KR20040059730A - 반도체 소자의 제조 방법 - Google Patents
반도체 소자의 제조 방법 Download PDFInfo
- Publication number
- KR20040059730A KR20040059730A KR1020020086135A KR20020086135A KR20040059730A KR 20040059730 A KR20040059730 A KR 20040059730A KR 1020020086135 A KR1020020086135 A KR 1020020086135A KR 20020086135 A KR20020086135 A KR 20020086135A KR 20040059730 A KR20040059730 A KR 20040059730A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- metal layer
- manufacturing
- wafer
- temperature
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
- H01L21/76889—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances by forming silicides of refractory metals
Abstract
Description
Claims (4)
- 실리콘 공정 및 패시베이션막 형성 공정을 진행하는 단계를 완료하고 웨이퍼 백사이드의 금속화 공정을,웨이퍼 백 그라인드(back grind) 공정을 진행하고 스트레스를 완화시키기 위한 습식 식각 공정을 진행하는 단계;금속화를 위한 제 1 금속층을 형성하고 제 1 금속층을 실리사이드화 하는 단계;제 2 금속층을 형성하고 에이징하는 단계;칩 개별화를 위한 소잉(sawing) 공정을 진행하여 패키징하는 단계를 포함하고 진행하는 것을 특징으로 하는 반도체 소자의 제조 방법.
- 제 1 항에 있어서, 제 1 금속층을 Ti를 사용하고, 제 2 금속층을 Ni를 사용하여 기상 증착 또는 스퍼터 공정으로 형성하는 것을 특징으로 하는 반도체 소자의 제조 방법.
- 제 1 항에 있어서, 제 1 금속층의 실리사이드화 공정을 300℃의 온도에서 10min, 500℃의 온도에서 60sec, 300℃의 온도에서 10min 동안 순차적으로RTA(Rapid Thermal Anneal) 공정으로 진행하는 것을 특징으로 하는 반도체 소자의 제조 방법.
- 제 1 항에 있어서, 에이징 공정을 400℃의 온도에서 100min 동안 N2/O2를 50/50 으로한 분위기에서 진행하는 것을 특징으로 하는 반도체 소자의 제조 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020086135A KR100883864B1 (ko) | 2002-12-28 | 2002-12-28 | 반도체 소자의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020086135A KR100883864B1 (ko) | 2002-12-28 | 2002-12-28 | 반도체 소자의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040059730A true KR20040059730A (ko) | 2004-07-06 |
KR100883864B1 KR100883864B1 (ko) | 2009-02-17 |
Family
ID=37351711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020086135A KR100883864B1 (ko) | 2002-12-28 | 2002-12-28 | 반도체 소자의 제조 방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100883864B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100752654B1 (ko) * | 2006-02-08 | 2007-08-29 | 삼성전자주식회사 | 반도체 기판의 후면에 전원전압을 인가하는 이미지 센서 및이미지 센서의 제조 방법 |
KR20170028094A (ko) * | 2015-09-03 | 2017-03-13 | 삼성전자주식회사 | 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5583372A (en) | 1994-09-14 | 1996-12-10 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
KR20000073538A (ko) * | 1999-05-12 | 2000-12-05 | 윤종용 | 웨이퍼 후면 제거방법 |
US6184064B1 (en) | 2000-01-12 | 2001-02-06 | Micron Technology, Inc. | Semiconductor die back side surface and method of fabrication |
-
2002
- 2002-12-28 KR KR1020020086135A patent/KR100883864B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100752654B1 (ko) * | 2006-02-08 | 2007-08-29 | 삼성전자주식회사 | 반도체 기판의 후면에 전원전압을 인가하는 이미지 센서 및이미지 센서의 제조 방법 |
KR20170028094A (ko) * | 2015-09-03 | 2017-03-13 | 삼성전자주식회사 | 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법 |
Also Published As
Publication number | Publication date |
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KR100883864B1 (ko) | 2009-02-17 |
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