KR20040037847A - 반도체소자의 제조방법 - Google Patents
반도체소자의 제조방법 Download PDFInfo
- Publication number
- KR20040037847A KR20040037847A KR1020020066513A KR20020066513A KR20040037847A KR 20040037847 A KR20040037847 A KR 20040037847A KR 1020020066513 A KR1020020066513 A KR 1020020066513A KR 20020066513 A KR20020066513 A KR 20020066513A KR 20040037847 A KR20040037847 A KR 20040037847A
- Authority
- KR
- South Korea
- Prior art keywords
- gate electrode
- source
- drain
- film
- semiconductor device
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 229910021332 silicide Inorganic materials 0.000 claims abstract description 13
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims abstract description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 10
- 125000006850 spacer group Chemical group 0.000 claims abstract description 9
- 229910001873 dinitrogen Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000012535 impurity Substances 0.000 claims description 33
- 150000004767 nitrides Chemical class 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 7
- 230000002159 abnormal effect Effects 0.000 abstract description 7
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract description 7
- 239000002019 doping agent Substances 0.000 abstract description 3
- 238000000137 annealing Methods 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 238000002955 isolation Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 230000035515 penetration Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims (6)
- 반도체기판 상에 게이트 전극을 형성하는 단계와,상기 게이트 전극을 마스크로 하고 엘디디용 불순물 도핑을 실시하는 단계와,상기 게이트 전극 측면에 절연 스페이서를 형성하는 단계와,상기 게이트 전극 및 절연 스페이서를 포함한 기판 전면에 질화막을 형성하는 단계와,상기 구조에 소오스/드레인용 불순물 도핑을 실시하여 엘디디 및 소오스/드레인을 형성하는 단계와,상기 결과물에 질소 가스를 공급하여 상기 게이트 전극 및 소오스/드레인 상부에 비정질층을 형성하는 단계와,상기 비정질층을 포함한 기판 전면에 금속막을 형성하는 단계와,상기 금속막을 열처리 및 패턴 식각하여 실리사이드막을 형성하는 단계를 포함한 것을 특징으로 하는 반도체소자의 제조방법.
- 제 1항에 있어서, 상기 질화막은 100∼200Å두께로 형성하는 것을 특징으로 하는 반도체소자의 제조방법.
- 제 1항에 있어서, 상기 질화막은 500℃ 이하의 온도 하에서 PE-질화막 장비내에서 증착하는 것을 특징으로 하는 반도체소자의 제조방법.
- 제 1항에 있어서, 상기 소오스/드레인용 불순물 도핑 공정은 4회의 로테이션 및 15∼30도의 틸트를 주는 것을 특징으로 하는 반도체소자의 제조방법.
- 제 1항에 있어서, 상기 소오스/드레인용 불순물 도핑 공정은 30∼45KeV 에너지 범위와 2E13∼4E13 도우즈로 진행하는 것을 특징으로 하는 반도체소자의 제조방법.
- 제 1항에 있어서, 상기 질소가스 공급 공정은 5∼15KeV 에너지 범위와 1E15 ∼5.0E15 도우즈로 진행하는 것을 특징으로 하는 반도체소자의 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020066513A KR100541705B1 (ko) | 2002-10-30 | 2002-10-30 | 반도체소자의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020066513A KR100541705B1 (ko) | 2002-10-30 | 2002-10-30 | 반도체소자의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040037847A true KR20040037847A (ko) | 2004-05-08 |
KR100541705B1 KR100541705B1 (ko) | 2006-01-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020066513A KR100541705B1 (ko) | 2002-10-30 | 2002-10-30 | 반도체소자의 제조방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100541705B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101044385B1 (ko) * | 2004-06-29 | 2011-06-29 | 매그나칩 반도체 유한회사 | 반도체 소자의 제조방법 |
US10431498B2 (en) * | 2017-05-05 | 2019-10-01 | Semiconductor Manufacturing International (Shanghai) Corporation | Semiconductor devices and fabrication methods thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108695257B (zh) * | 2017-04-06 | 2020-11-27 | 中芯国际集成电路制造(上海)有限公司 | 半导体结构及其形成方法 |
-
2002
- 2002-10-30 KR KR1020020066513A patent/KR100541705B1/ko active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101044385B1 (ko) * | 2004-06-29 | 2011-06-29 | 매그나칩 반도체 유한회사 | 반도체 소자의 제조방법 |
US10431498B2 (en) * | 2017-05-05 | 2019-10-01 | Semiconductor Manufacturing International (Shanghai) Corporation | Semiconductor devices and fabrication methods thereof |
Also Published As
Publication number | Publication date |
---|---|
KR100541705B1 (ko) | 2006-01-16 |
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