TW201735098A - Semiconductor Package Processing Apparatus - Google Patents

Abstract

The present invention relates to a semiconductor package processing apparatus capable of stably attaching and fixing a semiconductor package to a frame with a fixing film for a semiconductor package sputtering process by carrying out the semiconductor package or picking up the semiconductor package provided from a semiconductor package supply unit after removing a burr which remains in the semiconductor package by a sputtering process after separating the semiconductor package in which the sputtering process is completed, from the frame with the fixing film.

Description

Semiconductor package processing device

The present invention relates to a semiconductor package processing apparatus. More specifically, the present invention relates to removing a burr remaining in a semiconductor package by a sputtering process after separating a semiconductor package in which a sputtering process is completed from a frame having a fixed film, and then carrying The semiconductor package, or a semiconductor package provided from the semiconductor package supply portion, is picked up and stably attached to a frame having a fixed film for a semiconductor package sputtering process and fixed.

The present invention relates to a semiconductor package processing apparatus. A semiconductor package for an electronic product performs a sputtering process for an individual semiconductor package in order to block electromagnetic waves that affect the human body or to minimize electronic interference occurring between adjacent electronic products.

The sputtering process needs to be performed on an upper surface or a side surface (for example, four side surfaces) excluding a lower surface having terminals such as solder balls. Therefore, the semiconductor package does not perform the sputtering process in a state of being placed in the tray in which the semiconductor package is densely accommodated, but forms a plurality of hidden grooves in the semiconductor package that can hide the terminals of the solder balls or the like on the lower surface of the semiconductor package. Separating the distance between the semiconductor packages to separate the semiconductor packages The pattern is attached to the frame to facilitate the sputtering process on the side of the semiconductor package.

In the sputtering process of the semiconductor package, it is necessary to prevent sputtering of the bottom surface of the semiconductor package, and therefore, the sputtering process can be performed after the semiconductor package is uniformly attached to the frame. Further, the semiconductor packages which have been sputtered are respectively picked up by the selector, and are carried in a state of being loaded on a tray or the like.

In the conventional semiconductor package processing apparatus, in order to perform the sputtering process, it is difficult to uniformly attach the semiconductor package during the process of attaching the semiconductor package to the fixed film formed on the frame, resulting in a delay in the process.

Further, a burr or the like formed by the sputtering deposition material remains on the periphery of the edge where the bottom surface and the side surface of the semiconductor package in which the sputtering is completed, and the burr needs to be removed by manual work, thereby reducing work efficiency. And it is difficult to use an automation device.

The problem to be solved by the present invention is to provide a semiconductor package processing apparatus that removes a burr remaining in a semiconductor package by a sputtering process after separating a semiconductor package that has completed a sputtering process from a frame having a fixed film, and then transports the semiconductor package. The semiconductor package or the semiconductor package provided from the semiconductor package supply portion is picked up and stably attached to a frame having a fixed film for a semiconductor package sputtering process and fixed.

In order to solve the above problems, the present invention provides a semiconductor package The package processing apparatus includes: a frame supply recovery portion for supplying a frame for performing a sputtering process in a state in which a plurality of semiconductor packages are attached, and recovering an empty frame separating the semiconductor packages; the semiconductor package a separation portion that picks up a semiconductor package attached to the supplied frame using a detection selector to separate the semiconductor package from the frame; a semiconductor package deburring portion including a plurality of deburring units, The deburring unit removes burrs remaining on the semiconductor package during transfer of the semiconductor package separated from the semiconductor package separating portion; a plurality of blocks for loading through the detection selector a semiconductor package picked up, or a semiconductor package for loading burrs; and a semiconductor package loading portion that picks up the deburred semiconductor package loaded on the block through an unloading selector and It is mounted on a tray for semiconductor package handling.

At this time, the semiconductor package deburring portion further includes a cleaning selector, and the cleaning selector picks up the semiconductor package loaded on the block and transfers to the upper portion of the deburring unit. The deburring unit includes: a first deburring unit including one or more rotating brushes having a vertical rotation axis; and a second deburring unit including a roller brush having a horizontal rotation axis, the first deburring The unit and the second deburring unit are arranged side by side to remove burrs in sequence.

And, the block includes: a first block for loading a semiconductor package separated from the semiconductor package separation portion through the detection selector; and a second block for loading a transmission a semiconductor package for removing burrs by a cleaning selector, the first block and the first The two blocks are transferred independently of each other in the Y-axis direction.

Further, a plurality of rotating brushes constituting the first deburring unit are respectively attached to a rotating member having a thread formed on an outer peripheral surface thereof, and each of the rotating members and the adjacent rotating member are screwed to each other, and a plurality of rotations are performed. When one of the rotating members is rotationally driven by the rotary motor, all of the rotating members are simultaneously rotated.

Here, the rotating brush constituting the first deburring unit is vertically implanted with a large number of clusters of bristles, and the second deburring unit is radially implanted with a large number of bristles on its elongated rotating shaft. The rotating shaft is driven by a drive shaft of the motor and a drive belt.

At this time, the deburring unit further includes a third deburring unit, and the third deburring unit is parallel to the first deburring unit and the second deburring unit behind the second deburring unit The third deburring unit includes a fan and a suction flow path, and the fan passes through a semiconductor package that removes burrs in the second deburring unit to a side direction or a bottom direction of the semiconductor package or The compressed air is jetted in the diagonal direction to remove burrs remaining in the semiconductor package.

In order to solve the above problems, the present invention also provides a semiconductor package processing apparatus including: a semiconductor package supply portion for supplying a sputter object semiconductor package; a semiconductor package attaching portion which picks up the semiconductor by using an additional selector a semiconductor package supplied from a package supply portion, and attaching the semiconductor package to a fixed film, the fixed film being disposed in an annular frame for a sputtering process; and a semiconductor package pressing portion facing from the upper portion to the semiconductor Attached to the frame in the attachment portion of the package The semiconductor package of the fixed film applies pressure to enhance the adhesion state of the semiconductor package and the fixed film; and the frame supply recovery portion supplies an empty frame to the semiconductor package attachment portion to attach the semiconductor package to the After the fixing film of the frame is described, a frame that is pressurized at the pressing portion of the semiconductor package is recovered.

Further, the semiconductor package supply portion includes: a first supply portion disposed in front of the semiconductor package attaching portion centering on the semiconductor package attaching portion, cutting the semiconductor strip and supplying the semiconductor package; and The second supply portion is disposed behind the semiconductor package attaching portion centering on the semiconductor package attaching portion for supplying the singulated semiconductor package mounted on the tray.

The first supply portion here includes: a semiconductor strip supply portion for supplying a semiconductor strip; a semiconductor strip cutting portion for cutting the supplied semiconductor strip into a plurality of semiconductor packages; a cell selector, Disposing the semiconductor package to a drying device via a washing device in a state of picking up a plurality of semiconductor packages to be cut; drying device for adsorbing the semiconductor package received from the cell selector, Moving in the X-axis direction on the XY plane and rotating on the Y-axis; and, the entire column, the loading slot for loading the semiconductor package and the non-loading portion of the unloaded semiconductor package along the X-axis and the Y-axis The directions are alternately formed and move in the Y-axis direction.

Further, the semiconductor package sucked by the drying device is loaded on the entire row or the semiconductor package sucked by the drying device is directly attached to the fixed film of the semiconductor package attaching portion.

And, the semiconductor package mounted on the entire array is picked up by the additional selector and attached to the fixed film of the semiconductor package attachment portion.

Here, the semiconductor package pressing portion is transferred in a direction perpendicular to a transfer direction of the frame, the semiconductor package pressing portion including at least one pressing member, a setting direction of the pressing member and transfer of the frame The direction is perpendicular and parallel to the transfer direction of the semiconductor package pressing portion.

Further, the semiconductor package pressing portion is raised and lowered along the Z-axis direction, and the pressing member of the semiconductor package pressing portion is mounted with the elastic member as a medium to elastically support and pressurize the semiconductor package.

According to the semiconductor package processing apparatus of the present invention, after the semiconductor package which completes the sputtering process is separated from the frame having the fixed film, the deburring portion is effectively removed by the semiconductor package having various brushes or fans by the sputtering process After the burrs of the semiconductor package, the semiconductor package is carried.

Further, according to the semiconductor package processing apparatus of the present invention, after the semiconductor package provided from the semiconductor package supply portion is picked up and attached to the frame having the fixed film for the semiconductor package sputtering process, the semiconductor package is pressed Further pressure is applied to the portion to enhance the adhesion state of the semiconductor package.

1‧‧‧Semiconductor package processing device

1'‧‧‧Semiconductor package processing unit

100‧‧‧Frame Supply and Recycling Department

120‧‧‧Frame selector

200‧‧‧Semiconductor Package Separation Department

200‧‧‧ semiconductor package attachment

210‧‧‧Frame selector

230‧‧‧Detector selector

231‧‧‧ picking unit

250‧‧‧Unload selector

251‧‧‧ picking unit

300‧‧‧Decapture part of semiconductor package

310‧‧‧First deburring unit

311‧‧‧Rotary brush

311a‧‧‧bristles

311b‧‧‧ body parts

313‧‧‧Rotating parts

313a‧‧‧Mounting holes

313b‧‧ thread

313c‧‧‧Fixed shaft

314‧‧‧ bearing

315‧‧‧Installation parts

315b‧‧‧Installation port

316‧‧‧ bolt

317‧‧‧Rotary motor

318‧‧‧Inhalation flow path

319‧‧‧ Cover

319h‧‧‧Sucking hole

330‧‧‧Second deburring unit

331‧‧‧Rolling brush

331x‧‧‧ horizontal axis of rotation

336‧‧‧ Cover

337‧‧ ‧motor

337b‧‧‧ drive belt

337x‧‧‧ drive shaft

338‧‧‧Inhalation flow path

350‧‧‧ Third deburring unit

350a‧‧‧ Third deburring unit

350b‧‧‧ Third deburring unit

350c‧‧‧ third deburring unit

350d‧‧‧third deburring unit

351c‧‧‧fixed brush

351d‧‧‧ fan

354a‧‧‧ Cover

354a1‧‧‧jet flow path

354a2‧‧‧jet flow path

354a3‧‧‧ burr space

354a4‧‧‧Inhalation flow path

354a5‧‧‧jet

354b1‧‧‧jet flow path

354b5‧‧‧ sloped surface

358c‧‧‧Inhalation flow path

358d‧‧‧Inhalation flow path

370‧‧‧cleaning selector

371‧‧‧ Pickup unit

400‧‧‧Semiconductor package loading department

400‧‧‧ Semiconductor package adsorption department

410‧‧‧Tray selector

430‧‧‧Transport box

510‧‧‧ first block

511‧‧‧Loading trough

520‧‧‧Drying device

530‧‧‧Second block

530‧‧‧ Entire list

531‧‧‧Loading trough

531a‧‧‧Loading trough

531b‧‧‧Loading trough

600‧‧‧Semiconductor strip cutting device

600g‧‧‧ clip

610‧‧‧ entrance track

615‧‧‧ Strip Selector

630‧‧‧Cutting unit

640‧‧‧Washing unit

650‧‧‧ chuck table

670‧‧‧Unit selector

700‧‧‧Semiconductor package press

700‧‧‧ box

710‧‧‧ Pressing parts

710'‧‧‧ Pressing parts

720‧‧‧Flexible parts

730‧‧‧pressure bar

730‧‧‧ Pressing Department

740‧‧‧ Lifts

810a‧‧‧Additional selector

810b‧‧‧Additional selector

811a‧‧‧ picking unit

811b‧‧‧ picking unit

A‧‧‧Semiconductor Package Supply Department

e‧‧‧Injector

Tf‧‧‧

Tr‧‧‧Tray

Vu1‧‧‧second vision unit

Vu2‧‧‧second vision unit

Vu3‧‧‧ third visual unit

Vu5‧‧‧ fifth visual unit

Vu6‧‧‧ sixth vision unit

Vu7‧‧‧ seventh vision unit

Vu8‧‧‧ eighth visual unit

Vu9‧‧‧ eighth visual unit

Vu10‧‧‧10th visual unit

Vu11‧‧‧ eleventh visual unit

1 is a top plan view of one embodiment of a semiconductor package processing apparatus of the present invention.

2 is an exploded perspective view of a first deburring unit constituting a deburring portion of a semiconductor package of the semiconductor package processing apparatus of the present invention.

3 is a cross-sectional view showing a first deburring unit of a semiconductor package deburring portion constituting the semiconductor package processing apparatus of the present invention.

4 is a cross-sectional view showing a second deburring unit of a semiconductor package deburring portion constituting the semiconductor package processing apparatus of the present invention.

Figure 5 is a cross-sectional view showing one embodiment of a third deburring unit constituting a deburring portion of a semiconductor package of the semiconductor package processing apparatus of the present invention.

Fig. 6 is a schematic view showing the detailed operation state of the third deburring unit shown in Fig. 5.

Fig. 7 is a cross-sectional view showing a third deburring unit of still another embodiment of a deburring portion of a semiconductor package constituting the semiconductor package processing apparatus of the present invention.

Figure 8 is a cross-sectional view showing a third deburring unit of another embodiment of a deburring portion of a semiconductor package constituting the semiconductor package processing apparatus of the present invention.

Figure 9 is a cross-sectional view showing one embodiment of a semiconductor package deburring portion of the semiconductor package processing apparatus of the present invention.

Figure 10 is a cross-sectional view showing still another embodiment of the deburring portion of the semiconductor package of the semiconductor package processing apparatus of the present invention.

11 is a semiconductor package of a semiconductor package processing apparatus of the present invention; A cross-sectional view of yet another embodiment of a deburring portion.

Figure 12 is a plan view showing still another embodiment of the semiconductor package processing apparatus of the present invention. Figure 13 is a plan view showing still another embodiment of the semiconductor package processing apparatus of the present invention.

Figure 14 is a top plan view of still another embodiment of a semiconductor package processing apparatus of the present invention.

Figure 15 is a plan view showing still another embodiment of the semiconductor package processing apparatus of the present invention.

Fig. 16 is a perspective view and an enlarged view showing an embodiment of a semiconductor package pressing portion constituting the semiconductor package processing apparatus of the present invention.

Fig. 17 is a view showing an operational state of the pressing portion of the semiconductor package shown in Fig. 16.

Fig. 18 is a perspective view and an enlarged view showing still another embodiment of a semiconductor package pressing portion constituting the semiconductor package processing apparatus of the present invention.

Fig. 19 is a view showing the operational state of the pressing portion of the semiconductor package shown in Fig. 18.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein, but may be embodied in other forms. Instead, the embodiments described herein are intended to be thorough, and are also used to fully convey the inventive concept to those of ordinary skill in the art. In the entire specification, the same reference numerals denote the same structural elements.

1 is a view of a semiconductor package processing apparatus 1 of the present invention Top view of one embodiment.

The semiconductor package processing apparatus 1 of the present invention includes a frame supply and collection unit 100 that supplies a frame (not shown) that performs a sputtering process in a state in which a plurality of semiconductor packages are attached, and recovers a frame in which the semiconductor package is separated; a package separating portion 200 that picks up a separate semiconductor package from a frame supplied from the frame supply collecting portion 100 through a detecting selector 230; and a semiconductor package deburring portion 300 including a first deburring unit 310 and a second In the deburring unit 330, the first deburring unit 310 includes a semiconductor package that is separated from the semiconductor package separating portion 200 by the transmission detecting selector 230, and is loaded on the first block 510 that can be transferred along the Y-axis direction and is directed to the semiconductor. After the package deburring portion 300 is transferred, in the state of being transferred by the cleaning selector 370, in order to wipe off the burrs remaining in the semiconductor package, at least one rotating brush 311 having a vertical rotation axis, the second The deburring unit 330 includes a roller brush 331 having a horizontal rotation axis, the first deburring unit 310 and the second deburring unit The element 330 includes a suction flow path for sucking the burrs separated by the brush, and the semiconductor package in which the deburring portion 300 of the semiconductor package is deburred is loaded by the cleaning selector 370 to the second seat which can be transferred along the Y-axis direction. After block 530, it is transferred to the unload selector 250 side. The semiconductor package mounted on the second block is picked up by the unloading selector 250, and is loaded in the semiconductor package carrying tray tr in the semiconductor package loading portion 400.

The semiconductor package processing apparatus 1 shown in FIG. 1 is attached to the annular frame with respect to the fixed film to which the sputtered object semiconductor package is attached After the sputtering process is performed in the state of the circumferential surface, the semiconductor package processing apparatus 1 remaining in the burr of the semiconductor package is removed after the semiconductor package is separated from the fixed film.

The semiconductor package can perform a sputtering process in a state in which only the upper surface and the side surface are exposed, and adhered to the fixed film provided at the center portion of the annular frame.

The semiconductor package processing apparatus 1 shown in FIG. 1 takes out the semiconductor package pickup object frame from the frame supply and collection unit 100 with a clip, and transfers the semiconductor package pickup object frame to the semiconductor package separation unit 200 through the frame selector 120. The frame selector 120 described above may have a first visual unit vu1 for imaging inspection of the frame being transferred.

The above-described semiconductor package separating portion 200 may have a stage tf on which a frame to which an evaporated semiconductor package is attached may be placed.

The semiconductor package attached to the fixed film of the frame placed on the above-mentioned stage tf can be separated from the fixed film by the injector e and the detecting selector 230 and picked up.

In a state in which the frame of the fixed film having the sputter-treated semiconductor package is placed on the stage, the semiconductor package can be separated from the fixed film by the ejector e disposed under the stage tf, and the separated semiconductor package can pass through the above The detection selector 230 picks up and can load it on the first block.

Moreover, in the embodiment shown in Fig. 1, the table tf and the detection selector 230 can be transferred to the Y-axis, and the injector e can be transferred to the X-axis.

And, in the detection selector for picking up the semiconductor package The 230 has a plurality of pickup units 231 arranged in a row along the Y-axis direction, and the pickup units respectively adsorb the semiconductor packages or release the adsorption of the semiconductor packages.

Therefore, the semiconductor package which is located at any position of the ring frame by the above-described injector e and the above-described detection selector 230 can be picked up through the detection selector 230.

In the above-described semiconductor package separating portion 200, burrs may remain on the semiconductor package from which the fixed film of the stage is separated by the ejector e and the detecting selector 230.

Therefore, the semiconductor package processing apparatus 1 of the present invention may be provided with a semiconductor package deburring portion 300 for removing the semiconductor package. In the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention shown in Fig. 1, since the semiconductor package has various deburring units, the deburring operation can be performed in stages. The embodiment shown in Fig. 1 shows an example having three kinds of deburring units, and the above-described semiconductor package deburring portion 300 will be described in detail with reference to the drawings subsequent to Fig. 2.

The ejector e of the semiconductor package separating portion 200 sequentially strikes the bottom surface of the semiconductor package attached to the fixed film, so that the plurality of pick-up units provided in the detecting selector 230 can pick up the semiconductor package separated from the fixed film. The burr remaining in the above semiconductor package can be removed at the deburring portion 300. A separate cleaning selector 370 and a plurality of deburring units that are disposed in the X-axis direction of the semiconductor deburring portion 300 may be included.

The above-described cleaning selector 370 shown in FIG. 1 is in the above-described semi-conductive The state in which the body package deburring portion 300 picks up the semiconductor package is transferred to the upper portion of each deburring unit in the X-axis direction and the burr is removed. Since the semiconductor package deburring portion 300 has a plurality of deburring units arranged in parallel along the Y-axis direction, the cleaning selector transferred in the X direction can clean the semiconductor package picked up in the Y-axis direction at one time.

As described below, in the plurality of deburring units constituting the semiconductor package deburring portion 300, a plurality of deburring units are arranged side by side, and the plurality of deburring units may be respectively constituted by brush units, and thus, through the cleaning selector The 370 picks up the semiconductor selector to pass through the deburring unit, and the burr remaining in the semiconductor package can be removed by brush rubbing or wind pressure.

Therefore, the burrs of the semiconductor package can be completely removed in sequence through the plurality of deburring units.

In the above-described semiconductor package separating portion 200, the semiconductor package picked up by the detecting selector 230 needs to be transferred to the semiconductor package deburring portion 300 to be picked up by the cleaning selector 370 of the semiconductor package deburring portion 300.

To this end, the semiconductor package processing apparatus 1 of the present invention shown in FIG. 1 includes a first block 510 that goes to the semiconductor package in which the semiconductor package separation portion 200 is picked up by the detection selector 230. The burr portion 300 is transferred; and a second block 530 is loaded with the first block and the burr-deposited semiconductor package and transferred.

The semiconductor package transferred from the first block 510 to the semiconductor package deburring portion 300 is disposed on the X-axis of the semiconductor package deburring portion 300 that can be transferred to the X-axis cleaning selector 370. The direction is transferred and a cleaning operation can be performed.

As described above, the respective burr take-out units constituting the deburring portion 300 of the above-described semiconductor package are arranged side by side in the Y-axis direction, thereby performing semiconductors arranged in a row in the Y-axis direction on the cleaning selector 370 transferred to the X-axis in stages. The deburring process of the package allows complete removal of the burrs.

The package picked up by the above-described cleaning selector 370 and completing the deburring process is transferred along the transfer path of the unloading selector 250 in a state of being placed on the second block 530, so that it can be loaded on the semiconductor package through the unloading selector 250. Department 400.

The detection selector 230 and the cleaning selector 370 are respectively transferred in the Y-axis direction, and the detection selector 230 and the cleaning selector 370 are provided with a plurality of pickup units 231 and 251 at corresponding pitches in the Y-axis direction. In the first block 510 and the second block 530, the loading grooves 511 and 531 are formed corresponding to the intervals of the respective pick-up units.

Therefore, the semiconductor package selected by the above-described detection selector 230 is loaded once after being loaded into the first block 510, so that the cleaning operation can be picked up and executed by the cleaning selector 370 at one time.

A fifth vision unit vu5 for inspecting a mold face as an upper face of the semiconductor package transferred in the first block 510 described above may also be included.

In the embodiment shown in FIG. 1, the semiconductor package deburring unit includes a first deburring unit 310 to a third deburring unit 350, and in the state selected by the cleaning selector 370, in the first The burr unit 310 to the third deburring unit 350 sequentially perform a deburring operation, and after the cleaning operation is completed, are transferred in the reverse order through the cleaning selector 370, the second block 530, and the unloading selector 250, thereby The semiconductor package in which the burr of the semiconductor package deburring portion 300 is burred is picked up by the unloading selector 250 so as to be transportable through the semiconductor package loading portion 400 mounted on the semiconductor package carrying tray.

It is also possible to have a second visual unit vu2 and a third visual unit vu3 for inspecting the bottom surface or the side surface of the above-described semiconductor package picked up and transported through the unloading selector 250.

The semiconductor package mounting portion 400 includes a tray selector 410, whereby the transport tray tr filled with the semiconductor package can be transported, and the empty transport tray tr can be supplied to the loading position of the unloading selector 250.

Further, when the semiconductor package is judged to be defective or the semiconductor package is small in size and difficult to be mounted on the tray, the semiconductor package can be collected through another carrier 430 or the like instead of being transported. Tray collection.

Hereinafter, the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention will be described in detail.

The semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention includes: a first deburring unit 310 including at least one rotating brush 311 having a rotating shaft, the rotating brush being separated from the semiconductor package Part 200 of the semiconductor package is picked up a state in which the state is transferred to erase a burr remaining in the semiconductor package; and a second deburring unit 330 including a roller brush 331 having a horizontal rotation axis, the first deburring unit 310 and the second The deburring unit 330 may be provided with a suction flow path for sucking a burr separated by a brush.

Hereinafter, a deburring unit constituting the semiconductor package deburring portion 300 will be described.

2 is an exploded perspective view of the first deburring unit 310 of the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention, and FIG. 3 is a semiconductor package constituting the semiconductor package processing apparatus 1 of the present invention. A cross-sectional view of the first deburring unit 310 of the burr portion 300.

The first deburring unit 310 described above may include a plurality of rotating brushes 311 having a vertical axis of rotation. The rotating brush 311 constituting the first deburring unit 310 described above has a large number of bristles 311a grouped in the vertical direction so as to be implantable in the main body member 311b.

Specifically, the rotating brush 311 constituting the first deburring unit 310 is arranged in a plurality of rows, and the plurality of rotating brushes 311 constituting the first deburring unit 310 can be separated from the semiconductor package separating portion 200 perpendicularly. The Y-axis direction of the transfer trajectory of the cleaning selector 370 of the semiconductor package is formed in a row.

Further, as shown in FIG. 2, the plurality of rotating brushes 311 constituting the first deburring unit 310 may be attached to the rotating member 313 having the screw 313b formed on the outer peripheral surface thereof.

The rotating member 313 includes the above-described body member 311b The mounting hole 313a and the fixed shaft 313c, which are supported by the bearing 314, are rotatably coupled to the mounting opening 315b formed in the mounting member 315 by the fastening bolt 316.

As shown in FIG. 3, each of the rotating members 313 of the first deburring unit 310 and the adjacent rotating members 313 are disposed such that the threads 313b are mutually coupled, whereby one of the plurality of rotating members 313 is rotated. When the 313 is rotationally driven by the rotary motor, the entire rotating member 313 is rotated together, so that only one rotary motor 317 for rotating the rotating brush 311 can be provided.

Further, the outer cover 319 to which the rotary brush 311 constituting the first deburring unit 310 is rotatably attached may be formed with a suction flow path 318 for sucking the burrs separated by the brush.

Therefore, the semiconductor package can be transferred over the rotating brush of the first deburring unit 310, and if the burr remaining in the semiconductor package is separated, it falls to the outer cover 319, and the burr falls through the suction hole 319h of the outer cover 319. Can be discharged to the outside.

As shown in FIG. 3, the plurality of rotating brushes 311 are respectively rotatable about a vertical axis of rotation by rotation of a rotary motor 317, so that they can be picked up by the cleaning selector 370 and transmitted through the rotating brush 311. The burr removal operation of a plurality of semiconductor package columns arranged side by side. Moreover, the embodiment shown in FIGS. 1 and 3 shows an example in which a row of rotating brushes 311 are arranged side by side in the first deburring unit 310. However, depending on the type and size of the semiconductor package or the diameter of the rotating brush, etc., Has a multi-column rotating brush.

4 is a cross-sectional view showing a second deburring unit 330 of the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention.

As described with reference to FIG. 1, after being separated from the semiconductor package separating portion 200 together with the second deburring unit 330, it may be arranged side by side perpendicular to the direction of the transfer trajectory of the semiconductor package picked up by the cleaning selector 370.

The second deburring unit may have a roller brush 331 that rotates around the horizontal rotation axis 331x. The second deburring unit 330 radially implants a large number of bristles on the long rotating shaft 331x, and can be driven by the driving shaft 337x of the motor 337 and the driving belt 337b even if the rotating shaft is not orthogonal to the motor.

Further, similarly to the first deburring unit 310 described above, the outer cover 336 to which the second deburring unit 330 is rotatably attached with the roller brush 331 may have a suction flow path 338 for sucking burrs separated by the brush.

Therefore, when the semiconductor package is transferred to the upper portion of the roller brush 331 of the second deburring unit 330 to separate the burrs remaining in the semiconductor package, the semiconductor package is dropped, and the burr or the like falling to the outer cover 336 is transmitted through the suction flow. The road 338 is sucked in so as to be discharged to the outside as well.

In the embodiment shown in Figs. 1 and 4, the roller brush 331 constituting the second deburring unit 330 is provided in the Y-axis direction, and the roller brush 331 disposed in the Y-axis direction can be divided into many. Alternatively, the plurality of roller brushes 331 may be disposed in parallel with each other.

In addition to the first deburring unit 310 having the rotating brush 311 and the second deburring unit 330 having the roller brush 331, the semiconductor package processing apparatus 1 of the present invention may further include a third for removing burrs remaining in the semiconductor package Deburring unit 350.

The first deburring unit 310 and the second deburring unit 330 frictionally separate the burrs remaining in the semiconductor package in the sputtering process using a brush or the like. However, when the burr separated from the semiconductor package remains in the semiconductor package due to static electricity or the like, the third deburring unit 350 may be provided in order to remove the burr.

The third deburring unit 350 described above may include a fan or a stationary brush or the like instead of a rotary brush. Description will be made with reference to Figs. 5 to 7 .

Fig. 5 is a cross-sectional view showing an embodiment of a third deburring unit 350a constituting the semiconductor package deburring portion 300 of the semiconductor package processing apparatus 1 of the present invention.

Fig. 6 shows a detailed operational state of the third deburring unit 350a shown in Fig. 5.

The rear side of the second deburring unit 330 has a third deburring unit 350a, the third deburring unit 350a is parallel to the first deburring unit 310 and the second deburring unit 330, and the third deburring unit 350a It can have a fan and a suction flow path.

The third deburring unit 350a shown in FIGS. 5 and 6 may have a fan. After the semiconductor package in which the burr is removed by the second deburring unit 330 is transferred to the third deburring unit 350, the fan of the third deburring unit 350a is turned to the side of the semiconductor package in the lowered state. The compressed air is jetted in the plane direction and the bottom surface direction to remove burrs remaining in the semiconductor package.

The outer cover 354a of the fan constituting the third deburring unit 350a is formed with a deburring space 354a3 in the center portion in the Y-axis direction, and injection passages 354a1, 354a2 and injection ports 354a5 having compressed air on the side and bottom surfaces of the deburring space. So that compressed air can be injected. Further, the spurs separated and scattered by the compressed air are sucked through the suction flow path 354a4 connected to the outer cover of the fan and discharged to the outside.

As shown in the enlarged view of Fig. 6, in order to eject compressed air to the side surface and the bottom surface of the semiconductor package picked up through the cleaning selector 370, it is necessary to dispose a semiconductor inside the deburring space 354a3 formed in the outer cover of the fan. The package, therefore, the pickup unit 371 of the above-described cleaning selector 370 needs to be lowered by a predetermined height.

That is, in the embodiment shown in FIGS. 5 and 6, the cleaning selector 370 that has passed through the upper portions of the first deburring unit 310 and the second deburring unit 330 and is transferred at a predetermined height needs to be temporarily suspended in the third deburring unit 350. The lowering is performed to inject compressed air to the side and bottom surfaces of the semiconductor package. Therefore, in the embodiment shown in Figs. 5 and 6, in order to perform the deburring operation by the third deburring unit 350 through the fan, the cleaning selector 370 needs to be temporarily lowered, which may become a factor of the process delay.

Fig. 7 is a cross-sectional view showing a third deburring unit 350b of still another embodiment of the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention.

The fan of the above-described third deburring unit 350 shown in FIG. The inner surface of the outer cover of the fan constituting the third deburring unit 350b below the semiconductor package is transferred after the semiconductor package for removing the burr in the second deburring unit 330 is transferred to the upper side of the third deburring unit 350b. The inclined surface 354b5 is sprayed with compressed air in a diagonal direction by the inclined surface 354b5.

Therefore, unlike the embodiment shown in FIGS. 5 and 6, in the embodiment shown in FIG. 7, in the state where the cleaning selector 370 is transferred to the upper side of the third deburring unit 350, there is no additional down action. The compressed air ejected from the ejection flow path 354b1 and the ejection opening is ejected toward the bottom surface and the side surface of the semiconductor package along the inclined surface 354b5 of the outer cover, so that the burr remaining in the semiconductor package can be removed.

Fig. 8 is a cross-sectional view showing a fixed brush unit of the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention.

The embodiment shown in FIGS. 5 to 7 uses the above-described third deburring unit 350 to remove burrs remaining in the semiconductor package through the fan-based compressed air.

As described above, the third deburring unit 350 described above is used to assist in blowing or removing burrs or the like which are not completely removed in the semiconductor package.

Therefore, the third deburring unit 350 can also use a stationary brush instead of a rotating brush. Similarly, the separated burrs can be discharged to the outside through the suction flow path.

In the embodiment shown in FIG. 8, a third deburring unit 350c is disposed behind the second deburring unit 330, the third deburring unit 350c and the first deburring unit 310 and the second deburring unit. The element 330 is parallel, and the third deburring unit 350c has a fixed brush 351c, and may have a suction flow path 358c at the center of the fixed brush 351c.

In the case of including the fixed brush 351c as described above, as in the embodiment shown in Fig. 7, in the cleaning process through the third deburring unit 350, even if the cleaning selector 370 does not descend, the fixed type brush can be used. The weak friction is used to remove residual burrs, and the removed burrs can be sucked through the suction flow path and discharged.

The semiconductor package processing apparatus 1 of the present invention shown in FIG. 1 picks up a semiconductor package from a frame or the like to which a semiconductor package for sputtering is attached, and removes burrs remaining in the semiconductor package after the semiconductor package deburring portion 300 Loading in the loading slot 531 of the second block 530.

As described above, the semiconductor package deburring portion 300 constituting the semiconductor package processing apparatus 1 of the present invention includes: a first deburring unit 310 having a rotating brush 311; and a second deburring unit 330 having a roller brush The 331, and may further include a third deburring unit 350, which includes a fan or a stationary brush.

Further, as explained with reference to FIG. 1, the first deburring unit 310 to the third deburring unit 350 may be arranged side by side in the Y-axis direction perpendicular to the X-axis direction which is the transfer direction of the cleaning selector 370. .

The process in which the cleaning selector 370 picks up the semiconductor package and penetrates the semiconductor package deburring portion 300 and removes the burrs will be described with reference to FIG. 9 and subsequent figures.

Figure 9 is a half of the semiconductor package processing apparatus 1 of the present invention FIG. 10 is a cross-sectional view showing another embodiment of the semiconductor package deburring portion 300 of the semiconductor package processing apparatus 1 of the present invention, and FIG. 11 is a semiconductor package of the present invention. FIG. A cross-sectional view of still another embodiment of the semiconductor package deburring portion 300 of the processing device 1.

Specifically, the third deburring unit 350a of FIG. 9 includes the fan unit of FIGS. 5 and 6 described above, and the third deburring unit 350c of FIG. 10 includes the fixed type brush of FIG. 8, and the third deburring unit of FIG. The 350d includes a new form of fan.

In the embodiment shown in FIG. 9, the semiconductor package picked up through the cleaning selector 370 can be horizontally transferred to a height at which the bottom surface and the side surface of the semiconductor package can rub against the rotating brush 311 or the roller brush 331.

Thereby, the burrs remaining on the semiconductor package transferred in the state picked up by the cleaning selector 370 are sequentially removed by the rotating brush 311 and the roller brush 331, and then transferred to the upper side of the third deburring unit 350.

The third deburring unit 350a may include a fan. As described with reference to FIGS. 5 and 6, the compressed air is ejected toward the side surface and the bottom surface of the semiconductor package in a state where the inside of the burr removing space has the semiconductor package. The above cleaning selector 370 needs to be lowered.

After the third deburring unit 350a completes the cleaning of the semiconductor package, the cleaning selector 370 rises so that the semiconductor package is not handled in contact with the rotating brush or the roller brush 331 or the like.

In contrast, in the embodiment shown in FIG. 10, the third deburring unit 350c includes a fixed type brush, and thus, unlike the embodiment shown in FIG. 9, There is no need to drop the semiconductor package in order to eject compressed air.

Therefore, in the embodiment shown in FIG. 10, the semiconductor package can be transferred in the horizontal direction after being sequentially transferred in contact with the brushes of the first deburring unit 310, the second deburring unit 330, and the third deburring unit 350c. Cleaning.

Unlike the fan of Figs. 5 to 7, the third deburring unit 350d of the embodiment shown in Fig. 11 has a structure in which the suction flow path and the fan are separated.

That is, the fan 351d of the embodiment shown in Fig. 11 has a wind blade shape and has a structure in which compressed air can be ejected in the diagonal direction of the transferred semiconductor package, and a suction flow path 358d is provided behind the fan. Distinguish between the injection position of the compressed air and the suction position of the scattered burr.

After the semiconductor package in which the sputtering process is completed is separated from the frame having the fixed film by the above method, the semiconductor package of the semiconductor package having various brushes or fans is effectively removed by the sputtering process, and the semiconductor package is removed and the semiconductor is carried. Package.

The semiconductor package processing apparatus 1 of the present invention described with reference to FIGS. 1 to 11 separates the sputtered semiconductor package from the fixed film of the frame and removes the burr remaining in the semiconductor package, and then loads it on the transfer tray. The device that tr carries.

Further, the semiconductor package processing apparatus 1 of the present invention may include a semiconductor package that is picked up from the semiconductor package supply unit A for the sputtering process and attached to the frame having the fixed film for the sputtering process. Rack of equipment.

Specifically, the present invention can provide a semiconductor package processing apparatus 1' including: a semiconductor package supply portion A for supplying a sputter object semiconductor package; and a semiconductor package attaching portion 200 which is picked up by a selector a semiconductor package supplied from the semiconductor package supply unit A, and attaching the semiconductor package to a fixed film formed on a central portion of the annular frame for the sputtering process; the semiconductor package pressing portion 700 attached to the semiconductor package The portion 200 applies pressure to the semiconductor package attached to the fixed film of the frame from the upper portion to enhance the adhesion state of the semiconductor package and the fixed film; and the frame supply and recovery portion 100 supplies the semiconductor package attaching portion 200 with an empty space. The frame and the frame of the semiconductor package that is pressed at the semiconductor package pressing portion 700 described above are carried.

Fig. 12 is a plan view showing still another embodiment of the semiconductor package processing apparatus 1' of the present invention.

Unlike the semiconductor package processing apparatus 1 shown in FIG. 1, the semiconductor package processing apparatus 1' shown in FIG. 12 is obtained by picking up a sputtered object semiconductor package mounted on a supply tray through a selector, in a semiconductor package. The attaching portion 200 attaches the semiconductor package to an empty frame supplied from the frame supply and collection unit 100.

Further, the semiconductor package processing apparatus 1 shown in FIG. 1 is a semiconductor package in which the sputtering is separated from the semiconductor package separation portion 200, and then the burr is removed in the semiconductor package deburring portion 300 and loaded on the carrier tray. Transportation, however, the semiconductor package processing apparatus 1' shown in FIG. 12 may be provided with a semiconductor package pressing portion 700 for use in the above The semiconductor package attaching portion 200 applies pressure from the upper portion to the semiconductor package attached to the fixed film of the frame, thereby reinforcing the adhesion state of the semiconductor package and the fixed film.

Further, the transport tray and the detection selector 230 of the semiconductor package processing apparatus 1 shown in FIG. 1 correspond to the supply tray and the additional selectors 810a and 810b of the semiconductor package processing apparatus 1' shown in FIG. Further, the above-described additional selectors 810a and 810b shown in FIG. 12 are provided with a plurality of pickup units 811a and 811b which are arranged in the transport direction and are independently driven, and are also identical to the above-described detection selector 230 shown in FIG.

In addition, the frame in which the sputtering process is performed is attached to the state in which the plurality of semiconductor packages of the semiconductor package processing apparatus 1 shown in FIG. 1 are attached, and the frame supply and collection part 100 of the frame in which the semiconductor package is separated is collected and shown in FIG. The semiconductor package attaching portion 200 of the semiconductor package processing device 1' is supplied with an empty frame, and corresponds to the frame supply and recovery portion 100 to which the frame of the semiconductor package in which the semiconductor package pressing portion 700 is pressurized is attached. .

Further, in the semiconductor package deburring portion 300 of the embodiment shown in FIG. 1, the burr-removed semiconductor package is picked up by the selector and loaded on the semiconductor package carrying tray tr of the semiconductor package loading portion 400. It is possible to correspond to the semiconductor package supply portion A supplied to the sputter object semiconductor package of the embodiment shown in FIG. 12, and to select from the frame supplied from the frame supply recovery portion 100 of the embodiment shown in FIG. The semiconductor package separating portion 200 for picking up and separating the semiconductor package and the semiconductor package attaching portion of the embodiment shown in FIG. Corresponding to 200, the semiconductor package attaching portion is for picking up the semiconductor package provided by the semiconductor package supply portion A through a selector and attaching it to a center portion of a ring frame provided for a sputtering process. Fix the tape.

In summary, the semiconductor package processing apparatus shown in FIG. 1 and the semiconductor package processing apparatus shown in FIG. 12 have similar layouts, respectively, but the difference is that the transfer path of the semiconductor package is reversed, and whether removal is performed. The processing of the burr or the processing of the pressing action for enhancing the adhesion state of the semiconductor package and the fixed film.

The semiconductor package pressing portion 700 of the embodiment shown in FIG. 12 can be attached in the X-axis direction, and at least one of the pressing members constituting the semiconductor package pressing portion 700 can also be formed in an elongated shape in the X-axis direction.

Further, as shown in FIG. 12, in the semiconductor package attaching portion 200, the transfer direction of the stage and the transfer direction of the additional selectors 810a, 810b may be perpendicular to each other.

The embodiment shown in FIG. 12 may include: a sixth visual unit vu6 for imaging inspection of a station transferred by the frame selector 210 in the frame supply and collection unit 100; an eighth visual unit vu8 and a ninth visual unit vu10, Mounted to a pair of additional selectors 810a, 810b for performing a lower imaging inspection; a tenth vision unit vu10, mounted to the semiconductor package pressing portion 700, and further provided with a seventh visual unit vu7, which may be An imaging inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a, 810b performs an upper imaging inspection.

Figure 13 is a plan view showing still another embodiment of the semiconductor package processing apparatus 1' of the present invention.

The embodiment shown in Fig. 13 differs from the embodiment shown in Fig. 12 in that the position of the visual unit will be different. This is to reduce the movement route of the above-described additional selectors 810a, 810b.

Unlike the embodiment shown in FIG. 12, in the embodiment shown in FIG. 13, the eleventh visual unit vu11 is located between the semiconductor package supply portion A and the stage, and the pair of additional selectors 810a, 810b can be reduced. The transfer distance has an effect of improving the efficiency of the process, and the eleventh visual unit is for performing an upper imaging inspection to perform an image pickup inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a, 810b.

On the other hand, the semiconductor package supply portion A of the embodiment shown in FIG. 12 or FIG. 13 is supplied through a semiconductor package supply tray on which a separate semiconductor package is mounted, but in the embodiment shown in FIG. The semiconductor package supply portion A passes through the semiconductor strip cutting unit 630 to singulate and supply the semiconductor strip.

A semiconductor package supply portion according to still another embodiment of the present invention includes: a first supply portion disposed in front of the semiconductor package attaching portion centering on the semiconductor package attaching portion, for cutting a semiconductor strip as a semiconductor The package is supplied; and the second supply portion is disposed behind the semiconductor package attaching portion around the semiconductor package attaching portion for supplying the singulated semiconductor package mounted on the tray.

The first supply unit includes: a semiconductor strip supply unit, For supplying a semiconductor strip; a semiconductor strip cutting portion for cutting the supplied semiconductor strip into a plurality of semiconductor packages; and a cell selector for picking up the semiconductor in a state of picking the plurality of cut semiconductor packages The package is transferred to the drying device via the washing device; the drying device is configured to adsorb the semiconductor package received from the unit selector, and move along the X-axis direction in the XY plane, and rotate according to the Y-axis; and In the entire array, a loading groove for loading the semiconductor package and a non-loading portion on which the semiconductor package is not mounted are alternately formed along the X-axis and the Y-axis direction, and are movable in the Y-axis direction. Therefore, the first supply portion achieves singulation of the semiconductor package by supplying and cutting the semiconductor strip, whereby the sputter object semiconductor package can be supplied.

Figure 14 is a plan view showing still another embodiment of the semiconductor package processing apparatus 1' of the present invention. Fig. 14 is a view showing a form in which a material supply portion is added to the embodiment of Figs. 12 and 13; As shown in FIG. 12 and FIG. 13, the semiconductor package processing apparatus of the present invention can respectively provide a singulated semiconductor package, but in the present embodiment, the material in the form of a strip is supplied, thereby providing staged washing, Dry semiconductor package.

The above-described semiconductor package supply unit A of FIGS. 14 and 15 will be described in more detail. The description overlapping with the description with reference to FIGS. 12 and 13 will be omitted, and a new first supply unit and a semiconductor package processing method using the same will be described below.

In the above-described semiconductor package supply portion A, the semiconductor strips are laminated in the case 700, and the semiconductor strips are sequentially pulled by the clips 600g and supplied.

The cutting article semiconductor strip s may be an elongated quadrangular material in which a plurality of semiconductor packages are arranged in a matrix form along the X-axis and the Y-axis direction, and the semiconductor strip cutting device is parallel in such a manner that the longitudinal direction thereof and the X-axis direction are parallel. 600 is supplied to the above semiconductor strip.

A plurality of cutting object semiconductor strips can be loaded on the cassette M. If the clips 600g sequentially pull the semiconductor strips toward the semiconductor strip cutting device 600 side, the semiconductor strips s advanced in the X-axis direction are used to guide the semiconductor strips. The inside of the entrance rail 610 of the semiconductor cutting device 600 provided with the board enters.

The strip selector 615 carries the semiconductor strip to the chuck table 650.

That is, the strip selector 615 vacuum-adsorbs the semiconductor strip, and transfers the mold surface of the semiconductor package to the chuck table in a downward direction.

The chuck table 650 is movable to an arbitrary position on the XY plane and is rotatable about the Z axis. The semiconductor strips adsorbed to the chuck table 650 are cut into individual semiconductor packages by at least one cutting unit 630. . In the embodiment shown in Figure 14, the cutting unit 630 has two cutters.

Moreover, during the relative displacement of the cutting unit 630 and the chuck table 650, the semiconductor strips adsorbed to the chuck table 650 can be cut into individual semiconductor packages, and the plurality of semiconductor packages that are cut are selected by unit. The device is picked up and transferred at one time.

The above unit selector 670 vacuum absorbs a plurality of half at a time The conductor package is picked up and transferred or transferred to the drying device 520, which will be described later, via the washing unit 640, and the washing process and the drying process can be performed. The cleaning unit 640 may include a brush unit, a fan, a washing liquid ejecting unit, and the like that remove dust or the like remaining in the semiconductor package during the cutting process.

The plurality of semiconductor packages picked up by the unit selector 670 and washed in the washing unit 640 can be loaded in a state of being adsorbed on a loading tank provided in the drying device 520, and the drying device constitutes the semiconductor package adsorbing portion 400.

The drying device 520 is embedded with a hot wire to perform a drying process, and the drying device 520 constituting the semiconductor package supply portion A may further include a quick flip function for flipping up and down and a transfer function to the X-axis direction or the Y-axis direction.

That is, the drying device 520 adsorbs the cut and washed semiconductor package, and moves in the X-axis direction or the Y-axis direction on the XY plane, and rotates on the XY plane with respect to the Y-axis.

A part of the semiconductor package picked up by the unit selector 670 is loaded on the upper surface (one surface) of the drying device 520, and the remaining semiconductor package is mounted on the bottom surface (the other surface) of the drying device 520.

Further, a row 530 having a first loading region and a second loading region may be formed on one side of the drying device 520, and alternately formed along the X-axis and the Y-axis direction in the first loading region and the second loading region ( There is a checker row arrangement) a suction port for absorbing and loading the semiconductor package and a non-loading portion not loaded with the semiconductor package.

Loading a semiconductor package in each loading area of the entire column 530 In the case of the package, the loading grooves formed in the entire row 530 are not dense and seamless, but are lattice-type or plaid only adjacent to the diagonal direction (connected to the zigzag-type pneumatic flow path) .

The semiconductor package mounted on only one surface of the drying device 520 or the upper surface and the bottom surface of the drying device 520 is transferred to the alignment row 530, and then the dried semiconductor package is mounted on the semiconductor package by split loading or the like. Each of the loading grooves 531a and 531b of the first loading area and the second loading area is disposed on the entire row 530 in the first loading area and the second loading area. Next, when the alignment stage 530 is moved in the Y-axis direction, the additional selectors 810a and 810b pick up the semiconductor package mounted on the entire array, and then attach the respective semiconductor packages to the fixed film attached to the frame.

In the semiconductor package processing apparatus of the present invention, in order to attach the semiconductor package to the fixed film provided on the frame for the sputtering process, as shown in FIG. 12 or FIG. 13, the attached semiconductor package can be loaded on the tray. The state is provided, but as in the embodiment shown in FIG. 14, after the cutting and supplying in the semiconductor strip cutting device 600, the additional selectors 810a, 810b pick up the semiconductor strip and attach it to the stage, and A method of enhancing the adhesion state of the semiconductor package pressing portion 700.

In addition, the semiconductor package adsorbed to the drying device may not be placed on the entire stage, but the drying device may be moved to the X-axis to directly attach the upper and lower surfaces of the semiconductor package to the fixed film of the frame.

Therefore, in the above case, the drying device can also be attached Add the function of the selector. That is, in FIG. 14, after the semiconductor strip is supplied, it is cut to supply the state of the singulated semiconductor material, as shown in FIG. 12 and FIG. 13, after the state in which the singulated semiconductor package is respectively loaded in the tray is supplied, The additional selectors 810a, 810b pick up the semiconductor package and attach it to the fixed film.

That is, according to FIG. 14 and FIG. 15, the method of attaching the semiconductor package to the fixed film of the present invention is as follows. The semiconductor package adsorbed to the drying device is directly transferred to the loading slot of the entire row in a state where the semiconductor package is turned upside down. After that, the semiconductor package mounted on the entire array is picked up by an additional selector and attached to the fixed film of the semiconductor package, and the semiconductor package attached to the drying device can be directly attached to the semiconductor package by being turned upside down. On the fixed membrane.

Further, in the embodiment shown in FIG. 14, the semiconductor package pressing portion 700 is also attached so as to be transferred in the X-axis direction, and at least one of the pressing members constituting the semiconductor package pressing portion 700 is also elongated along the X-axis direction. As shown in FIG. 14, in the semiconductor package attaching portion 200, the transfer direction of the stage and the transfer direction of the additional selectors 810a, 810b are also perpendicular.

As with the above embodiment, the embodiment shown in FIG. 14 may include: an eighth visual unit vu8 and a ninth visual unit vu9, mounted to a pair of additional selectors 810a, 810b for performing a lower imaging inspection; and, tenth The visual unit vu10 is attached to the semiconductor pressing unit 700, and has an imaging test for performing the upper imaging inspection for the imaging inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a and 810b. Seven vision units vu7.

Figure 15 is a plan view showing still another embodiment of the semiconductor package processing apparatus 1' of the present invention. The same description as that described with reference to Fig. 14 is omitted. The embodiment shown in Fig. 15 differs from the position of the visual unit in the embodiment shown in Fig. 14.

Unlike the embodiment shown in FIG. 14, the embodiment shown in FIG. 15 is the same as the above-described embodiment, and is used for execution of an image pickup inspection of the pickup state of the semiconductor package picked up by the pair of additional selectors 810a, 810b. The eleventh visual unit vu11 of the upper imaging inspection is located between the semiconductor package supply portion A and the stage, so that the transfer distance of the pair of additional selectors 810a, 810b can be reduced.

Hereinafter, the configuration and operation method of the semiconductor package pressing portion 700 constituting the semiconductor package processing apparatus 1 of the present invention will be described in detail with reference to FIG.

Fig. 16 is a perspective view and an enlarged view showing an embodiment of a semiconductor package pressing portion 700 constituting the semiconductor package processing apparatus 1' of the present invention.

The semiconductor package pressing portion 700 of the semiconductor package processing apparatus 1' of the present invention performs a process of pressing the upper surface of the semiconductor package to apply pressure thereto, so that the semiconductor package mounted on the empty frame t and the frame-coated The bond is uniformly and stably bonded.

In this case, the semiconductor package pressing portion 700 simultaneously presses the plurality of semiconductor packages, thereby improving the efficiency of the pressing and attaching process. The details are as follows.

The transfer direction of the semiconductor package pressing portion 700 is perpendicular to the transfer direction of the stage, and the semiconductor package pressing portion 700 may include at least one pressing member 710 which is perpendicular to the transfer direction of the stage, and the above The transfer direction of the semiconductor package pressing portion 700 is arranged in a direction parallel to the direction.

The semiconductor package pressing portion 700 shown in FIG. 16 has a plurality of pressing members 710 arranged in a line for applying pressure to the upper surface of the semiconductor package.

Each of the pressing members 710 may be made of a rubber or the like of a flexible material, and each of the pressing members 710 may be elastically supported by the elastic members 720. Therefore, when the semiconductor package pressing portion 700 is lowered to apply pressure to the upper surface of each of the semiconductor packages, the pressing force is restricted by the elastic member 720, and the semiconductor package can be prevented from being damaged.

As shown in the enlarged view of FIG. 16, each of the pressing members 710 can press a plurality of semiconductor packages, and the plurality of pressing members 710 are attached to the pressing bars 730 constituting the pressing portion 700 by the respective elastic members 720.

The pressing portion 700 can be attached to the elevator 740 that moves up and down along the Z axis.

The plurality of pressing members 710 attached to the pressing portion 730 are arranged in a line along the Y-axis direction, and the pressing portion 730 may be transferred in the Y-axis direction, and a table on which the frame of the sputtered object semiconductor package is placed is placed along In the X-axis direction transfer, the stage is transferred in the X-axis direction in the semiconductor package attached to the frame, and the pressing member 710 of the semiconductor package pressing portion 700 that is transported along the Y-axis direction is set regardless of the position. Pressed so that it can be stably attached to the frame.

FIG. 17 is a schematic view showing an operational state of the semiconductor package pressing portion 700 shown in FIG. 16.

Specifically, (a) of FIG. 17 is a schematic view of a process in which the semiconductor package pressing portion 700 is transferred to the pressurizing or pressing position of the semiconductor package and then lowered, and (b) of FIG. 17 is a pressing of the semiconductor package pressing portion 700. The component 710 applies a predetermined time pressure to the upper surface of the semiconductor package, thereby disposing the semiconductor package to the process of the frame.

Each of the pressing members 710 applies pressure to the upper surface of one semiconductor package, respectively, so that the semiconductor package attached to the frame is uniformly attached to the frame through the adhesive applied to the frame.

18 is a perspective view and an enlarged view of still another embodiment of the semiconductor package pressing portion 700 constituting the semiconductor package processing apparatus 1' of the present invention, and FIG. 19 is an operational state of the semiconductor package pressing portion 700 shown in FIG. The same description as that of the description with reference to FIGS. 16 and 17 will be omitted.

Unlike the pressing members shown in FIGS. 2 and 3, in the embodiment shown in FIGS. 18 and 19, one pressing member 710' can apply pressure to a plurality of semiconductor packages. That is, the pressing member 710' may be elongated so that one pressing member corresponds to a plurality of semiconductor packages.

Further, similarly to the embodiment shown in FIGS. 16 and 17, the pressing member 710' can be mounted in parallel to the pressing portion 730 in a direction perpendicular to the conveying direction of the table.

Further, the embodiment shown in Figs. 18 and 19 is also mounted with the elastic member 720, whereby the pressing member 710 performs pressing on the semiconductor package. The magnitude of the pressing force is limited during the pressing operation, thereby preventing damage caused by providing the same pressing force to the individual semiconductor packages having the height difference.

In the embodiment shown in FIGS. 18 and 19, both ends of one pressing member 710' are connected to the pressing portion 730 by the elastic member 720, but the pressing portion is the same as the pressing portion 710'. The number of positions where the 730 is connected is variable. That is, in the embodiment shown in FIGS. 18 and 19, the two pressing members 710' are attached only to one pressing portion 730, but the number of pressing members can be increased or decreased, and the number of connection positions can be determined according to the length of the pressing member or the like. Increase or decrease.

That is, the size and the like of the pressing members of the semiconductor package pressing portion 700 shown in FIGS. 16 to 19 can be changed, but the common point is the number of semiconductor package members that are pressurized and adhered by the sequential falling sliding action. For multiple. Thereby, the efficiency of the adhesion process by the semiconductor package pressing operation can be improved.

According to the above method, the present invention picks up the semiconductor package provided from the semiconductor package supply portion and attaches it to the frame having the fixed film for the semiconductor package sputtering process, and additionally applies pressure by the semiconductor package pressing portion. Thereby, the adhesion state of the semiconductor package can be enhanced. It can be fixed after attachment.

Further, after the semiconductor package is attached to the additional selectors 810a, 810b, the semiconductor package is pressed again without using the additional selector, but the additional semiconductor package pressing portion is provided to enhance the adhesion state, thereby preventing the process from being concentrated on Additional selectors, separated by The process department helps to increase the hourly output (UPH).

In the present specification, the preferred embodiments of the present invention have been described, but those skilled in the art to which the present invention pertains are within the scope of the inventive concepts and fields described in the scope of the invention as described below. Various modifications and changes can be made to the invention. Therefore, if the implementation of the deformation substantially includes the structural elements of the claimed scope of the invention, it is within the technical scope of the present invention.

1‧‧‧Semiconductor package processing device

100‧‧‧Frame Supply and Recycling Department

120‧‧‧Frame selector

200‧‧‧Semiconductor Package Separation Department

230‧‧‧Detector selector

231‧‧‧ picking unit

250‧‧‧Unload selector

251‧‧‧ picking unit

300‧‧‧Decapture part of semiconductor package

310‧‧‧First deburring unit

330‧‧‧Second deburring unit

350‧‧‧ Third deburring unit

370‧‧‧cleaning selector

400‧‧‧Semiconductor package loading department

410‧‧‧Tray selector

430‧‧‧Transport box

510‧‧‧ first block

511‧‧‧Loading trough

530‧‧‧Second block

531‧‧‧Loading trough

e‧‧‧Injector

Tf‧‧‧

Tr‧‧‧Tray

Vu1‧‧‧second vision unit

Vu2‧‧‧second vision unit

Vu3‧‧‧ third visual unit

Vu5‧‧‧ fifth visual unit

Claims (13)

A semiconductor package processing apparatus, comprising: a frame supply and recovery portion for supplying a frame for performing a sputtering process in a state in which a plurality of semiconductor packages are attached, and recycling the space for separating the semiconductor package a semiconductor package separation portion that picks up a semiconductor package attached to the supplied frame using a detection selector to separate the semiconductor package from the frame; a semiconductor package deburring portion including a plurality of deburring units that remove burrs remaining on the semiconductor package during transfer of the semiconductor package separated from the semiconductor package separating portion; a plurality of blocks for loading a semiconductor package picked up by the detection selector, or a semiconductor package for loading a deburring; and a semiconductor package loading portion that picks up the deburred semiconductor loaded on the block through an unloading selector The package is mounted on a semiconductor package carrying tray. The semiconductor package processing apparatus according to claim 1, wherein the semiconductor package deburring portion further comprises a cleaning selector, and the cleaning selector picks up a semiconductor package mounted on the block, The top deburring unit is transferred, the deburring unit includes: a first deburring unit including one or more rotating brushes having a vertical axis of rotation; A second deburring unit includes a roller brush having a horizontal rotation axis, and the first deburring unit and the second deburring unit are arranged side by side to sequentially remove burrs. The semiconductor package processing apparatus according to claim 2, wherein the block includes: a first block for loading a semiconductor package separated from the semiconductor package separation portion by the detection selector And a second block for loading a semiconductor package for removing burrs through the cleaning selector, the first block and the second block being independently transferred to each other in the Y-axis direction. The semiconductor package processing apparatus according to claim 1, wherein the plurality of rotating brushes constituting the first deburring unit are respectively mounted on a rotating member having a thread formed on an outer peripheral surface, each of the rotating members and the phase The adjacent rotating members are threaded to each other, and when one of the plurality of rotating members is rotationally driven by the rotary motor, all of the rotating members are simultaneously rotated. The semiconductor package processing apparatus according to claim 2, wherein the rotating brush constituting the first deburring unit is vertically implanted with a large number of clusters of bristles, and the second deburring unit is elongated Radially implanted on the axis of rotation A large number of bristles are driven by the drive shaft of the motor and the drive belt. The semiconductor package processing apparatus according to claim 2, wherein the deburring unit further comprises a third deburring unit, the third deburring unit is behind the second deburring unit The first deburring unit and the second deburring unit are disposed in parallel, the third deburring unit includes a fan and a suction flow path, and the fan passes through a semiconductor package for removing burrs in the second deburring unit The piece ejects compressed air toward a side surface direction or a bottom surface direction or a diagonal direction of the semiconductor package to remove burrs remaining in the semiconductor package. A semiconductor package processing apparatus, comprising: a semiconductor package supply portion for supplying a sputter object semiconductor package; a semiconductor package attaching portion which is supplied by the semiconductor package supply portion using an additional selector pickup a semiconductor package, and attaching the semiconductor package to the fixed film, the fixed film being disposed in an annular frame for a sputtering process; and a semiconductor package pressing portion from the upper portion to the semiconductor package attaching portion Applying pressure to a semiconductor package attached to a fixed film of the frame to enhance adhesion of the semiconductor package and the fixed film; and a frame supply recovery portion that supplies an empty frame to the semiconductor package attachment portion, After the semiconductor package is attached to the fixed film of the frame, the frame that is pressed at the pressing portion of the semiconductor package is recovered. A semiconductor package processing apparatus according to claim 7, characterized in that The semiconductor package supply portion includes: a first supply portion disposed in front of the semiconductor package attaching portion centering on the semiconductor package attaching portion, cutting the semiconductor strip and supplying the semiconductor package; and The second supply portion is disposed behind the semiconductor package attaching portion centering on the semiconductor package attaching portion for supplying the singulated semiconductor package mounted on the tray. The semiconductor package processing apparatus according to claim 8, wherein the first supply portion includes: a semiconductor strip supply portion for supplying a semiconductor strip; and a semiconductor strip cutting portion for supplying the semiconductor strip The semiconductor strip is cut into a plurality of semiconductor packages; the unit selector transmits the semiconductor package to the drying device via the washing device in a state of picking up the plurality of semiconductor packages to be cut; the drying device is used for adsorbing The semiconductor package received by the cell selector, which moves in the X-axis direction on the XY plane and rotates on the Y-axis; and an array of stages for loading the loading slots of the semiconductor package and the The non-loading portion on which the semiconductor package is mounted is alternately formed along the X-axis and Y-axis directions, and moves in the Y-axis direction. The semiconductor package processing apparatus according to claim 9, wherein the semiconductor package sucked by the drying device is loaded on the entire row or the semiconductor package adsorbed by the drying device is directly attached to a fixed film of the semiconductor package attachment portion. The semiconductor package processing apparatus according to claim 9, wherein the additional package is used to pick up a semiconductor package mounted on the entire array and attach it to a fixed film of the semiconductor package attachment portion. . The semiconductor package processing apparatus according to claim 7, wherein the semiconductor package pressing portion is transferred in a direction perpendicular to a transfer direction of the frame, and the semiconductor package pressing portion includes at least one pressing member The direction in which the pressing member is disposed is perpendicular to the direction in which the frame is transferred, and is parallel to the direction in which the semiconductor package pressing portion is transferred. The semiconductor package processing apparatus according to claim 7, wherein the semiconductor package pressing portion is raised and lowered along the Z-axis direction, and the pressing member of the semiconductor package pressing portion is mounted with the elastic member as a medium, thereby being elastic Support and pressurize the semiconductor package.