KR20030070743A - Method and apparatus for inspecting and sorting semiconductor package - Google Patents

Abstract

PURPOSE: An apparatus and a method for inspecting and classifying a semiconductor package are provided to rapidly and precisely carry out a semiconductor manufacturing process by improving inspecting and classifying processes of the semiconductor package. CONSTITUTION: A semiconductor inspecting and classifying apparatus includes a first horizontal moving block(42), which is movably aligned in a first axial direction. A first lifting block(45) is installed on the first horizontal moving block(42) in such a manner that the first lifting block(45) is moved up and down in a second axial direction, which is perpendicular to the first axial direction. A first suction plate(48) is connected to a rotating shaft, which is rotatably coupled to the first lifting block(45). A second horizontal moving block(51) is movably aligned in the second axial direction and a second lifting block(54) is installed on the second horizontal moving block(51) in such a manner that the second lifting block(54) is moved up and down in the second axial direction. A second suction plate(49) is connected to a rotating shaft, which is rotatably coupled to the second lifting block(54). A first camera(66) is provided to photograph a semiconductor package attached to the first suction plate(48). A second camera(73) is provided to photograph semiconductor packages released from the second suction plate(49). A suction nozzle is installed at one side of the second lifting block(54) so as to treat failed articles.

Description

Method and apparatus for inspecting and sorting semiconductor package

The present invention relates to an inspection and classification method and apparatus of a semiconductor package, and more particularly, to clean an assembly of semiconductor packages produced in a matrix form with individual semiconductor packages, and to inspect and classify according to a defect. An inspection and classification method and apparatus for semiconductor packages are provided.

In general, the semiconductor package attaches the semiconductor chip to the lead frame, performs wire bonding connecting the lead and the electrode of the semiconductor chip with a gold wire, and then encapsulates the semiconductor chip with a molding resin. In this case, in the encapsulation process, when individual semiconductor packages are accommodated and molded in a single mold, a separate dicing process is not required. In the case of molding in a mold, a dicing process for separating into individual semiconductors is required. That is, since the semiconductor package is molded in a single mold, the molding resin is connected to several semiconductor packages. Therefore, a dicing process for separating into individual semiconductor packages is required.

Meanwhile, after the dicing process is performed, the washing and drying processes are performed, and then the individual semiconductor packages are inspected for defects. Inspection of the defect is mainly performed by the imaging camera. For example, in the case of a ball grid array semiconductor package, it is inspected whether a ball bonded to one surface of the package is defective and whether a marking formed on the other surface of the package is defective. The semiconductor package determined to be defective is taken out to the defective product tray by the defective article taking out device, and the quality semiconductor package is taken out to another tray.

1A to 1G are schematic explanatory diagrams for a method of inspecting and classifying a plurality of semiconductor packages after dicing is performed.

Referring to FIG. 1A, separation of a plurality of semiconductor packages 11 by dicing is performed by vacuum adsorption on a surface of an adsorption plate 12 in which adsorption holes are formed, which may be provided with a vacuum force, and move to a cleaning step. do. The washing nozzle 13 provided in the washing step washes the semiconductor package 11 by spraying the washing liquid.

Referring to FIG. 1B, the suction plate 12 lowers the semiconductor package 11 onto the drying rack 15. The dry air injector 14 blows dry air against the semiconductor package 11 placed on the drying table 15 to dry the moisture of the cleaning liquid provided in the previous washing step.

Referring to FIG. 1C, the semiconductor packages 11 that have been dried are photographed by the first surface imaging camera 16. In this case, the first surface of the semiconductor package 11 to be imaged is a surface to which a ball (not shown) is attached in the case of a ball grid array semiconductor package. By the first surface imaging, it is determined which of the semiconductor packages have a defect factor on the first surface and is input to the controller.

Referring to FIG. 1D, the adsorption plate 12 again adsorbs the semiconductor packages after the first surface imaging is completed. The adsorption plate 12 simultaneously adsorbs a plurality of semiconductor packages 11 to the next buffer stage 17.

Referring to FIG. 1E, adsorption nozzles 18 adsorb the semiconductor packages 11 placed on the buffer stage 17 one by one.

Next, as shown in FIG. 1F, the adsorption nozzle 18 moves to the upper side of the second surface imaging camera 19 in the state of adsorbing the semiconductor package 11 to the second surface of the semiconductor package 11. Enable imaging. Imaging of the second surface of the semiconductor package 11 is a test for marking failure. That is, it is to check whether the laser marking engraved on one surface of the semiconductor package 11 is correctly performed. Whether to check the marking is input to the control unit.

Referring to FIG. 1G, the adsorption nozzle 18 classifies and places the semiconductor package 11 into the good tray 1 or the defective tray 2 according to the imaging results of the first and second surfaces of the semiconductor package. .

The inspection and sorting process of the semiconductor package as described above is performed using only one adsorption plate and adsorption nozzle, which limits the speed and accuracy of the process. In particular, the imaging operation by the second surface imaging camera 19 in the process of FIG. 1F is delayed because the adsorption nozzle 18 must absorb and image the individual semiconductor packages 11, respectively. The problem is that the overall process is slow even if other tasks are done quickly.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an improved inspection and classification method of a semiconductor package.

Another object of the present invention is to provide an apparatus for inspecting and classifying an improved semiconductor package.

It is another object of the present invention to provide a method and apparatus for inspecting and classifying semiconductor packages in which the overall process can be made quickly and accurately.

1A to 1G are explanatory diagrams schematically showing a process of inspecting and classifying a semiconductor package according to the prior art.

2 is an explanatory diagram illustrating the separation of semiconductor package assemblies into individual semiconductor packages;

3 is a schematic perspective view of an adsorption plate for adsorbing and maintaining individual semiconductor packages.

4 is a perspective view schematically showing an inspection and classification apparatus of a semiconductor package according to the present invention.

5A to 5H are explanatory diagrams schematically showing a process of inspecting and classifying a semiconductor package according to the present invention.

<Brief Description of Major Codes in Drawings>

41.X axis frame 42.First horizontal feed block

43. First lifting motor 44. Ball screw

45. First lifting block 46. First rotating motor

48. First adsorption plate 49. Second adsorption plate

In order to achieve the above object, according to the present invention, a first horizontal moving block movably installed in a first axial direction; A first elevating block provided on the first horizontal moving block to be capable of elevating in a second axis direction perpendicular to the first axis; A first adsorption plate connected to a rotation shaft rotatably installed on the first lifting block, and having a plurality of vacuum adsorption holes formed therein; A second horizontal moving block movably installed in the first axial direction; A second lifting block provided on the second horizontal moving block to move up and down in the second axial direction; A second suction plate connected to a rotation shaft rotatably installed at the second lifting block, and having a plurality of vacuum suction holes formed therein; A first surface imaging camera movable in the third axis direction orthogonal to the first axis and the second axis so as to image the semiconductor package adsorbed on the first suction plate; A second surface imaging camera movably installed in one side of the second lifting block in the third axial direction to capture a plurality of semiconductor packages separated by vacuum suction from the second suction plate; And an adsorption nozzle for taking out the defective article provided on one side of the second elevating block.

According to another feature of the present invention, the first adsorption plate and the second adsorption plate are rotated to face each other, so that the semiconductor package vacuum-adsorbed on the first adsorption plate may be vacuum adsorbed on the second adsorption plate. have.

According to another feature of the invention, further provided with a cleaning liquid jet nozzle and a dry air jet nozzle installed to be movable in the third axial direction to wash and dry the semiconductor packages adsorbed on the first adsorption plate, do.

According to another feature of the invention, the semiconductor package from which the vacuum adsorption is released from the second adsorption plate is placed thereon, and the imaging operation by the second surface imaging camera and the extraction operation by the adsorption nozzle for taking out the defective product are performed. It further has a buffer.

In addition, according to the present invention, a plurality of vacuum adsorption holes are formed and adsorbing a plurality of semiconductor packages made of dicing to the first adsorption plate rotatably installed; Spraying a cleaning liquid and dry air on the semiconductor packages attached to the first adsorption plate; Imaging a first surface of semiconductor packages attached to the first adsorption plate; Rotating the second adsorption plate and the first adsorption plate rotatably provided with a plurality of vacuum adsorption holes formed thereon to transfer the semiconductor packages on the first adsorption plate to the second adsorption plate; Lowering the semiconductor packages in a buffer after rotating the second adsorption plate; Imaging a second side of semiconductor packages on the buffer; And classifying and taking out defective and good products according to the imaging results of the first and second surfaces. The inspection and classification method of a semiconductor package is provided.

Hereinafter, the present invention will be described in more detail with reference to an embodiment shown in the accompanying drawings.

2 is an explanatory view showing the separation of individual semiconductor packages into a collection of semiconductor packages manufactured in a matrix form.

Referring to the drawings, the aggregate 21 of semiconductor packages having a matrix form is formed by molding with a molding resin in a single mold. Such an aggregate 21 is separated into individual semiconductor packages 22 through a dicing process. This separation into individual semiconductor packages 22 is commonly referred to as singulation.

3 is a perspective view showing an adsorption plate for carrying individual semiconductor packages.

Referring to the drawings, a plurality of adsorption holes 32 are formed on the upper surface of the adsorption plate 31, and a vacuum is provided through each of the adsorption holes 32. Accordingly, each of the singulated semiconductor packages 22 is maintained in alignment with the surface of the adsorption plate 31 by the force of vacuum provided from each of the adsorption holes 32. That is, in FIG. 2, the assembly 21 of the semiconductor package is separated by dicing into individual semiconductor packages 22, but the shape of the assembly shown in FIG. 1 is maintained by an apparatus such as the adsorption plate 31. It will be transported as it is and will be able to receive the inspection process. The suction plate 31 can handle the individual semiconductor packages 22 together simultaneously by moving in any direction by a robot or other transfer device.

4 is a schematic perspective view of an inspection and classification apparatus of a semiconductor package according to the present invention.

Referring to the drawings, the first horizontal moving block 42 and the second horizontal moving block 51 are provided on the X axis frame 41 so as to be independent of each other in the X axis direction. The horizontal movement blocks 42 and 51 may independently move horizontally through separate driving means, and thus may move closer or move relative to each other, and the other may move while one is stopped. The transfer of the horizontal moving blocks 42 and 51 may be made by, for example, a driving means composed of a drive motor, a ball screw, and the like, not shown.

The first horizontal moving block 42 is provided with a first lifting block 45 provided to be able to move up and down in the Z-axis direction. The first lifting block 45 receives the driving force of the first lifting motor 43 installed in the first horizontal moving block 42 through the ball screw 44 to move in the height direction of the first horizontal moving block 42. Can be.

One side of the first lifting block 45 is provided with a first rotary motor 46, the rotary shaft 47 may be rotated by the rotational driving force of the first rotary motor 46. The first adsorption plate 48 and the second adsorption plate 49 are connected to the rotary shaft 47 through connecting portions 48a and 49a, respectively. Therefore, when the rotation shaft 47 rotates, the first adsorption plate 48 and the second adsorption plate 49 can rotate. That is, the adsorption face of each adsorption plate may face the bottom face or the side face. In other embodiments, not shown in the figures, there may be only one of the two adsorption plates.

As described with reference to FIG. 3, a plurality of adsorption holes 32 are provided on the surfaces of the adsorption plates 48 and 49, and dicing is performed by the force of the vacuum provided to the adsorption holes. Since a plurality of semiconductor packages 22 can be adsorbed at the same time.

On the other hand, the second horizontal block 51 is provided with a second lifting block 54 provided to be capable of lifting in the Z-axis direction. The second lifting block 54 receives the driving force of the second lifting motor 52 installed in the second horizontal moving block 51 through the ball screw 53, and in the height direction of the second horizontal moving block 51. I can move it.

A second rotating motor 56 is installed at one side of the second lifting block 54, and a rotating shaft rotatably installed in the second lifting block 54 by the rotation driving force of the second rotating motor 56. ) Can be rotated. The third suction plate 55 is connected to the rotary shaft through the connecting portion 55a. Therefore, when the rotating shaft is rotated by the second rotary motor 56, the second suction plate 55 may rotate. That is, the adsorption face of each adsorption plate may face the bottom face or the side face.

The lifting, rotation, and proximity and separation of the first to third adsorption plates 48, 49, and 55 have important meanings in the process progress. In the state where the adsorption surface on which the adsorption holes of the adsorption plates 48, 49, and 55 are formed faces the bottom surface, the plurality of semiconductor packages can be simultaneously adsorbed or the adsorbed semiconductor packages can be laid down by lifting and lowering, which will be described later. However, by placing a plurality of semiconductor packages on a dry air nozzle, it is possible to perform a predetermined cleaning and drying operation. In addition, the imaging operation can be performed in the state of being adsorbed on the adsorption plate.

Most importantly, when the surfaces of the first or second adsorption plates 48 and 49 come close to each other with the surfaces of the third adsorption plates 55, it is possible to simultaneously receive a plurality of semiconductor packages. Is that. That is, the plurality of semiconductor packages adsorbed on the first or second adsorption plates 48 and 49 may be transferred together to the third adsorption plate 55. At this time, if the first surface of the semiconductor package (that is, the surface on which the marking is made) is adsorbed to the adsorption surfaces of the first or second adsorption plates 48 and 49, the adsorption surfaces of the third adsorption plate 55 may be removed. Two sides (ie the side to which the ball is attached) will be adsorbed. Therefore, the semiconductor package is flipped at the same time by the transfer between the suction plates. When a plurality of semiconductor packages are flipped at the same time, imaging and sorting of other surfaces of the semiconductor package may be easier.

Referring to FIG. 3 again, a fixing frame 70 is fixed to one side of the second lifting block 54, and a ball screw 72 is rotatably installed in the Y direction with respect to the fixing frame 70. The ball screw 72 is rotationally driven by a motor 71 provided on one side of the fixed frame 70. The nut coupled to the ball screw 72 is provided with a second imaging camera 73. The 2nd imaging camera 73 is for imaging the semiconductor package arrange | positioned under it. The second imaging camera 73 can perform a predetermined imaging operation while moving in the Y axis direction. Of course, the second imaging camera 73 may move in accordance with the X-axis movement of the second horizontal movement block 51 or the Z-axis movement of the second lifting block 54.

One side of the second imaging camera 73 is provided with a suction nozzle 77 for taking out defective products. The defective product adsorption nozzle 77 can perform three-axis movement in the same manner as the second imaging camera 73, and can also perform its own lifting movement.

The table frame 75 is provided with components for cleaning, drying, and imaging which semiconductor packages must pass through. That is, the washing stage 61, the drying stage 62, and the first surface inspection stage 63 are disposed on the table frame 75. The washing stage 61 is provided with a washing liquid spray nozzle 64, and the washing liquid spray nozzle 64 may move in the Y axis direction by a ball screw 67 that is rotationally driven by a driving motor (not shown). A separate structure for preventing the scattering of the washing liquid is omitted for convenience of illustration.

In addition, the drying stage 62 is provided with a dry air spray nozzle 65, and the dry air spray nozzle 65 may also move in the Y axis direction by a ball screw 68 driven by a drive motor (not shown). . The dry air jet nozzle 65 functions to dry the surface of the wet semiconductor package by the cleaning liquid jet nozzle 64.

A first surface imaging camera 66 is installed on the first surface inspection stage 63, and the first surface imaging camera 66 is a bottom surface of the semiconductor package adsorbed by the first or second adsorption plate 48. It serves to capture the image. The first surface imaging camera 66 can also be moved in the Y axis direction by the ball screw 69 rotating by a drive motor (not shown). In other words, the first or second adsorption plate 48 is moved in the X-axis direction to the upper portion of the first surface imaging camera 66 in a state where the first or second adsorption plate 48 adsorbs the semiconductor package. When the camera 66 is approached in the Z axis direction, the first surface imaging camera 66 performs imaging while moving in the Y axis direction.

Designated by reference numeral 69 is a buffer stage. The buffer stage is a stage for laying down a plurality of semiconductor packages adsorbed by the third adsorption plate 55. A large number of adsorption holes are also formed in the buffer 78 provided in the buffer stage, so that the semiconductor package can be adsorbed and held by the vacuum force. The buffer 78 can also be rotated and fed in the Y axis by a mechanism not shown.

After the semiconductor packages are transferred from the third suction plate 55 to the buffer stage 69, imaging by the second surface imaging camera 73 may be performed. The third adsorption plate 55 may lower the semiconductor packages onto the buffer 78 of the buffer stage 67 by facing the bottom in the Z-axis direction. The second side imaging camera 73 may then image the second side of the semiconductor packages.

On the other hand, the defective article suction nozzle 77 takes out the defective article according to the imaging result of the said 1st surface image pickup camera 66 and the 2nd surface image pickup camera 73. Since the number of defective items is relatively small, the defective items can be taken out from the buffer stage 67 as a single suction nozzle and transferred to the defective product tray. On the other hand, good semiconductor packages are moved by the buffer 78 of the buffer stage 67 and taken out by another good quality suction nozzle (not shown). It is preferable that the good quality adsorption nozzle is a multiple adsorption nozzle in which many nozzles were combined.

Hereinafter, the inspection and classification method of the semiconductor package according to the present invention will be described with reference to FIGS. 5A to 5H.

Referring to FIG. 5A, the first or second adsorption plates 48, 49 adsorb a plurality of semiconductor packages 22 separated into individual semiconductor packages by dicing. As described above, the cleaning operation by the cleaning liquid spray nozzle 64 is performed in the state in which the plurality of semiconductor packages 22 are adsorbed.

In FIG. 5B, the semiconductor packages which have been sprayed with the washing liquid are sprayed with dry air by the dry air spray nozzle 65 while attached to the first or second adsorption plates 48 and 49. Residual cleaning liquids may be dried by such dry air injection.

In FIG. 5C, the semiconductor packages are moved to the upper side of the first surface imaging camera 66 while being attached to the first or second adsorption plates 48 and 49 to perform the imaging operation. The imaging operation at this time is performed with respect to the 1st surface (for example, the surface with a ball) of a semiconductor package.

In FIG. 5D, the semiconductor packages are attached to the first or second adsorption plates 48, 49 and are delivered to the third adsorption plate 55. To this end, the first or second adsorption plates 48 and 49 and the third adsorption plates 55 are rotated at an angle of 90 degrees, respectively, so that the adsorption surfaces on which the adsorption holes are formed can face each other, and also the proximity action to each other. This is done.

In FIG. 5E, the third adsorption plate 55 is rotated 90 degrees again so that the semiconductor packages face the bottom surface. As the semiconductor packages are adsorbed on the third adsorption plate 55, a flip action is performed when the semiconductor packages are placed on the buffer stage 67. That is, the marking surface, which is the second surface of the semiconductor package, faces upward.

5F, the semiconductor packages 22 placed on the buffer stage 67 are picked up by the second surface imaging camera 73. The second surface imaging camera 73 can image a plurality of semiconductor packages in a short time through its horizontal movement.

5G shows that the defective article suction nozzle 77 takes the defective article out of the buffer 78 and moves it to the defective tray 87. Since the defective article is a relatively small quantity, even a single suction nozzle 77 can be quickly taken out of the defective article.

5H shows that the good quality suction adsorption nozzle 89 takes the good semiconductor package out of the buffer 78 and moves it to the good tray 88. For taking out a relatively large number of good semiconductor packages, it is preferable that multiple nozzles 89 be provided. At this time, the buffer 78 is moved to another position from the position shown in Fig. 5G.

The inspection and classification apparatus for manufacturing a semiconductor package according to the present invention has an advantage that a plurality of semiconductor packages can be quickly and accurately inspected to determine whether there is a defect, and a classification operation can be performed accordingly. This operation is made possible in particular by a flip acting adsorptive plate, which enables cleaning and inspection processes for a number of semiconductor packages.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is only illustrative, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (5)

A first horizontal moving block movably installed in a first axial direction; A first elevating block provided on the first horizontal moving block to be capable of elevating in a second axis direction perpendicular to the first axis; A first adsorption plate connected to a rotation shaft rotatably installed on the first lifting block, and having a plurality of vacuum adsorption holes formed therein; A second horizontal moving block movably installed in the first axial direction; A second lifting block provided on the second horizontal moving block to move up and down in the second axial direction; A second suction plate connected to a rotation shaft rotatably installed at the second lifting block, and having a plurality of vacuum suction holes formed therein; A first surface imaging camera movable in the third axis direction orthogonal to the first axis and the second axis so as to image the semiconductor package adsorbed on the first suction plate; A second surface imaging camera movably installed in one side of the second lifting block in the third axial direction to capture a plurality of semiconductor packages separated by vacuum suction from the second suction plate; And, And a sorting device for inspecting a semiconductor package including a suction nozzle for picking out defective products provided on one side of the second lifting block. The method of claim 1, By rotating the first adsorption plate and the second adsorption plate to face each other, the semiconductor package vacuum adsorbed on the first adsorption plate can be vacuum adsorbed onto the second adsorption plate. Inspection and sorting device. The method of claim 1, The semiconductor package of claim 1, further comprising a washing liquid spray nozzle movably installed in the third axial direction, and a dry air spray nozzle to wash and dry the semiconductor packages adsorbed on the first adsorption plate. Inspection and sorting device. The method of claim 1, And a buffer on which semiconductor packages from which vacuum adsorption is released from the second adsorption plate are placed thereon, the imaging operation by the second surface imaging camera and the extraction operation by the adsorption nozzle for taking out the defective product are performed. A semiconductor package inspection and sorting apparatus. Adsorbing a plurality of semiconductor packages having a dicing formed on the first adsorption plate rotatably provided with a plurality of vacuum adsorption holes; Spraying a cleaning liquid and dry air on the semiconductor packages attached to the first adsorption plate; Imaging a first surface of semiconductor packages attached to the first adsorption plate; Rotating the second adsorption plate and the first adsorption plate rotatably provided with a plurality of vacuum adsorption holes formed thereon to transfer the semiconductor packages on the first adsorption plate to the second adsorption plate; Lowering the semiconductor packages in a buffer after rotating the second adsorption plate; Imaging a second side of semiconductor packages on the buffer; And, And dividing the defective article and the defective article according to the imaging results of the first and second surfaces, and inspecting and classifying the semiconductor package.