制造(上海)有限公司 | Mos晶体管的形成方法 |
TWI559409B (zh) * | 2010-08-16 | 2016-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置之製造方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7816278B2 (en) * | 2008-03-28 | 2010-10-19 | Tokyo Electron Limited | In-situ hybrid deposition of high dielectric constant films using atomic layer deposition and chemical vapor deposition |
TW201003915A (en) * | 2008-07-09 | 2010-01-16 | Nanya Technology Corp | Transistor device |
US8124513B2 (en) | 2009-03-18 | 2012-02-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Germanium field effect transistors and fabrication thereof |
US9240283B2 (en) | 2011-10-21 | 2016-01-19 | University College Cork—National University of Ireland | Single crystal high dielectric constant material and method for making same |
US8877598B2 (en) * | 2012-06-01 | 2014-11-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of lithography process with an under isolation material layer |
CN110164850A (zh) * | 2018-02-15 | 2019-08-23 | 松下知识产权经营株式会社 | 电容元件和电容元件的制造方法 |
CN117321766A (zh) * | 2021-04-22 | 2023-12-29 | 应用材料公司 | 通过超循环原子层沉积的新颖无定形高k金属氧化物电介质的方法及应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319643A (ja) * | 1989-06-16 | 1991-01-28 | Suzuki Kinzoku Kogyo Kk | 崩壊性細径金属芯テグス |
JP2001015739A (ja) * | 1999-06-30 | 2001-01-19 | Nec Corp | ゲート絶縁膜とその製造方法 |
JP2002367981A (ja) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2003179051A (ja) * | 2001-12-11 | 2003-06-27 | Matsushita Electric Ind Co Ltd | 絶縁膜形成方法、半導体装置及びその製造方法 |
JP2004266263A (ja) * | 2003-02-12 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2005079563A (ja) * | 2003-09-04 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0513706A (ja) | 1991-07-03 | 1993-01-22 | Toshiba Corp | 半導体装置 |
JP2000058832A (ja) | 1998-07-15 | 2000-02-25 | Texas Instr Inc <Ti> | オキシ窒化ジルコニウム及び/又はハフニウム・ゲ―ト誘電体 |
KR100363084B1 (ko) | 1999-10-19 | 2002-11-30 | 삼성전자 주식회사 | 박막 구조를 위한 다중막을 포함하는 커패시터 및 그 제조 방법 |
US6844604B2 (en) * | 2001-02-02 | 2005-01-18 | Samsung Electronics Co., Ltd. | Dielectric layer for semiconductor device and method of manufacturing the same |
JP2002314072A (ja) * | 2001-04-19 | 2002-10-25 | Nec Corp | 高誘電体薄膜を備えた半導体装置及びその製造方法並びに誘電体膜の成膜装置 |
US6642131B2 (en) * | 2001-06-21 | 2003-11-04 | Matsushita Electric Industrial Co., Ltd. | Method of forming a silicon-containing metal-oxide gate dielectric by depositing a high dielectric constant film on a silicon substrate and diffusing silicon from the substrate into the high dielectric constant film |
US6858547B2 (en) * | 2002-06-14 | 2005-02-22 | Applied Materials, Inc. | System and method for forming a gate dielectric |
JP4507232B2 (ja) * | 2003-03-24 | 2010-07-21 | ローム株式会社 | 半導体装置の製造方法 |
TW200506093A (en) * | 2003-04-21 | 2005-02-16 | Aviza Tech Inc | System and method for forming multi-component films |
JP4212435B2 (ja) * | 2003-08-29 | 2009-01-21 | 株式会社東芝 | 半導体装置およびその製造方法 |
US7498247B2 (en) * | 2005-02-23 | 2009-03-03 | Micron Technology, Inc. | Atomic layer deposition of Hf3N4/HfO2 films as gate dielectrics |
-
2005
- 2005-06-09 JP JP2005170210A patent/JP2006344837A/ja active Pending
-
2006
- 2006-03-28 EP EP06006437A patent/EP1739754A3/en not_active Withdrawn
- 2006-04-27 US US11/411,932 patent/US7465618B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319643A (ja) * | 1989-06-16 | 1991-01-28 | Suzuki Kinzoku Kogyo Kk | 崩壊性細径金属芯テグス |
JP2001015739A (ja) * | 1999-06-30 | 2001-01-19 | Nec Corp | ゲート絶縁膜とその製造方法 |
JP2002367981A (ja) * | 2001-06-04 | 2002-12-20 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP2003179051A (ja) * | 2001-12-11 | 2003-06-27 | Matsushita Electric Ind Co Ltd | 絶縁膜形成方法、半導体装置及びその製造方法 |
JP2004266263A (ja) * | 2003-02-12 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2005079563A (ja) * | 2003-09-04 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009177161A (ja) * | 2007-12-27 | 2009-08-06 | Canon Inc | 絶縁膜の形成方法 |
TWI559409B (zh) * | 2010-08-16 | 2016-11-21 | 半導體能源研究所股份有限公司 | 半導體裝置之製造方法 |
US9793383B2 (en) | 2010-08-16 | 2017-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
CN103632966A (zh) * | 2012-08-21 | 2014-03-12 | 中芯国际集成电路制造(上海)有限公司 | Mos晶体管的形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060281264A1 (en) | 2006-12-14 |
EP1739754A3 (en) | 2009-06-10 |
US7465618B2 (en) | 2008-12-16 |
EP1739754A2 (en) | 2007-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8168547B2 (en) | Manufacturing method of semiconductor device | |
US7655099B2 (en) | High-k dielectric film, method of forming the same and related semiconductor device | |
US7465618B2 (en) | Semiconductor device and method for fabricating the same | |
US7871942B2 (en) | Methods for manufacturing high dielectric constant film | |
KR101078498B1 (ko) | 절연체 박막의 제조 방법 | |
KR100687153B1 (ko) | 반도체 장치 및 그 제조 방법 | |
KR100729354B1 (ko) | 유전막의 전기적 특성 향상을 위한 반도체 소자의 제조방법 | |
US8927438B2 (en) | Methods for manufacturing high dielectric constant films | |
JP2005317647A (ja) | 半導体装置及びその製造方法 | |
JP5050351B2 (ja) | 半導体装置の製造方法 | |
JPWO2005038929A1 (ja) | 半導体装置の製造方法 | |
US8633119B2 (en) | Methods for manufacturing high dielectric constant films | |
US8633114B2 (en) | Methods for manufacturing high dielectric constant films | |
WO2006009025A1 (ja) | 半導体装置及び半導体装置の製造方法 | |
JP2004158498A (ja) | 半導体装置 | |
WO2010140278A1 (ja) | 半導体装置及びその製造方法 | |
JP4051063B2 (ja) | 半導体装置の製造方法 | |
Yamamoto et al. | Electrical and physical characterization of remote plasma oxidized HfO/sub 2/gate dielectrics | |
KR100680970B1 (ko) | 반도체 소자의 게이트 형성방법 | |
US20050189598A1 (en) | Logic embedded-memory integrated circuits | |
JP2004289082A (ja) | 高誘電率ゲート絶縁膜の形成方法 | |
Chong | Novel high-k dielectrics for nanoelectronics | |
KR20040086495A (ko) | 반도체 장치의 제조 방법 및 반도체 장치 및 반도체 제조장치 | |
KR20060007676A (ko) | 반도체 소자의 게이트 형성방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080212 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080212 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20100414 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111018 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120313 |