KR20040029976A - 원자외선 리소그래피용 포토레지스트 조성물 - Google Patents

원자외선 리소그래피용 포토레지스트 조성물 Download PDF

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Publication number
KR20040029976A
KR20040029976A KR10-2003-7014580A KR20037014580A KR20040029976A KR 20040029976 A KR20040029976 A KR 20040029976A KR 20037014580 A KR20037014580 A KR 20037014580A KR 20040029976 A KR20040029976 A KR 20040029976A
Authority
KR
South Korea
Prior art keywords
photoresist composition
photoresist
alkyl
copolymer
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR10-2003-7014580A
Other languages
English (en)
Korean (ko)
Inventor
다멜랄프알
사카무리라즈
Original Assignee
클래리언트 파이낸스(비브이아이)리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 클래리언트 파이낸스(비브이아이)리미티드 filed Critical 클래리언트 파이낸스(비브이아이)리미티드
Publication of KR20040029976A publication Critical patent/KR20040029976A/ko
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR10-2003-7014580A 2001-05-11 2002-04-25 원자외선 리소그래피용 포토레지스트 조성물 Ceased KR20040029976A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/853,732 2001-05-11
US09/853,732 US6737215B2 (en) 2001-05-11 2001-05-11 Photoresist composition for deep ultraviolet lithography
PCT/EP2002/004558 WO2002093263A1 (en) 2001-05-11 2002-04-25 Photoresist composition for deep ultraviolet lithography

Publications (1)

Publication Number Publication Date
KR20040029976A true KR20040029976A (ko) 2004-04-08

Family

ID=25316757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2003-7014580A Ceased KR20040029976A (ko) 2001-05-11 2002-04-25 원자외선 리소그래피용 포토레지스트 조성물

Country Status (8)

Country Link
US (1) US6737215B2 (enExample)
EP (1) EP1388027A1 (enExample)
JP (1) JP2004530159A (enExample)
KR (1) KR20040029976A (enExample)
CN (1) CN100335972C (enExample)
MY (1) MY128511A (enExample)
TW (1) TWI242106B (enExample)
WO (1) WO2002093263A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100732301B1 (ko) * 2005-06-02 2007-06-25 주식회사 하이닉스반도체 포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법
KR20170117468A (ko) * 2015-02-18 2017-10-23 프로메러스, 엘엘씨 광염기 발생제를 함유하는 광이미지화 가능한 폴리올레핀 조성물

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US7579308B2 (en) 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
JP4838437B2 (ja) * 2000-06-16 2011-12-14 Ｊｓｒ株式会社 感放射線性樹脂組成物
US6635401B2 (en) * 2001-06-21 2003-10-21 International Business Machines Corporation Resist compositions with polymers having 2-cyano acrylic monomer
DE10131670A1 (de) * 2001-06-29 2003-01-16 Infineon Technologies Ag Fotoresists mit Reaktionsankern für eine chemische Nachverstärkung von Resiststrukturen für Belichtungen bei 157 nm
US7543592B2 (en) * 2001-12-04 2009-06-09 Ekc Technology, Inc. Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6800416B2 (en) * 2002-01-09 2004-10-05 Clariant Finance (Bvi) Ltd. Negative deep ultraviolet photoresist
US20050227183A1 (en) * 2002-01-11 2005-10-13 Mark Wagner Compositions and methods for image development of conventional chemically amplified photoresists
DE10203839B4 (de) * 2002-01-31 2007-10-18 Infineon Technologies Ag Resist für die Fotolithografie mit reaktiven Gruppen für eine nachträgliche Modifikation der Resiststrukturen
EP1551886B1 (en) * 2002-08-19 2008-09-10 E.I. Du Pont De Nemours And Company Fluorinated polymers useful as photoresists, and processes for microlithography
AU2003277582A1 (en) * 2002-11-07 2004-06-07 Asahi Glass Company, Limited Fluoropolymer
US6919167B2 (en) * 2002-11-14 2005-07-19 Micell Technologies Positive tone lithography in carbon dioxide solvents
US7427463B2 (en) * 2003-10-14 2008-09-23 Intel Corporation Photoresists with reduced outgassing for extreme ultraviolet lithography
TWI286555B (en) * 2003-10-23 2007-09-11 Shinetsu Chemical Co Polymers, resist compositions and patterning process
JP4407358B2 (ja) * 2004-04-14 2010-02-03 旭硝子株式会社 含フッ素ポリマーおよびレジスト組成物
WO2006081534A1 (en) * 2005-01-28 2006-08-03 Micell Technologies, Inc. Compositions and methods for image development of conventional chemically amplified photoresists
US7410751B2 (en) * 2005-01-28 2008-08-12 Micell Technologies, Inc. Compositions and methods for image development of conventional chemically amplified photoresists
JP5084216B2 (ja) * 2005-10-03 2012-11-28 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． フォトリソグラフィーのための組成物および方法
TWI431426B (zh) * 2007-03-27 2014-03-21 Fujifilm Corp 正型感光性樹脂組成物及使用它之硬化薄膜形成法
JP5412125B2 (ja) * 2008-05-01 2014-02-12 東京応化工業株式会社 液浸露光用ネガ型レジスト組成物およびレジストパターン形成方法
JP5401126B2 (ja) 2008-06-11 2014-01-29 東京応化工業株式会社 液浸露光用レジスト組成物およびそれを用いたレジストパターン形成方法
JP5172505B2 (ja) * 2008-07-07 2013-03-27 東京応化工業株式会社 ネガ型レジスト組成物およびそれを用いたレジストパターン形成方法
JP5887244B2 (ja) * 2012-09-28 2016-03-16 富士フイルム株式会社 パターン形成用自己組織化組成物、それを用いたブロックコポリマーの自己組織化によるパターン形成方法、及び自己組織化パターン、並びに電子デバイスの製造方法
KR20140096863A (ko) * 2013-01-29 2014-08-06 삼성디스플레이 주식회사 그래핀 패턴 형성 방법
TWI649620B (zh) 2015-02-18 2019-02-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像組成物
JP6765501B2 (ja) * 2016-07-28 2020-10-07 プロメラス， エルエルシー 無水ナジック酸重合体及びそれに由来する感光性組成物
FR3090666B1 (fr) * 2018-12-19 2021-11-19 Arkema France Composition comprenant des cyanoacrylates et au moins un copolymère à blocs
CN114262416B (zh) * 2022-03-03 2022-05-20 甘肃华隆芯材料科技有限公司 用于193nm水浸式光刻的聚合物树脂、抗水涂层组合物、抗水涂层及其制备方法

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US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
DE3638387A1 (de) 1986-10-03 1988-04-14 Bayer Ag Copolymere aus (alpha)-cyanacrylaten und ((alpha)-alkyl)-acrylaten, ihre herstellung und verwendung
EP0440374B1 (en) 1990-01-30 1997-04-16 Wako Pure Chemical Industries Ltd Chemical amplified resist material
DE4319178C2 (de) 1992-06-10 1997-07-17 Fujitsu Ltd Resist-Zusammensetzung enthaltend ein Polymermaterial und einen Säuregenerator
US5843624A (en) 1996-03-08 1998-12-01 Lucent Technologies Inc. Energy-sensitive resist material and a process for device fabrication using an energy-sensitive resist material
KR100265597B1 (ko) 1996-12-30 2000-09-15 김영환 Arf 감광막 수지 및 그 제조방법
US6165674A (en) 1998-01-15 2000-12-26 Shipley Company, L.L.C. Polymers and photoresist compositions for short wavelength imaging
JP3847454B2 (ja) 1998-03-20 2006-11-22 富士写真フイルム株式会社 遠紫外線露光用ポジ型フォトレジスト組成物及びパターン形成方法
CN1190706C (zh) 1998-08-26 2005-02-23 住友化学工业株式会社 一种化学增强型正光刻胶组合物
IL141803A0 (en) 1998-09-23 2002-03-10 Du Pont Photoresists, polymers and processes for microlithography
KR20020012206A (ko) 1999-05-04 2002-02-15 메리 이. 보울러 플루오르화 중합체, 포토레지스트 및 마이크로리소그래피방법
US6692888B1 (en) 1999-10-07 2004-02-17 Shipley Company, L.L.C. Copolymers having nitrile and alicyclic leaving groups and photoresist compositions comprising same
JP2004500596A (ja) 1999-11-17 2004-01-08 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ニトリル／フルオロアルコールポリマー含有フォトレジストおよび関連するミクロリソグラフィのための方法
US6509134B2 (en) * 2001-01-26 2003-01-21 International Business Machines Corporation Norbornene fluoroacrylate copolymers and process for the use thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100732301B1 (ko) * 2005-06-02 2007-06-25 주식회사 하이닉스반도체 포토레지스트 중합체, 포토레지스트 조성물 및 이를 이용한반도체 소자의 제조 방법
KR20170117468A (ko) * 2015-02-18 2017-10-23 프로메러스, 엘엘씨 광염기 발생제를 함유하는 광이미지화 가능한 폴리올레핀 조성물

Also Published As

Publication number Publication date
US6737215B2 (en) 2004-05-18
MY128511A (en) 2007-02-28
US20020187419A1 (en) 2002-12-12
WO2002093263A1 (en) 2002-11-21
JP2004530159A (ja) 2004-09-30
EP1388027A1 (en) 2004-02-11
TWI242106B (en) 2005-10-21
CN100335972C (zh) 2007-09-05
CN1524201A (zh) 2004-08-25

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